ATA5423

ATA5423_06 ATMEL | Alldatasheet

Document overview

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Technical content

Features

• Multi Channel Half-duplex Transceiver with Approximately ±2.5 MHz Programmable Tuning Range
• High FSK Sensitivity: –106 dBm at 20 Kbit/s/–109.5 dBm at 2.4 Kbit/s (433.92 MHz)
• High ASK Sensitivity: –112.5 dBm at 10 Kbit/s/–116.5 dBm at 2.4 Kbit/s (433.92 MHz)
• Low Supply Current: 10.5 mA in RX and TX Mode (3V/TX with 5 dBm)
• Data Rate: 1 to 20 Kbit/s Manchester FSK, 1 to 10 Kbit/s Manchester ASK
• ASK/FSK Receiver Uses a Low-IF Architecture with High Selectivity, Blocking, and Low Intermodulation (Typical Blocking 55 dB at ±750 kHz/61 dB at ±1.5 MHz and 70 dB at ±10 MHz, System I1dBCP = –30 dBm/System IIP3 = –20 dBm)
• 226 kHz/237 kHz IF Frequency with 30 dB Image Rejection and 170 kHz Usable IF Bandwidth
• Transmitter Uses Closed Loop Fractional-N Synthesizer for FSK Modulation with a High PLL Bandwidth and an Excellent Isolation between PLL/VCO and PA
• Tolerances of XTAL Compensated by Fractional-N Synthesizer with 800 Hz RF Resolution
• Integrated RX/TX-Switch, Single-ended RF Input and Output
• RSSI (Received Signal Strength Indicator)
• Communication to Microcontroller with SPI Interface Working at Maximum 500 kBit/s
• Configurable Self Polling and RX/TX Protocol Handling with FIFO-RAM Buffering of Received and Transmitted Data
• 5 Push Button Inputs and One Wake-up Input are Active in Power-down Mode
• Integrated XTAL Capacitors
• PA Efficiency: up to 38% (433.92 MHz/10 dBm/3V)
• Low In-band Sensitivity Change of Typically ±1.8 dB within ±58 kHz Center Frequency Change in the Complete Temperature and Supply Voltage Range
• Supply Voltage Switch, Supply Voltage Regulator, Reset Generation, Clock/Interrupt Generation and Low Battery Indicator for Microcontroller
• Fully Integrated PLL with Low Phase Noise VCO, PLL Loop Filter and Full Support of Multi-channel Operation with Arbitrary Channel Distance Due to Fractional-N Synthesizer
• Sophisticated Threshold Control and Quasi-peak Detector Circuit in the Data Slicer
• Power Management via Different Operation Modes
• 315 MHz, 345 MHz, 433.92 MHz, 868.3 MHz and 915 MHz without External VCO and PLL Components
• Inductive Supply with Voltage Regulator if Battery is Empty (AUX Mode)
• Efficient XTO Start-up Circuit (> –1.5 kΩ Worst Case Real Start-up Impedance)
• Changing of Modulation Type ASK/FSK and Data Rate without Component Changes
• Minimal External Circuitry Requirements for Complete System Solution
• Adjustable Output Power: 0 to 10 dBm Adjusted and Stabilized with External Resistor
• ESD Protection at all Pins (1.5 kV HBM, 200V MM, 1 kV FCDM)
• Supply Voltage Range: 2.4V to 3.6V or 4.4V to 6.6V
• Temperature Range: –40°C to +85°C
• Small 7 × 7 mm QFN48 Package UHF ASK/FSK Transceiver ATA5423 ATA5425 ATA5428 ATA5429 4841C–WIRE–05/06

4841C–WIRE–05/06 ATA5423/25/28/29

Applications

• Consumer Industrial Segment
• Access Control Systems
• Remote Control Systems
• Alarm and Telemetry Systems
• Energy Metering
• Home Automation Benefits
• Low System Cost Due to Very High System Integration Level
• Only One Crystal Needed in System
• Less Demanding Specification for the Microcontroller Due to Handling of Power-down Mode, Delivering of Clock, Reset, Low Battery Indication and Complete Handling of Receive/Transmit Protocol and Polling
• Single-ended Design with High Isolation of PLL/VCO from PA and the Power Supply Allows a Loop Antenna in the Remote Control Unit to Surround the Whole Application

4841C–WIRE–05/06 ATA5423/25/28/29 General Description The ATA5423/25/28/29 is a highly integrated UHF ASK/FSK multi-channel half-duplex trans- ceiver with low power consumption supplied in a small 7 x 7 mm QFN48 package. The receive part is built as a fully integrated low-IF receiver, whereas direct PLL modulation with the frac- tional-N synthesizer is used for FSK transmission and switching of the power amplifier for ASK transmission. The device supports data rates of 1 Kbit/s to 20 Kbit/s (FSK) and 1 Kbit/s to 10 Kbit/s (ASK) in Manchester, Bi-phase and other codes in transparent mode. The ATA5428 can be used in the 431.5 MHz to 436.5 MHz and in the 862 MHz to 872 MHz bands, the ATA5423 in the 312.5 MHz to 317.5 MHz band, the ATA5425 in the 342.5 MHz to 347.5 MHz band and the ATA5429 in the 912.5 MHz to 917.5 MHz band. The very high system integration level results in a small number of external components needed. Due to its blocking and selectivity performance, together with the additional 15 dB to 20 dB loss and the narrow bandwidth of a typical loop antenna in a remote control unit, a bulky blocking SAW is not needed in the remote control unit. Additionally, the building blocks needed for a typi- cal remote control and access control system on both sides (the base and the mobile stations) are fully integrated. Its digital control logic with self-polling and protocol generation enables a fast challenge- response system without using a high-performance microcontroller. Therefore, the ATA5423/ATA5425/ATA5428/ATA5429 contains a FIFO buffer RAM and can compose and receive the physical messages themselves. This provides more time for the microcontroller to carry out other functions such as calculating crypto algorithms, composing the logical messages, and controlling other devices. Therefore, a standard 4-/8-bit microcontroller without special periphery and clocked with the CLK output of about 4.5 MHz is sufficient to control the communi- cation link. This is especially valid for passive entry and access control systems, where within less than 100 ms several challenge-response communications with arbitration of the communi- cation partner have to be handled. It is hence possible to design bi-directional remote control and access control systems with a fast challenge-response crypto function, with the same PCB board size and with the same cur- rent consumption as uni-directional remote control systems.

4841C–WIRE–05/06 ATA5423/25/28/29 Table 1-1. Pin Description Pin Symbol Function NC Not connected NC Not connected NC Not connected RF_IN RF input NC Not connected 433_N868 Selects RF input/output frequency range NC Not connected R_PWR Resistor to adjust output power PWR_H Pin to select output power RF_OUT RF output NC Not connected NC Not connected NC Not connected NC Not connected NC Not connected AVCC Blocking of the analog voltage supply VS2 Power supply input for voltage range 4.4V to 6.6V VS1 Power supply input for voltage range 2.4V to 3.6V VAUX Auxiliary supply voltage input TEST1 Test input, at GND during operation DVCC Blocking of the digital voltage supply VSOUT Output voltage power supply for external devices TEST2 Test input, at GND during operation XTAL1 Reference crystal XTAL2 Reference crystal NC Not connected VSINT Microcontroller interface supply voltage N_RESET Output pin to reset a connected microcontroller IRQ Interrupt request CLK Clock output to connect a microcontroller SDO_TMDO Serial data out/transparent mode data out SDI_TMDI Serial data in/transparent mode data in SCK Serial clock DEM_OUT Demodulator open drain output signal CS Chip select for serial interface RSSI Output of the RSSI amplifier CDEM Capacitor to adjust the lower cut-off frequency data filter RX_TX2 GND pin to decouple LNA in TX mode RX_TX1 Switch pin to decouple LNA in TX mode PWR_ON Input to switch on the system (active high) Key input 5 (can also be used to switch on the system (active low))

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 1-3. Block Diagram Key input 4 (can also be used to switch on the system (active low)) Key input 3 (can also be used to switch on the system (active low)) Key input 2 (can also be used to switch on the system (active low)) Key input 1 (can also be used to switch on the system (active low)) RX_ACTIVE Indicates RX operation mode NC Not connected NC Not connected GND Ground/backplane Table 1-1. Pin Description (Continued) Pin Symbol Function R_PWR RF_OUT RX_TX2 RF_IN AVCC GND Signal Processing (Mixer IF-filter IF-amplifier FSK/ASK Demodulator Data filter Data Slicer) RF Transceiver Digital Control Logic DVCC PA_Enable (ASK) RX/TX Frontend Enable Demod_Out XTAL1 XTAL2 CLK N_RESET CS SCK SDI_TMDI SDO_TMDO VS2 VS1 PWR_ON CDEM RX_TX1 PWR_H RSSI IRQ DEM_OUT µC_Interface VSINT PA Fract.-N- Frequency Synthesizer LNA SPI XTO FREF TX/RX - Data buffer Control register Status register Polling circuit Bit-check logic RX_ACTIVE TEST1 TEST2 FREQ TX_DATA (FSK) Power Supply Switches Regulators Wake-up Reset Reset RX/TX switch 433_N868 VAUX VSOUT

4841C–WIRE–05/06 ATA5423/25/28/29 Application Circuits 2.1 Typical Remote Control Unit Application with 1 Li Battery (3V) Figure 2-1 shows a typical 433.92 MHz Remote Control Unit application with one battery. The external components are 11 capacitors, 1 resistor, 2 inductors and a crystal. C1 to C4 are 68 nF voltage supply blocking capacitors. C5 is a 10 nF supply blocking capacitor. C6 is a 15 nF fixed capacitor used for the internal quasi-peak detector and for the high-pass frequency of the data filter. C7 to C11 are RF matching capacitors in the range of 1 pF to 33 pF. L1 is a matching induc- tor of about 5.6 nH to 56 nH. L2 is a feed inductor of about 120 nH. A load capacitor of 9 pF for the crystal is integrated. R1 is typically 22 kΩ and sets the output power to about 5.5 dBm. The loop antenna’s quality factor is somewhat reduced by this application due to the quality factor of L2 and the RX/TX switch. On the other hand, this lower quality factor is necessary to have a robust design with a bandwidth that is broad enough for production tolerances. Due to the sin- gle-ended and ground-referenced design, the loop antenna can be a free-form wire around the application as it is usually employed in remote control uni-directional systems. The ATA5423/ATA5425/ATA5428/ATA5429 provides sufficient isolation and robust pulling behavior of internal circuits from the supply voltage as well as an integrated VCO inductor to allow this. Since the efficiency of a loop antenna is proportional to the square of the surrounded area it is beneficial to have a large loop around the application board with a lower quality factor in order to relax the tolerance specification of the RF components and to get a high antenna efficiency in spite of their lower quality factor. Figure 2-1. Typical Remote Control Unit Application, 433.92 MHz, 1 Li Battery (3V) AVCC RX_TX1 RX_TX2 DVCC VS2 VS1 VSINT VAUX PWR_ON N_RESET XTAL1 XTAL2 CLK TEST1 DEM_OUT IRQ RSSI CDEM CS SCK SDI_TMDI SDO_TMDO VSOUT NC RX_ACTIVE RF_IN NC NC R_PWR RF_OUT 433_N868 PWR_H NC NC NC NC NC NC NC TEST2 NC NC NC VCC VSS AVCC 20 mm × 0.4mm Loop antenna ATmega 48/88/168 ATA5423/ATA5425/ ATA5428/ATA5429 Litihum- Cell C10 C11

13.25311 MHz

4841C–WIRE–05/06 ATA5423/25/28/29 2.2 Typical Base-station Application (5V) external components are 12 capacitors, 1 resistor, 4 inductors, a SAW filter, and a crystal. C1 and C3 to C4 are 68 nF voltage supply blocking capacitors. C2 and C12 are 2.2 µF supply block- ing capacitors for the internal voltage regulators. C5 is a 10 nF supply blocking capacitor. C6 is a 15 nF fixed capacitor used for the internal quasi-peak detector and for the high-pass frequency of the data filter. C7 to C11 are RF matching capacitors in the range of 1 pF to 33 pF. L2 to L4 are matching inductors of about 5.6 nH to 56 nH. A load capacitor for the crystal of 9 pF is inte- grated. R1 is typically 22 kΩ and sets the output power at RF_OUT to about 10 dBm. Since a quarter wave or PCB antenna, which has high efficiency and wide band operation, is typically used here, it is recommended to use a SAW filter to achieve high sensitivity in case of powerful out-of-band blockers. L1, C9 and C10 together form a low-pass filter, which is needed to filter out the harmonics in the transmitted signal to meet regulations. An internally regulated voltage at pin VSOUT can be used in case the microcontroller only supports 3.3V operation, a blocking capac- itor with a value of C12 = 2.2 µF has to be connected to VSOUT in any case. Figure 2-2. Typical Base-station Application (5V), 433.92 MHz AVCC RX_TX1 RX_TX2 DVCC VS2 VS1 VSINT VAUX PWR_ON N_RESET XTAL1 XTAL2 CLK TEST1 DEM_OUT IRQ RSSI CDEM CS SCK SDI_TMDI SDO_TMDO VSOUT NC RX_ACTIVE RF_IN NC NC R_PWR RF_OUT 433_N868 PWR_H NC NC NC NC NC NC NC TEST2 NC NC NC AVCC 20 mm × 0.4 mm 50Ω connector ATA5423/ATA5425/ ATA5428/ATA5429 C10 VCC = 4.75V to 5.25V SAW Filter C11 C12 VCC VSS ATmega 48/88/168 Sensor

4841C–WIRE–05/06 ATA5423/25/28/29 2.3 Typical Remote Control Unit Application, 2 Li Batteries (6V) Figure 2-3 shows a typical 433.92 MHz 2 Li battery Remote Control Unit application. The exter- nal components are 11 capacitors, 1 resistor, 2 inductors and a crystal. C1 and C4 are 68 nF voltage supply blocking capacitors. C2 and C3 are 2.2 µF supply blocking capacitors for the inter- nal voltage regulators. C5 is a 10 nF supply blocking capacitor. C6 is a 15 nF fixed capacitor used for the internal quasi-peak detector and for the high-pass frequency of the data filter. C7 to C11 are RF matching capacitors in the range of 1 pF to 33 pF. L1 is a matching inductor of about 5.6 nH to 56 nH. L2 is a feed inductor of about 120 nH. A load capacitor for the crystal of 9 pF is integrated. R1 is typically 22 kΩ and sets the output power to about 5.5 dBm. Figure 2-3. Typical Remote Control Unit Application, 433.92 MHz, 2 Li Batteries (6V) AVCC RX_TX1 RX_TX2 DVCC VS2 VS1 VSINT VAUX PWR_ON N_RESET XTAL1 XTAL2 CLK TEST1 DEM_OUT IRQ RSSI CDEM CS SCK SDI_TMDI SDO_TMDO VSOUT NC RX_ACTIVE RF_IN NC NC R_PWR RF_OUT 433_N868 PWR_H NC NC NC NC NC NC NC TEST2 NC NC NC AVCC 20 mm × 0.4 mm Loop antenna ATA5423/ATA5425/ ATA5428/ATA5429 Litihum- Cell C10 C11

