Interface

BD79104MUF-M

Rohm

Successive Approximation A/D Converter 12 bit, 0.5 MSPS to 1 MSPS, 8-channel, SPI Interface 12.Jan.2023 Rev.001

Manufacturer: Rohm

Document: 25 Pages / 1Mb

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BD79104MUF-M ROHM | Alldatasheet

Document overview

Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
PDF pages: 25

Technical content

Datasheet sections

Features

◼ AEC-Q100 Qualified(Note 1) ◼ Maximum 1 MSPS Sampling Rate ◼ Low Power Consumption ◼ Small VQFN16FV3030 Package ◼ Serial Interface Compatible with SPI/QSPI/MICROWIRE ◼ Single-ended Input ◼ Output Code in Straight Binary Format (Note 1) Grade 1

Applications

◼ Car Navigation Systems ◼ Automotive Cluster Display ◼ Battery Management Systems (BMS) ◼ Data Acquisition Systems Key Specifications ◼ Supply Voltage Range (VDD): 2.70 V to 5.25 V ◼ Supply Voltage Range (IOVDD): 1.65 V to 5.25 V ◼ Sampling Rate: 0.5 MSPS to 1.0 MSPS ◼ Power Consumption: (In 1 MSPS Operation) 4 mW @ VDD = 3.6 V (Typ) 9.5 mW @ VDD = 5.25 V (Typ) ◼ INL: ±1.0 LSB @ VDD = 3 V (Typ) ◼ DNL: +1.2 / -0.99 LSB @ VDD = 3 V (Typ) ◼ SNR: 72 dB @ VDD = 3 V (Typ) ◼ SINAD: 72 dB @ VDD = 3 V (Typ) ◼ Operating Temperature Range: -40 °C to +125 °C Package W (Typ) x D (Typ) x H (Max) VQFN16FV3030 3.0 mm x 3.0 mm x 1.0 mm Typical Application Circuit BD79104MUF-M IOVDD MICROPROCESSOR or DSP IN0 IN1 IN2 IN3 IN4 IN5 IN6 IN7 ANALOG SIGNAL ANALOG SIGNAL ANALOG / DIGITAL SUPPLY VOLTAGE VQFN16FV3030 Wettable Flank Package Enlarged View DGND AGND VDD DIGITAL I/O SUPPLY VOLTAGE SCK SDI CSB SDO DIGITAL GROUND ANALOG GROUND Datasheet

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. 12.Jan.2023 Rev.001 TSZ22111 • 15 • 001 www.rohm.com Pin Configuration Pin Descriptions Pin No. Pin Name Function 1 AGND Analog ground pin. This voltage level is the zero scale of the analog input. 2 IN0 Analog input pin 0. The voltage range must be between 0 V and VDD. 3 IN1 Analog input pin 1. The voltage range must be between 0 V and VDD. 4 IN2 Analog input pin 2. The voltage range must be between 0 V and VDD. 5 IN3 Analog input pin 3. The voltage range must be between 0 V and VDD. 6 IN4 Analog input pin 4. The voltage range must be between 0 V and VDD. 7 IN5 Analog input pin 5. The voltage range must be between 0 V and VDD. 8 IN6 Analog input pin 6. The voltage range must be between 0 V and VDD. 9 IN7 Analog input pin 7. The voltage range must be between 0 V and VDD. 10 DGND Digital ground pin. 11 IOVDD Digital I/O power supply pin. 12 SDI Digital data input pin. 13 SDO Digital data output pin. 14 SCK Digital clock input pin. 15 CSB Chip select pin. A/D conversion starts at the falling edge of this signal. 16 VDD Analog/Digital power supply pin. This voltage is the full scale of the analog input. - EXP-PAD Connect the EXP-PAD to AGND. Block Diagram (TOP VIEW) CSB SCK SDO AGND SDI IN0 IOVDD IN1 DGND IN2 IN7 IN3 IN4 IN5 VDD IN6 EXP-PAD IOVDD DIGITAL IN/OUT MUX IN0 TRACK/HOLD CONTROL LOGIC SCK CSB IN1 IN2 IN3 IN4 IN5 IN6 VDD IN7 12-BIT SUCCESSIVE APPROXIMATION ADC AGND SDI SDO DGND

