BAT750 ZETEX | Alldatasheet

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Technical content

Features

  • L o w VF  High current capability  SOT23 package

Applications

 DC-DC converters  Mobile telecoms P C M I A

Ordering information

(inches) Tape width (mm) Quantity per reel BAT750TA 7 8 3000 C A C N/C A Top view

Issue 2 - May 2008 2 www.zetex.com © Zetex Semiconductors plc 2008 Absolute maximum ratings Electrical characteristics (@ Tamb = 25°C unless otherwise stated) Parameter Symbol Limit Unit Collector reverse voltage V R 40 V RMS reverse voltage V R(RMS) 28 V Forward current (continuous) I F 750 mA Forward voltage @ IF = 750mA V F 490 mV Average peak forward current; DC = 50% I FAV 1500 mA Non repetitive forward current t /H11349100/H9262S t/H113498.3ms IFSM 12 5.5 A Power dissipation @ Tamb = 25°C P tot 350 mW Typical thermal resistance, junction to ambient air R /H9052JA 286 °C/W Storage temperature range T stg -55 to +150 °C Junction temperature T j 125 °C Parameter Symbol Min. Typ. Max. Unit Conditions Reverse breakdown voltage V(BR)R 40 60 V I R = 300/H9262A Forward voltage V F 225 280 mV IF = 50mA (*) NOTES: (*) Measured under pulsed conditions. Pulse width = 300/H9262 duty cycle /H113492%. 235 310 mV IF = 100mA(*) 290 350 mV IF = 250mA(*) 340 420 mV IF = 500mA(*) 390 490 mV IF = 750mA(*) 440 540 mV IF = 1000mA(*) 530 650 mV IF = 1500mA(*) Reverse current I R 50 100 /H9262AV R = 30V Diode capacitance C D 25 - pF V R = 25V, f = 1.0MHz Reverse recovery time t rr 5- n s I F = IR = 100mA, Irr = 10mA

Issue 2 - May 2008 3 www.zetex.com © Zetex Semiconductors plc 2008 Thermal data

Issue 2 - May 2008 4 www.zetex.com © Zetex Semiconductors plc 2008 Typical characteristics

Issue 2 - May 2008 5 www.zetex.com © Zetex Semiconductors plc 2008 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Dim. Millimeters Inches Dim. Millimeters Inches A - 1.12 - 0.044 e1 1.90 NOM 0.075 NOM e0 . 9 5 N O M 0 . 0 3 7 5 N O M ----- E e L D A c E1L1 b 3 leads

Issue 2 - May 2008 6 www.zetex.com © Zetex Semiconductors plc 2008 Zetex sales offices Europe Zetex GmbH Kustermann-Park Balanstraße 59 D-81541 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc

700 Veterans Memorial Highway

Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com © 2008 Published by Zetex Semiconductors plc Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as desi gn ideas. It is the responsibility of the user to ensure that t he circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoev er is assumed by Zetex with respect to the accuracy or use of such in formation, or infringement of patents or other intellectual prop erty rights arising from such use or otherwise. Zetex does not assume any le gal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restricti on or otherwise) for any damages, loss of profit, business, con tract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support devi ce or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issu ed to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict bet ween the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts dire ctly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunc tion to degradation of function or performance in use over ti me. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding reg- ulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the Ro HS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: “Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production ha s been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet ver sion and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet cont aining finalized specifications. However, changes to specifications may occur, at any time and without notice.