4841C–WIRE–05/06 ATA5423/25/28/29 RF Transceiver As seen in Figure 1-3 on page 6, the RF transceiver consists of an LNA (Low-noise Amplifier), PA (Power Amplifier), RX/TX switch, fractional-N frequency synthesizer and the signal process- ing part with mixer, IF filter, IF amplifier with analog RSSI, FSK/ASK demodulator, data filter, and data slicer. In receive mode the LNA pre-amplifies the received signal which is converted down to 226 kHz (ATA5423/ATA5428) and 235 kHz (ATA5425/ATA5429), filtered and amplified before it is fed into an FSK/ASK demodulator, data filter, and data slicer. The RSSI (Received Signal Strength Indicator) signal and the raw digital output signal of the demodulator are available at the pins RSSI and DEM_OUT. The demodulated data signal Demod_Out is fed to the digital control logic where it is evaluated and buffered as described in the section “Digital Control Logic” . In transmit mode, the fractional-N frequency synthesizer generates the TX frequency which is fed to the PA. In ASK mode the PA is modulated by the signal PA_Enable. In FSK mode the PA is enabled and the signal TX_DATA (FSK) modulates the fractional-N frequency synthesizer. The frequency deviation is digitally controlled and internally fixed to about ±16 kHz (see Table 4-1 on page 28 for exact values). The transmit data can also be buffered as described in the section “Digital Control Logic” . A lock detector within the synthesizer ensures that the transmis- sion will start only if the synthesizer is locked. The RX/TX switch can be used to combine the LNA input and the PA output to a single antenna with a minimum of losses. Transparent modes without buffering of RX and TX data are also available to allow protocols and coding schemes other than the internally supported Manchester encoding. 3.1 Low-IF Receiver The receive path consists of a fully integrated low-IF receiver. It fulfills the sensitivity, blocking, selectivity, supply voltage and supply current specification needed to manufacture, for example, an automotive remote control unit without the use of SAW blocking filter (see Figure 2-1 on page 7). In a Base-station Application (5V) the receiver can be used with an additional blocking SAW front-end filter as shown in Figure 2.2 on page 8. At 433.92 MHz the receiver has a typical system noise figure of 7.0 dB, a system I1dBCP of -30 dBm and a system IIP3 of –20 dBm. There is no AGC or switching of the LNA needed; thus, a better blocking performance is achieved. This receiver uses an IF (Intermediate Frequency) of 226 kHz, the typical image rejection is 30 dB and the typical 3 dB IF filter bandwidth is 185 kHz (fIF = 226 kHz ±92.5 kHz, flo_IF = 133.5 kHz and fhi_IF = 318.5 kHz). The demodulator needs a signal to Gaussian noise ratio of 8 dB for 20 Kbit/s Manchester with ±16 kHz frequency deviation in FSK mode; thus, the resulting sensitivity at 433.92 MHz is typically –106 dBm at 20 Kbit/s Manchester. Due to the low phase noise and spurious emissions of the synthesizer in receive mode(1) together with the eighth order integrated IF filter, the receiver has a better selectivity and block- ing performance than more complex double superhet receivers but without external components and without numerous spurious receiving frequencies.

4841C–WIRE–05/06 ATA5423/25/28/29 A low-IF architecture is also less sensitive to second-order intermodulation (IIP2) than direct conversion receivers, where every pulse or AM-modulated signal (especially the signals from TDMA systems like GSM) demodulates to the receiving signal band at second-order non-linearities. Note: –120 dBC/Hz at ±1 MHz and –75 dBC at ±FREF at 433.92 MHz 3.2 Input Matching at RF_IN The measured input impedances as well as the values of a parallel equivalent circuit of these impedances can be seen in Table 3-1. The highest sensitivity is achieved with power matching of these impedances to the source impedance of 50Ω The matching of the LNA Input to 50Ω was done with the circuit shown in Figure 3-1 and with the values given in Table 3-2 on page 12. The reflection coefficients were always ≤10 dB. Note that value changes of C1 and L1 may be necessary to compensate for individual board layouts. The measured typical FSK and ASK Manchester code sensitivities with a Bit Error Rate (BER) of 10-3 are shown in Table 3-3 and Table 3-4 on page 12. These measurements were done with induc- tors having a quality factor according to Table 3-2, resulting in estimated matching losses of 915 MHz. These losses can be estimated when calculating the parallel equivalent resistance of the inductor with Rloss = 2 × π × f × L × QL and the matching loss with 10 log(1 + Rp/Rloss). With an ideal inductor, for example, the sensitivity at 433.92 MHz/FSK/20 Kbit/s/ ±16 kHz/Manchester can be improved from –106 dBm to –106.7 dBm. The sensitivity depends on the control logic which examines the incoming data stream. The examination limits must be programmed in control registers 5 and 6. The measurements in Table 3-3 and Table 3-4 on page 12 are based on the values of registers 5 and 6 according to Table 9-3 on page 61. Figure 3-1. Input Matching to 50Ω Table 3-1. Measured Input Impedances of the RF_IN Pin fRF/MHz Z(RF_IN) Rp//Cp 315 (44-j233)Ω 1278Ω//2.1 pF 345 (40-j211)Ω 1153Ω//2.1 pF 433.92 (32-j169)Ω 925Ω//2.1 pF 868.3 (21-j78)Ω 311Ω//2.2 pF 915 (18-j70)Ω 290Ω//2.3 pF ATA5423/ATA5425/ ATA5428/ATA5429 RF_IN

4841C–WIRE–05/06 ATA5423/25/28/29 3.3 Sensitivity versus Supply Voltage, Temperature and Frequency Offset To calculate the behavior of a transmission system it is important to know the reduction of the sensitivity due to several influences. The most important are frequency offset due to crystal oscillator (XTO) and crystal frequency (XTAL) errors, temperature and supply voltage depen- dency of the noise figure and IF filter bandwidth of the receiver. Figure 3-2 shows the typical sensitivity at 433.92 MHz/FSK/20 Kbit/s/±16 kHz/Manchester versus the frequency offset between transmitter and receiver with Tamb = –40°C, +25°C and +105°C and supply voltage VS1 = VS2 = 2.4V, 3.0V and 3.6V. Table 3-2. Input Matching to 50Ω fRF/MHz C1/pF L1/nH QL1 315 2.4 345 1.8 433.92 1.8 868.3 1.2 6.8 915 1.3 5.6 Table 3-3. Measured Sensitivity FSK, ±16 kHz, Manchester, dBm, BER = 10–3 RF Frequency BR_Range_0

1.0 Kbit/s

BR_Range_0

2.4 Kbit/s

BR_Range_1

5.0 Kbit/s

BR_Range_2

10 Kbit/s

BR_Range_3

20 Kbit/s

315 MHz

–110.0 dBm –110.5 dBm –109.0 dBm –108.0 dBm –107.0 dBm

345 MHz

–109.5 dBm –110.5 dBm –109.0 dBm –107.5 dBm –107.0 dBm

433.92 MHz

–109.0 dBm –109.5 dBm –108.0 dBm –107.0 dBm –106.0 dBm

868.3 MHz

–106.0 dBm –106.5 dBm –105.5 dBm –104.0 dBm –103.5 dBm

915 MHz

–105.5 dBm –106.0 dBm –105.0 dBm –103.5 dBm –103.0 dBm Table 3-4. Measured Sensitivity 100% ASK, Manchester, dBm, BER = 10–3 RF Frequency BR_Range_0 BR_Range_0 BR_Range_1 BR_Range_2 –117.0 dBm –117.5 dBm –115.0 dBm –113.5 dBm –117.0 dBm –117.5 dBm –115.0 dBm –113.0 dBm –116.0 dBm –116.5 dBm –114.0 dBm –112.5 dBm –112.5 dBm –113.0 dBm –111.5 dBm –109.5 dBm –112.5 dBm –113.0 dBm –111.0 dBm –109.0 dBm

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 3-2. Measured Sensitivity 433.92 MHz/FSK/20 Kbit/s/±16 kHz/Manchester versus Frequency Offset, Tempera- ture and Supply Voltage As can be seen in Figure 3-2 on page 13 the supply voltage has almost no influence. The tem- perature has an influence of about +1.5/–0.7 dB, and a frequency offset of ±65 kHz also influences by about ±1 dB. All these influences, combined with the sensitivity of a typical IC, are then within a range of –103.7 dBm and –107.3 dBm over temperature, supply voltage and fre- quency offset which is –105.5 dBm ±1.8dB. The integrated IF filter has an additional production tolerance of only ±7 kHz, hence, a frequency offset between the receiver and the transmitter of ±58 kHz can be accepted for XTAL and XTO tolerances. Note: For the demodulator used in the ATA5423/ATA5425, the tolerable frequency offset does not change with the data frequency, hence, the value of ±58 kHz is valid for up to 1 Kbit/s. This small sensitivity spread over supply voltage, frequency offset and temperature is very unusual in such a receiver. It is achieved by an internal, very fast and automatic frequency cor- rection in the FSK demodulator after the IF filter, which leads to a higher system margin. This frequency correction tracks the input frequency very quickly; if, however, the input frequency makes a larger step (for example, if the system changes between different communication part- ners), the receiver has to be restarted. This can be done by switching back to IDLE mode and then again to RX mode. For that purpose, an automatic mode is also available. This automatic mode switches to IDLE mode and back into RX mode every time a bit error occurs. (See “Digital Control Logic” on page 36.) -110.0 -109.0 -108.0 -107.0 -106.0 -105.0 -104.0 -103.0 -102.0 -101.0 -100.0 -99.0 -98.0 -97.0 -96.0 -95.0 -100 -80 -60 -40 -20 100 Frequency Offset (kHz) VS = 2.4 V Tamb = -40°C Sensitivity (dBm) VS = 3.0 V Tamb = -40°C VS = 3.6 V Tamb = -40°C VS = 2.4 V Tamb = +25°C VS = 3.0 V Tamb = +25°C VS = 3.6 V Tamb = +25°C VS = 2.4 V Tamb = +105°C VS = 3.0 V Tamb = +105°C VS = 3.6 V Tamb = +105°C

4841C–WIRE–05/06 ATA5423/25/28/29 3.4 Frequency Accuracy of the Crystals The XTO is an amplitude regulated Pierce oscillator with integrated load capacitors. The initial tolerances (due to the frequency tolerance of the XTAL, the integrated capacitors on XTAL1, XTAL2 and the XTO’s initial transconductance gm) can be compensated to a value within ±0.5 ppm by measuring the CLK output frequency and programming the control registers 2 and 3 (see Table 7-7 on page 39 and Table 7-10 on page 40). The XTO then has a remaining influ- ence of less than ±2 ppm over temperature and supply voltage due to the band gap controlled gm of the XTO. The needed frequency stability of the used crystals over temperature and aging is hence ±58 kHz/315 MHz – 2 × ±2.5 ppm = ±179.2 ppm for 315 MHz, ±58 kHz/345 MHz – 2 × ±2.5 ppm = ±163.2 ppm for 345 MHz, ±58 kHz/433.92 MHz – 2 × ±2.5 ppm = ±128.6 ppm for 433.92 MHz, ±58 kHz/868.3 MHz – 2 × ±2.5 ppm = ±61.8 ppm for 868.3 MHz and ±58 kHz/915 MHz – 2 × ±2.5 ppm = ±58.4 ppm for 915 MHz. Thus, the used crystals in receiver and transmitter each need to be better than ±89.6 ppm for ±29.2 ppm for 915 MHz. In access control systems it may be advantageous to have a more tight tolerance at the Base-station in order to relax the requirement for the remote control unit. 3.5 RX Supply Current versus Temperature and Supply Voltage Table 3-5 shows the typical supply current at 433.92 MHz of the transceiver in RX mode versus supply voltage and temperature with VS = VS1 = VS2. As can be seen, the supply current at

2.4 V and –40°C is less than the typical supply current; this is useful because this is also the

operation point where a lithium cell has the worst performance. The typical supply current at 315 MHz, 345 MHz, 868.3 MHz or 915 MHz in RX mode is about the same as for 433.92 MHz. 3.6 Blocking, Selectivity As can be seen in Figure 3-3 and Figure 3-4 on page 15, the receiver can receive signals 3 dB higher than the sensitivity level in the presence of very large blockers of –47 dBm/–34 dBm with small frequency offsets of ±1/ ±10 MHz. Figure 3-3 shows narrow band blocking and Figure 3-4 wide band blocking characteristics. The measurements were done with a signal of 433.92 MHz/FSK/20 Kbit/s/±16 kHz/ Manchester, and with a level of –106 dBm + 3 dB = –103 dBm which is 3 dB above the sensitivity level. The fig- ures show how much larger than –103dBm a continuous wave signal can be before the BER is higher than 10–3. The measurements were done at the 50Ω input according to Figure 3-1 on page 11. At 1 MHz, for example, the blocker can be 56 dB higher than –103 dBm which is -103 dBm + 56 dB = –47 dBm. These values, together with the good intermodulation perfor- mance, avoid the need for a SAW filter in the remote control unit application. Table 3-5. Measured 433.92 MHz Receive Supply Current in FSK Mode VS = VS1 = VS2 2.4V 3.0V 3.6V Tamb = –40°C 8.4 mA 8.8 mA 9.2 mA Tamb = 25°C 9.9 mA 10.3 mA 10.8 mA Tamb = 85°C 10.9 mA 11.3 mA 11.8 mA

