BATT-TPLCABLE20 | DigiCamel IC Datasheet

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UM11746 NXP | Alldatasheet

Document overview

Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 18

Technical content

Datasheet sections

1 Important notice
2 Getting started
2.1 Kit contents
2.2 Additional hardware
3 Getting to know the hardware
3.1 Board overview
3.2 Board features
3.3 Block diagram
3.4 Board description
3.5 Connectors
4 Configuring the hardware
4.1 Test setup
5 Available accessories
6 Legal information

Rev. 2 — 25 August 2022 User manual Document information Information Content Keywords CCMU, MC33665A, MC33775A Abstract User manual to work with centralized cell monitoring unit (CCMU) in controller area network flexible data rate (CAN FD) to perform voltage monitor and passive balancing with MC33775A.

NXP Semiconductors UM11746 RD33775ACNCEVB Rev Date Description 2 20220825 Modifications

Section 2, Section 3, and Section 4: updated text 1 20220802 initial version

Revision history

NXP Semiconductors UM11746 RD33775ACNCEVB

1 Important notice

For engineering development or evaluation purposes only NXP provides the product under the following conditions: This evaluation kit is for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed-circuit board to make it easier to access inputs, outputs and supply terminals. This evaluation board may be used with any development system or other source of I/O signals by connecting it to the host MCU computer board via off-the-shelf cables. This evaluation board is not a Reference Design and is not intended to represent a final design recommendation for any particular application. Final device in an application heavily depends on proper printed-circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality. The product provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end device incorporating the product. Due to the open construction of the product, it is the responsibility of the user to take all appropriate precautions for electric discharge. In order to minimize risks associated with the customers’ applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services.

2 Getting started

The NXP analog product development boards provide an easy-to-use platform for evaluating NXP products. The boards support a range of analog, mixed-signal, and power solutions. They incorporate monolithic integrated circuits and system-in-package devices that use proven high-volume technology. NXP products offer longer battery life, a smaller form factor, reduced component counts, lower cost, and improved performance in powering state-of-the-art systems. This document provides guidelines to use RD33775ACNCEVB.

2.1 Kit contents

The RD33775ACNCEVB kit contents include:

RD33775ACNCEVB
One transport protocol link (TPL) daisy chain cable
One power and CAN interface cable
Four cell interface cables
Quick start guide UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. User manual Rev. 2 — 25 August 2022

NXP Semiconductors UM11746 RD33775ACNCEVB

2.2 Additional hardware

NXP offers the following board solutions to check the functionality of devices and support the setup in testing the devices.

BATT-14CEMULTAOR: 14-cell battery pack or a battery emulator
BATT-14EXTENDER: battery emulator extender

3 Getting to know the hardware

3.1 Board overview

The RD33775ACNCEVB supports as a hardware reference design for centralized cell monitoring unit to communicate directly via CAN or CAN FD. The MC33665ATF4AE populated on RD33775ACNCEVB is a gateway router that can route TPL messages with CAN or CAN FD communication protocol. The MC33775A is a battery cell controller from NXP to monitor the cell voltages, temperatures, and passive balance. RD33775ACNCEVB can support to monitor up to 56 cells. Note: MC33665ATF4AE is used in RD33775ACNCEVB, any reference in this documentation as MC33665A is to be considered as MC33665ATF4AE.

3.2 Board features

The main features of RD33775ACNCEVB are:

CAN or CAN FD communication up to 5 Mbit/s to MC33665A
Onboard CAN transceiver TJA1443
Configurable CAN communication and CAN FD arbitration speeds using population variant of resistors for CFG0 and CFG1 pins
Configurable CAN ID (ID0_STB_OD, ID1, ID2, and ID3) for MC33665A using population variant of resistors
Four MC33775A battery cell controllers
Voltage monitoring and passive cell balancing functionality for 56 cells (emulator or relevant)
Capacitive isolation for daisy chain communication of onboard MC33775A devices
Transformer isolation for offboard daisy chain communication and from TPL port 0 of MC33665A to MC33775A
Flexible loopback configuration for single chain or two independent daisy chains without loopback UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. User manual Rev. 2 — 25 August 2022

3.3 Block diagram

Figure 1. RD33775ACNCEVB block diagram

3.4 Board description

directly with CAN or CAN FD. of MC33665A is interfaced to the first MC33775A onboard with transformer isolation. UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.

