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BAR64... Silicon PIN Diode
- High voltage current controlled RF resistor for RF attenuator and switches
- Frequency range above 1 MHz up to 6 GHz
- Very low capacitance at zero volt reverse bias at frequencies above 1 GHz (typ. 0.17 pF)
- Low forward resistance (typ. 2.1 Ω @ 10 mA)
- Very low signal distortion
- Pb-free (RoHS compliant) package
- Qualified according AEC Q1011) BAR64-06 BAR64-06W BAR64-05 BAR64-05W BAR64-02EL BAR64-02V BAR64-03W BAR64-04 BAR64-04W /G31 /G32 /G33 /G31 /G44 /G32 /G32 /G44 /G31 /G33 /G31 /G44 /G32 /G32 /G44 /G31 /G33 /G31 /G44 /G32 /G32 /G44 /G31 Type Package Configuration LS(nH) Marking BAR64-02EL* BAR64-02V BAR64-03W BAR64-04 BAR64-04W BAR64-05 BAR64-05W BAR64-06 BAR64-06W TSLP-2-19 SC79 SOD323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 single, leadless single single series series common cathode common cathode common anode common anode 0.4 0.6 1.8 1.8 1.4 1.8 1.4 1.8 1.4 OE O blue 2 PPs PPs PRs PRs PSs PSs 1*BAR64-02EL is not qualified according AEC Q101
BAR64... Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 150 V Forward current IF 100 mA Total power dissipation BAR64-02EL, T S ≤ 135 °C BAR64-02V, TS ≤ 125 °C BAR64-03W, TS ≤ 25 °C BAR64-04W, -05W, -06W, TS ≤ 115 °C Ptot 250 250 250 250 250 mW Junction temperature Tj 150 °C Operating temperature range Top -55 ... 125 Storage temperature Tstg -55 ... 150 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) BAR64-02EL BAR64-02V, -04W, -05W, -06W BAR64-03W BAR64-04, -05, -06 RthJS ≤ 60 ≤ 140 ≤ 370 ≤ 340 1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation) Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage I (BR) = 5 µA V(BR) 150 - - V Forward voltage I F = 50 mA VF - - 1.1
BAR64... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics Diode capacitance VR = 20 V, f = 1 MHz VR = 0 V, f = 100 MHz VR = 0 V, f = 1...1.8 GHz, BAR64-02EL VR = 0 V, f = 1...1.8 GHz, all other CT 0.23 0.3 0.13 0.17 0.35 pF Reverse parallel resistance V R = 0 V, f = 100 MHz VR = 0 V, f = 1 GHz VR = 0 V, f = 1.8 GHz RP kΩ Forward resistance I F = 1 mA, f = 100 MHz IF = 10 mA, f = 100 MHz IF = 100 mA, f = 100 MHz rf 12.5 2.1 0.85 2.8 1.35 Ω Charge carrier life time I F = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω τ rr - 1550 - ns I-region width WI - 50 - µm Insertion loss1) IF = 3 mA, f = 1.8 GHz IF = 5 mA, f = 1.8 GHz IF = 10 mA, f = 1.8 GHz IL 0.32 0.23 0.16 dB Isolation1) VR = 0 V, f = 0.9 GHz VR = 0 V, f = 1.8 GHz VR = 0 V, f = 2.45 GHz VR = 0 V, f = 5.6 GHz ISO 14.5 8.5 1BAR64-02EL in series configuration, Z = 50 Ω
BAR64... Diode capacitance CT = ƒ (VR) f = Parameter 0 2 4 6 8 10 12 14 16 V 20 VR 0.1 0.2 0.3 0.4 0.5 pF 0.7 CT
1 MHz
100 MHz
1 GHz
1.8 GHz
Reverse parallel resistance RP = ƒ(VR) f = Parameter 0 5 10 15 20 25 30 V 40 VR -1 10 0 10 1 10 2 10 3 10 4 10 KOhmRp Forward resistance rf = ƒ (IF) f = 100MHz 10 -2 10 -1 10 0 10 1 10 2 mA IF -1 10 0 10 1 10 2 10 3 10 Ohm RF Forward current IF = ƒ (VF) TA = Parameter VF -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 A IF -40 °C 25 °C 85 °C 125 °C
BAR64... Intermodulation intercept point IP3 = ƒ (IF); f = Parameter 10 -1 10 0 10 1 mA IF 1 10 2 10 dBm IP3 f=1800MHz f=900MHz Forward current IF = ƒ (TS) BAR64-02EL 0 30 60 90 120 °C 165 TS 100 mA 120 IF Forward current IF = ƒ (TS) BAR64-02V 0 15 30 45 60 75 90 105 120 °C 150 TS 100 mA 120 IF Forward current IF = ƒ (TS) BAR64-04, BAR64-05, BAR64-06 0 15 30 45 60 75 90 105 120 °C 150 TS 100 mA 120 IF
