BFP740FE6327 INFINEON | Alldatasheet
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Technical content
NPN Silicon Germanium RF Transistor
- High gain ultra low noise RF transistor
- Provides outstanding performance for a wide range of wireless applications up to 10 GHz and more
- Ideal for CDMA and WLAN applications
- Outstanding noise figure F = 0.5 dB at 1.8 GHz Outstanding noise figure F = 0.75 dB at 6 GHz
- High maximum stable gain Gms = 27.5 dB at 1.8 GHz
- Gold metallization for extra high reliability
- 150 GHz fT-Silicon Germanium technology
- Pb-free (RoHS compliant) package1)
- Qualified according AEC Q101 Direction of Unreeling Top View XYs ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type Marking Pin Configuration Package BFP740F R7s 1=B 2=E 3=C 4=E - - TSFP-4 1Pb-containing package may be available upon special request
Parameter Symbol Value Unit Collector-emitter voltage TA > 0°C TA ≤ 0°C VCEO 3.5 V Collector-emitter voltage VCES 13 Collector-base voltage VCBO 13 Emitter-base voltage VEBO 1.2 Collector current IC 30 mA Base current IB 3 Total power dissipation1) TS ≤ 90°C Ptot 160 mW Junction temperature Tj 150 °C Ambient temperature TA -65 ... 150 Storage temperature Tstg -65 ... 150 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point2) RthJS ≤ 370 K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage I C = 1 mA, IB = 0 V(BR)CEO 4 4.7 - V Collector-emitter cutoff current VCE = 13 V, VBE = 0 ICES - - 30 µA Collector-base cutoff current VCB = 5 V, IE = 0 ICBO - - 100 nA Emitter-base cutoff current VEB = 0.5 V, IC = 0 IEBO - - 3 µA DC current gain IC = 25 mA, VCE = 3 V, pulse measured hFE 160 250 400 - 1TS is measured on the collector lead at the soldering point to the pcb 2For calculation of RthJA please refer to Application Note Thermal Resistance
Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics (verified by random sampling) Transition frequency IC = 25 mA, VCE = 3 V, f = 1 GHz fT - 42 - GHz Collector-base capacitance VCB = 3 V, f = 1 MHz, VBE = 0 , emitter grounded Ccb - 0.08 0.14 pF Collector emitter capacitance VCE = 3 V, f = 1 MHz, VBE = 0 , base grounded Cce - 0.2 - Emitter-base capacitance VEB = 0.5 V, f = 1 MHz, VCB = 0 , collector grounded Ceb - 0.44 - Noise figure IC = 8 mA, VCE = 3 V, f = 1.8 GHz, ZS = ZSopt IC = 8 mA, VCE = 3 V, f = 6 GHz, ZS = ZSopt F 0.5 0.75 dB Power gain, maximum stable1) IC = 25 mA, VCE = 3 V, ZS = ZSopt, ZL = ZLopt , f = 1.8 GHz Gms - 27.5 - dB Power gain, maximum available1) IC = 25 mA, VCE = 3 V, ZS = ZSopt, ZL = ZLopt, f = 6 GHz Gma - 19 - dB Transducer gain IC = 25 mA, VCE = 3 V, ZS = ZL = 50 Ω , f = 1.8 GHz f = 6 GHz |S21e|2 dB Third order intercept point at output2) VCE = 3 V, IC = 25 mA, ZS=ZL=50 Ω , f = 1.8 GHz IP3 - 25 - dBm 1dB Compression point at output IC = 25 mA, VCE = 3 V, ZS=ZL=50 Ω , f = 1.8 GHz P-1dB - 11 - 1Gma = |S21e / S12e| (k-(k²-1)1/2), Gms = |S21e / S12e| 2IP3 value depends on termination of all intermodulation frequency components. Termination used for this measurement is 50Ω from 0.1 MHz to 6 GHz
