BA01203 MITSUBISHI | Alldatasheet
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Technical content
MITSUBISHI SEMICONDUCTOR <GaAs HBT> BA01203 Specifications are subject to change without notice. GaAs HBT HYBRID IC
DESCRIPTION
BA01203 is GaAs RF amplifier designed OUTLINE DRAWING for CDMA/AMPS handheld-phone. Unit : millimeters 1 t Tr FEATURES fo | ih High gain Gp=28dB lo oe de Single supply voltage Vcc=3.2V | | | i laf CDMA-mode © ® a High power Po=28.5dBm ~ 9 * i High efficiency Ict=580mA(38%) - ~ hd AMPS-mode Spe Ov Oe High power Po=31dBm(@Vcc=3.2V) if |] @ rin © Pout High efficiency Ict=820mA(@Po=31dBm,Vcc=3.2V) q bod Over Oo Internal input and output matching : || @cw © oo Small size: 6x6mm? 5 baie? snitsmn APPLICATION * CDMAVAMPS 824-849MHz handset. ABSOLUTE MAXIMUM RATINGS(Ta=25°C. Vcc _|Correctorvoltage | | St Pin linputPower —|[zG=zi-502_ | 5 | dBm | [rc(op) [Operating case temp. | | -30~ 495 [tstg [Storage temp, | | “80+ 1285 Each maximum rating is guaranteed independently. ELECTRICAL CHARACTERISTICS (Ta=25°C, Recommendation of operation voltage=3.2-4.2' Condition , Symbol Parameter Notet [Min] TYP [Max | Unit | freq_|Frequency(TDMA/AMPS eee ee ed [tq auiescent Curent no-nnputvecsavvanooy | ~ | 75 | ~ | ma |_Pin [input Power CMA modo? [= | + | — |aam| | ict {Total Corrector Current Po=28.5dBm |. [seo] - | ma] | ACP _ [Adjacent channel power(+885KHz) Vc1=Vce2=3.2V, | -- | | -29 | apc | NACP__|Adjacent channel power(+1.98MHz) __|Vref=3.0V | | | -a2 | aac | [Pin input Power lamPS-modePo-aidam | - | 3 | ~ | aam| Total Corrector Current Ve1=Vce2=3.2V | -- | 820 | - | ma | asp/asp lend/rd Harmonics Vref=3.0V | | — | 30 | ac | Noise in RX band [fo] [ase | Notet: 2g=Z1=50(2) Note2: CDMA modulated signal based on IS-95 STD. Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (1) placement of | substitutive, auxiliary, circuits, (2) use of non-flammable material or (3) prevention against malfunction or mishap. | ‘00/Jul