B10 RHOPOINT | Alldatasheet
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RHOPOINT COMPONENTS LTD Email: sales@rhopointcomponents.com Web: www.rhopointcomponents.com B10 RF Relays Ball Grid Array Relays Coto’s Ball Grid Array (BGA) construction offers a breakthrough in reed relay performance. This patented technology 1 allows for shorter RF paths in a controlled 50 Ω environment to minimize signal attentuation. The designer is now able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies. This is particularly important in Mixed Signal IC testers. BGA packag- ing allows relays to be integrated easily on boards designed for surface mount processing. Series Features Applications /whwydiamond BGA Surface Mount /whwydiamond IC T esters /whwydiamond Ability to pass GHz signals /whwydiamond In-Line Relay T esters /whwydiamond Rise time < 40ρSec /whwydiamond Memory T esters /whwydiamond 50Ω Characteristic Impedance /whwydiamond Mixed Signal T esters /whwydiamond Low Capacitance /whwydiamond High Bandpass Applications /whwydiamond Patented Design1 Dimensions in Inches (Millimeters) Notes:
1 Protected by one or more of the following
US Patents: 6025768, 6052045, 6294971, 6683518, RE38381 and other foreign patents.
41RHOPOINT COMPONENTS LTD Email: sales@rhopointcomponents.com Web: www.rhopointcomponents.com B10 RF Relays NOTES: 1All parameters specified per EIA/NARM standards for dry reed relays, # RS-421 and RS-436, if a suitable parametric standard exists. 2Unless otherwise noted, all parameters are specified at 25°C and 40% RH. 3Life expectancies based on characteristic life (63.2% failure) calculated from the 2-parameter Weibull distribution. Contact resistance >2.0 Ω defines end of life. 4Frequency at which the difference between output and input signal amplitude exceeds -3dB. (Direct wired using 50 Ω coaxial cable.) ENVIRONMENTAL RATINGS: Storage T emperature: -35°C to +100°C. Operating T emperature: -20°C to +85°C. Vibration: sinusoidal vibration with an amplitude of 10G over a 10Hz to 2000Hz frequency range shall not cause a closed channel activated at the nominal coil voltage to open, not an open channel to close. Max Soldering T emperature: 226°C (438°F) max for 1 minute dwell time. T emperature measured at a relay ball termination. B10 Test Parameters Conditions 1,2 Min Typ Max Units Coil Resistance 49.5 55.0 60.5 Ω Nominal Voltage 3.3V Coil 5.0 4.0 Volts DC Must Operate Voltage 2.4 Volts DC Must Release V oltage 0.4 Volts DC Coil Resistance 135.0 150.0 165.0 Ω Nominal Voltage 5V Co il 5.0 6.0 Volts DC Must Operate Voltage 3.8 Volts DC Must Release V oltage 0.4 Volts DC Switching Voltage Max DC/Peak AC 125 Volts Switching Current 0.25 Amps Carry Current (Continuous) Switch and Shield 0.5 Amps Contact Rating (Resistive Load) Resistive Load 3.0 Watts Life Expectancy Signal Switching 3 1VDC / 10mA 1000 x 10 6 Ops Resistive Load3 12VDC / 10mA 1 x 106 Ops Other Load Conditions3 Consult Factory Static Contact Resistance (initial) 0.05VDC / 10mA 0.125 Ω Dynamic Contact Resistance (initial) 0.5V / 50mA 100 Hz, 1.5 mSec 0.150 Ω Insulation Res All Isolated Pins 100VDC 10 !10 10 12 Ω Capacitance Across Contacts Shield Guarding 0.2 pF Capacitance Open Contact to Coil Shield Guarding 0.5 pF Capacitance Closed Contact to Coil Shield Guarding 1 pF Across Contacts 100 µA 150 V (DC/Pk AC) Dielectric Contact to Coil 100 µA 1500 V (DC/Pk AC) Strength Contact to Shield 100 µA 1500 V (DC/Pk AC) Operate Time (including bounce) Nominal Voltage coil drive @ 30 Hz, 100 200 µSec Release Time (Si diode damped) square wave 30 50 µSec RF Insertion Loss4 -3 dB roll-off frequency 10.0 GHz Signal Rise Time (10% - 90%) Corrected for measurement 40 pSec system response time