BD00FD0WFP2-E2

Online Datasheet

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Document overview

Manufacturer or author: ROHM CO., LTD.
PDF pages: 31

Technical content

Features

 Output current capability: 2A  Output voltage: Variable, Fixed / 9.0V / 12V / 15V / 16V) High output voltage accuracy (Ta=25°C)  Low saturation with PDMOS output  Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits  Built-in thermal Shutdown circuit for protecting the IC from thermal damage due to overloading  Low ESR Capacitor  HRP5/TO263-5 package Packages W(Typ) x D(Typ) x H(Max) HRP5 9.395mm x 10.540mm x 2.005mm TO263-5 10.16mm×15.10mm×4.70mm Key Specifications  Supply Voltage(Vo ≥ 3.0V): Vo+1.0V to 32.0V  Supply Voltage(Vo < 3.0V): 4.0V to 32.0V  Output Voltage(BD00FD0W): 1.5V to 16.0V  Output Current: 2A  Output Voltage Precision(Note 1): ±1%(Ta=25°C)  Operating Temperature Range: -40°C to +105°C (Note 1) BD15/18/25FD0W are ±1.5% (Ta=25°C)

Applications

B D x x F D 0 W x x x - x x Output voltage 00: Variable 15:1.5V 18:1.8V 25:2.5V 30:3.0V 33:3.3V 50:5.0V 80:8.0V 90:9.0V J2:12.0V J5:15.0V J6:16.0V Input Voltage, Current capacity FD0: 35V, 2A Enable W: With CTL(Enable) Package HFP: HRP5 FP2: TO263-5 Packaging and f orming specification TR: Embossed tape and reel(HRP5) E2: Embossed tape and reel(TO263-5) Datasheet

1 CTL

2 Vcc

3 GND Ground

It is connected to the FIN terminal at the ground of the circuit. to Operational Notes 15 for capacitance and ESR value.

5 ADJ Output voltage setting terminal

Connect a resistor between Vo and ADJ,ADJ and GND. It is recommended that FIN is soldered to a copper foil part with a large area. It is electrically connected to GND inside the package. It is connected to the FIN terminal at the ground of the circuit. to Operational Notes 15 for capacitance and ESR value. It is recommended that FIN is soldered to a copper foil part with a large area. It is electrically connected to GND inside the package.

© 2017 ROHM Co., Ltd. All rights reserved. 09.Sep.2019 Rev.003 www.rohm.com TSZ22111・15・001 Description of Blocks Block Name Function Description of Blocks PREREG Internal Power Supply A logical “High” ( VthH ≥ 2.0 V ) at the CTL enables Power Supply for Internal Circuit TSD Thermal Shutdown Protection To protect the device from overheating. If the chip temperature ( Tj ) reaches ca. 175 °C ( Typ ), the output is turned off. VREF Reference Voltage Generate the Reference Voltage AMP Error Amplifier The Error Amplifier amplifies the difference between the fe ed back voltage of the output voltage and the reference v. Driver Output MOS FET Driver Drive the Output MOS FET OCP Over Current Protection To protect the device from damage caused by over current. If the output current reaches current ability ( Typ : 2500mA ), the output is turned off.

© 2017 ROHM Co., Ltd. All rights reserved. 09.Sep.2019 Rev.003 www.rohm.com TSZ22111・15・001 Absolute Maximum Ratings Parameter Symbol Ratings Unit Supply Voltage (Note 1) Vcc -0.3 to +35.0 V Output Control Voltage (Note 2) VCTL -0.3 to +35.0 V Operating Temperature Range Ta -40 to +105 °C Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C (Note 1) Do not exceed Tjmax. (Note 2) The order of starting up power supply (Vcc) and CTL pin doesn't have either in the problem within the range of the operation power-supply voltage ahead. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (-40°C ≤ Ta ≤ +105°C) Parameter Symbol Min Max. Unit Supply Voltage (Vo ≥ 3.3V) Vcc Vo+1 32.0 V Supply Voltage (Vo ≤ 3.0V) Vcc 4.0 32.0 V Startup Voltage (Io=0mA) Vcc - 3.8 V Output Control Voltage VCTL 0 32.0 V Output Current Io 0 2.0 A Output Voltage (BD00FD0W) (Note 3) Vo 1.5 18.0 V (Note 3) Refer to Notes15 for use when you use BD00FD0W by output voltage 1.5V ≤ Vo < 3.0V.