4841C–WIRE–05/06 ATA5423/25/28/29 The ATA5423/ATA5425/ATA5428/ATA5429 can also receive FSK and ASK modulated signals if they are much higher than the I1dBCP. It can typically receive useful signals at 10 dBm. This is often referred to as the nonlinear dynamic range which is the maximum to minimum receiving signal and is 116 dB for 20 Kbit/s Manchester. This value is useful if two transceivers have to communicate and are very close to each other. Figure 3-5. Close In 6 dB Blocking Characteristic and Image Response at 433.92 MHz This high blocking performance even makes it possible for some applications using quarter wave whip antennas to use a simple LC band-pass filter instead of a SAW filter in the receiver. When designing such an LC filter take into account that the 3 dB blocking at 433.92 MHz/2 = 216.96 MHz is 43 dBC and at 433.92 MHz/3 = 144.64 MHz is 48 dBC and at 2 × (433.92 MHz + 226 kHz) + –226 kHz = 868.066 MHz/868.518 MHz is 56 dBC. And espe- cially that at 3 × (433.92 MHz + 226 kHz) + 226 kHz = 1302.664 MHz the receiver has its second LO harmonic receiving frequency with only 12 dBC blocking. Table 3-6. Blocking 6 dB Above Sensitivity Level with BER < 10–3 Frequency Offset Blocker Level Blocking +0.75 MHz –45 dBm 55 dBC/61 dBS –0.75 MHz –45 dBm 55 dBC/61 dBS +1.5 MHz –38 dBm 62 dBC/68 dBS –1.5 MHz –38 dBm 62 dBC/68 dBS +10 MHz –30 dBm 70 dBC/76 dBS –10 MHz –30 dBm 70 dBC/76 dBS -10.0 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 1.0 Distance of Interfering to Receiving Signal [MHz] Blocking Level [dBC]

4841C–WIRE–05/06 ATA5423/25/28/29 3.7 In-band Disturbers, Data Filter, Quasi-peak Detector, Data Slicer If a disturbing signal falls into the received band or a blocker is not continuous wave, the perfor- mance of a receiver strongly depends on the circuits after the IF filter. The demodulator, data filter and data slicer are important, in that case. The data filter of the ATA5423/ATA5425/ATA5428/ATA5429 implies a quasi-peak detector. This results in a good suppression of the above mentioned disturbers and exhibits a good carrier to Gaussian noise performance. The required useful signal to disturbing signal ratio to be received with a BER of 10–3 is less than 12 dB in ASK mode and less than 3 dB (BR_Range_0 to BR_Range_2)/6 dB (BR_Range_3) in FSK mode. Due to the many different waveforms possible these numbers are measured for signal as well as for disturbers with peak amplitude values. Note that these values are worst case values and are valid for any type of modulation and mod- ulating frequency of the disturbing signal as well as the receiving signal. For many combinations, lower carrier to disturbing signal ratios are needed. 3.8 DEM_OUT Output The internal raw output signal of the demodulator Demod_Out is available at pin DEM_OUT. DEM_OUT is an open drain output and must be connected to a pull-up resistor if it is used (typi- cally 100 kΩ) otherwise no signal is present at that pin. 3.9 RSSI Output The output voltage of the pin RSSI is an analog voltage, proportional to the input power level. Using the RSSI output signal, the signal strength of different transmitters can be distinguished. The usable dynamic range of the RSSI amplifier is 70 dB, the input power range P(RFIN) is –115 dBm to –45 dBm and the gain is 8 mV/dB. Figure 3-6 shows the RSSI characteristic of a typical device at 433.92 MHz with VS1 = VS2 = 2.4 to 3.6 V and Tamb = –40°C to +85°C with a matched input according to Table 3-2 on page 12 and Figure 3-1 on page 11. At 915 MHz about 3.3 dB and at 868.3 MHz about 2.7 dB more signal level, at 345 MHz about 0.8 dB and at 315 MHz about 1 dB less signal level is needed for the same RSSI results. Figure 3-6. Typical RSSI Characteristic versus Temperature and Supply Voltage 400 500 600 700 800 900 1000 1100 -120 -110 -100 -90 -80 -70 -60 -50 -40 PRF_IN (dBm) VRSSI (mV) max. min. typ.

4841C–WIRE–05/06 ATA5423/25/28/29 3.10 Frequency Synthesizer The synthesizer is a fully integrated fractional-N design with internal loop filters for receive and transmit mode. The XTO frequency fXTO is the reference frequency FREF for the synthesizer. The bits FR0 to FR12 in control registers 2 and 3 (see Table 7-7 on page 39 and Table 7-10 on page 40) are used to adjust the deviation of fXTO. In transmit mode, at 433.92 MHz, the carrier has a phase noise of –111 dBC/Hz at 1 MHz and spurious emissions at FREF of –66 dBC with a high PLL loop bandwidth allowing the direct modulation of the carrier with 20 Kbit/s Manchester data. Due to the closed loop modulation any spurious emissions caused by this modulation are effectively filtered out as can be seen in Figure 3-9 on page 20. In RX mode the synthesizer has a phase noise of –120 dBC/Hz at 1 MHz and spurious emissions of –75 dBC. The initial tolerances of the crystal oscillator due to crystal tolerances, internal capacitor toler- ances and the parasitics of the board have to be compensated at manufacturing setup with control registers 2 and 3 as can be seen in Table 4-1 on page 28. The other control words for the synthesizer needed for ASK, FSK and receive/transmit switching are calculated internally. The RF (Radio Frequency) resolution is equal to the XTO frequency divided by 16384 which is 868.3 MHz and 862.6 Hz at 915.0 MHz. For the multi-channel system the frequency control word FREQ in control registers 2 and 3 can be programmed in the range of 1000 to 6900, this is equivalent to a programmable tuning range of ±2.5 MHz hence every frequency within the 315 MHz, 345 MHz, 433 MHz, 868 MHz and

915 MHz ISM bands can be programmed as receive and as transmit frequency, and the position

of channels within these ISM bands can be chosen arbitrarily (see Table 4-1). Care must be taken as to the harmonics of the CLK output signal as well as to the harmonics produced by a microprocessor clocked with it, since these harmonics can disturb the reception of signals. In a single-channel system, using FREQ = 3803 to 4053 ensures that harmonics of this signal do not disturb the receive mode. 3.11 FSK/ASK Transmission Due to the fast modulation capability of the synthesizer and the high resolution, the carrier can be internally FSK modulated, which simplifies the application of the transceiver. The deviation of the transmitted signal is ±20 digital frequency steps of the synthesizer which is equal to 868.3 MHz and ±17.25 kHz for 915 MHz. Due to closed loop modulation with PLL filtering the modulated spectrum is very clean, meeting ETSI and CEPT regulations when using a simple LC filter for the power amplifier harmonics as it is shown in Figure 2.2 on page 8. In ASK mode the frequency is internally connected to the cen- ter of the FSK transmission and the power amplifier is switched on and off to perform the modulation. Figure 3-7 on page 19 to Figure 3-9 on page 20 show the spectrum of the FSK mod- ulation with pseudo-random data with 20 Kbit/s/±16.17 kHz/Manchester and 5 dBm output power.

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 3-9. FSK-modulated TX Spectrum (433.92 MHz/20 Kbit/s/±16.17 kHz/Manchester Code) 3.12 Output Power Setting and PA Matching at RF_OUT The Power Amplifier (PA) is a single-ended open collector stage which delivers a current pulse which is nearly independent of supply voltage, temperature and tolerances due to band gap sta- bilization. Resistor R1, see Figure 3-10 on page 21, sets a reference current which controls the current in the PA. A higher resistor value results in a lower reference current, a lower output power and a lower current consumption of the PA. The usable range of R1 is 15 kΩ to 56 kΩ. Pin PWR_H switches the output power range between about 0 dBm to 5 dBm (PWR_H = GND) and 5 dBm to 10 dBm (PWR_H = AVCC) by multiplying this reference current by a factor 1 (PWR_H = GND) and 2.5 (PWR_H = AVCC), which corresponds to about 5 dB more output power. If the PA is switched off in TX mode, the current consumption without output stage with VS1 = VS2 = 3 V, Tamb = 25°C is typically 6.5 mA for 868.3 MHz and 6.95 mA for 315 MHz and 433.92 MHz. The maximum output power is achieved with optimum load resistances RLopt according to Table 3-7 on page 22 with compensation of the 1.0 pF output capacitance of the RF_OUT pin by absorbing it into the matching network consisting of L1, C1, C3 as shown in Figure 3-10 on page 21. There must also be a low resistive DC path to AVCC to deliver the DC current of the power amplifier's last stage. The matching of the PA output was done with the circuit shown in Figure 3-10 on page 21 with the values in Table 3-7 on page 22. Note that value changes of these ele- ments may be necessary to compensate for individual board layouts. Ref 10 dBm Atten 20 dB Samp Log dB/ VAvg W1 S2 S3 FC Center 433.92 MHz Res BW 10 kHz VBW 10 kHz Span 1 MHz Sweep 27.5 ms (401 pts)

4841C–WIRE–05/06 ATA5423/25/28/29 Example: According to Table 3-7 on page 22, with a frequency of 433.92 MHz and output power of 11 dBm the overall current consumption is typically 17.8 mA; hence, the PA needs 17.8 mA - 6.95 mA = 10.85 mA in this mode, which corresponds to an overall power amplifier efficiency of the PA of (10(11dBm/10) × 1 mW)/(3 V × 10.85 mA) × 100% = 38.6% in this case. Using a higher resistor in this example of R1 = 1.091 × 22 kΩ= 24 kΩ results in 9.1% less cur- using a new load resistance of 300Ω× 1.091 = 327Ω. The resulting output power is then 11 dBm – 0.38 dB = 10.6 dBm and the overall current consumption is 6.95 mA + 9.95 mA = 16.9 mA. The values of Table 3-7 on page 22 were measured with standard multi-layer chip inductors with quality factors Q according to Table 3-7 on page 22. Looking to the 433.92 MHz/11 dBm case with the quality factor of QL1 = 43 the loss in this inductor is estimated with the parallel equivalent resistance of the inductor Rloss = 2 × π × f × L × QL 1 and the matching loss with 10 log (1 + RLopt/Rloss) which is equal to 0.32 dB losses in this inductor. Taking this into account, the PA efficiency is then 42% instead of 38.6%. Be aware that the high power mode (PWR_H = AVCC) can only be used with a supply voltage higher than 2.7V, whereas the low power mode (PWR_H = GND) can be used down to 2.4V as can be seen in the “Electrical Characteristics: General” on page 67. The supply blocking capacitor C2 (10 nF) has to be placed close to the matching network because of the RF current flowing through it. Figure 3-10. Power Setting and Output Matching ATA5423/ATA5425/ ATA5428/ATA5429 RF_OUT RFOUT AVCC R_PWR PWR_H VPWR_H

4841C–WIRE–05/06 ATA5423/25/28/29 3.13 Output Power and TX Supply Current versus Supply Voltage and Temperature Table 3-8 on page 22 shows the measurement of the output power for a typical device with VS = VS1 = VS2 in the 433.92 MHz and 6.2 dBm case versus temperature and supply voltage measured according to Figure 3-10 on page 21 with components according to Table 3-7. As opposed to the receiver sensitivity, the supply voltage has here the major impact on output power variations because of the large signal behavior of a power amplifier. Thus, a two battery system with voltage regulator or a 5V system shows much less variation than a 2.4V to 3.6V one battery system because the supply voltage is then well within 3.0V and 3.6V. The reason is that the amplitude at the output RF_OUT with optimum load resistance is AVCC – 0.4V and the power is proportional to (AVCC – 0.4V)2 if the load impedance is not changed. This means that the theoretical output power reduction if reducing the supply voltage ciple behavior in the measurement. This is not the same case for higher voltages, since here increasing the supply voltage from 3V to 3.6V should theoretical increase the power by 1.8 dB; but a gain of only 0.8 dB in the measurement shows that the amplitude does not increase with the supply voltage because the load impedance is optimized for 3V and the output amplitude stays more constant. Table 3-7. Measured Output Power and Current Consumption with VS1 = VS2 = 3V, Tamb = 25°C Frequency (MHz) TX Current (mA) Output Power (dBm) R1 (kΩ) VPWR_H RLopt (Ω) L1 (nH) QL1 C1 (pF) C3 (pF) 315 8.5 0.4 GND 2500 1.5 315 10.5 5.7 GND 920 2.2 315 16.7 10.5 AVCC 350 3.9 345 8.8 1.6 GND 2400 1.2 345 10.4 5.9 GND 900 1.8 345 16.9 10.7 AVCC 320 3.9 433.92 8.6 0.1 GND 2300 0.75 433.92 11.2 6.2 GND 890 1.5 433.92 17.8 AVCC 300 2.7 868.3 9.3 -0.3 GND 1170 1.0 3.3 868.3 11.5 5.4 GND 471 1.0 868.3 16.3 9.5 AVCC 245 1.5 915 9.6 0.1 GND 1100 0.7 915 11.8 4.9 GND 465 1.5 915 20.3 10.2 AVCC 230 1.5 Table 3-8. Measured Output Power and Supply Current at 433.92 MHz, PWR_H = GND VS = 2.4 V 3.0 V 3.6 V Tamb = –40°C 10.19 mA 3.8 dBm 10.19 mA 5.5 dBm 10.78 mA 6.2 dBm Tamb = +25°C 10.62 mA 4.6 dBm 11.19 mA 6.2 dBm 11.79 mA 7.1 dBm Tamb = +85°C 11.4 mA 3.9 dBm 12.02 mA 5.5 dBm 12.73 mA 6.6 dBm

4841C–WIRE–05/06 ATA5423/25/28/29 Table 3-9 shows the relative changes of the output power of a typical device compared to 3.0V/25°C. As can be seen, a temperature change to –40°C as well as to +85°C reduces the power by less than 1 dB due to the band gap regulated output current. Measurements of all the cases in Table 3-7 on page 22 over temperature and supply voltage have shown about the same relative behavior as shown in Table 3-9. 3.14 RX/TX Switch The RX/TX switch decouples the LNA from the PA in TX mode, and directs the received power to the LNA in RX mode. To do this, it has a low impedance to GND in TX mode and a high impedance to GND in RX mode. To design a proper RX/TX decoupling, a linear simulation tool for radio frequency design together with the measured device impedances of Table 3-1 on page 11, Table 3-7 on page 22, Table 3-10 and Table 3-11 on page 24 should be used, but the exact element values have to be found on-board. Figure 3-11 shows an approximate equivalent circuit of the switch. The principal switching operation is described here according to the application of Figure 2-1 on page 7. The application of Figure 2.2 on page 8 works similarly. Figure 3-11. Equivalent Circuit of the Switch Table 3-9. Measurements of Typical Output Power Relative to 3V/25°C VS = 2.4V 3.0V 3.6V Tamb = –40°C –2.4 dB –0.7 dB 0 dB Tamb = +25°C –1.6 dB 0 dB +0.9 dB Tamb = +85°C –2.3 dB –0.7 dB +0.4 dB Table 3-10. Impedance of the RX/TX Switch RX_TX2 Shorted to GND Frequency Z(RX_TX1) TX Mode Z(RX_TX1) RX Mode (4.8 + j3.2)Ω (11.3 – j214)Ω (4.7 + j3.4)Ω (11.1 – j181)Ω (4.5 + j4.3)Ω (10.3 – j153)Ω (5 + j9)Ω (8.9 – j73)Ω (5 + j9.2)Ω (9 – j65)Ω 1.6 nH RX_TX1 2.5 pF 11 Ω TX 5 Ω

