BAR1 INFINEON | Alldatasheet

Document overview

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Technical content

  • RF switch, RF attenuator for frequencies above 10 MHz
  • Low distortion faktor
  • Long-term stability of electrical characteristics
  • Pb-free (RoHS compliant) package
  • Qualified according AEC Q101 BAR61BAR16-1BAR14-1 BAR15-1 /G33 /G31 /G44 /G32 /G32 /G44 /G31 /G33 /G31 /G44 /G32 /G32 /G44 /G31 /G32 /G31 /G34 /G33 /G44 /G31 /G44 /G32 /G44 /G33 /G33 /G31 /G44 /G32 /G32 /G44 /G31 Type Package Configuration LS(nH) Marking BAR14-1 BAR15-1 BAR16-1 BAR61 SOT23 SOT23 SOT23 SOT143 series common cathode common anode PI element 1.8 1.8 1.8 L7s L8s L9s 61s Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 100 V Forward current IF 140 mA Total power dissipation TS ≤ 65°C Ptot 250 mW Junction temperature Tj 150 °C Operating temperature range Top -55 ... 125 Storage temperature Tstg -55 ... 150 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) RthJS ≤ 340 K/W 1For calculation of RthJA please refer to Application Note Thermal Resistance

Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Reverse current VR = 50 V VR = 100 V IR 100 1000 nA Forward voltage I F = 100 mA VF - 1.05 1.25 V AC Characteristics Diode capacitance VR = 0 V, f = 100 MHz VR = 50 V, f = 1 MHz CT 0.2 0.25 0.5 0.5 pF Zero bias conductance V R = 0 V, f = 100 MHz gP - 50 100 µS Forward resistance IF = 0.01 mA, f = 100 MHz IF = 0.1 mA, f = 100 MHz IF = 1 mA, f = 100 MHz IF = 10 mA, f = 100 MHz rf 300 5.5 2600 470 4200 Ω Charge carrier life time IF = 10 mA, IR = 6 mA, measured at IR = 3 mA, RL = 100 Ω τ rr 700 1000 - ns I-region width WI - 146 - µm

Diode capacitance CT = ƒ (VR) f = Parameter 00.0 EHD07067BAR 14-1...16-1 C T RV 0.5 pF 1.0 f = 1 = 100f MHz MHz 10 20 30 40 V 50 Forward resistance rf = ƒ (IF) f = 100MHz EHD07066BAR 14-1...16-1 r f FΙ -2 2 10mA 010 Ω 10 4 10 1 10 2 10 3 -110 010 110 Forward current IF = ƒ (VF) TA = 25°C 0.010 EHD07065BAR 14-1...16-1 Ι F FV -110 010 110 10 2 mA -40 ˚CTA = 150 0.5 1.0 V 1.5 Forward current IF = ƒ (TS) BAR14-1, BAR15-1, BAR16-1 0 15 30 45 60 75 90 105 120 °C 150 TS 100 120 mA 160 IF

VReg. +12 V OutputInput 1 nF Ω1 k Ω1 k 1 nF 50 kΩ 1 nF 1 nF1 nF Ω5.6 k 4.7 k Ω 1 nF Ω12 k 1 nF 1 nF Ω1.8 k 2.2 kΩ

Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel RF s 2005, June Date code (YM) BFP181 Type code Pin 1 0.8 0.81.2 0.9 1.1 0.9 1.2 0.8 0.8 0.8 -0.05 +0.1 1.9 1.7 ±0.12.9 +0.1 -0.050.4 0.1 MAX.

0.25 M B

±0.11 10˚ MAX. 0.15 MIN. 0.2 AM 2.4 ±0.15 0.2 10˚ MAX.A 1.3 ±0.1 0...8˚ 2.6 3.15Pin 1 0.2 1.15 B Manufacturer

Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel EH s BCW66 Type code Pin 1 0.8 0.9 0.91.3 0.8 1.2

0.25 M BC

1.9 -0.05 +0.10.4 ±0.12.9 0.95 C B 0...8˚ 0.2 A 0.1 MAX. 1.3 ±0.1 10˚ MAX. M 2.4 ±0.15 ±0.11 A 0.15 MIN. 1) Lead width can be 0.6 max. in dambar area 3.15 2.65 2.13 0.9 0.2 1.15Pin 1 Manufacturer 2005, June Date code (YM)

81726 Munich, Germany

 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com >). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.