BAR64... Forward current IF = ƒ (TS) BAR64-04W, BAR64-05W, BAR64-06W 0 15 30 45 60 75 90 105 120 °C 150 TS 100 mA 120 IF Permissible Puls Load RthJS = ƒ (tp) BAR64-02EL 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp -1 10 0 10 1 10 2 10 K/WRthJS 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0 Permissible Pulse Load IFmax/ IFDC = ƒ (tp) BAR64-02EL 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp 0 10 1 10 2 10 IFmax/IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
BAR64... Permissible Puls Load RthJS = ƒ (tp) BAR64-02V 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp -1 10 0 10 1 10 2 10 3 10 K/WRthJS 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0 Permissible Pulse Load IFmax/ IFDC = ƒ (tp) BAR64-02V 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 1 s tp 0 10 1 10 2 10 IFmax / IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 Permissible Puls Load RthJS = ƒ (tp) BAR64-04, BAR64-05, BAR64-06 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP -1 10 0 10 1 10 2 10 3 10 K/WRthJS 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0 Permissible Pulse Load IFmax/ IFDC = ƒ (tp) BAR64-04, BAR64-05, BAR64-06 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP 0 10 1 10 2 10 IFmax/IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
BAR64... Permissible Pulse Load IFmax/ IFDC = ƒ (tp) BAR64-04W, BAR64-05W, BAR64-06W 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 1 s tP 0 10 1 10 2 10 IFmax/IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 Permissible Puls Load RthJS = ƒ (tp) BAR64-04W, BAR64-05W, BAR64-06W 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tP -1 10 0 10 1 10 2 10 3 10 K/W RthJS 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D = 0 Isolation ISO = -|S21|2 = ƒ(f) VR = Parameter BAR64-02EL in series configuration, Z = 50Ω f -30 -25 -20 -15 -10 dB |S21|2 0 V 1 V 10 V Insertion loss IL = -|S21|2 = ƒ(f) IF = Parameter BAR64-02EL in series configuration, Z = 50Ω 0 1 2 3 4 GHz 6 f -0.4 -0.35 -0.3 -0.25 -0.2 -0.15 -0.1 dB |S21|2 3 mA 5 mA 10 mA 100 mA
BAR64...Package SC79
BAR64... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code 1) New Marking Layout for SC75, implemented at October 2005. Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 201 3 2014 0 1 apAPapAPapAP 0 2 bqB Q bqB Q bqB Q 0 3 crC R crC R crC R 0 4 d sDSd sDSd sDS 0 5 e t ETe t ETe t ET 0 6 fuF U fuF U fuF U 0 7 gvG VgvG VgvG V 0 8 h xHXh xHXh xHX 0 9 jyJ Y jyJ Y jyJ Y 1 0 k zKZk zKZk zKZ 1 1 l 2L4 l 2L4 l 2L4 1 2 n3N5n3N5n3N5
BAR64...Package SOD323
BAR64...Package SOT23 Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel EH s BCW66 Type code Pin 1 0.8 0.9 0.91.3 0.8 1.2
0.25 M BC
1.9 -0.05 +0.10.4 ±0.12.9 0.95 C B 0...8˚ 0.2 A 0.1 MAX. 1.3 ±0.1 10˚ MAX. M 2.4 ±0.15 ±0.11 A 0.15 MIN. 1) Lead width can be 0.6 max. in dambar area 3.15 2.65 2.13 0.9 0.2 1.15Pin 1 Manufacturer 2005, June Date code (YM)
BAR64...Package SOT323 Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 1.25 ±0.1 0.1 MAX. 2.1±0.1 0.15 +0.1 -0.05 0.3+0.1 ±0.10.9 A ±0.22 -0.05 0.650.65 M 0.1 0.1 MIN. 0.1 M0.2 A 0.24 2.15 1.1 2.3 Pin 1 Pin 1 2005, June Date code (YM) BCR108W Type code 0.6 0.8 1.6 0.65 0.65 Manufacturer
BAR64...Package TSLP-2-19
BAR64... Edition 2009-11-16 Published by Infineon Technologies AG
81726 Munich, Germany
2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com >). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.