4841C–WIRE–05/06 ATA5423/25/28/29 3.15 Matching Network in TX Mode In TX mode the 20 mm long and 0.4 mm wide transmission line which is much shorter than λ/4 is approximately switched in parallel to the capacitor C9 to GND. The antenna connection between C8 and C9 has an impedance of about 50Ω locking from the transmission line into the loop antenna with pin RF_OUT, L2, C10, C8 and C9 connected (using a C9 without the added 7.6 pF as discussed later). The transmission line can be approximated with a 16 nH inductor in series with a 1.5Ω resistor, the closed switch can be approximated according to Table 3-10 on page 23 with the series connection of 1.6 nH and 5Ω in this mode. To have a parallel resonant high impedance circuit with little RF power going into it looking from the loop antenna into the trans- mission line a capacitor of about 7.6 pF to GND is needed at the beginning of the transmission line (this capacitor is later absorbed into C9 which is then higher, as needed for 50Ω transforma- tion). To keep the 50Ω impedance in RX mode at the end of this transmission line, C7 also has to be about 7.6 pF. This reduces the TX power by about 0.5 dB at 433.92 MHz compared to the case the where the LNA path is completely disconnected. 3.16 Matching Network in RX Mode In RX mode the RF_OUT pin has a high impedance of about 7 kΩ in parallel with 1.0 pF at 433.92 MHz as can be seen in Table 3-11. This, together with the losses of the inductor L2 with 120 nH and QL2 = 25, gives about 3.7 kΩ loss impedance at RF_OUT. Since the optimum load impedance in TX mode for the power amplifier at RF_OUT is 890 Ω the loss associated with the inductor L2 and the RF_OUT pin can be estimated to be 10 × log(1 + 890/3700) = 0.95 dB com- pared to the optimum matched loop antenna without L2 and RF_OUT. The switch represents, in this mode at 433.92 MHz, approximately an inductor of 1.6 nH in series with the parallel connec- tion of 2.5 pF and 2.0 kΩ. Since the impedance level at pin RX_TX1 in RX mode is about 50Ω this only negligibly dampens the received signal (by about 0.1 dB). When matching the LNA to the loop antenna, the transmission line and the 7.6 pF part of C9 have to be taken into account when choosing the values of C11 and L1 so that the impedance seen from the loop antenna into the transmission line with the 7.6 pF capacitor connected is 50Ω. Since the loop antenna in RX mode is loaded by the LNA input impedance, the loaded Q of the loop antenna is lowered by about a factor of 2 in RX mode; hence the antenna bandwidth is higher than in TX mode. Note that if matching to 50Ω, like in Figure 2.2 on page 8, a high Q wire-wound inductor with a Q > 70 should be used for L2 to minimize its contribution to RX losses that will otherwise be dominant. The RX and TX losses will be in the range of 1.0 dB there. Table 3-11. Impedance RF_OUT Pin in RX Mode Frequency Z(RF_OUT)RX RP//CP 36Ω – j 502Ω 7 kΩ//1.0 pF 33Ω – j 480Ω 7 kΩ//1.0 pF 19Ω – j 366Ω 7 kΩ//1.0 pF 2.8Ω – j 141Ω 7 kΩ//1.3 pF 2.6Ω – j 135Ω 7 kΩ//1.3 pF

4841C–WIRE–05/06 ATA5423/25/28/29 XTO The XTO is an amplitude-regulated Pierce oscillator type with integrated load capacitances (2 × 18 pF with a tolerance of ±17%) hence CLmin = 7.4 pF and CLmax = 10.6 pF. The XTO oscil- lation frequency fXTO is the reference frequency FREF for the fractional-N synthesizer. When designing the system in terms of receiving and transmitting frequency offset, the accuracy of the crystal and XTO have to be considered. The synthesizer can adjust the local oscillator frequency for the initial frequency error in fXTO. This is done at nominal supply voltage and temperature with the control registers 2 and 3 (see Table 7-7 and Table 7-10). The remaining local oscillator tolerance at nominal supply voltage and temperature is then < ±0.5 ppm. The XTO’s gm has very low influence of less than ±2 ppm on the frequency at nominal supply voltage and temperature. In a single channel system less than ±150 ppm should be corrected to avoid that harmonics of the CLK output disturb the receive mode. If the CLK is not used or if it is carefully laid out on the application PCB (as needed for multi channel systems), more than ±150 ppm can be compensated. Over temperature and supply voltage, the XTO's additional pulling is only ±2 ppm. The XTAL versus temperature and its aging is then the main source of frequency error in the local oscillator. The XTO frequency depends on XTAL properties and the load capacitances CL1, 2 at pin XTAL1 and XTAL2. The pulling of fXTO from the nominal fXTAL is calculated using the following formula: ppm. Cm is the crystal's motional, C0 the shunt and CLN the nominal load capacitance of the XTAL found in its data sheet. CL is the total actual load capacitance of the crystal in the circuit and con- sists of CL1 and CL2 in series connection. Figure 4-1. XTAL with Load Capacitance With Cm ≤14 fF, C0 ≥1.5 pF, CLN = 9 pF and CL = 7.4 pF to 10.6 pF, the pulling amounts to P ≤±100 ppm and with Cm ≤7 fF, C0 ≥1.5 pF, CLN = 9 pF and CL = 7.4 pF to 10.6 pF, the pulling is P ≤ ±50 ppm. Since typical crystals have less than ±50 ppm tolerance at 25°C, the compensation is not criti- cal, and can in both cases be done with the ±150 ppm. P Cm CLN CL CLN CL 106 XTAL CL1 CL2 Cm Lm Rm CL = CL1 × CL2/(CL1 + CL2) Crystal equivalent circuit

4841C–WIRE–05/06 ATA5423/25/28/29 C0 of the XTAL has to be lower than CLmin/2 = 3.7 pF for a Pierce oscillator type in order to not enter the steep region of pulling versus load capacitance where there is a risk of an unstable oscillation. To ensure proper start-up behavior the small signal gain, and thus the negative resistance, pro- vided by this XTO at start is very large; for example, oscillation starts up even in worst case with a crystal series resistance of 1.5 kΩ at C0 ≤2.2 pF with this XTO. The negative resistance is approximately given by with Z1, Z2 as complex impedances at pin XTAL1 and XTAL2, hence Z1 = –j/(2 × π × fXTO × CL1) + 5Ω and Z2 = –j/(2 × π × fXTO × CL2) + 5Ω. Z3 consists of crystals C0 in parallel with an internal 110 kΩ resistor hence Z3 = –j/(2 × π × fXTO × C0) /110 kΩ, gm is the internal transconductance between XTAL1 and XTAL2 with typically 19 mS at 25°C. With fXTO = 13.5 MHz, gm = 19 mS, CL = 9 pF, and C0 = 2.2 pF, this results in a negative resis- tance of about 2 kΩ. The worst case for technological, temperature and supply voltage variations is then for C0 ≤2.2 pF always higher than 1.5 kΩ. Due to the large gain at startup, the XTO is able to meet a very low start-up time. The oscillation start-up time can be estimated with the time constant τ. After 10 τ to 20 τ an amplitude detector detects the oscillation amplitude and sets XTO_OK to High if the amplitude is large enough. This sets N_RESET to High and activates the CLK output if CLK_ON in control register 3 is High (see Table 7-7). Note that the necessary conditions of the VSOUT and DVCC voltage also have to be fulfilled (see Figure 4-2 and Figure 5-1). To save current in IDLE and Sleep modes, the load capacitors are partially switched off in these modes with S1 and S2, as seen in Figure 4-2. It is recommended to use a crystal with Cm = 3.0 fF to 7.0 fF, CLN = 9 pF, Rm < 120Ω and C0 = 1.0 pF to 2.2 pF. Lower values of Cm can be used, this increases the start-up time slightly. Lower values of C0 or higher values of Cm (up to 15 fF) can also be used, this has only little influence on pulling. Re ZXTOcore Re gm gm τ fm Cm Re ZXTOcore Rm

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 4-2. XTO Block Diagram To find the right values used in control registers 2 and 3 (see Table 7-7 and Table 7-10), the relationship between fXTO and the fRF is shown in Table 4-1 on page 28. To determine the right content, the frequency at pin CLK as well as the output frequency at RF_OUT in ASK mode can be measured, then the FREQ value can be calculated according to Table 4-1 on page 28 so that fRF is exactly the desired radio frequency. XTAL1 XTAL2 CL1 CL2 10 pF 10 pF Divider CLK CLK_ON (Control Register 3) Divider /16 fDCLK fXTO Divider /16 fXDCLK Baud1 Baud0 XLim 8 pF 8 pF In IDLE Mode and during Sleep Mode (RX_Polling) the switches S1 and S2 are open. Amplitude Detector XTO_OK (to Reset Logic) VSOUT_OK (from Power Supply) DVCC_OK (from Power Supply)

4841C–WIRE–05/06 ATA5423/25/28/29 The variable FREQ depends on FREQ2 and FREQ3, which are defined by the bits FR0 to FR12 in control register 2 and 3, and is calculated as follows: Table 4-1. Calculation of fRF Frequency (MHz) Pin 6 433_N868 CREG1 Bit(4) FS fXTO (MHz) fRF = fTX_ASK = fRX fTX_FSK_L fTX_FSK_H Frequency Resolution 315 AVCC 12.73193 fRF –15.54 k Hz fRF + 15.54 kHz 777.1 Hz 345 AVCC 13.94447 fRF –17.02 k Hz fRF + 17.02 kHz 851.1 Hz 433.92 AVCC 13.25311 fRF –16.17 k Hz fRF + 16.17 kHz 808.9 Hz 868.3 GND 13.41191 fRF –16.37 k Hz fRF + 16.37 kHz 818.6 Hz 915 GND 14.13324 fRF –17.25 k Hz fRF + 17.25 kHz 862.6 Hz fXTO 24.5 FREQ 20.5 16384 fXTO 24.5 FREQ 20.5 16384 fXTO 32.5 FREQ 20.5 16384 fXTO 64.5 FREQ 20.5 16384 fXTO 64.5 FREQ 20.5 16384

4841C–WIRE–05/06 ATA5423/25/28/29 FREQ = FREQ2 + FREQ3 Care must be taken to the harmonics of the CLK output signal fCLK as well as to the harmonics produced by an microprocessor clocked with it, since these harmonics can disturb the reception of signals if they get to the RF input. In a single channel system, using FREQ = 3803 to 4053 ensures that the harmonics of this signal do not disturb the receive mode. In a multichannel sys- tem, the CLK signal can either be not used or carefully laid out on the application PCB. The supply voltage of the microcontroller must also be carefully blocked in a multichannel system. 4.1 Pin CLK Pin CLK is an output to clock a connected microcontroller. The clock frequency fCLK is calculated as follows: Because the enabling of pin CLK is asynchronous, the first clock cycle may be incomplete. The signal at CLK output has a nominal 50% duty cycle. Figure 4-3. Clock Timing 4.2 Basic Clock Cycle of the Digital Circuitry The complete timing of the digital circuitry is derived from one clock. As shown in Figure 4-2 on page 27, this clock cycle TDCLK is derived from the crystal oscillator (XTO) in combination with a divider. TDCLK controls the following application relevant parameters:

• Timing of the polling circuit including bit check
• TX bit rate The clock cycle of the bit check and the TX bit rate depends on the selected bit-rate range (BR_Range) which is defined in control register 6 (see Table 7-20 on page 42) and XLim which is defined in control register 4 (see Table 7-13 on page 40). This clock cycle TXDCLK is defined by the following formulas for further reference: fCLK fXTO N_RESET CLK_ON (Control Register 3) CLK VSOUT VThres_2 = 2.38 V (typ) VThres_1 = 2.3 V (typ) fDCLK fXTO

4841C–WIRE–05/06 ATA5423/25/28/29 BR_Range ⇒ BR_Range 0: TXDCLK = 8 × TDCLK × XLim BR_Range 1: TXDCLK = 4 × TDCLK × XLim BR_Range 2: TXDCLK = 2 × TDCLK × XLim BR_Range 3: TXDCLK = 1 × TDCLK × XLim Power Supply Figure 5-1. Power Supply The supply voltage range of the ATA5423/ATA5425/ATA5428/ATA5429 is 2.4V to 3.6V or 4.4V to 6.6V. Pin VS1 is the supply voltage input for the range 2.4V to 3.6V and is used in 1 Li battery applica- tions (3V) using a single lithium 3V cell. Pin VS2 is the voltage input for the range 4.4V to 6.6V (2 Li battery application (6V) and Base-station Application (5V); in this case, the voltage regula- tor V_REG1 regulates VS1 to typically 3.25V. If the voltage regulator is active, a blocking capacitor of 2.2 µF has to be connected to VS1. Pin VAUX is an input for an additional auxiliary voltage supply and can be connected, for exam- ple, to an inductive supply (see Figure 5-6 on page 36). This input can only be used together V_REG1 3.25 V typ. IN OUT V_REG2 3.25 V typ. IN S R ≥ 1 ≥ 1 AVCC_EN VAUX PWR_ON DVCC_OK OFFCMD Q VS2 VS1 EN VSOUT_EN VS1 + 0.55 V typ. and AVCC DVCC VSOUT (Control Register 3) (Control Register 1) OUT EN P_On_Aux (Status Register) (Command via SPI) DVCC_OK (to XTO and Reset Logic) Low_Batt (Status Register and Reset Logic) SW_AVCC SW_DVCC SW_VSOUT S R Q 0 0 no change 0 1 0 1 0 1 1 1 1 FF1 VSINT V_Monitor (1.5 V typ.) V_Monitor (2.3 V/ 2.38 V typ.) VSOUT_OK (to XTO and Reset Logic)

