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Document overview

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Technical content

Features

 Low noise and high linearity performance  Enhancement Mode Technology[1]  Excellent uniformity in product specifi cations  Low cost surface mount small plastic package SOT- 343 (4 lead SC-70) in Tape-and-Reel packaging option available  Lead-free option available Specifi cations 2 GHz; 3V, 30 mA (Typ.)  30.5 dBm output 3rd order intercept  19 dBm output power at 1 dB  0.5 dB noise fi gure  16.5 dB associated gain

Applications

 Q1 LNA for cellular/PCS/WCDMA base stations  Q1, Q2 LNA and Pre-driver amplifi er for 3–4 GHz WLL  Other low noise and high linearity applications at 450 MHz to 6 GHz Note: 1. Enhancement mode technology requires positive Vgs, thereby eliminating the need for the negative gate voltage associated with conventional depletion mode devices. Pin Connections and Package Marking Note: Top View. Package marking provides orientation and identifi cation “8F” = Device Code “x” = Date code character identifi es month of manufacture. SOURCE DRAIN GATE SOURCE 8Fx Attention: Observe precautions for handling electrostatic sensitive devices. ESD Machine Model (Class A) ESD Human Body Model (Class 1A) Refer to Avago Technologies Application Note A004R: Electrostatic Discharge Damage and Control.

Symbol Parameter and Test Condition Units Min. Typ. [2] Max.

  1. Measurements obtained using production test board described in Figure 5.
  2. Typical values determined from a sample size of 500 parts from 3 wafers.

Figure 5. Block diagram of 2 GHz production test board used for Noise Figure, Associated Gain, P1dB and OIP3 measurements. This circuit represents a trade-off between an optimal noise match and associated impedance matching circuit losses.

  1. F min values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are based on a

set of 16 noise fi gure measurements made at 16 diff erent impedances using an ATN NP5 test system. From these measurements Fmin is calculated. Refer to the noise parameter application section for more information.

  1. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of

via holes are placed within 0.010 inch from each source lead contact point, one via on each side of that point. Figure 19. MSG/MAG and S21 vs. Frequency

  1. F min values at 2 GHz and higher are based on measurements while the Fmins below 2 GHz have been extrapolated. The Fmin values are based on a

set of 16 noise fi gure measurements made at 16 diff erent impedances using an ATN NP5 test system. From these measurements Fmin is calculated. Refer to the noise parameter application section for more information.

  1. S and noise parameters are measured on a microstrip line made on 0.025 inch thick alumina carrier. The input reference plane is at the end of

via holes are placed within 0.010 inch from each source lead contact point, one via on each side of that point. Figure 20. MSG/MAG and S21 vs. Frequency

Package Dimensions Outline 43 (SOT-343/SC70 4 lead)

Ordering Information

Part Number No. of Devices Container ATF-58143-TR1G 3000 7” Reel ATF-58143-TR2G 10000 13”Reel ATF-58143-BLKG 100 antistatic bag HE D A1b E 1.30 (.051) BSC 1.15 (.045) BSC CL A DIMENSIONS (mm) MIN. 1.15 1.85 1.80 0.80 0.80 0.00 0.15 0.55 0.10 0.10 MAX. 1.35 2.25 2.40 1.10 1.00 0.10 0.40 0.70 0.20 0.46 SYMBOL E D HE A b c L NOTES: 1. All dimensions are in mm. 2. Dimensions are inclusive of plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. All specifications comply to EIAJ SC70. 5. Die is facing up for mold and facing down for trim/form, ie: reverse trim/form. 6. Package surface to be mirror finish. Recommended PCB Pad Layout for Avago's SC70 4L/SOT-343 Products 1.30 (0.051) 0.60 (0.024) 0.9 (0.035) Dimensions in mm (inches) 1.15 (0.045) 2.00 (0.079) 1.00 (0.039)

Tape Dimensions For Outline 4T For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes 5989-3749EN AV02-0672EN - June 8, 2012 P Po P2 F W C D E Ao 10 MAX. t1 (CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS) 10 MAX. Bo Ko DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES) LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER Ao Bo Ko P 2.40 ± 0.10 2.40 ± 0.10 1.20 ± 0.10 4.00 ± 0.10 1.00 + 0.25 0.094 ± 0.004 0.094 ± 0.004 0.047 ± 0.004 0.157 ± 0.004 0.039 + 0.010 CAVITY DIAMETER PITCH POSITION D Po E 1.55 ± 0.10 4.00 ± 0.10 1.75 ± 0.10 0.061 + 0.002 0.157 ± 0.004 0.069 ± 0.004 PERFORATION WIDTH THICKNESS W 8.00 + 0.30 - 0.10 0.254 0.02 0.315 + 0.012 0.0100 ± 0.0008 CARRIER TAPE CAVITY TO PERFORATION (WIDTH DIRECTION) CAVITY TO PERFORATION (LENGTH DIRECTION) F 3.50 ± 0.05 2.00 ± 0.05 0.138 ± 0.002 0.079 ± 0.002 DISTANCE WIDTH TAPE THICKNESS C Tt 5.40 ± 0.10 0.062 ± 0.001 0.205 + 0.004 0.0025 ± 0.0004 COVER TAPE Device Orientation USER FEED DIRECTION COVER TAPE CARRIER TAPE REEL END VIEW 8 mm 4 mm TOP VIEW 8Fx 8Fx8Fx8Fx