B352F110T24_2 VICOR | Alldatasheet
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vicorpower.com 800-735-6200 Rev. 1.3 9/2009 Page 1 of 2 –Out +Out –Out +Out –In +InPC RSV TM S NRTLCU S RoHS VIB0003TFJ AP4141PRS724558BCM U.S. PATS. LISTED ON PACKING MATERIALS & DATASHEETS VICOR CORP . MADE IN USA Efficiency: 95% Typical Input: HV 270 / 350 / 380 V Power Density: >1000 W/in3 Current sharing: 5% Isolation: 4,242 Vdc Footprint: 1.1 in2 VI Chip TM BCM TM HV Bus Converter Family Product Description The HV Bus Converter Module family consists of six models that provide an isolated intermediate bus voltage to power non-isolated POL converters. The HV BCMs offer direct conversion from PFC bus voltage to 12 V POL at up to 300 W with isolation to 4,242 Vdc. The HV family provides superior performance, the highest efficiency and power density in the smallest package available. 32,5 1.28 22,0 0.87 –Out +Out –Out +Out –In +InPC RSV TM S NRTLCU S RoHS BCM U.S. PATS. LISTED ON PACKING MATERIALS & DATASHEETS VICOR CORP . MADE IN USA –Out +Out –Out +Out –In +InPC RSV TM S NRTLCU S RoHS BCM U.S. PATS. LISTED ON PACKING MATERIALS & DATASHEETS VICOR CORP . MADE IN USA HV POL LOAD –Out +Out –Out +Out –In +InPC VC TM S NRTLCU S RoHS –In +In –Out +Out PR NC IL TM PC VC CD NC OS SG SC VH S NRTLCU S RoHS U.S. PATS. LISTED ON PACKING MATERIALS & DATASHEETS PRM VICOR CORP . MADE IN USA VTM U.S. PATS. LISTED ON PACKING MATERIALS & DATASHEETS VICOR CORP . MADE IN USA HV LOAD LOAD 48 V 12 V 0.8 – 55 V Typical Applications 6,73 0.265 mm inActual size Model Input Output Output Output Temp. Number* Voltage Voltage Power Current Grade Package (V) (V) (W) (A) B352F110T24 330 – 365 10.3 – 11.4 240 24.0 T Full B384F120T30 360 – 400 11.25 – 12.5 300 25.0 T Full VIB0001TFJ 330 – 365 10.3 – 11.4 300 28.0 T Full VIB0002TFJ 360 – 400 45.0 – 50.0 300 7.0 T Full VIB0003TFJ 330 – 365 41.25 – 45.62 325 7.7 T Full VMB0004MFJ 240 – 330 30.0 – 41.25 240 7.3 MIL COTS Full * Products are also available in through-hole model. See individual datasheets.
vicorpower.com 800-735-6200 Rev. 1.3 9/2009 Page 2 of 2 General Specifications Parameter Typ Unit Note MTBF MIL-HDBK-217F 3.5 Mhrs 25°C, GB Isolation Voltage 4,242 Vdc Input to output (basic insulation) Capacitance 500–660 pF Input to output Resistance 10 M Ω Input to output cTÜVus UL /CSA 60950, EN60950 Regulatory compliance CE Mark Low voltage directive RoHS Thermal Over temperature shutdown 125 °C minimum, junction temperature Case-to-ambient thermal impedance 3.7 °C/W with 0.25” heat sink @ 300 LFM Operating junction temperature -40 to 125 °C T–Grade Operating junction temperature -55 to 125 °C MIL–COTS Storage temperature -40 to 125 °C The products described on this data sheet are protected by the following U.S. Patents Numbers: 5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472 and for use under 6,975,098 and 6,984,965 BCM Mechanical Outline Drawing* Heat Sink Push-Pin Hole Pattern 2.95±0.07 [0.116±0.00 3] NON-PLATED THROUGH HOLE SEE NOTE 1. ø (2) PL (4. 37) 0.172 (11. 37) 0.44 8 (7.00) 0.276 (36.50) 1.4 37 (1 8.25) 0.719 (2.510) 0.099 (31.4 8) 1.240 (39.50) 1.555 SEE NOTE 2. DOTTED LINE INDICATES VIC POSITION SEE NOTE 3 HEAT SINK PUSH-PIN HOLE PATTERN ( TOP SIDE SHOWN ) SEE NOTE 3 BOTTOM VIEW RECOMMENDED LAND PA TTERN ( COMPONENT SIDE SHOWN ) TOP VIEW ( COMPONENT SIDE ) inch mmNOTES: 1. DIMENSIONS ARE . 2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE: 3. PRODUCT MARKING ON TOP SURFACE DXF and PDF files are available on vicorpower.com inch (mm) NOTES: 1. MAINTAIN 3.5/[0.138] DIA. KEEP OUT ZONE FREE OF COPPER. ALL PCB LAYERS. 2. MINIMUM RECOMMENDED PITCH IS 39.50/[1.555]. THIS PROVIDES 7.00/[0.276] COMPONENT EDGE-TO-EDGE SPACING. AND 0.50/[0.020] CLEARANCE BETWEEN VICOR HEAT SINKS. 3. VI CHIP LAND PATTERN SHOWN FOR REFERENCE ONL Y; ACTUAL LAND PATTERN MAY DIFFER. DIMENSIONS FROM EDGES OF LAND PATTERN TO PUSH-PIN HOLES WILL BE THE SAME FOR ALL FULL SIZE VI CHIPS. 4. DIMENSION ARE * For through–hole mechanical drawing see individual datasheets.