4841C–WIRE–05/06 ATA5423/25/28/29 with a rectifier or as in the application shown in Figure 2.2 on page 8 and must otherwise be left open. Pin VSINT is the voltage input for the Microcontoller_Interface and must be connected to the power supply of the microcontroller. The voltage range of VVSINT is 2.4V to 5.25V (see Figure 5-5 on page 35 and Figure 5-6 on page 36). AVCC is the internal operation voltage of the RF transceiver and is fed by VS1 via the switch SW_AVCC. AVCC must be blocked with a 68 nF capacitor (see Figure 2-1 on page 7, Figure 2.2 on page 8 and Figure 2-3 on page 9). DVCC is the internal operation voltage of the digital control logic and is fed by VS1 or VSOUT via the switch SW_DVCC. DVCC must be blocked on pin DVCC with 68 nF (see Figure 2-1 on page 7, Figure 2.2 on page 8 and Figure 2-3 on page 9). Pin VSOUT is a power supply output voltage for external devices (for example, microcontrollers) and is fed by VS1 via the switch SW_VSOUT, or by the auxiliary voltage supply VAUX via V_REG2. The voltage regulator V_REG2 regulates VSOUT to typically 3.25V. If the voltage reg- ulator is active, a blocking capacitor of 2.2 µF has to be connected to VSOUT. VSOUT can be switched off by the VSOUT_EN bit in control register 3 and is then reactivated by conditions found in Figure 5-2 on page 32. Pin N_RESET is set to low if the voltage VVSOUT at pin VSOUT drops below 2.3V (typically) and can be used as a reset signal for a connected microcontroller (see Figure 5-3 on page 34 and Figure 5-4 on page 35). Pin PWR_ON is an input to switch on the transceiver (active high). Pin T1 to T5 are inputs for push buttons and can also be used to switch on the transceiver (active low). For current consumption reasons it is recommended to set T1 to T5 to GND, or PWR_ON to VCC only temporarily. Otherwise, an additional current flows because of a 50 kΩ pull-up resistor. There are two voltage monitors generating the following signals (see Figure 5-1 on page 30):

• DVCC_OK if DVCC > 1.5V typically
• VSOUT_OK if VSOUT > VThres1 (2.3V typically)
• Low_Batt if VSOUT < VThres2 (2.38V typically)

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 5-2. Operation Modes Flow Chart 5.1 OFF Mode If the power supply (battery) is connected to pin VS1 and/or VS2, and if the voltage on pin VAUX VVAUX < 3.5V (typically), then the transceiver is in OFF mode. In OFF mode AVCC, DVCC and VSOUT are disabled, resulting in very low power consumption (IS_OFF is typically 10 nA). In OFF mode the transceiver is not programmable via the 4-wire serial interface. AVCC = OFF DVCC = OFF VSOUT = OFF Pin PWR_ON = 1 or Pin T1, T2, T3, T4 or T5 = 0 VVAUX > 3.5 V (typ) VVAUX < 3.5 V (typ) Bit AVCC_EN = 0 and OFF Command and Pin PWR_ON = 0 and Pin T1, T2, T3, T4 and T5 = 1 AVCC = VS1 DVCC = VS1 VSOUT = VS1 AVCC = OFF DVCC = V_REG2 VSOUT = V_REG2 OFF Mode IDLE Mode AUX Mode AVCC = VS1 DVCC = VS1 VSOUT = V_REG2 IDLE Mode VVAUX < VS1 + 0.5V VVAUX > VS1 + 0.5V Bit AVCC_EN = 0 and OFF Command and Pin PWR_ON = 0 and Pin T1, T2, T3, T4 and T5 = 1 OPM1 OPM0 0 1 TX Mode 1 0 RX Polling Mode 1 1 RX Mode OPM1 = 0 and OPM0 = 0 AVCC = VS1 DVCC = VS1 VSOUT = VS1 or V_REG2 TX Mode AVCC = VS1 DVCC = VS1 VSOUT = VS1 or V_REG2 RX Polling Mode AVCC = VS1 DVCC = VS1 VSOUT = VS1 or V_REG2 RX Mode OPM1 = 1 and OPM0 = 0 OPM1 = 0 and OPM0 = 1 OPM1 = 1 and OPM0 = 0 OPM1 = 1 and OPM0 = 1 or Bit check ok OPM1 = 0 and OPM0 = 1 OPM1 = 1 and OPM0 = 1 AVCC = VS1 DVCC = VS1 VSOUT = OFF RX Polling Mode Bit check ok VSOUT_EN = 0 Status bit Power_On = 1 or Event on Pin T1, T2, T3, T4 or T5 Pin PWR_ON = 1 or Pin T1, T2, T3, T4 or Pin T5 = 0 or Bit AVCC_EN = 1 AVCC = VS1 DVCC = VS1 VSOUT = OFF IDLE Mode VSOUT_EN = 0 Statusbit Power_On = 1 or Event on Pin T1, T2, T3, T4 or T5

4841C–WIRE–05/06 ATA5423/25/28/29 5.2 AUX Mode The transceiver changes from OFF mode to AUX mode if the voltage at pin VAUX VVAUX > 3.5V (typically). In AUX mode DVCC and VSOUT are connected to the auxiliary power supply input (VAUX) via the voltage regulator V_REG2. In AUX mode the transceiver is programmable via the 4-wire serial interface, but no RX or TX operations are possible because AVCC = OFF. The state transition OFF mode to AUX mode is indicated by an interrupt at pin IRQ and the sta- tus bit P_On_Aux = 1. 5.3 IDLE Mode In IDLE mode AVCC and DVCC are connected to the battery voltage (VS1). From OFF mode the transceiver changes to IDLE mode if pin PWR_ON is set to 1 or pin T1, T2, T3, T4 or T5 is set to “0”. This state transition is indicated by an interrupt at pin IRQ and the sta- tus bits Power_On = 1 or ST1, ST2, ST3, ST4 or ST5 = 1. From AUX mode the transceiver changes to IDLE mode by setting AVCC_EN = 1 in control register 1 via the 4-wire serial interface or if pin PWR_ON is set to “1” or pin T1, T2, T3, T4 or T5 is set to “0”. VSOUT is either connected to VS1 or to the auxiliary power supply (V_REG2). If VVAUX < VS1 + 0.5V, VSOUT is connected to VS1. If VVAUX > VS1 + 0.5V, VSOUT is connected to V_REG2 and the status bit P_On_Aux is set to “1”. In IDLE mode, the RF transceiver is disabled and the power consumption IS_IDLE is about 230 µA (VSOUT OFF and CLK output OFF and VS = VS1 = VS2 = 3V). The exact value of this current is strongly dependent on the application and the exact operation mode, therefore check the sec- tion “Electrical Characteristics: General” on page 67 for the appropriate application case. Via the 4-wire serial interface a connected microcontroller can program the required parameter and enable the TX, RX polling or RX mode. The transceiver can be set back to OFF mode by an OFF command via the 4-wire serial inter- face (the bit AVCC_EN must be set to “0”, the input level of pin PWR_ON must be “0” and pin T1, T2, T3, T4 and T5 = 1 before writing the OFF command). 5.4 Reset Timing and Reset Logic If the transceiver is switched on (OFF mode to IDLE mode, OFF mode to AUX mode) DVCC and VSOUT ramp up as illustrated in Figure 5-3 on page 34 (AVCC only ramps up if the transceiver is set to the IDLE mode). The internal signal DVCC_RESET resets the digital control logic and sets the control register to default values. A voltage monitor generates a low level at pin N_RESET until the voltage at pin VSOUT exceeds 2.38V (typically) and the start-up time of the XTO has elapsed (amplitude detector, see Figure 4-2 on page 27). After the voltage at pin VSOUT exceeds 2.3V (typically) and the start-up time of the XTO has elapsed, the output clock at pin CLK is available. Because the enabling of pin CLK is asynchronous, the first clock cycle may be incomplete. Table 5-1. Control Register 1 OPM1 OPM0 Function IDLE mode

4841C–WIRE–05/06 ATA5423/25/28/29 The status bit Low_Batt is set to “1” if the voltage at pin VSOUT VVSOUT drops below VThres_2 (typically 2.38V). Low_Batt is set to “0” if VVSOUT exceeds VThres_2 and the status register is read via the 4-wire serial interface or N_RESET is set to low. If VVSOUT drops below VThres_1 (typically 2.3V), N_RESET is set to low. If bit VSOUT_EN in con- trol register 3 is “1”, a DVCC_RESET is also generated. If VVSOUT was already disabled by the connected microcontroller by setting bit VSOUT_EN = 0, no DVCC_RESET is generated. Note: If VSOUT < VThres_1 (typically 2.3 V) the output of the pin CLK is low, the Microcontroller_Interface is disabled and the transceiver is not programmable via the 4-wire serial interface. Figure 5-3. Reset Timing VSOUT DVCC (AVCC) DVCC_RESET VThres_1 = 2.3 V (typ) VThres_2 = 2.38 V (typ) N_RESET Low_Batt (Status Register) VSOUT_EN (Control Register 3)

1.5 V (typ)

VVSOUT > 2.38 V and the XTO is running VVSOUT > 2.3 V and the XTO is running

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 5-4. Reset Logic, SR Latch Generates the Hysteresis in the NRESET Signal 5.5

1 Li Battery Application (3V)

The supply voltage range is 2.4V to 3.6V and VAUX is not used. Figure 5-5. ≥ 1 and DVCC_OK XTO_OK and VSOUT_OK LOW_BATT S R Q Q and NRESET VSOUT_EN DVCC_RESET S R Q no change no change VS1 VS2 VAUX VSOUT VSINT ATmega 48/88/168 ATA5423/ATA5425/ ATA5428/ATA5429 VS 2.4V to 3.6V AVCC DVCC CS SCK SDI_TMDI SDO_TMDO IRQ CLK NRESET OUT OUT OUT IN IN IN IN µC_Interface DEM_OUT Digital Control Logic RF Transceiver

4841C–WIRE–05/06 ATA5423/25/28/29 5.6

2 Li Battery Application (6V)

The supply voltage range is 4.4V to 6.6V and VAUX is connected to an inductive supply. Figure 5-6.

2 Li Battery Application (6V) with Inductive Emergency Supply

The microcontroller interface is a level converter which converts all internal digital signals that are referred to the DVCC voltage into the voltage used by the microcontroller. Therefore, the pin VSINT has to be connected to the supply voltage of the microcontroller. This makes it possible to use the internal voltage regulator/switch at pin VSOUT as in Figure 2-1 on page 7 and Figure 2-3 on page 9 or to connect the microcontroller and the pin VSINT directly to the supply voltage of the microcontroller as in Figure 2.2 on page 8. Digital Control Logic 7.1 Register Structure The configuration of the transceiver is stored in RAM cells. The RAM contains a 16 × 8-bit TX/RX data buffer and a 6 × 8-bit control register and is writable and readable via a 4-wire serial interface (CS, SCK, SDI_TMDI, SDO_TMDO). The 1 × 8-bit status register is not part of the RAM and is readable via the 4-wire serial interface. The RAM and the status information are stored as long as the transceiver is in any active mode (DVCC = VS1 or DVCC = V_REG2) and are lost when the transceiver switches to OFF mode (DVCC =OFF). VS1 VS2 VAUX ATmega 48/88/168 ATA5423/ATA5425/ ATA5428/ATA5429 4.4V to 6.6V VSOUT VSINT VS AVCC DVCC CS SCK SDI_TMDI SDO_TMDO IRQ CLK NRESET OUT OUT OUT IN IN IN IN µC_Interface DEM_OUT RF Transceiver Digital Control Logic

4841C–WIRE–05/06 ATA5423/25/28/29 After the transceiver is turned on via pin PWR_ON = High, T1 = Low, T2 = Low, T3 = Low, T4 = Low or T5 = Low or the voltage at pin VAUX VVAUX > 3.5V (typically), the control registers are in the default state. Figure 7-1. Register Structure 7.2 TX/RX Data Buffer The TX/RX data buffer is used to handle the data transfer during RX and TX operations. MSB LSB Status Register (ADR 8) Control Register 1 (ADR 0) Control Register 4 (ADR 3) ST5 ST4 ST3 ST2 ST1 BitChk BitChk ASK/ NFSK Sleep Sleep Sleep Sleep Sleep XSleep Lim_ min5 Lim_ min4 Lim_ min3 Lim_ min2 Lim_ min1 Lim_ min0 Lim_ max5 Lim_ max4 Lim_ max3 Lim_ max2 Lim_ max1 Lim_ max0 IR1 IR0 TX/RX Data Buffer: 16 × 8 Bit OPM1 MODE Control Register 5 (ADR 4) Control Register 6 (ADR 5) Power _On OPM0 Control Register 2 (ADR 1) FR4 FR3 FR2 FR1 FR0 Control Register 3 (ADR 2) FR8 Low_ Batt P_On _Aux FS AVCC _EN FR5 FR6 MODE FR7 VSO UT_ EN CLK_ ON XLim Baud 1 Baud 0 FR9 FR10 FR11 FR12

4841C–WIRE–05/06 ATA5423/25/28/29 7.3 Control Register To use the transceiver in different applications, it can be configured by a connected microcon- troller via the 4-wire serial interface. 7.3.1 Control Register 1 (ADR 0) Table 7-1. Control Register 1 (Function of Bit 7 and Bit 6 in RX Mode) IR1 IR0 Function (RX Mode) Pin IRQ is set to “1” if 4 received bytes are in the TX/RX data buffer or a receiving error occurred Pin IRQ is set to “1” if 8 received bytes are in the TX/RX data buffer or a receiving error occurred Pin IRQ is set to “1” if 12 received bytes are in the TX/RX data buffer or a receiving error occurred (default) Pin IRQ is set to “1” if a receiving error occurred Table 7-2. Control Register 1 (Function of Bit 7 and Bit 6 in TX Mode) IR1 IR0 Function (TX Mode) Pin IRQ is set to “1” if 4 bytes remain in the TX/RX data buffer or the TX data buffer is empty Pin IRQ is set to “1” if 8 bytes remain in the TX/RX data buffer or the TX data buffer is empty Pin IRQ is set to “1” if 12 bytes remain in the TX/RX data buffer or the TX data buffer is empty (default) Pin IRQ is set to “1” if the TX data buffer is empty Table 7-3. Control Register 1 (Function of Bit 5) AVCC_EN Function (default) Enables AVCC, if the ATA5423/ATA5425 is in AUX mode Table 7-4. Control Register 1 (Function of Bit 4) FS Function (RX Mode, TX Mode) Selected frequency 345/433/868/915 MHz (default) Selected frequency 315 MHz Table 7-5. Control Register 1 (Function of Bit 2 and Bit 1) OPM1 OPM0 Function IDLE mode (default) TX mode RX polling mode RX mode