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. 12.Jan.2023 Rev.001 TSZ22111 • 15 • 001 www.rohm.com Absolute Maximum Ratings (Ta = 25 °C) Parameter Symbol Rating Unit Analog/Digital Supply Voltage VDD 5.7 V Digital I/O Supply Voltage VIOVDD VDD+0.3, max 5.7 V Analog Input Voltage VIN -0.3 to VDD+0.3 V Digital Input Voltage VDIN -0.3 to VIOVDD+0.3 V Maximum Junction Temperature Tjmax 150 °C Storage Temperature Range Tstg -55 to +150 °C Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection m easures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in de terioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. Thermal Resistance(Note 2) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 4) 2s2p(Note 5) VQFN16FV3030 Junction to Ambient θJA 189.0 57.5 °C/W Junction to Top Characterization Parameter(Note 3) ΨJT 23 10 °C/W (Note 2) Based on JESD51-2A (Still-Air). (Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top c enter of the outside surface of the component package. (Note 4) Using a PCB board based on JESD51-3. (Note 5) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Measurement Board Material Board Size Thermal Via (Note 6) Pitch Diameter Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm (Note 6) This thermal via connect with the copper pattern of layers 1,2, and 4. The placement and dimensions obey a land pattern.

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. 12.Jan.2023 Rev.001 TSZ22111 • 15 • 001 www.rohm.com Recommended Operating Conditions Parameter Symbol Min Typ Max Unit Analog/Digital Supply Voltage VDD 2.70 - 5.25 V Digital I/O Supply Voltage VIOVDD 1.65 - VDD V Analog Input Voltage VIN 0 - VDD V Digital Input Voltage VDIN 0 - VIOVDD V Operating Temperature Topr -40 +25 +125 °C Clock Frequency fSCK 10 - 20 MHz Sampling Rate fS 0.5 - 1.0 MSPS

Electrical Characteristics

Unless otherwise specified, Ta = -40 °C to +125 °C (typical: Ta = 25 °C), VDD = 2.7 V to 5.25 V, VIOVDD = 1.65 V to 5.25 V, fSCK = 20 MHz, fS = 1 MSPS Parameter Symbol Min Typ Max Unit Parameter Statistic Converter Characteristics Resolution with No Missing Codes RES - 12 - bit Integral Non-linearity1 INL1 -1.2 - +1.2 LSB Ta = 25 °C, VDD = 5.0 V VIOVDD = 3.0 V Integral Non-linearity2 INL2 -1.0 - +1.0 LSB Ta = 25 °C, VDD = 3.0 V VIOVDD = 3.0 V Differential Non-linearity1 DNL1 -0.99 - +1.2 LSB Ta = 25 °C, VDD = 5.0 V VIOVDD = 3.0 V Differential Non-linearity2 DNL2 -0.99 - +1.2 LSB Ta = 25 °C, VDD = 3.0 V VIOVDD = 3.0 V Offset Error OE -2.3 ±1.1 +2.3 LSB Ta = 25 °C Gain Error GE -2.0 ±0.8 +2.0 LSB Ta = 25 °C Dynamic Converter Characteristics (fIN = 100 kHz, VIN = -0.02 dBFS) Signal to Noise and Distortion Ratio1 SINAD1 70 72 - dB Ta = 25 °C, VDD = 5.0 V VIOVDD = 3.0 V, fIN = 100 kHz Signal to Noise and Distortion Ratio2 SINAD2 70 72 - dB Ta = 25 °C, VDD = 3.0 V VIOVDD = 3.0 V, fIN = 100 kHz Signal to Noise Ratio1 SNR1 70.8 72.0 - dB Ta = 25 °C, VDD = 5.0 V VIOVDD = 3.0 V, fIN = 100 kHz Signal to Noise Ratio2 SNR2 70.8 72.0 - dB Ta = 25 °C, VDD = 3.0 V VIOVDD = 3.0 V, fIN = 100 kHz Total Harmonic Distortion THD - -80 - dB Ta = 25 °C, VDD = 5.0 V VIOVDD = 3.0 V, fIN = 100 kHz Spurious-free Dynamic Range SFDR - 82 - dB Ta = 25 °C, VDD = 5.0 V VIOVDD = 3.0 V, fIN = 100 kHz Effective Number of Bits1 ENOB1 11.3 11.6 - bit Ta = 25 °C, VDD = 5.0 V VIOVDD = 3.0 V Effective Number of Bits2 ENOB2 11.3 11.6 - bit Ta = 25 °C, VDD = 3.0 V VIOVDD = 3.0 V Inter-channel Isolation1 ISO1 - -85 - dB Ta = 25 °C, VDD = 5.0 V VIOVDD = 3.0 V Inter-channel Isolation2 ISO2 - -84 - dB Ta = 25 °C, VDD = 3.0 V VIOVDD = 3.0 V Inter-modulation Distortion1 (Second Order Term) IMD1 - -78 - dB VDD = 5.25 V, VIOVDD = 3.0 V 103.5 kHz, 113.5 kHz Inter-modulation Distortion2 (Third Order Term) IMD2 - -76 - dB VDD = 5.25 V, VIOVDD = 3.0 V 103.5 kHz, 113.5 kHz Full Power Band Width fPBW - 10 - MHz VDD = VIOVDD = 5 V Aperture Delay tAD - 4.3 - ns VDD = VIOVDD = 5 V Aperture Jitter tAJ - 30 - ps VDD = VIOVDD = 5 V Clock Frequency fSCK 10 - 20 MHz Sampling Rate fS 500 k - 1 M SPS Track/Hold Acquisition Time tACQ - - 3 SCK cycles