Figure 2. RD33775ACNCEVB description MC33775A battery cell controllers are populated on the high-voltage section of the board. termination of RD33775ACNCEVB. UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.

Figure 4. CAN HW settings for MC33665A Based on the circuit shown in Figure 4, CFG0 is set to HIGH and CFG1 is set to LOW.

3.5 Connectors

Figure 5. RD33775ACNCEVB connectors Pin configuration of connectors is shown in Table 2 to Table 8. UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.

1 VBAT connection to 12 V

2 CANH used for CANH interface for external communication

3 CANL used for CANL interface for external communication

4 GND ground connection for MC33665A and interface boards

Table 2. Power and CAN connector - J25

1 TPL1_P daisy chain port 1 positive

2 TPL1_N daisy chain port 1 negative

Table 3. Daisy chain TPL port 1 - J2

1 GND_B1 ground for MC33775A B1

2 B1_NTC7 temperature measurement; NTC7 for MC33775A B1

3 GND_B1 ground for MC33775A B1

4 B1_NTC6 temperature measurement; NTC6 for MC33775A B1

5 GND_B1 ground for MC33775A B1

6 B1_NTC2 temperature measurement; NTC2 for MC33775A B1

7 GND_B1 ground for MC33775A B1

8 B1_NTC1 temperature measurement; NTC1 for MC33775A B1

9 GND_B1 ground for MC33775A B1

10 GND_B1 ground for MC33775A B1

11 B1_C1P cell 1 positive for MC33775A B1

12 B1_C1M cell 1 negative for MC33775A B1

13 B1_C3P cell 3 positive for MC33775A B1

14 B1_C2P cell 2 positive for MC33775A B1

15 B1_C5P cell 5 positive for MC33775A B1

16 B1_C4P cell 4 positive for MC33775A B1

17 B1_C7P cell 7 positive for MC33775A B1

18 B1_C6P cell 6 positive for MC33775A B1

19 B1_C9P cell 9 positive for MC33775A B1

20 B1_C8P cell 8 positive for MC33775A B1

21 B1_C11P cell 11 positive for MC33775A B1

22 B1_C10P cell 10 positive for MC33775A B1

23 B1_C13P cell 13 positive for MC33775A B1

24 B1_C12P cell 12 positive for MC33775A B1

25 B1_C14P-PWR power for MC33775A B1

26 B1_C14P cell 14 positive for MC33775A B1

Table 4. Cell terminal and temperature - J1...continued

1 GND_B2 ground for MC33775A B2

2 B2_NTC7 temperature measurement; NTC7 for MC33775A B2

3 GND_B2 ground for MC33775A B2

4 B2_NTC6 temperature measurement; NTC6 for MC33775A B2

5 GND_B2 ground for MC33775A B2

6 B2_NTC2 temperature measurement; NTC2 for MC33775A B2

7 GND_B2 ground for MC33775A B2

8 B2_NTC1 temperature measurement; NTC1 for MC33775A B2

9 GND_B2 ground for MC33775A B2

10 GND_B2 ground for MC33775A B2

11 B2_C1P cell 1 positive for MC33775A B2

12 B2_C1M cell 1 negative for MC33775A B2

13 B2_C3P cell 3 positive for MC33775A B2

14 B2_C2P cell 2 positive for MC33775A B2

15 B2_C5P cell 5 positive for MC33775A B2

16 B2_C4P cell 4 positive for MC33775A B2

17 B2_C7P cell 7 positive for MC33775A B2

18 B2_C6P cell 6 positive for MC33775A B2

