B3DK3

B3DK3 HARVATEK | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 15

Technical content

Features

• Support signal reshaping to pass control waveforms to next adjacent driver
• Cascading port transmission by a single data line
• Built-in current regulator, three-way drive.
• Optional- Optional maximal drive current: 5mA
• 256-step gray-scale output to allow 16,777,216 color display
• Built-in oscillator 20MHz
• LED driver port maximum withstand Voltage 6.5V
• Built-in power-on-reset (2.6V) (@VDD=5V)
• Operating voltage 4.5~5.5V

Applications

• Decorative LED lighting
• LED video display

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 2/15 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 3/15 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices o r systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 4/15 Product Specifications Item Specification Material Quantity Luminous Intensity(Iv) Red : 40~120 mcd Green : 60~180 mcd Blue : 15~60 mcd IC@5V, R/G/B@5mA Ts= 25O C; Tolerance ±10% Wavelength Red : 618~625 nm Green : 518~535 nm Blue : 460~474 nm IC@5V, R/G/B@5mA Ts= 25O C; Tolerance ±10% Applied voltage 5V_DC View angle 120o Resin Clear Epoxy Carrier tape Conductive black tape 3000 ea/reel Reel Conductive black Label HT standard Paper Packing bag 220x240mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified Others: Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. Note :This is shipped test conditions ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP , GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 5/15 Label Specifications ■Harvatek P/N: B 3DK 3 BRG- 05C- 0001 13 ■ Lot No.: Product Dice Current Taping PCB 3:Tri R/G/B:5mA 1. Taping style 2. Q’ty Package Color Series Number 2.0(L)x2.0(W)x0.9(H) mm RGB RGB(Full Color) X001~XZZZ

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 6/15 Specifications Range ■Luminous Intensity (Iv) : Color Spec. Range R 40-120 mcd G 60-180 mcd B 15-60 mcd Note: It maintains a tolerance of ±10% on luminous intensity ■Wavelength : Color Spec. Range R 618-625 nm G 518-535 nm B 460-474 nm Note: It maintains a tolerance of + 0.5nm on Wavelength Bin

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 7/15 Product Features Electro-Optical Characteristics (TSoldering , 25 oC) Series Emitting Color Material Wavelength λ(nm) IV(mcd) Viewing Angle 12 λD λP △ λ Typical B3DK3BRG R AllnGaP 624 630 18 65 120 G InGaN 523 518 35 85 120 B InGaN 470 465 25 20 120 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (Unit:mm Tolerance: +/ -0.1) Outline Dim. Soldering Pattern Soldering terminals may shift in the x, y direction. Absolute Maximum Ratings (unless otherwise specified, Temperature=25° C) ( TSoldering 25 ℃) Characteristic Symbol Rating Unit Supply Voltage VDD 6.5 V Power Dissipation PD <400 mW Maximum Output Current ILEDOUT 5 mA Welding Temperature TM 300(8S) °C Operating Temperature Range TOPR -40~85 °C Storage Temperature Range TSTO -65~120 °C

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 8/15

Electrical Characteristics

Parameter Symbol Min. Typ. Max. Units Note Supply Voltage VDD 4.5 5 5.5 V Operation Current IDD 2 mA R、G、B no load Input High “H” of DI VIH 2.7 VDD V Input Low “L” of DI VIL 0 1.0 V Pull Down Resistance RPD 500K Ω DI, DO Output High “H” of DO VOH 4.5 V IOH=4mA Output Low “L” of DO VOL 0.4 V IOL=4mA R, G, B Sink Current Isink 4.75 5 5.25 mA Vo=VDD-3.0V @VDD=5V Input leakage Ileak 1 uA DI=VDD R , G , B off leakage current Ioff 1 uA PWM=0(off), @R, G, B =5V Parameter Symbol Min. Typ. Max. Units Note Propagation delay time tPLZ 300 ns DI → DO, CL=15pF, RL=10KΩ tPZL 300 ns Rising time tTZH 200 ns R、G、B=20mA, CL=30pF Falling time tTHZ 200 ns Data rate Fdata 800 Khz

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 9/15 Data Transfer Protocol The single wire data transfer protocol supports 24-bit data for each LED RGB display data refresh. The IC receives 24-bit data and passes the remaining data to next LED. The 24-bit data consist of green, red and blue data, each with 8-bit width, and are transferred with MSB first. The transferred data are recognized based on the pulse widths received by the IC. A low bit 0 is represented by a 0.3us high pulse followed by a 0.9us low pulse. A high bit 1 is represented by a 0.9us hig h pulse followed by a 0.3us low pulse. A low pulse ≧ 200us is used to issue a reset command to the IC to start a new cycle of serial commands.

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 10/15 Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within 72hours after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the produ cts may be modified for improvement without further notice. 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti -electrostatic glove when handling the LEDs. If a voltage over the absol ute maximum rating is applied to LEDs, it will damage LEDs. Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 11/15 Packaging Tape Dimension Dim. A Dim. B Dim. C Q’ty/Reel

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 12/15 Reel Dimension Packing 5 or 10 boxes per carton is available depending on shipment quantity.

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 13/15 Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. A humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows: Baking Baking before soldering is recommended when the package has been unsealed for 72hours. The conditions are as followings: 1. 60±3℃×(12~24hrs)and<5%RH, taped reel type. 2. 100±3℃×(45min~1hr), bulk type. 3. 130±3℃×(15min~30min), bulk type. Precautions 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit. 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light. 6. If possible, assemble the unit in a clean room or dust-free environment.

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 14/15 Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 220℃ ,60 sec. 2. Peak temp.:260 ℃Max.,10sec Max. 3. Reflow soldering should not be done more than two times. 4. Never attempt next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as following: Lead-free Solder Profile Reworking  Rework should be completed within 5 seconds under 260 ℃.  The iron tip must not come in contact with the copper foil.  Twin-head type is preferred. Cleaning Following are cleaning procedures after soldering:  An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.  Temperature x Time should be 50℃ x 30sec. or <30℃ x 3min  Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter  Curing: 100 ℃ max, <3min

Official Product HT Part No. B3DK3BRG-05C-000113 Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 02/07/2020 Version 1.0 Page 15/15 Cautions of Pick and Place  Avoid stress on the resin at elevated temperature.  Avoid rubbing or scraping the resin by any object.  Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended. Revise History Rev. Descriptions Date Page 1.0 - 02/07/2020 -