B37B3 HARVATEK | Alldatasheet
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- Manufacturer or author: Meicer
- PDF pages: 15
Technical content
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 1/15 Harvatek Surface Mount CHIP LEDs Data Sheet B37B3BGR-10C-000274 Preliminary
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 2/15 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 3/15 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical c omponent in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 4/15 Product Specifications Item Specification Material Quantity Luminous Intensity(Iv) R： 28.5-285 mcd G： 71.5-450 mcd B： 18~180 mcd @10mA/ Ts= 25℃;Tolerance: + 10% Wavelength R：615.0-630.0 nm G：515.0-530.0 nm B：460.0-472.0 nm @10mA/ TS= 25℃;Tolerance: + 0.5nm Vf R：1.6-2.4 V G：2.6-3.4 V B：2.6-3.4 V @10mA/ TS= 25℃ ;Tolerance: + 0.05V Ir < 1 µA @ VR = 5V Resin Clear Epoxy Carrier tape EIA 481-1A specs Conductive black tape 4000ea/reel Reel EIA 481-1A specs Conductive black Label HT standard Paper Packing bag 220x240mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified Others: Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. Note :This is shipped test conditions ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP , GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 5/15 Label Specifications ■Harvatek P/N: B 37B 3 BGR 10C- 0002 74 ■ Lot No.: Product Dice Current Taping PCB 3: Tri 10mA 1. Taping style 2. Q’ty Package Color Series Number 2.0(L)x1.4(W)x0.9(H) mm BGR : RGB(Full Color) 0001~ZZZZ
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 6/15 Specifications Range ■Luminous Intensity (Iv) Bin: Luminous Intensity (Iv) Bin:R/G/B@10mA HT-B37B3BGR Series IV Red Green Blue N 28.5 45 R 112.5 180 M 18 28.5 P 45 71.5 S 180 285 N 28.5 45 Q 71.5 112.5 T 285 360 P 45 71.5 R 112.5 180 U 360 450 Q 71.5 112.5 S 180 285 V 450 560 R 112.5 180 Note: It maintains a tolerance of ±10% on luminous intensity Dominant Wavelength (λD) Bin: HT-B37B3 BGR Series WD Red Green Blue A 615 620 A 515 520 A 460 464 B 620 625 B 520 525 B 464 468 C 625 630 C 525 530 C 468 472 Note: It maintains a tolerance of + 0.5nm on color Forward Voltage (Vf) Bin: HT-B37B3BGR Series VF Red Green Blue Note: It maintains a tolerance of ±0.05V on forward voltage measurements
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 7/15 Product Features Electro-Optical Characteristics (TSoldering , 25 oC) Series Emitting Color Material VF(V) Wavelength λ(nm) IV(mcd) Viewing Angle 12 Typ max λD λP △ λ Typical B37B3BGR Red AllnGaP 2.0 2.4 620 627 16 100 X=120 Y=104 Green InGaN 2.9 3.4 523 516 35 290 X=109 Y=111 Blue InGaN 2.9 3.4 467 461 22 55 X=113 Y=113 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering (Unit:mm Tolerance: +/ -0.1) Outline Dim. Soldering Pattern Soldering terminals may shift in the x, y direction.
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 8/15 ( TSoldering 25 ℃) Absolute Maximum Ratings *Condition for IFP is pulse of 1/10 duty and 0.1msec width *Remarks:This product should be operated in forward bias.If a reverse voltage is continuously applied to the product,such operation can cause migration resulting in LED damage. Characteristics of B37B3BGR Series PD (mW) VR(V) IF (mA) IFP (mA)* Top(°C) Color Power Dissipation Reverse Voltage Forward Current Pulse Forward Current Operating Temperature Red 30 5 10 ≦20 -40~85 Green 40 5 10 ≦20 Blue 40 5 10 ≦20
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 9/15 Directive Characteristics Directive Characteristics
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 10/15 Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LED s must be used within 72 hours after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for imp rovement without further notice. 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti -electrostatic glove when handling the LEDs.If a voltage over the absolute maximum rating is applie d to LEDs, it will damage LEDs.Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 11/15 Packaging Tape Dimension Dim. A Dim. B Dim. C Q’ty/Reel
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 12/15 Reel Dimension Packing 5 boxes per carton is available depending on shipment quantity.
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 13/15 Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. A humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows: Baking Baking before soldering is recommended when the package has been unsealed for 72 hours. The conditions are as followings: 1. 60±3℃×(12~24hrs)and<5%RH, taped reel type. 2. 100±3℃×(45min~1hr), bulk type. 3. 130±3℃×(15min~30min), bulk type. Precautions 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit. 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light. 6. If possible, assemble the unit in a clean room or dust-free environment.
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 14/15 Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 220℃ ,60 sec. 2. Peak temp.:260 ℃Max.,10sec Max. 3. Reflow soldering should not be done more than two times. 4. Never attempt next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as following: Lead-free Solder Profile Reworking Rework should be completed within 5 seconds under 260 ℃. The iron tip must not come in contact with the copper foil. Twin-head type is preferred. Cleaning Following are cleaning procedures after soldering: An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended. Temperature x Time should be 50℃ x 30sec. or <30℃ x 3min Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter Curing: 100 ℃ max, <3min
Official Product HT Part No. B37B3BGR-10C-000274 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 03/26/2019 Preliminary Page 15/15 Cautions of Pick and Place Avoid stress on the resin at elevated temperature. Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended. Revise History Rev. Descriptions Date Page 1.0 - 12/17/2018 -