BAT60BE6327 INFINEON | Alldatasheet

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Technical content

BAT60B... Silicon Schottky Diode

  • High current rectifier Schottky diode with very low VF drop (typ. 0.24 V at IF = 10mA)
  • For power supply applications
  • For clamping and protection in low voltage applications
  • For detection and step-up-conversion
  • Pb-free (RoHS compliant) package1)
  • Qualified according AEC Q101 BAT60B /G31 /G32 ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type Package Configuration Marking BAT60B SOD323 single white/5 Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage2) VR 10 V Forward current IF 3 A Non-repetitive peak surge forward current (t ≤ 10ms) IFSM 5 Total power dissipation TS ≤ 28°C Ptot 1350 mW Junction temperature Tj 150 °C Operating temperature range Top -55 ... 125 Storage temperature Tstg -55 ... 150 1Pb-containing package may be available upon special request 2For TA > 25 °C the derating of VR has to be considered. Please refer to curve Permissible reverse voltage.

BAT60B... Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) RthJS ≤ 90 K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Reverse current2) VR = 5 V VR = 8 V VR = 5 V, TA = 80 °C VR = 8 V, TA = 80 °C IR 100 410 800 1500 µA Forward voltage2) IF = 10 mA IF = 100 mA IF = 500 mA IF = 1000 mA VF 0.2 0.26 0.32 0.36 0.24 0.32 0.4 0.48 0.3 0.38 0.5 0.6 V AC Characteristics Diode capacitance VR = 5 V, f = 1 MHz CT 12 25 30 pF 1For calculation of RthJA please refer to Application Note Thermal Resistance 2Pulsed test: tp = 300 µs; D = 0.01

BAT60B... Reverse current IR = ƒ(VR) TA = Parameter 0 2 4 6 8 V 12 VR -10 10 -9 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 A IR 25°C -40°C 85°C 125°C Forward current IF = ƒ (VF) TA = Parameter VF -5 10 -4 10 -3 10 -2 10 -1 10 0 10 A IF -40°C 25°C 85°C 125°CPermissible Reverse voltage VR = ƒ (TA) tp = Parameter; duty cycle < 0.01 Device mounted on PCB with Rth = 160 K/W 0 20 40 60 80 100 120 °C 150 TA V VR 300µs 100ms DC Forward current IF = ƒ (TS) 0 15 30 45 60 75 90 105 120 °C 150 TS 500 1000 1500 2000 2500 mA 3500 IF

BAT60B... Permissible Puls Load RthJS = ƒ (tp) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp -1 10 0 10 1 10 2 10 K/WRthJS 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0 Permissible Pulse Load IFmax/ IFDC = ƒ (tp) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp 0 10 1 10 2 10 IFmax/IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5

BAT60B...Package SOD323 Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel BAR63-03W Type code Cathode marking Laser marking 0.80.8 0.6 1.7 marking Cathode ±0.22.5 0.25 0.3 -0.05 M A +0.1 +0.2 1.25-0.1 +0.05 -0.2 1.7 0.3 0.15-0.06 +0.1 0±0.05 +0.2 -0.1 A 0.9+0.2 -0.1 ±0.150.45 0.24 2.9 1.35 0.65Cathode marking

BAT60B... Edition 2006-02-01 Published by Infineon Technologies AG

81726 München, Germany

© Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.