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. 12.Jan.2023 Rev.001 TSZ22111 • 15 • 001 www.rohm.com Electrical Characteristics - continued Unless otherwise specified, Ta = -40 °C to +125 °C (typical: Ta = 25 °C), VDD = 2.7 V to 5.25 V, VIOVDD = 1.65 V to 5.25 V, fSCK = 20 MHz, fS = 1 MSPS Parameter Symbol Min Typ Max Unit Conditions Analog Input Characteristics Input Range VIN 0 - VDD V Input DC Leakage Current ILEAK -1.0 ±0.1 +1.0 µA VIN = 0 V or VDD Input Capacitance1 CINA1 - 28 - pF track mode, VDD = 5 V Input Capacitance2 CINA2 - 4 - pF hold mode, VDD = 5 V Digital Input Characteristics High Input Voltage VIH 0.7 x VIOVDD - - V Low Input Voltage VIL - - 0.3 x VIOVDD V Input Current IIND -1.0 ±0.1 +1.0 µA VIND = 0 V or VIOVDD Input Capacitance CIND - 2.5 - pF Digital Output Characteristics Output High Voltage1 VOH1 VIOVDD - 0.20 VIOVDD - 0.03 - V ISOURCE = 200 µA Output High Voltage2 VOH2 - VIOVDD - 0.1 - V ISOURCE = 1 mA Output Low Voltage1 VOL1 - 0.02 0.40 V ISINK = 200 µA Output Low Voltage2 VOL2 - 0.1 - V ISINK = 1 mA High-Z Leakage Current IOZ -10.0 ±0.1 +10.0 µA VOZ = 0 V or VDD High-Z Output Capacitance COUT - 2 - pF Current Consumption Operational Current Consumption1 IA1 - 1.8 2.7 mA VDD = VIOVDD = 5.25 V, fS = 1 MSPS Operational Current Consumption2 IA2 - 1.1 1.5 mA VDD = VIOVDD = 3.6 V, fS = 1 MSPS Stand-by Current Consumption1 IS1 - 0.5 - µA VDD = VIOVDD = 5.25 V, SCK off Stand-by Current Consumption2 IS2 - 0.3 - µA VDD = VIOVDD = 3.6 V, SCK off