Electrical Characteristics

Unless otherwise specified, Ta=25°C, Vcc= 13.5V(Note 1), Io=0mA, VCTL=5.0V The resistor of between ADJ and Vo =56.7kΩ, ADJ and GND =10kΩ (BD00FD0W) Parameter Symbol Limits Unit Conditions Min Typ Max Shutdown Current Isd - 0 10 μA VCTL=0V, Vcc<10V Circuit Current Ib - 0.5 1.0 mA ADJ Terminal Voltage (BD00FD0W) VADJ 0.742 0.750 0.758 V Io=500mA, Vcc=13.5V Output Voltage (BD15/18/25FD0W) Vo Vo 0.985 Vo Vo 1.015 V Io=500mA Vo ≤ 2.5V Output Voltage (BD30 to J6FD0W) (Note 2) Vo Vo 0.99 Vo Vo 1.01 V Io=500mA Vo ≥ 3.0V Dropout Voltage ΔVd - 0.40 0.55 V Vcc=Vo×0.95, Io=1A, Vo ≥ 5.0V Ripple Rejection (BD00 to 50FD0W) (Note 3) R.R. 45 55 - dB f=120Hz, Input Voltage Ripple =1Vrms, Io=500mA Ripple Rejection (BD80 to J6FD0W) (Note 4) R.R. 40 50 - dB f=120Hz, Input Voltage Ripple =1Vrms, Io=500mA Line Regulation (Note 5) Reg.I - 20 80 mV Vo+1.0V ≤ Vcc ≤ 26.5V Vo ≥ 3.3V Line Regulation (Note 6) Reg.I - 20 80 mV 4.0V ≤ Vcc ≤ 26.5V Vo ≤ 3.0V Load Regulation (Note 5) Reg.L - Vo 0.007 Vo 0.014 V 5mA ≤ Io ≤ 1A Vo ≥ 3.3V Load Regulation (Note 6) Reg.L - Vo 0.020 Vo 0.040 V 5mA ≤ Io ≤ 1A Vo ≤ 3.0V CTL ON Mode Voltage VthH 2.0 - - V ACTIVE MODE CTL OFF Mode Voltage VthL - - 0.8 V OFF MODE CTL Bias Current ICTL - 25 50 μA (Note 1) In case of Vo>10V, Vcc=Vo+5V (Note 2) BD30/33/50/80/90/J2/J5/J6FD0W (Note 3) BD00/15/18/25/30/33/50FD0W (Note 4) BD80/90/J2/J5/J6FD0W (Note 5) BD00/33/50/80/90/J2/J5/J6FD0W (Note 6) BD15/18/25/30FD0W

© 2017 ROHM Co., Ltd. All rights reserved. 09.Sep.2019 Rev.003 www.rohm.com TSZ22111・15・001 Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s (Note 3) 2s2p (Note 4) HRP5 Junction to Ambient θJA 119.3 22.0 °C/W Junction to Top Characterization Parameter (Note 2) ΨJT 8 3 °C/W TO263-5 Junction to Ambient θJA 80.7 20.3 °C/W Junction to Top Characterization Parameter (Note 2) ΨJT 8 2 °C/W (Note 1) Based on JESD51-2A(Still-Air) (Note 2) The thermal characterization paramete r to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Single FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm Layer Number of Measurement Board Material Board Size Thermal Via (Note 5) Pitch Diameter Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm (Note 5) This thermal via connects with the copper pattern of all layers. The placement and dimensions obey a land pattern.

© 2017 ROHM Co., Ltd. All rights reserved. 09.Sep.2019 Rev.003 www.rohm.com TSZ22111・15・001 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supp ly lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small -signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the powe r dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge ca pacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 8. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pin s being shorted to each other especially to ground , power supply and output pin . Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 9. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the po wer supply or ground line.

