B36J3 HARVATEK | Alldatasheet
Document overview
- Manufacturer or author: Meicer
- PDF pages: 16
Technical content
Features
- Package: RGB 3 in 1 package/4pin Polarity
- Anti-Reflection resin
- View angle : >=120ﾟ (min 50% brightness)
- Component solder able surface finish is gold
- High contrast Main Applications
- Indoor display
- Full color display
- Fine pitch application
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 2/16 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 3/16 DISCLAIMER HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. LIFE SUPPORT POLICY HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 4/16 Product Specifications Specification Material Quantity Luminous Intensity(Iv) Red : 32 mcd typical Green : 46 mcd typical Blue : 8 mcd typical R@5mA;G/B@2mA/ Ts= 25O C; Tolerance ±10% Wavelength Red : 621 nm typical Green : 530 nm typical Blue : 470 nm typical R@5mA;G/B@2mA/ Ts= 25O C;Tolerance ± 0.5nm Vf Red : 2.4 V maximum Green : 3.1 V maximum Blue : 3.1 V maximum R@5mA;G/B@2mA/ Ts= 25O C;Tolerance ± 0.05V Ir < =1 µA @ VR = 5 V Resin Dark Epoxy Carrier tape EIA 481-1A specs Conductive black tape 24000pcs/reel Reel EIA 481-1A specs Conductive black Label HT standard Paper Packing bag 250x230mm Aluminum laminated bag/ no-zipper One reel per bag Carton HT standard Paper Non-specified
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 5/16 Others: Each immediate box consists of 28 reels. The 28 reels may not necessarily have the same lot number or the same bin combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label as well. Note :This is shipped test conditions ※Remarks: This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. ATTENTION: Electrostatic Discharge (ESD) protection The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts built with AlInGaP , GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must be taken during design and assembly. If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process. Label Specifications 順向電壓 客戶品號 宏齊品號 日期 數量 波長 光強度 批號
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 6/16 ■Harvatek P/N: B 36J 3 RGB- F6C- 0001 HO Lot No. 1 2 3 4 5 6 7 8 9 10 1 7 N E 4 1 L N 1 1 Code 1 2 Code 3 Code 4 Code 5 Code 6 Code 7 Code 8 Code 9 Code 10 Mfg.Year Mfg.Month Consecutive number Special code Internal Tracing Code Mixing Lot No. 2010-A 2011-B 2012-C 2013-D 2014-E 1:Jan 2:Feb A:Oct B:Nov C:Dec 01~ZZ 000~ZZZ Product Dice Current Taping PCB 3:Tri R:5mA G/B:2mA 1. Taping style 2. Q’ty Package Color Series Number 0.65(L)x0.65(W)x0.5(H) mm RGB RGB(Full Color) X001~XZZZ
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 7/16 Specifications Range ■Luminous Intensity (Iv) Bin: Luminous Intensity (Iv) Bin: R@5mA;G/B @2mA B36J3RGB Series IV Red Green Blue HG1 24 30 HH1 33.5 42 HC1 6 7.5 HG3 30 37.5 HH3 42 52.5 HC3 7.5 9.4 HH1 33.5 42 HJ1 47 60 HD1 8.5 10.7 HH2 37.5 47 HJ2 52.5 65.7 HD2 9.4 12 HH3 42 52.5 HJ3 60 75 HD3 10.7 13.4 Note: It maintains a tolerance of ±10% on Luminous Intensity Dominant Wavelength (λD) Bin: R@5mA;G/B @2mA B36J3RGB Series WD Red Green Blue RH2 618 623 GH1 526 530 BH1 464 468 RH3 623 628 GH2 528 532 BH2 466 470 RH4 628 633 GH3 530 534 BH3 468 472 GH4 532 536 BH4 470 474 GH5 534 538 Note: It maintains a tolerance of ±0.5nm on Color Bin Forward Voltage (Vf) Bin: R@5mA;G/B @2mA B36J3RGB Series Vf Red Green Blue Note: It maintains a tolerance of ±0.05V on forward voltage measurements
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 8/16 Product Features Electro-Optical Characteristics (IF Red@5mA,Green &Blue@2mA, Ts 25 oC) Part number Emitting Forward Wavelength V(mcd) Viewing Angle 2θ1/2 Color Voltage(VF) (nm) typ. typ. max. λD λp Δλ typ. B36J3RGB-F6 Ultra Bright Red 1.9 2.4 621 628 11 32 140 Green 2.5 3.1 530 521 28 46 140 Blue 2.5 3.1 469 465 16 8 140 Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering Unit: mm Tolerance: +/-0.1 Outline Dim. Soldering Pattern Soldering terminals may shift in the x, y direction. Absolute Maximum Ratings (TS 25 oC) Series PD (mW) IF (mA) IFP (mA) VR(V) TOP (oC) TST (oC) Color Power Dissipation Forward Current Pulse Forward Current Reverse Voltage Operation Temperature Storage Temperature Red 24.4 Blue/Green 2 ** Condition for IFP is pulse of 1/10 duty and 0.1msec width
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 9/16 Characteristics of B36J3RGB-F6 Relative Intensity vs. Forward Current Forward Voltage vs. Forward Current Forward Current vs. Ambient Temperature Wavelength vs. Forward Current
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 10/16 Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within seven days after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for improvement without further notice. 6. The LEDs are sensitive to the static electri city and surge. It is strongly recommended to use a grounded wrist band and anti -electrostatic glove when handling the LEDs.If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs.Damaged LEDs will show some abnormal character istics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 11/16 Packaging Tape Dimension Dim. A Dim. B Dim. C Q’ty/Reel nit: mm
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 12/16 Reel Dimension Packing 28 boxes per carton is available depending on shipment quantity.
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 13/16 Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. Upon request, a humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows: Baking Baking before soldering is recommended when the package has been unsealed for 4weeks. The conditions are as followings: 1. MBB open≤672hrs, 50±3℃×(3hrs) 2. MBB open>672hrs, 60±3℃×(8~12hrs)and<5%RH, taped reel type. 3. 100±3℃×(45min~1hr), bulk type. 4. 130±3℃×(15min~30min), bulk type.
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 14/16 PRECAUTIONS 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit. 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light. 6. If possible, assemble the unit in a clean room or dust-free environment. Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 220 OC ,60sec 2. Peak temp.:260 OCMax.,10sec Max. 3. Never take next process until the component is cooled down to room temperature after reflow. 4. The recommended reflow soldering profile (measuring on the surface of the LED terminal) is following: Lead-free Solder Profile 5. Reflow soldering should not be done more than two times
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 15/16 Reworking Rework should be completed within 5 seconds under 260 OC. The iron tip must not come in contact with the copper foil. Twin-head type is preferred. Cleaning Following are cleaning procedures after soldering: An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended. Temperature x Time should be 50oC x 30sec. or <30oC x 3min Ultra sonic cleaning: < 15W/ bath; bath volume ≤ 1liter Curing: 100 OC max, <3min Cautions of Pick and Place Avoid stress on the resin at elevated temperature. Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended.
Official Product HT Part No. B36J3RGB-F6 Customer Part No. Data Sheet No. Specifications are subject to changes for improvement without advance notice. Proprietary data, drawings, company confidential all rights reserved. 04/10/2018 Version 1.0 Page 16/16 Revise History Rev. Descriptions Date Page 1.0 - 04/10/2018 -