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. 12.Jan.2023 Rev.001 TSZ22111 • 15 • 001 www.rohm.com Term Definitions ACQUISITION TIME: It is the time when the voltage of the sampling capacitor equals input voltage from the charge start. APERTURE DELAY: It is defined as the time when the input voltage is held since a sampling capacitor was separated with outside by a 4th falling edge of SCK. APERTURE JITTER: The variation in the aperture delays in sampling operations. Aperture jitter gets to affect output noise. INTEGRAL NON-LINEARLITY (INL): It is a measure of the deviation of each individual code from a line drawn from zero scale (0.5 LSB b elow the first code transition) through full scale (0.5 LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value. DIFFERENTIAL NON-LINEARLITY (DNL): It is the measure of the maximum deviation from the ideal step size of 1 LSB. OFFSET ERROR (OE): It is the deviation of the first code transition “(000…000) to (000…001)” from the ideal of 0.5 LSB. FULL SCALE ERROR (FSE): It is the deviation of the last code transition “(111…110) to (111…111)” from the ideal of “VDD-1.5 LSB”. GAIN ERROR (GE): It is defined as full scale error minus offset error. TOTAL HARMONIC DISTORTION (THD): It is the ratio, expressed in dB or dBc, of the RMS total of the first 5 harmonic components at the output to the RMS level of the input signal frequency as seen at the output. THD is calculated as where Af1 is the RMS power of the input frequency at the output and A f2 through Af6 are the RMS power in the first 5 harmonic frequencies. SIGNAL TO NOISE AND DISTORTION RATIO (SINAD): It is the ratio, expressed in dB, of the RMS value of the input signal to the RMS value of all other spectral components below half the sampling frequency, including harmonics but excluding DC component. EFFECTIVE NUMBER OF BITS (ENOB): It is another method of specifying Signal to Noise and Distortion Ratio. ENOB is defined as “(SINAD-1.76) / 6.02” and says that the converter is equivalent to a perfect A/D converter of this number of bits. SIGNAL TO NOISE RATIO (SNR): It is the ratio, expressed in dB, of the RMS value of the input signal to the RMS value of all other spectral components below half the sampling frequency, not including harmonics and DC component. SPURIOUS FREE DYNAMIC RANGE (SFDR): It is the difference, expressed in dB, between the RMS value of the input signal to the RMS value of the peak spurious spectral component, where a peak spurious spectral component is any spurious signal present in the output spectrum that is not present at the input. CONVERSION TIME: It is the required time for the A/D converter to convert the input signal to the digital code.

Overview of A/D Conversion Process

schematics of the A/D converter are shown in Figure 14 and Figure 15. comparator. Then, the sampling capacitor is charged with the analog input voltage VIN. balances again. The control logic also generates the output code of the A/D converter.

Ideal Transfer Characteristics

format of the A/D converter is straight binary. Figure 14. Track Mode Figure 15. Hold Mode Figure 16. Ideal Transfer Characteristics

0.5 LSB

1 LSB = VDD / 4096

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. tracked input signal is sampled and held for conversion at this point. SDO goes back to High-Z at the rising edge of CSB. SDO access time has elapsed. Figure 17. Serial Interface Timing

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. As shown in Figure 18, the A/D conversion can be performed even if CSB remains low after second communication. CSB should be high after all communication is completed while the A/D conversion is stopped. data ADD0, ADD1, and ADD2 as shown Table 1 when the 3rd SCK clock is inputted after the CSB becomes low. The IN0 pin is selected after power-up. Table 1. Input Channel Selection Figure 18. A/D Conversion after Power-up

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. converter’s capability. Ceramic capacitors of 0.1 μF and 1 μF to 10 μF are to be used as bypass capacitor for this product. Especially, the capacitor of 0.1 μF should be placed as close to the IOVDD and VDD pins of this product as possible. deviation remains at the transition from Track mode to Hold mode, it could cause the conversion error. capacitor and a resister on the IN analog input could support the amplifier to reduce the influence of the charge. Figure 19. Application Circuit

TSZ02201-05H5AFH22010-1-2 © 2022 ROHM Co., Ltd. All rights reserved. 12.Jan.2023 Rev.001 TSZ22111 • 15 • 001 www.rohm.com Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions The function and operation of the IC are guaranteed within the range specified by the recommended operating conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical characteristics. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supp ly should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground , power supply and o utput pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to prod uce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line.

Regarding the Input Pin of the IC

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Figure 23. Example of Monolithic IC Structure temperature and the decrease in nominal capacitance due to DC bias and others.

Ordering Information

B D 7 9 1 0 4 M U F - M E 2 Package MUF: VQFN16FV3030 Product Rank M: for Automotive Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN16FV3030 (TOP VIEW) 1 04 Part Number Marking LOT Number Pin 1 Mark D 7 9 7123

Revision History

12.Jan.2023 001 New Release

Notice-PAA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications ”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independen t verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse , is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsibl e or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PAA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circu it, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgmen t in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Product Information

BD79104MUF-M specifications and overview.

Summary

Successive Approximation A/D Converter 12 bit, 0.5 MSPS to 1 MSPS, 8-channel, SPI Interface 12.Jan.2023 Rev.001

Description

Successive Approximation A/D Converter 12 bit, 0.5 MSPS to 1 MSPS, 8-channel, SPI Interface 12.Jan.2023 Rev.001

Source title BD79104MUF-M Datasheet(PDF) - Rohm

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