© 2017 ROHM Co., Ltd. All rights reserved. 09.Sep.2019 Rev.003 www.rohm.com TSZ22111・15・001 Operational Notes – continued 15. Output Pin In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend a capacitor with a capacitance of more than 2.2μF(Min) (3.0V ≤ Vo ≤ 16.0V). Electrolytic, tantalum and ceramic capacitors capacitors can be used. When selecting the capacitor ensure that the capacitance of more than 2.2μF(Min)(3.0V ≤ Vo ≤ Due to changes in temperature, the capacitance can fluctuate possibly resulting in oscillatio n. For selection of the capacitor refer to the Cout ESR vs Io data. The stable operation range given in the reference data is based on the standalone IC and resistive load. For actual applications the stable operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore verification of the final operating environment is needed. When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and DC-biasing characteristics and high voltage tolerance. Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual application meets with the required specification. Measurement circuit (BD00FD0W) Vcc CTL GND ADJ Vo VCTL (5.0V) Cin Cout ESR Io (Rout) (5k to 10kΩ) VCC (4.0V to 26.5V) Cout ESR vs Io 3.0V ≤ Vo ≤ 16.0V 4.0V ≤ Vcc ≤ 26.5V 3.0V ≤ Vo ≤ 16.0V 5kΩ ≤ R1 ≤ 10kΩ (BD00FD0W) 1.0µF ≤ Cin ≤ 100µF 2.2µF ≤ Cout ≤ 100µF 4.0V ≤ Vcc ≤ 26.5V 1.5V ≤ Vo < 3.0V 5kΩ ≤ R1 ≤ 10kΩ (BD00FD0W) 2.2µF ≤ Cin ≤ 100µF 4.7µF ≤ Cout ≤ 100µF 4.7µF ≤ Cout ≤ 100µF 0.001 0.01 0.1 100 0 400 800 1200 1600 2000 Io(mA) Cout_ESR(Ω ） Stable operating region Unstable operating region Cout ESR vs Io 1.5V ≤ Vo < 3.0V 0.001 0.01 0.1 100 0 400 800 1200 1600 2000 Io(mA) Cout_ESR(Ω ） Unstable operating region Stable operating region

© 2017 ROHM Co., Ltd. All rights reserved. 09.Sep.2019 Rev.003 www.rohm.com TSZ22111・15・001 Operational Notes – continued 16. CTL Pin Do not set the voltage level on the IC's enable pin in between VthH and VthL. Do not leave it floating or unconnected, otherwise, the output voltage would be unstable. 17. Rapid variation in Vcc Voltage and load Current CTL Pin In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as output transistor. Although the actual application might be the cause of the transient s, the IC input voltage, output current and temperature are also possible causes. In case problems arise within the actual operating range, use countermeasures such as adjusting the output capacitance. 18. Minute variation in output voltage In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 19. Regarding the Input Pin and Vcc voltage In some applications, the V cc and pi n potential might be reversed, possibly resulting in circuit internal damage or damage to the elements. For example, while the external capacitor is charged, the V cc shorts to the GND. Use a capacitor with a capacitance with less th an 1000μF. We also recommend using reverse polarity diodes in series or a bypass between all pins and the Vcc pin.

1.5 D15FD0WHFP

1.8 D18FD0WHFP

2.5 D25FD0WHFP

3.0 D30FD0WHFP

3.3 D33FD0WHFP

5.0 D50FD0WHFP

8.0 D80FD0WHFP

9.0 D90FD0WHFP

12.0 DJ2FD0WHFP

15.0 DJ5FD0WHFP

16.0 DJ6FD0WHFP

Voltage[V] Part Number Marking Variable 00FD0WFP2 1.5 15FD0WFP2 1.8 18FD0WFP2 2.5 25FD0WFP2 3.0 30FD0WFP2 3.3 33FD0WFP2 5.0 50FD0WFP2 8.0 80FD0WFP2 9.0 90FD0WFP2

12.0 J2FD0WFP2

15.0 J5FD0WFP2

16.0 J6FD0WFP2

HRP5 (TOP VIEW) Part Number Marking LOT Number 1PIN MARK TO263-5 TO263-5 (TOP VIEW) Part Number Marking LOT Number 1PIN

Revision History

21.Mar.2017 001 New Release 15.Mar.2018 002 TO263-5 package added 09.Sep.2019 003 Figure 12 changed Notation variation fixed

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( “Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse , is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. I f the flow soldering method is preferred on a surface-mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper name s of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Product Information

BD00FD0WFP2-E2 specifications and overview.

Summary

35V Voltage Resistance 2A LDO Regulators 09.Sep.2019 Rev.003

Description

The BDxxFD0 series are low-saturation regulators. The

Source title BD00FD0WFP2-E2 Datasheet(PDF) - Rohm

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