BAR8802VH6327 INFINEON | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 10
Technical content
BAR88... Silicon PIN Diode
- Optimized for low current antenna switches in hand held applications
- Very low forward resistance (typ. 1.5 Ω @ IF = 1 mA)
- Low capacitance at zero volt reverse bias at frequencies above 1 GHz (typ. 0.28 pF)
- Very low signal distortion
- Pb-free (RoHS compliant) package BAR88-02LRH BAR88-02V /G31 /G32 Type Package Configuration LS(nH) Marking BAR88-02LRH BAR88-02V TSLP-2-7 SC79 single, leadless single 0.4 0.6 U Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 80 V Forward current IF 100 mA Total power dissipation BAR88-02LRH T s ≤ 133°C BAR88-02V, Ts ≤ 123°C Ptot 250 250 mW Junction temperature Tj 150 °C Operating temperature range Top -55 ... 125 Storage temperature Tstg -55 ... 150
BAR88... Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) BAR88-02LRH BAR88-02V RthJS ≤ 65 ≤ 105 K/W Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage I (BR) = 5 µA V(BR) 80 - - V Reverse current V R = 60 V IR - - 50 nA Forward voltage I F = 1 mA IF = 100 mA VF 0.75 0.95 0.9 1.2 V 1For calculation of RthJA please refer to Application Note Thermal Resistance
BAR88... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics Diode capacitance VR = 1 V, f = 1 MHz VR = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz CT 0.3 0.4 0.28 0.25 0.4 pF Reverse parallel resistance V R = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz RP 2.5 1.5 kΩ Forward resistance I F = 1 mA, f = 100 MHz IF = 5 mA, f = 100 MHz IF = 10 mA, f = 100 MHz rf 1.5 0.8 0.6 2.5 Ω Charge carrier life time I F = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω τ rr - 500 - ns I-region width WI - 13 - µm Insertion loss1) IF = 1 mA, f = 1.8 GHz IF = 5 mA, f = 1.8 GHz IF = 10 mA, f = 1.8 GHz IL 0.11 0.07 0.06 dB Isolation1) VR = 0 V, f = 0.9 GHz VR = 0 V, f = 1.8 GHz VR = 0 V, f = 2.45 GHz ISO 1BAR88-02LRH in series configuration, Z = 50Ω
BAR88... Diode capacitance CT = ƒ (VR) f = Parameter 0 2 4 6 8 10 12 14 16 V 20 VR 0.1 0.15 0.2 0.25 0.3 0.35 0.4 pF 0.5 CT
1 MHz
100 MHz
1 GHz
1.8 GHz
Reverse parallel resistance RP = ƒ(VR) f = Parameter 0 2 4 6 8 10 12 14 16 V 20 VR -1 10 0 10 1 10 2 10 3 10 4 10 KOhmRp Forward resistance rf = ƒ (IF) f = 100MHz 10 -2 10 -1 10 0 10 1 10 2 mA IF -1 10 0 10 1 10 2 10 Ohmrf Forward current IF = ƒ (VF) TA = Parameter VF -9 10 -8 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 A IF -40°C +25°C +85°C +125°C
BAR88... Forward current IF = ƒ (TS) BAR88-02LRH 0 15 30 45 60 75 90 105 120 °C 150 TS 100 mA 120 IF Forward current IF = ƒ (TS) BAR88-02V 0 15 30 45 60 75 90 105 120 °C 150 TS 100 mA 120 IF Permissible Puls Load RthJS = ƒ (tp) BAR88-02LRH 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 1 °C tp -1 10 0 10 1 10 2 10 K/WRthJS 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0 Permissible Pulse Load IFmax/ IFDC = ƒ (tp), BAR88-02LRH 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 °C tp 0 10 1 10 2 10 IFmax/IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
BAR88... Permissible Pulse Load IFmax/ IFDC = ƒ (tp) BAR88-02V 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 °C tp 0 10 1 10 2 10 IFmax/IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 Permissible Puls Load RthJS = ƒ (tp) BAR88-02V 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 °C tp -1 10 0 10 1 10 2 10 3 10 K/WRthJS 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0 Insertion loss IL = -|S21|2 = ƒ(f) IF = Parameter BAR88-02LRH in series configuration, Z = 50Ω 0 1 2 3 4 GHz 6 f -0.4 -0.35 -0.3 -0.25 -0.2 -0.15 -0.1 dB |S21|2 10 mA 5 mA 1 mA 0.5 mA 0.1 mA Isolation ISO = -|S21|2 = ƒ(f) VR = Paramter BAR88-02LRH in series configuration, Z = 50Ω 0 1 2 3 4 GHz 6 f -30 -25 -20 -15 -10 dB |S21|2 0 V 1 V 10 V
BAR88...Package SC79
BAR88... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code 1) New Marking Layout for SC75, implemented at October 2005. Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 201 3 2014 0 1 apAPapAPapAP 0 2 bqB Q bqB Q bqB Q 0 3 crC R crC R crC R 0 4 d sDSd sDSd sDS 0 5 e t ETe t ETe t ET 0 6 fuF U fuF U fuF U 0 7 gvG VgvG VgvG V 0 8 h xHXh xHXh xHX 0 9 jyJ Y jyJ Y jyJ Y 1 0 k zKZk zKZk zKZ 1 1 l 2L4 l 2L4 l 2L4 1 2 n3N5n3N5n3N5
BAR88...Package TSLP-2-7 ±0.050.6 ±0.050.65 ±0.0350.25 1) 1±0.05 0.05 MAX. +0.010.39-0.03 1) Dimension applies to plated terminal Cathode marking 1)±0.0350.5 Bottom viewTop view Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) For board assembly information please refer to Infineon website "Packages" 0.45 0.275 0.275 0.375 0.925 Copper Solder mask Stencil apertures 0.35 0.6 0.35 0.3 0.76 1.16 0.5 Cathode marking BAR90-02LRH Type code Cathode marking Laser marking
BAR88... Edition 2009-11-16 Published by Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com >). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.