4841C–WIRE–05/06 ATA5423/25/28/29 7.3.2 Control Register 2 (ADR 1) Table 7-6. Control Register 1 (Function of Bit 0) T_MODE Function TX and RX function via TX/RX data buffer (default) Transparent mode, TX/RX data buffer disabled, TX modulation data stream via pin SDI_TMDI, RX modulation data stream via pin SDO_TMDO Table 7-7. Control Register 2 (Function of Bit 7, Bit 6, Bit 5, Bit 4, Bit 3, Bit 2 and Bit 1) FR6 FR5 FR4 FR3 FR2 FR1 FR0 Function FREQ2 = 0 FREQ2 = 1 FREQ2 = 88 (default) FREQ2 = 127 Note: Tuning of fRF LSBs (total 13 bits), frequency trimming resolution of fRF is fXTO/16384, which is approximately 800 Hz (see section “XTO”, Table 4-1 on page 28) Table 7-8. Control Register 2 (Function of Bit 0 in RX Mode) P_MODE Function (RX Mode) Pin IRQ is set to “1” if the bit check is successful (default) No effect on pin IRQ if the bit check is successful Table 7-9. Control Register 2 (Function of Bit 0 in TX Mode) P_MODE Function (TX Mode) Manchester modulator on (default) Manchester modulator off (NRZ mode)

4841C–WIRE–05/06 ATA5423/25/28/29 7.3.3 Control Register 3 (ADR 2) 7.3.4 Control Register 4 (ADR 3) Table 7-10. Control Register 3 (Function of Bit 7, Bit 6, Bit 5, Bit 4, Bit 3 and Bit 2) FR12 212 FR11 211 FR10 210 FR9 FR8 FR7 Function FREQ3 = 0 FREQ3 = 128 FREQ3 = 256 FREQ3 = 3840 (default) FREQ3 = 7936 FREQ3 = 8064 Note: Tuning of fRF MSBs Table 7-11. Control Register 3 (Function of Bit 1) VSOUT_EN Function Output voltage power supply for external devices off (pin VSOUT) Output voltage power supply for external devices on (default) Note: This bit is set to “1” if the bit check is OK (RX_Polling, RX mode), an event at pin T1, T2, T3, T4 or T5 occurs or the bit Power_On in the status register is “1”. Setting VSOUT_EN = 0 in AUX mode is not allowed Table 7-12. Control Register 3 (Function of Bit 0) CLK_ON Function Clock output off (pin CLK) Clock output on (default) Note: This bit is set to “1” if the bit check is OK (RX_Polling, RX mode), an event at pin T1, T2, T3, T4 or T5 occurs or the bit Power_On in the status register is “1”. Table 7-13. Control Register 4 (Function of Bit 7) ASK_NFSK Function (TX Mode, RX Mode) FSK mode (default) ASK mode

4841C–WIRE–05/06 ATA5423/25/28/29 7.3.5 Control Register 5 (ADR 4) Table 7-14. Control Register 4 (Function of Bit 6, Bit 5, Bit 4, Bit 3 and Bit 2) Sleep4 Sleep3 Sleep2 Sleep1 Sleep0 Function (RX Mode) Sleep (TSleep = Sleep × 1024 × TDCLK × XSleep) (TSleep = 10 × 1024 × TDCLK × XSleep) (default) Table 7-15. Control Register 4 (Function of Bit 1) XSleep Function XSleep = 1; extended TSleep off (default) XSleep = 8; extended TSleep on Table 7-16. Control Register 4 (Function of Bit 0) XLim Function XLim = 1; extended TLim_min, TLim_max off (default) XLim = 2; extended TLim_min, TLim_max on Table 7-17. Control Register 5 (Function of Bit 7 and Bit 6) BitChk1 BitChk0 Function NBit-check = 0 (0 bits checked during bit check) NBit-check = 3 (3 bits checked during bit check) (default) NBit-check = 6 (6 bits checked during bit check) NBit-check = 9 (9 bits checked during bit check)

4841C–WIRE–05/06 ATA5423/25/28/29 7.3.6 Control Register 6 (ADR 5) Table 7-18. Control Register 5 (Function of Bit 5, Bit 4, Bit 3, Bit 2, Bit 1 and Bit 0 in RX Mode) Lim_min5 Lim_min4 Lim_min3 Lim_min2 Lim_min1 Lim_min0 Function (RX Mode) Lim_min (Lim_min < 10 are not applicable) (TLim_min = Lim_min × TXDCLK) (TLim_min = 16 × TXDCLK) (default) Table 7-19. Control Register 5 (Function of Bit 5, Bit 4, Bit 3, Bit 2, Bit 1 and Bit 0 in TX Mode) Lim_min5 Lim_min4 Lim_min3 Lim_min2 Lim_min1 Lim_min0 Function (TX Mode) Lim_min (Lim_min < 10 are not applicable) (TX_Bitrate = 1/((Lim_min + 1) × TXDCLK × 2) (TX_Bitrate = 1/((16 + 1) × TXDCLK × 2) (default) Table 7-20. Control Register 6 (Function of Bit 7 and Bit 6) Baud1 Baud0 Function Bit-rate range 0 (B0) 1.0 Kbit/s to 2.5 Kbit/s; TXDCLK = 8 × TDCLK × XLim Bit-rate range 1 (B1) 2.0 Kbit/s to 5.0 Kbit/s; TXDCLK = 4 × TDCLK × XLim Bit-rate range 2 (B2) 4.0 Kbit/s to 10.0 Kbit/s; TXDCLK = 2 × TDCLK × XLim; (default) Bit-rate range 3 (B3) 8.0 Kbit/s to 20.0 Kbit/s; TXDCLK = 1 × TDCLK × XLim Note that the receiver does not work with >10 Kbit/s in ASK mode

4841C–WIRE–05/06 ATA5423/25/28/29 7.4 Status Register The status register indicates the current status of the transceiver and is readable via the 4-wire serial interface. Setting Power_On or P_On_Aux or an event on ST1, ST2, ST3, ST4 or ST5 is indicated by an IRQ. Reading the status register resets the bits Power_On, Low_Batt, P_On_Aux and the IRQ. 7.4.1 Status Register (ADR 8) Table 7-21. Control Register 6 (Function of Bit 5, Bit 4, Bit 3, Bit 2, Bit 1 and Bit 0) Lim_max5 Lim_max4 Lim_max3 Lim_max2 Lim_max1 Lim_max0 Function Lim_max (Lim_max < 12 is not Applicable) (TLim_max = (Lim_max – 1) × TXDCLK) (TLim_max = (28 – 1) × TXDCLK) (default) Table 7-22. Status Register Status Bit Function ST5 Status of pin T5 Pin T5 = 0 →ST5 = 1 Pin T5 = 1 →ST5 = 0 (see Figure 7-3 on page 45) ST4 Status of pin T4 Pin T4 = 0 →ST4 = 1 Pin T4 = 1 →ST4 = 0 (see Figure 7-3 on page 45) ST3 Status of pin T3 Pin T3 = 0 →ST3 = 1 Pin T3 = 1 →ST3 = 0 (see Figure 7-3 on page 45) ST2 Status of pin T2 Pin T2 = 0 →ST2 = 1 Pin T2 = 1 →ST2 = 0 (see Figure 7-3 on page 45) ST1 Status of pin T1 Pin T1 = 0 →ST1 = 1 Pin T1 = 1 →ST1 = 0 (see Figure 7-3 on page 45)

4841C–WIRE–05/06 ATA5423/25/28/29 7.5 Pin Tn To switch the transceiver from OFF to IDLE mode, pin Tn must be set to “0” (maximum 0.2 × VVS2) for at least TTn_IRQ (see Figure 7-2). The transceiver recognizes the negative edge, sets pin N_RESET to low and switches on DVCC, AVCC and the power supply for external devices VSOUT. If VDVCC exceeds 1.5V (typically) and the XTO is settled, the digital control logic is active and sets the status bit STn to “1” and an interrupt is issued (TTn_IRQ). After the voltage on pin VSOUT exceeds 2.3V (typically) and the start-up time of the XTO is elapsed, the output clock on pin CLK is available. Because the enabling of pin CLK is asynchro- nous, the first clock cycle may be incomplete. N_RESET is set to high if VVSOUT exceeds 2.38V (typically) and the XTO is settled. Figure 7-2. Timing Pin Tn, Status Bit STn Power_On Indicates that the transceiver was woken up by pin PWR_ON (rising edge on pin PWR_ON). During Power_On = 1, the bits VSOUT_EN and CLK_ON in control register 3 are set to “1”. (see Figure 7-4 on page 46) Low_Batt Indicates that output voltage on pin VSOUT is too low (VVSOUT < 2.38V typically) (see Figure 7-5 on page 47) P_On_Aux Indicates that the auxiliary supply voltage on pin VAUX is high enough to operate. State transition: a) OFF mode →AUX mode (see Figure 5-2 on page 32) b) IDLE mode (VSOUT = VS1) →IDLE mode (VSOUT = V_REG2) (see Figure 7-6 on page 48) Table 7-22. Status Register (Continued) Status Bit Function VSOUT Tn VThres_2 = 2.38 V (typ) N_RESET IRQ STn (Status Register) CLK OFF Mode IDLE Mode DVCC, AVCC TTn_IRQ VThres_1 = 2.3 V (typ)

4841C–WIRE–05/06 ATA5423/25/28/29 If the transceiver is in any active mode (IDLE, AUX, TX, RX, RX_Polling), an integrated debounce logic is active. If there is an event on pin Tn a debounce counter is set to 0 (T = 0) and started. The status is updated, an interrupt is issued and the debounce counter is stopped after reaching the counter value T = 8195 × TDCLK. An event on the same key input before reaching T = 8195 × TDCLK stops the debounce counter. An event on an other key input before reaching T = 8195 × TDCLK resets and restarts the debounce counter. While the debounce counter is running, the bits VSOUT_EN and CLK_ON in control register 3 are set to “1”. The interrupt is deleted after reading the status register or executing the command Delete_IRQ. If pin Tn is not used, it can be left open because of an internal pull-up resistor (typically 50 kΩ). Figure 7-3. Timing Flow Pin Tn, Status Bit STn Event on pin Tn ? N Y Event on pin Tn ? N Y T = 8195 × TDCLK N Y T = 0 Start debounce counter Stop debounce counter STn = 1; IRQ = 1 Pin Tn = 0 ? Stop debounce counter STn = 0; IRQ = 1 Y N IDLE Mode or AUX Mode or TX Mode or RX Polling Mode or RX Mode Tn = STn ? Y N Stop debounce counter

4841C–WIRE–05/06 ATA5423/25/28/29 7.6 Pin PWR_ON To switch the transceiver from OFF to IDLE mode, pin PWR_ON must be set to “1” (minimum 0.8 × VVS2) for at least TPWR_ON (see Figure 7-4). The transceiver recognizes the positive edge, sets pin N_RESET to low, and switches on DVCC, AVCC and the power supply for external devices VSOUT. If VDVCC exceeds 1.5V (typically) and the XTO is settled, the digital control logic is active and sets the status bit Power_On to “1” and an interrupt is issued (TPWR_ON_IRQ_1). After the voltage on pin VSOUT exceeds 2.3V (typically) and the start-up time of the XTO is elapsed the output clock on pin CLK is available. Because the enabling of pin CLK is asynchro- nous, the first clock cycle may be incomplete. N_RESET is set to high if VVSOUT exceeds 2.38V (typically) and the XTO is settled. If the transceiver is in any active mode (IDLE, AUX, RX, RX_Polling, TX), a positive edge on pin PWR_ON sets Power_On to “1” (after TPWR_ON_IRQ_2). The state transition Power_On 0 → 1 gen- erates an interrupt. If Power_On is still “1” during the positive edge on pin PWR_ON no interrupt is issued. Power_On and the interrupt are deleted after reading the status register. During Power_On = 1, the bits VSOUT_EN and CLK_ON in control register 3 are set to “1”. Note: It is not possible to set the transceiver to OFF mode by setting pin PWR_ON to “0”. If pin PWR_ON is not used, it must be connected to GND. Figure 7-4. Timing Pin PWR_ON, Status Bit Power_On VSOUT PWR_ON VThres_2 = 2.38 V (typ) N_RESET IRQ Power_On (Status Register) CLK OFF Mode IDLE Mode IDLE, AUX, RX, RX Polling, TX Mode DVCC, AVCC TPWR_ON_IRQ_1 TPWR_ON_IRQ_2 VThres_1 = 2.3 V (typ)

4841C–WIRE–05/06 ATA5423/25/28/29 7.7 Low Battery Indicator The status bit Low_Batt is set to “1” if the voltage VVSOUT on pin VSOUT drops below 2.38V (typically). Low_Batt is set to “0” if VVSOUT exceeds VThres_2 and the status register is read via the 4-wire serial interface (see Figure 5-3 on page 34). Figure 7-5. Timing Status Bit Low_Batt 7.8 Pin VAUX To switch the transceiver from OFF to AUX mode, the voltage VVAUX on pin VAUX must exceed 3.5V (typically) (see Figure 7-6 on page 48). If VVAUX exceeds 2V (typically) pin N_RESET is set to low, and DVCC and the power supply for external devices VSOUT are switched on. If VVAUX exceeds 3.5V (typically) the status bit P_On_Aux is set to “1” and an interrupt is issued. After the voltage on pin VSOUT exceeds 2.3V (typically) and the start-up time of the XTO is elapsed, the output clock on pin CLK is available. Because the enabling of pin CLK is asynchro- nous, the first clock cycle may be incomplete. N_RESET is set to high if VVSOUT exceeds 2.38V (typically) and the XTO is settled. If the transceiver is in any active mode (IDLE, TX, RX, RX_Polling), a positive edge on pin VAUX and VVAUX > VS1 + 0.5V sets P_On_Aux to “1”. The state transition P_On_Aux 0 → 1 generates an interrupt. If P_On_Aux is still “1” during the positive edge on pin VAUX no interrupt is issued. P_On_Aux and the interrupt are deleted after reading the status register. VVSOUT< 2.38 V (typ) N Y IDLE, AUX, TX, RX or RX Polling Mode Low_Batt = 1 Read Status Register

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 7-6. Timing Pin VAUX, Status Bit P_On_Aux VSOUT VAUX VThres_2 = 2.38 V (typ) N_RESET IRQ P_On_Aux (Status Register) CLK OFF Mode AUX Mode DVCC

3.5 V (typ)

2.0 V (typ)

IDLE, TX, RX, RX Polling Mode VVAUX > VS1 + 0.5 V (typ) VVAUX > VS1 + 0.5 V (typ) VThres_1 = 2.3 V (typ)