19 B2_C9P cell 9 positive for MC33775A B2

20 B2_C8P cell 8 positive for MC33775A B2

21 B2_C11P cell 11 positive for MC33775A B2

22 B2_C10P cell 10 positive for MC33775A B2

23 B2_C13P cell 13 positive for MC33775A B2

24 B2_C12P cell 12 positive for MC33775A B2

25 B2_C14P-PWR power for MC33775A B2

26 B2_C14P cell 14 positive for MC33775A B2

1 GND_B3 ground for MC33775A B3

2 B3_NTC7 temp - NTC7 for MC33775A B3

3 GND_B3 ground for MC33775A B3

4 B3_NTC6 temp - NTC6 for MC33775A B3

5 GND_B3 ground for MC33775A B3

6 B3_NTC2 temp - NTC2 for MC33775A B3

7 GND_B3 ground for MC33775A B3

8 B3_NTC1 temp - NTC1 for MC33775A B3

9 GND_B3 ground for MC33775A B3

10 GND_B3 ground for MC33775A B3

11 B3_C1P cell 1 positive for MC33775A B3

12 B3_C1M cell 1 negative for MC33775A B3

13 B3_C3P cell 3 positive for MC33775A B3

14 B3_C2P cell 2 positive for MC33775A B3

15 B3_C5P cell 5 positive for MC33775A B3

16 B3_C4P cell 4 positive for MC33775A B3

17 B3_C7P cell 7 positive for MC33775A B3

18 B3_C6P cell 6 positive for MC33775A B3

19 B3_C9P cell 9 positive for MC33775A B3

20 B3_C8P cell 8 positive for MC33775A B3

21 B3_C11P cell 11 positive for MC33775A B3

22 B3_C10P cell 10 positive for MC33775A B3

23 B3_C13P cell 13 positive for MC33775A B3

24 B3_C12P cell 12 positive for MC33775A B3

25 B3_C14P-PWR power for MC33775A B3

26 B3_C14P cell 14 positive for MC33775A B3

Table 6. Cell terminal and temperature - J35

1 GND_B4 ground for MC33775A B4

2 B4_NTC7 temp - NTC7 for MC33775A B4

3 GND_B4 ground for MC33775A B4

4 B4_NTC6 temp - NTC6 for MC33775A B4

5 GND_B4 ground for MC33775A B4

6 B4_NTC2 temp - NTC2 for MC33775A B4

7 GND_B4 ground for MC33775A B4

8 B4_NTC1 temp - NTC1 for MC33775A B4

9 GND_B4 ground for MC33775A B4

10 GND_B4 ground for MC33775A B4

11 B4_C1P cell 1 positive for MC33775A B4

12 B4_C1M cell 1 negative for MC33775A B4

13 B4_C3P cell 3 positive for MC33775A B4

14 B4_C2P cell 2 positive for MC33775A B4

15 B4_C5P cell 5 positive for MC33775A B4

16 B4_C4P cell 4 positive for MC33775A B4

17 B4_C7P cell 7 positive for MC33775A B4

18 B4_C6P cell 6 positive for MC33775A B4

19 B4_C9P cell 9 positive for MC33775A B4

20 B4_C8P cell 8 positive for MC33775A B4

21 B4_C11P cell 11 positive for MC33775A B4

22 B4_C10P cell 10 positive for MC33775A B4

23 B4_C13P cell 13 positive for MC33775A B4

24 B4_C12P cell 12 positive for MC33775A B4

25 B4_C14P-PWR power for MC33775A B4

26 B4_C14P cell 14 positive for MC33775A B4

Table 7. Cell terminal and temperature - J36...continued

1 RDTXP_B4 daisy chain port 0 extension; RDTX positive from B4

2 RDTXN_B4 daisy chain port 0 extension; RDTX negative from B4

Table 8. Daisy chain TPL port 0 extension - J30

4 Configuring the hardware

4.1 Test setup

Figure 6. RD33775ACNCEVB test setup CAN FD communication with RD33775ACNCEVB.