SPICE Parameter (Gummel-Poon Model, Berkley-SPICE 2G.6 Syntax): Transistor Chip Data: IS = 384.4 aA VAF = 400 V NE = 1.586 - VAR = 1.28 V NC = 1.5 - RBM = 1.69 Ω CJE = 220 fF TF = 2.1 ps ITF = 290 mA VJC = 550 mV TR = 13 ps MJS = 180 m XTI = 910 m AF = 1 - BF = 1.1 k IKF = 512.1 mA BR = 62 - IKR = 5 mA RB = 3.23 Ω RE = 90 m Ω VJE = 590 mV XTF = 3 - PTF = 100 mdeg MJC = 152 m CJS = 79.7 fF XTB = -2.2 - FC = 950 m KF = 0 - NF = 1.018 - ISE = 4.296 fA NR = 1- ISC = 3.85 fA IRB = 10 A RC = 6.88 Ω MJE = 70 m VTF = 1.32 V CJC = 99.5 fF XCJC = 10 m VJS = 570 mV EG = 1.11 eV TNOM 298 K All parameters are ready to use, no scalling is necessary. Package Equivalent Circuit: LBC = 0.1 nH LCC = 0.2 nH LEC = 20 pH LBB = 0.411 nH LCB = 0.696 nH LEB = 21 pH CBEC = 0.1 pF CBCC = 1 fF CES = 0.34 pF CBS = 39 fF CCS = 75 fF CCEO = 0.177 pF CBEO = 92 fF CCEI = 0.217 pF CBEI = 52 fF REC =2 Ω RBS = 3.5 kΩ RCS = 1.65 k Ω RES = 90 Ω B C E CCEOCBEO CCEICBEI CBEC CBCC S C B E LBC LCC LEC CBS RCS RES LBB LCB LEB RBS CCS CES REC BFP740F_Chip Valid up to 6GHz For examples and ready to use parameters please contact your local Infineon Technologies distributor or sales office to obtain a Infineon Technologies CD-ROM or see Internet: http://www.infineon.com
Total power dissipation Ptot = ƒ(TS) 0 15 30 45 60 75 90 105 120 °C 150 TS 100 120 140 mW 180 Ptot Permissible Pulse Load RthJS = ƒ(tp) 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp 1 10 2 10 3 10 K/WRthJS D = 0,5 0,2 0,1 0,05 0,02 0,01 0,005 Permissible Pulse Load Ptotmax/PtotDC = ƒ(tp) 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp 0 10 1 10 2 10 Ptotmax/PtotDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 Collector-base capacitance Ccb = ƒ (VCB) f = 1 MHz 0 2 4 6 8 10 12 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 VCB [V] C cb [pF]
Third order Intercept Point IP3 = ƒ (IC) (Output, ZS = ZL = 50 Ω ) VCE = parameter, f = 900 MHz 0 5 10 15 20 25 30 35 IC [mA] IP3 [dBm] 1.00V 2.00V 3.00V 4.00V Transition frequency fT = ƒ(IC) VCE = parameter in V, f = 2 GHz 0 5 10 15 20 25 30 35 IC [mA] fT [GHz] 2V to 4V 1.00V 0.75V 0.50V Power gain Gma, Gms = ƒ (f) VCE = 3 V, IC = 25 mA 0 1 2 3 4 5 6 f [GHz] [GHz] G [dB] G ms G ma |S21|2 Power gain Gma, Gms = ƒ (IC) VCE = 3 V f = parameter in GHz 0 5 10 15 20 25 30 35 IC [mA] G [dB] 6.00GHz 5.00GHz 4.00GHz 3.00GHz 2.40GHz 1.80GHz 0.90GHz
Power gain Gma, Gms = ƒ (VCE) IC = 25 mA f = parameter in GHz VCE [V] G [dB] 6.00GHz 5.00GHz 4.00GHz 3.00GHz 2.40GHz 1.80GHz 0.90GHz Noise figure F = ƒ(IC) VCE = 3 V, f = parameter in GHz ZS = ZSopt 0 5 10 15 20 25 30 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 F [dB] Ic [mA] f = 0.9GHz f = 3GHz f = 2.4GHz f = 6GHz f = 5GHz f = 1.8GHz Noise figure F = ƒ(IC) VCE = 3 V, f = 1.8 GHz 0 5 10 15 20 25 30 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 Ic [mA] F [dB] ZS = 50Ω ZS = ZSopt Noise figure F = ƒ(f) VCE = 3 V, ZS = ZSopt 0 1 2 3 4 5 6 7 0.2 0.4 0.6 0.8 1.2 1.4 F [dB] f [GHz] IC = 25mA IC = 8mA
Source impedance for min. noise figure vs. frequency VCE = 3 V, IC = 8 mA / 25 mA 10.2 0.4 2 40 1.5 −10 −1.5 0.5 −0.5 0.1 −0.1 0.2 −0.2 0.3 3 −0.3 −3 0.4 −0.4 3GHz Ic = 8mA 1.8GHz 6GHz 5GHz 0.9GHz Ic = 25mA 4GHz 2.4GHz
Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel BFP420F Type codePin 1 0.35 0.45 0.9 0.5 0.5 4 0.2 1.55 0.7 1.4 Pin 1 ±0.050.2 ±0.051.4 10˚ MAX. ±0.050.8 1.2±0.05 ±0.040.55 ±0.050.2 ±0.050.15±0.050.2 0.5±0.05 0.5±0.05 Manufacturer
81726 München, Germany
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