4841C–WIRE–05/06 ATA5423/25/28/29 8.8 4-wire Serial Interface The 4-wire serial interface consists of the Chip Select (CS), the Serial Clock (SCK), the Serial Data Input (SDI_TMDI) and the Serial Data Output (SDO_TMDO). Data is transmitted/received bit by bit in synchronization with the serial clock. Note: If the output level on pin N_RESET is low, no data communication with the microcontroller is possible. When CS is low and the transparent mode is inactive (T_MODE = 0), SDO_TMDO is in a high impedance state. When CS is low and the transparent mode is active (T_MODE = 1), the RX data stream is available on pin SDO_TMDO. Figure 8-7. Serial Timing Table 8-1. Command Structure Command MSB LSB Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Read TX/RX data buffer x x x x x Write TX/RX data buffer x x x x x Read control/status register Write control register OFF command X X X X X Delete IRQ X X X X X Not used X X X X X Not used X X X X X CS SCK SDI_TMDI SDO_TMDO TOut_enable TSetup X MSB THold X MSB TCycle TCS_setup MSB-1 TOut_delay MSB-1 X TCS_disable TOut_disable X LSB X X TSCK_setup1 TSCK_setup2 TSCK_hold X can be either ViL or ViH

4841C–WIRE–05/06 ATA5423/25/28/29 Operation Modes 9.1 RX Operation The transceiver is set to RX operation with the bits OPM0 and OPM1 in control register 1. The transceiver is designed to consume less than 1 mA in RX operation while remaining sensi- tive to signals from a corresponding transmitter. This is achieved via the polling circuit. This circuit enables the signal path periodically for a short time. During this time the bit-check logic verifies the presence of a valid transmitter signal. Only if a valid signal is detected does the transceiver remain active and transfer the data to the connected microcontroller. This transfer takes place either via the TX/RX data buffer or via the pin SDO_TMDO. When there is no valid signal present, the transceiver is in sleep mode most of the time, resulting in low current con- sumption. This condition is called RX polling mode. A connected microcontroller can be disabled during this time. All relevant parameters of the polling logic can be configured by the connected microcontroller. This flexibility enables the user to meet the specifications in terms of current consumption, sys- tem response time, data rate, etc. In RX mode the RF transceiver is enabled permanently and the bit-check logic verifies the pres- ence of a valid transmitter signal. When a valid signal is detected the transceiver transfers the data to the connected microcontroller. This transfer take place either via the TX/RX data buffer or via the pin SDO_TMDO. 9.1.1 RX Polling Mode When the transceiver is in RX polling mode it stays in a continuous cycle of three different modes. In sleep mode the RF transceiver is disabled for the time period TSleep while consuming low current of IS = IIDLE_X. During the start-up period, TStartup_PLL and TStartup_Sig_Proc, all signal pro- cessing circuits are enabled and settled. In the following bit-check mode, the incoming data stream is analyzed bit by bit to see if it is a valid transmitter signal. If no valid signal is present, the transceiver is set back to sleep mode after the period TBit-check. This period varies check by check as it is a statistical process. An average value for TBit-check is given in the electrical charac- teristics. During TStartup_PLL the current consumption is IS = IStartup_PLL_X. During TStartup_Sig_Proc and TBit-check the current consumption is IS = IRX_X. The condition of the transceiver is indicated on pin RX_ACTIVE (see Figure 9-1 on page 54 and Figure 9-2 on page 55). The average cur- rent consumption in RX polling mode IP is different in 1 Li battery application (3V), 2 Li battery application (6V) or Base-station Application (5V). To calculate IP the index X must be replaced by VS1,VS2 in 1 Li battery application (3V), VS2 in 2 Li battery application (6V) or VS2,VAUX in Base-station Application (5V) (see section “Electrical Characteristics: General” on page 67). Table 9-1. Control Register 1 OPM1 OPM0 Function RX polling mode RX mode IP IIDLE_X TSleep IStartup_PLL_X T Startup_PLL IRX_X TStartup_Sig_Proc TBitcheck TSleep TStartup_PLL TStartup_Sig_Proc TBit_check

4841C–WIRE–05/06 ATA5423/25/28/29 To save current it is recommended that CLK and VVSOUT be disabled during RX polling mode. IP does not include the current of the Microcontroller_Interface, IVSINT, or the current of an external device connected to pin VSOUT (for example, microcontroller). If CLK and/or VSOUT is enabled during RX polling mode the current consumption is calculated as follows: During TSleep, TStartup_PLL and TStartup_Sig_Proc, the transceiver is not sensitive to a transmitter sig- nal. To guarantee the reception of a transmitted command, the transmitter must start the telegram with an adequate preburst. The required length of the preburst, TPreburst, depends on the polling parameters TSleep, TStartup_PLL, TStartup_Sig_Proc and TBit-check. Thus, TBit-check depends on the actual bit rate and the number of bits (NBit-check) to be tested. 9.1.2 Sleep Mode The length of period TSleep is defined by the 5-bit word sleep in control register 4, the extension factor XSleep defined by the bit XSleep in control register 4, and the basic clock cycle TDCLK. It is calculated to be: In US and European applications, the maximum value of TSleep is about 38 ms if XSleep is set to 1 (which is done by setting the bit XSleep in control register 4 to “0”). The time resolution is about 1.2 ms in that case. The sleep time can be extended to about 300 ms by setting XSleep to 8 (which is done by setting XSleep in control register 4 to “1”), the time resolution is then about 9.6 ms. 9.1.3 Start-up Mode During TStartup_PLL the PLL is enabled and starts up. If the PLL is locked, the signal processing circuit starts up (TStartup_Sig_Proc). After the start-up time all circuits are in stable condition and ready to receive. IS_Poll IP IVSINT IEXT TPreburst TSleep TStartup_PLL TStartup_Sig_Proc TBit_check TSleep Sleep 1024 TDCLK XSleep

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 9-1. Flow Chart Polling Mode/RX Mode (T_MODE = 0, Transparent Mode Inactive) Sleep mode: All circuits for analog signal processing are disabled. Only XTO and Polling logic is enabled. Output level on pin RX_ACTIVE -> Low; IS = IIDLE_X TSleep = Sleep × 1024 × TDCLK × XSleep Start-up signal processing: The signal processing circuit is enabled. Output level on pin RX_ACTIVE -> High; IS = IRX_X TStartup_Sig_Proc Receiving mode: The incoming data stream is passed via the TX/RX Data Buffer to the connected microcontroller. If an bit error occurs the transceiver is set back to Start-up mode. Output level on pin RX_ACTIVE -> High IS = IRX_X Start-up PLL: The PLL is enabled and locked. Output level on pin RX_ACTIVE -> High; IS = IStartup_PLL_X ;TStartup_PLL Start-up mode: OPM0 = 1 Bit check OK ? YES NO NO YES Set VSOUT_EN = 1 Set CLK_ON = 1 Set OPM0 = 1 Start bit detected ? YES Sleep: Defined by bits Sleep0 to Sleep4 in Control Register 4 XSleep: Defined by bit XSleep in Control Register 4 TDCLK: Basic clock cycle TStartup_PLL: 798.5 × TDCLK (typ) TStartup_Sig_Proc: 882 × TDCLK (BR_Range 0) 498 × TDCLK (BR_Range 1) 306 × TDCLK (BR_Range 2) 210 × TDCLK (BR_Range 3) Is defined by the selected bit-rate range and TDCLK. The bit-rate range is defined by bit Baud0 and Baud1 in Control Register 6. TBit-check: Depends on the result of the bit check. If the bit check is ok, TBit-check depends on the number of bits to be checked (NBit-check) and on the utilized data rate. If the bit check fails, the average time period for that check depends on the selected bit-rate range and on TXDCLK. The bit-rate range is defined by bit Baud0 and Baud1 in Control Register 6. P_MODE = 0 YES Set IRQ NO Start RX Polling Mode Start RX Mode RX data stream is written into the TX/RX Data Buffer Bit error ? YES TSLEEP = 0 NO YES NO NO If the transceiver detects a bit error after a successful bit check and before the start bit is detected, pin IRQ will be set to high (only if P_MODE=0) and the transceiver will be set back to start-up mode. Bit-check mode: The incoming data stream is analyzed. If the timing indicates a valid transmitter signal, the control bits VSOUT_EN, CLK_ON and OPM0 are set to 1 and the transceiver is set to receiving mode. Otherwise it is set to Sleep mode or to Start-up mode. Output level on Pin RX_ACTIVE -> High IS = IRX_X TBit-check

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 9-2. Flow Chart Polling Mode/RX Mode (T_MODE = 1, Transparent Mode Active) Sleep mode: All circuits for analog signal processing are disabled. Only XTO and Polling logic is enabled. Output level on pin RX_ACTIVE -> Low; IS = IIDLE_X TSleep = Sleep × 1024 × TDCLK × XSleep Start-up signal processing: The signal processing circuit is enabled. Output level on pin RX_ACTIVE -> High; IS = IRX_X TStartup_Sig_Proc Bit-check mode: The incoming data stream is analyzed. If the timing indicates a valid transmitter signal, the control bits VSOUT_EN, CLK_ON and OPM0 are set to 1 and the transceiver is set to receiving mode. Otherwise the transceiver is set to Sleep mode (if OPM0 = 0 and TSLEEP > 0) or stays in Bit-check mode. Output level on Pin RX_ACTIVE -> High IS = IRX_X TBit-check Receiving mode: The incoming data stream is passed via pin SDO_TMDO to the connected microcontroller. If a bit error occurs, the transceiver is not set back to Start-up mode. Output level on Pin RX_ACTIVE -> High IS = IRX_X Start-up PLL: The PLL is enabled and locked. Output level on pin RX_ACTIVE -> High; IS = IStartup_PLL_X ;TStartup_PLL Start-up mode: OPM0 = 1 Bit check OK ? YES NO NO YES Set VSOUT_EN = 1 Set CLK_ON = 1 Set OPM0 = 1 Sleep: Defined by bits Sleep0 to Sleep4 in Control Register 4 XSleep: Defined by bit XSleep in Control Register 4 TDCLK: Basic clock cycle TStartup_PLL: 798.5 × TDCLK (typ) TStartup_Sig_Proc: 882 × TDCLK (BR_Range 0) 498 × TDCLK (BR_Range 1) 306 × TDCLK (BR_Range 2) 210 × TDCLK (BR_Range 3) Is defined by the selected bit-rate range and TDCLK. The bit-rate range is defined by bit Baud0 and Baud1 in Control Register 6. TBit-check: Depends on the result of the bit check. If the bit check is ok, TBit-check depends on the number of bits to be checked (NBit-check) and on the utilized data rate. If the bit check fails, the average time period for that check depends on the selected bit-rate range and on TXDCLK . The bit-rate range is defined by bit Baud0 and Baud1 in Control Register 6. Start RX Polling Mode Start RX Mode Level on pin CS = Low ? YES NO RX data stream available on pin SDO_TMDO TSLEEP = 0 NO YES If the datastream is interrupted in FSK mode, the FSK-Demodulator-PLL tends to lock out and is further not able to lock in, even if there is a valid data stream available. In this case, the transceiver must be set back to IDLE mode.

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 9-10. Bit Error (TMODE = 0) 9.1.8 Recommended Lim_min and Lim_max for Maximum Sensitivity The sensitivity measurements in the section “Low-IF Receiver” in Table 3-3 on page 12 and Table 3-4 on page 12 have been done with the Lim_min and Lim_max values according to Table 9-3. These values are optimized for maximum sensitivity. Note that since these limits are opti- mized for sensitivity, the number of checked bits, NBit-check, has to be at least 6 to prevent the circuit from waking up to often in polling mode due to noise. Demod_Out Byte n-1 Byte n Byte n+1 Start-up mode Receiving mode Bit error Bit-check mode Receiving mode Preburst Bit check ok Byte 1 Table 9-2. RX Modulation Scheme Mode ASK/_NFSK T_MODE RFIN Bit in TX/RX Data Buffer Level on Pin SD0_TMDO RX fFSK_L →fFSK_H X fFSK_H →fFSK_L X fFSK_H fFSK_L fASK off →fASK on X fASK on →fASK off X fASK on fASK off Table 9-3. Recommended Lim_min and Lim_max Values for Different Bit Rates fRF (fXTAL)/ MHz BR_Range_0 XLim = 1 BR_Range_0 XLim = 0

5 Kbit/s

BR_Range_1 XLim = 0 BR_Range_2 XLim = 0 BR_Range_3 XLim = 0 315 (12.73193) Lim_min = 13 (261 µs) Lim_max = 38 (744 µs) Lim_min = 12 (121 µs) Lim_max = 34 (332 µs) Lim_min = 11 (55 µs) Lim_max = 32 (156 µs) Lim_min = 11 (28 µs) Lim_max = 32 (78 µs) Lim_min = 11 (14 µs) Lim_max = 31 (38 µs) 345 (13.94447) Lim_min = 13 (239 µs) Lim_max = 38 (679 µs) Lim_min = 12 (110 µs) Lim_max = 34 (303 µs) Lim_min = 11 (50 µs) Lim_max = 32 (142 µs) Lim_min = 11 (25 µs) Lim_max = 32 (71 µs) Lim_min = 11 (13 µs) Lim_max = 31 (34 µs) 433.92 (13.25311) Lim_min = 13 (251 µs) Lim_max = 38 (715 µs) Lim_min = 12 (116 µs) Lim_max = 34 (319 µs) Lim_min = 11 (53 µs) Lim_max = 32 (150 µs) Lim_min = 11 (27 µs) Lim_max = 32 (75 µs) Lim_min = 11 (13 µs) Lim_max = 32 (37 µs) 868.3 (13.41191) Lim_min = 13 (248 µs) Lim_max = 38 (706 µs) Lim_min = 12 (115 µs) Lim_max = 34 (315 µs) Lim_min = 11 (52 µs) Lim_max = 32 (148 µs) Lim_min = 11 (26 µs) Lim_max = 32 (74 µs) Lim_min = 11 (13 µs) Lim_max = 32 (37 µs) 915 (14.13324) Lim_min = 13 (235 µs) Lim_max = 38 (670 µs) Lim_min = 12 (109 µs) Lim_max = 34 (299 µs) Lim_min = 11 (50 µs) Lim_max = 32 (140 µs) Lim_min = 11 (25 µs) Lim_max = 32 (70 µs) Lim_min = 11 (12 µs) Lim_max = 32 (35 µs)