Set up the communication to RD33775ACNCEVB using the data sheets of MC33665A and MC33775A.
Set the CFG0, CFG1, ID0_STB_OD, ID1, ID2, and ID3 based on external CAN (FD) communication.
Based on test requirements, external MC33775A BCC devices can be connected to RD33775ACNCEVB. – Connect to J30 as extension to daisy chain port 0 from fourth MC33775A – Connect to J2 as second daisy chain of MC33775A BCC devices to daisy chain port 1 of MC33665A
External MC33771C/MC33772C can be connected to J2 as interface to daisy chain port 1 of MC33665A. Note: MC33771C/MC33772C BCC devices from NXP should not be connected to J30. UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. User manual Rev. 2 — 25 August 2022

Connect 12 V to BATT-14CEMULATOR and RD33775ACNCEVB after crosschecking the interface connections and boards based on test plan.

5 Available accessories

NXP Semiconductors UM11746 RD33775ACNCEVB

6 Legal information

6.1 Definitions

Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information.

6.2 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Evaluation products — This product is provided on an “as is” and “with all faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non- infringement, merchantability and fitness for a particular purpose. The entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. In no event shall NXP Semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. Notwithstanding any damages that customer might incur for any reason whatsoever (including without limitation, all damages referenced above and all direct or general damages), the entire liability of NXP Semiconductors, its affiliates and their suppliers and customer’s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (US$5.00). The foregoing limitations, exclusions and disclaimers shall apply to the maximum extent permitted by applicable law, even if any remedy fails of its essential purpose. Safety of high-voltage evaluation products — The non-insulated high voltages that are present when operating this product, constitute a risk of electric shock, personal injury, death and/or ignition of fire. This product is intended for evaluation purposes only. It shall be operated in a designated test area by personnel that is qualified according to local requirements and labor laws to work with non-insulated mains voltages and high-voltage circuits. The product does not comply with IEC 60950 based national or regional safety standards. NXP Semiconductors does not accept any liability for damages incurred due to inappropriate use of this product or related to non- insulated high voltages. Any use of this product is at customer’s own risk and liability. The customer shall fully indemnify and hold harmless NXP Semiconductors from any liability, damages and claims resulting from the use of the product. Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. User manual Rev. 2 — 25 August 2022

NXP Semiconductors UM11746 RD33775ACNCEVB Suitability for use in automotive applications (functional safety) — This NXP product has been qualified for use in automotive applications. It has been developed in accordance with ISO 26262, and has been ASIL classified accordingly. If this product is used by customer in the development of, or for incorporation into, products or services (a) used in safety critical applications or (b) in which failure could lead to death, personal injury, or severe physical or environmental damage (such products and services hereinafter referred to as “Critical Applications”), then customer makes the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. As such, customer assumes all risk related to use of any products in Critical Applications and NXP and its suppliers shall not be liable for any such use by customer. Accordingly, customer will indemnify and hold NXP harmless from any claims, liabilities, damages and associated costs and expenses (including attorneys’ fees) that NXP may incur related to customer’s incorporation of any product in a Critical Application.

6.3 Trademarks

Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. User manual Rev. 2 — 25 August 2022

NXP Semiconductors UM11746 RD33775ACNCEVB Tables Figures UM11746 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved. User manual Rev. 2 — 25 August 2022

Product Information

BATT-TPLCABLE20 specifications and overview.

Summary

RD33775ACNCEVB Rev. 2 - 25 August 2022

Description

RD33775ACNCEVB Rev. 2 - 25 August 2022

Source title BATT-TPLCABLE20 Datasheet(PDF) - NXP Semiconductors

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