B3C73RBG-K9C

B3C73RBG-K9C HARVATEK | Alldatasheet

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• Manufacturer or author: Meicer
• PDF pages: 16

Technical content

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 1/15 Harvatek Surface Mount CHIP LEDs Data Sheet B3C73RBG-K9C-0001H4 (Preliminary)

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 2/15 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 3/15 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical c omponent in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 4/15 Product Specifications Item Specification Material Quantity Luminous Intensity(Iv) 50-135 mcd R@0.9mA B@0.65mA G@1mA Ts= 25 O C; Tolerance ±10% Chromaticity Coordinate AS page 6 & 7 R@0.9mA B@0.65mA G@1mA Ts = 25 O C;Tolerance: + 0.007 Vf R：1.6-2.6 V B：2.0-3.0 V G：2.0-3.0 V R@0.9mA B@0.65mA G@1mA Ts= 25 O C;Tolerance ± 0.05V Ir < 100 µA @ VR = 5V Resin Water clear Epoxy Carrier tape EIA 481-1A specs Conductive black tape 4000ea/reel Reel EIA 481-1A specs Conductive black Label HT standard Paper Packing bag 250x230mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified Others: Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. Note :This is shipped test conditions ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP , GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 5/15 Label Specifications ■Harvatek P/N: B 3C7 3 RBG- K9C- 0001 H4 ■ Lot No.: Product Dice Current Taping PCB 3: Tri R 0.9mA B 0.65mA G 1 mA 1. Taping style 2. Q’ty Package Color Series Number 1.0(L)x1.0(W)x0.25(H) mm RBG(White) 0001~ZZZZ

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 6/15 Specifications Range ■Electro-Optical Characteristics (Ta=25℃): Color Color MIN MAX Condition Luminous Intensity (IV) Red 22.5 71.5 IF=2mA Blue 14.5 45 Green 71.5 180 Dominant Wavelength (WD) Red 620 630 Blue 466 475 Green 523 539 Forward Voltage (Vf) Red 1.6 2.4 Blue 2.4 3.4 Green 2.4 3.4 *Just for reference.

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 7/15 ■Luminous Intensity (Iv) Bin: Color Bin Code MIN MAX Condition White P1 45 56 R: IF=0.9mA G: IF=1mA B: IF=0.65mA P2 56 71.5 Q1 71.5 90 Q2 90 112.5 R1 112.5 140 Note: It maintains a tolerance of ±10% on luminous intensity ■Color Bin: Bin Code CIE_x BIN CODE CIE_y White A 0.207 0.250 0.207 0.300 0.257 0.320 0.257 0.270 B 0.257 0.270 0.257 0.320 0.307 0.340 0.307 0.290 C 0.207 0.300 0.207 0.350 0.257 0.370 0.257 0.320 D 0.257 0.320 0.257 0.370 0.307 0.390 0.307 0.340 Note: It maintains a tolerance of x,y ±0.007

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 8/15 ■CIE Chromaticity Diagram ■Forward Voltage (Vf) Bin: HT-B3C73RGB Series Vf Red Green Blue 4 2.88 2.94 4 2.75 2.85 5 3 3.06 5 2.85 2.95 6 3.06 3.12 6 7 3.12 3.18 7 Note: It maintains a tolerance of ±0.05V on forward voltage measurements

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 9/15 Product Features Electro-Optical Characteristics (TSoldering , 25 oC) Series Lightting Forward Voltage(V) I* V(mcd) Color typ. max White min max IF(mA) B3C73RBG-J9 Red 1.8 2.4 45 135 R 0.9 mA B 0.65 mA G 1 mA Blue 2.4 3.0 Green 2.5 3.0 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (Unit:mm Tolerance: +/ -0.1) Outline Dim. Soldering Pattern Soldering terminals may shift in the x, y direction. ( TSoldering 25 ℃) Absolute Maximum Ratings *Condition for IFP is pulse of 1/10 duty and 0.1msec width *Remarks:This product should be operated in forward bias.If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. Series PD (mW) IF (mA) VR(V) IFP (mA) TOP (oC) TST (oC) Color Power Dissipation Forward Current Reverse Voltage Pulse Forward Current Color Power Dissipation Red 12.75 0.9 5 20 -40~+85 -40~+100 Blue 0.65 Green 1

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 10/15 Characteristics of B3C73RBG – J9

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 11/15 Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within 4 weeks after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for improvement without further notice. 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti -electrostatic glove when handling the LEDs.If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs.Damaged LEDs will show some abnormal characteristi cs such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 12/15 Packaging Tape Dimension Dim. A Dim. B Dim. C Q’ty/Reel nit: mm

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 13/15 Reel Dimension Packing 5 boxes per carton is available depending on shipment quantity.

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 14/15 Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. A humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows: Baking Baking before soldering is recommended when the package has been unsealed for 4 weeks. The conditions are as followings: 1. 60±3℃×(12~24hrs)and<5%RH, taped reel type. 2. 100±3℃×(45min~1hr), bulk type. 3. 130±3℃×(15min~30min), bulk type. Precautions 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit. 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light. 6. If possible, assemble the unit in a clean room or dust-free environment.

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 15/15 Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 220℃ ,60 sec. 2. Peak temp.:260 ℃Max.,10sec Max. 3. Reflow soldering should not be done more than two times. 4. Never attempt next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as following: Lead-free Solder Profile Reworking  Rework should be completed within 5 seconds under 260 ℃.  The iron tip must not come in contact with the copper foil.  Twin-head type is preferred. Cleaning Following are cleaning procedures after soldering:  An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.  Temperature x Time should be 50℃ x 30sec. or <30℃ x 3min  Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter  Curing: 100 ℃ max, <3min

Official Product HT Part No. B3C73RBG-K9C-0001H4 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 08/07/2017 Version 1.0 Page 16/15 Cautions of Pick and Place  Avoid stress on the resin at elevated temperature.  Avoid rubbing or scraping the resin by any object.  Electric-static may cause damage to the component. Please ensure that the equipm ent is properly grounded. Use of an ionizer fan is recommended. Revise History Rev. Descriptions Date Page 1.0 - 08/07/2017 -