4841C–WIRE–05/06 ATA5423/25/28/29 9.2 TX Operation The transceiver is set to TX operation by using the bits OPM0 and OPM1 in the control register 1. Before activating TX mode, the TX parameters (bit rate, modulation scheme, etc.) must be selected as illustrated in Figure 9-11 on page 63. The bit rate depends on Baud 0 and Baud 1 in control register 6, Lim_min0 to Lim_min5 in control register 5 and XLIM in control register 4 (see section “Control Register” on page 38). The modulation is selected with ASK/_NFSK in control register 4. The FSK frequency deviation is fixed to about ±16 kHz. If P_Mode is set to “1”, the Manchester modulator is disabled and pattern mode is active (NRZ, see Table 9-5 on page 64). After the transceiver is set to TX mode, the start-up mode is active and the PLL is enabled. If the PLL is locked, the TX mode is active. If the transceiver is in start-up or TX mode, the TX/RX data buffer can be loaded via the 4-wire serial interface. After the first byte is in the buffer and the TX mode is active, the transceiver starts transmitting automatically (beginning with the MSB). While transmitting it is always possi- ble to load new data in the TX/RX data buffer. To prevent a buffer overflow or interruptions during transmitting, the user must ensure that data is loaded at the same speed as it is transmitted. There is a counter that indicates the number of bytes to be transmitted (see section “Transceiver Configuration” on page 49). If a byte is loaded, the counter is incremented, if a byte is transmit- ted, the counter is decremented. The counter value is available via the 4-wire serial interface. An IRQ is issued if the counter (while counting down) reaches the value defined by the control bits IR0 and IR1 in control register 1. Note: Writing to the control register 1, 4, 5 or 6 during TX mode resets the TX/RX data buffer and the counter which indicates the number of bytes to be transmitted. If T_Mode in control register 1 is set to “1”, the transceiver is in TX transparent mode. In this mode the TX/RX data buffer is disabled and the TX data stream must be applied on pin SDI_TMDI. Figure 9-11 on page 63 illustrates the flow chart of the TX transparent mode. Table 9-4. Control Register 1 OPM1 OPM0 Function TX mode

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 9-11. TX Operation (T_MODE = 0) N Write Control Register 6 Baud1, Baud0: Select bit-rate range. Lim_max0 ... Lim_max5: Don't care. Write Control Register 5 Lim_min0 ... Lim_min5: Select the bit rate. BitChk0, BitChk1: Don't care. Write Control Register 4 XLim: Select the bit rate. ASK/_NFSK: Select modulation. Sleep0 ... Sleep4: Don't care. XSleep: Don't care. Write Control Register 3 FR7, FR8: Adjust fRF VSOUT_EN: Set VSOUT_EN = 1 CLK_ON: Don't care. Write Control Register 2 FR0 ...FR6: Adjust fRF P_mode: Enable or disable the Manchester modulator. Write Control Register 1 IR1, IR0: Select an event which activates an interrupt. AVCC_EN: Don't care. FS: Select operating frequency OPM1, OPM0: Set OPM1 = 0 and OPM0 = 1. T_mode: Set T_mode = 0 Write TX/RX Data Buffer (max. 16 byte) Pin IRQ=1 ? Y N TX more Data Bytes ? Y Write TX/RX Data Buffer (Max. 16 - Number of Bytes still in the TX/RX Data Buffer) Command: Delete_IRQ N Pin IRQ=1 ? Y Write Control Register 1 OPM1, OPM0: Set IDLE Idle Mode Start-up Mode (TX) TStartup = 331.5 × TDCLK TX Mode Idle Mode

4841C–WIRE–05/06 ATA5423/25/28/29 Figure 9-12. TX Transparent Mode (T_MODE = 1) Write Control Register 4 XLim: Don't care. ASK/_NFSK: Select modulation. Sleep0 ... Sleep4: Don't care. XSleep: Don't care. Write Control Register 3 FR7, FR8: Adjust fRF VSOUT_EN: Set VSOUT_EN = 1 CLK_ON: Don't care. Write Control Register 2 FR0 ...FR6: Adjust fRF P_mode: Don't care. Write Control Register 1 IR1, IR0: Don't care. AVCC_EN: Don't care. FS: Select operating frequency OPM1, OPM0: Set OPM1 = 0 and OPM0 = 1. T_mode: Set T_mode = 1 Write Control Register 1 OPM1, OPM0: Set IDLE (OPM1=0, OPM0=0) Idle Mode Start-up Mode (TX) TStartup = 331.5 x TDCLK TX Mode Idle Mode Apply TX Data on Pin SDI_TMDI Table 9-5. TX Modulation Schemes Mode ASK/_NFSK P_Mode T_Mode Bit in TX/RX Data Buffer Level on Pin SDI_TMDI RFOUT TX X fFSK_L →fFSK_H X fFSK_H →fFSK_L X fFSK_H X fFSK_L X X fFSK_H X X fFSK_L X fASK off →fASK on X fASK on →fASK off X fASK on X fASK off X X fASK on X X fASK off

4841C–WIRE–05/06 ATA5423/25/28/29 9.3 Interrupts Via pin IRQ, the transceiver signals different operating conditions to a connected microcontrol- ler. If a specific operating condition occurs, pin IRQ is set to high. If an interrupt occurs, it is recommended to delete the interrupt immediately by reading the sta- tus register, so that a further potential interrupt doesn’t get lost. If the Interrupt pin doesn’t switch to low by reading the status register, the interrupt was triggered by the RX/TX data buffer. In this case read or write the RX/TX data buffer according to Table 9-6. Table 9-6. Interrupt Handling Operating Conditions Which Set Pin IRQ to High Level Operations Which Set Pin IRQ to Low Level Events in Status Register State transition of status bit STn (0 →1; 1 →0) Read status register or Command Delete IRQ Appearance of status bit Power_On (0 →1) Appearance of status bit P_On_Aux (0 →1) Events During TX Operation (T_MODE = 0) 4, 8 or 12 Bytes are in the TX data buffer or the TX data buffer is empty (depends on IR0 and IR1 in control register 1). Write TX data buffer or Write control register 1 or Write control register 4 or Write control register 5 or Write control register 6 or Command delete IRQ Events During RX Operation (T_MODE = 0) 4, 8 or 12 received bytes are in the RX data buffer or a receiving error is occurred (depends on IR0 and IR1 in control register 1). Read RX data buffer(1) or Write control register 1 or Write control register 4 or Write control register 5 or Write control register 6 or Command delete IRQ Successful bit check (P_MODE = 0) Note: 1. During reading of the RX/TX buffer, no IRQ is issued, due to the received bytes or a receiving error.

4841C–WIRE–05/06 ATA5423/25/28/29 10. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Symbol Min. Max. Unit Junction temperature Tj 150 Storage temperature Tstg –55 +125 Ambient temperature Tamb –40 +85 Supply voltage VS2 VMaxVS2 –0.3 +7.2 V Supply voltage VS1 VMaxVS1 –0.3 V Supply voltage VAUX VMaxVAUX –0.3 +7.2 V Supply voltage VSINT VMaxVSINT –0.3 +5.5 V ESD (Human Body Model ESD S 5.1) every pin HBM –1.5 + 1.5 kV ESD (Machine Model JEDEC A115A) every pin MM –200 +200 V ESD (Field Induced Charge Device Model ESD STM 5.3.1–1999) every pin FCDM kV Maximum input level, input matched to 50 Ω Pin_max dBm 11. Thermal Resistance Parameters Symbol Value Unit Junction ambient RthJA K/W

4841C–WIRE–05/06 ATA5423/25/28/29 12. Electrical Characteristics: General This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* RX_TX_IDLE Mode 1.1 RF operating frequency range ATA5423 V433_N868 = AVCC 4, 10 fRF 312.5 317.5 MHz A ATA5425 V433_N868 = AVCC 4, 10 fRF 342.5 347.5 MHz A ATA5428 V433_N868 = AVCC 4, 10 fRF 431.5 436.5 MHz A ATA5428 V433_N868 = GND 4, 10 fRF 862 872 MHz A ATA5429 V433_N868 = GND 4, 10 fRF 912.5 917.5 MHz A 1.2 Supply current OFF mode VVS1 = VVS2 = 3V, VVSINT = 0V (1 battery) and VVS2 = 6V (2 battery) OFF mode is not available if VVS2 = VVAUX = 5V VVSINT = 0V (base station) IS_OFF < 10 nA A 1.3 Supply current IDLE mode VVSOUT disabled, XTO running VVS1 = VVS2 = 3V (1 battery) IS_IDLE 220 µA B VVS2 = 6V (2 battery) IS_IDLE 310 µA B VVS2 = VVAUX = 5V (base station) IS_IDLE 310 µA B 1.4 System start-up time From OFF mode to IDLE mode including reset and XTO start-up (see Figure 7-4 on page 46) XTAL: Cm = 5 fF, C0 = 1.8 pF, Rm =15Ω TPWR_ON_IRQ_1 0.3 ms C *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 1.5 RX start-up time From IDLE mode to receiving mode NBit-check = 3 Bit rate = 20 Kbit/s, BR_Range_3 (see Figure 9-1 on page 54, Figure 9-2 on page 55 and Figure 9-3 on page 56) TStartup_PLL + TStartup_Sig_Proc + TBit-chek 1.39 ms A 1.6 TX start-up time From IDLE mode to TX mode (see Figure 9-11 on page 63) TStartup 0.4 ms A 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 Receiver/RX Mode 2.1 Supply current RX mode fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz 17, 18 IS_RX 10.5 mA A fRF = 868 MHz fRF = 915 MHz 17, 18 IS_RX 10.3 mA A 2.2 Supply current RX polling mode TSleep = 49.45 ms XSLEEP = 8, Sleep = 5 Bit rate = 20 Kbit/s FSK, VVSOUT disabled 17, 18 IP 444 µA B 2.3 Input sensitivity FSK fRF = 433.92 MHz FSK deviation fDEV = ±16 kHz limits according to Table 9-3 on page 61, BER = 10-3 Tamb = 25°C Bit rate 20 Kbit/s (4) PREF_FSK –104.0 –106.0 –107.5 dBm B Bit rate 2.4 Kbit/s (4) PREF_FSK –107.5 –109.5 –111.0 dBm B 2.4 Input sensitivity ASK fRF = 433.92 MHz ASK 100%, level of carrier limits according to Table 9-3 on page 61, BER = 10-3 Tamb = 25°C Bit rate 10 Kbit/s (4) PREF_ASK –110.5 –112.5 –114.0 dBm B Bit rate 2.4 Kbit/s (4) PREF_ASK –114.5 –116.5 –118.0 dBm B 2.5 Sensitivity change at fRF = 315 MHz fRF = 345 MHz fRF = 868.3 MHz fRF = 915 MHz compared to fRF = 433.92 MHz fRF = 433.92 MHz to fRF = 315 MHz fRF = 433.92 MHz to fRF = 345 MHz fRF = 433.92 MHz to fRF = 868.3 MHz fRF = 433.92 MHz to fRF = 915 MHz P = PREF_ASK + ∆PREF1 + ∆PREF2 P = PREF_FSK + ∆PREF1 + ∆PREF2 (4) ∆PREF1 –1.0 –0.8 +2.7 +3.3 dB B 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 2.6 Maximum frequency offset in FSK mode Maximum frequency difference of fRF between receiver and transmitter in FSK mode (fRF is the center frequency of the FSK signal with fDEV = ±16 kHz) (4) ∆fOFFSET –58 +58 kHz B 2.7 Supported FSK frequency deviation With up to 2 dB loss of sensitivity. Note that the tolerable frequency offset is for fDEV = ±22 kHz, 6 kHz lower than for fDEV = ±16 kHz hence ∆fOFFSET ≤±52 kHz (4) fDEV ±14 ±16 ±22 kHz B 2.8 System noise figure fRF = 315 MHz (4) NF 6.0 dB B fRF = 345 MHz (4) NF 6.2 dB B fRF = 433.92 MHz (4) NF 7.0 dB B fRF = 868.3 MHz (4) NF 9.7 dB B fRF = 915 MHz (4) NF 10.3 dB B 2.9 Intermediate frequency fRF = 315 MHz fIF 227 kHz A fRF = 345 MHz fIF 235 kHz A fRF = 433.92 MHz fIF 223 kHz A fRF = 868.3 MHz fIF 226 kHz A fRF = 915 MHz fIF 238 kHz A

2.10 System bandwidth

information only! Note that for crystal and system frequency offset calculations, ∆fOFFSET must be used. (4) SBW 185 kHz A 2.11 System outband 2nd-order input intercept point with respect to fIF ∆fmeas1 = 1,800 MHz ∆fmeas2 = 2,026 MHz fIF = ∆fmeas2 – ∆fmeas1 (4) IIP2 +50 dBm C 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 2.12 System outband 3rd-order input intercept point ∆fmeas1 = 1.8 MHz ∆fmeas2 = 3.6 MHz fRF = 315 MHz (4) IIP3 –22 dBm C fRF = 345 MHz (4) IIP3 –22 dBm C fRF = 433.92 MHz (4) IIP3 –21 dBm C fRF = 868.3 MHz (4) IIP3 –17 dBm C fRF = 915 MHz (4) IIP3 –16 dBm C

2.13 System outband input

∆fmeas1 = 1 MHz fRF = 315 MHz (4) I1dBCP –31 dBm C fRF = 345 MHz (4) I1dBCP –31 dBm C fRF = 433.92 MHz (4) I1dBCP –30 dBm C fRF = 868.3 MHz (4) I1dBCP –27 dBm C fRF = 915 MHz (4) I1dBCP –26 dBm C

2.14 LNA input impedance

fRF = 315 MHz Zin_LNA (44 – j233) Ω C fRF = 345 MHz Zin_LNA (40 – j211) Ω C fRF = 433.92 MHz Zin_LNA (32 – j169) Ω C fRF = 868.3 MHz Zin_LNA (21 – j78) Ω C fRF = 915 MHz Zin_LNA (18 – j70) Ω C

2.15 Allowable peak RF input

level, ASK and FSK BER < 10-3, ASK: 100% (4) PIN_max +10 –10 dBm C FSK: fDEV = ±16 kHz (4) PIN_max +10 –10 dBm C

2.16 LO spurious emission at

LNA_IN f < 1 GHz (4) –57 dBm C f >1 GHz (4) –47 dBm C fRF = 315 MHz (4) –100 dBm C fRF = 345 MHz (4) –100 dBm C fRF = 433.92 MHz (4) –97 dBm C fRF = 868.3 MHz (4) –84 dBm C fRF = 915 MHz (4) –84 dBm C

2.17 Image rejection

(4) dB A 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29

2.18 Useful signal to interfering

interferer for BER < 10-3 with any modulation scheme of interferer FSK BR_Ranges 0, 1, 2 (4) SNRFSK0-2 dB B FSK BR_Range_3 (4) SNRFSK3 dB B ASK (PRF < PRFIN_High) (4) SNRASK dB B

2.19 RSSI output

(4), 36 DRSSI dB A Lower level of range fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz (4), 36 PRFIN_Low –116 –115 –115 –112 –111 dBm dBm dBm dBm dBm A Upper level of range fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz (4), 36 PRFIN_High –46 –45 –45 –42 –41 dBm dBm dBm dBm dBm A Gain (4), 36 5.5 8.0 10.5 mV/dB A Output voltage range (4), 36 OVRSSI 400 1100 mV A

2.20 Output resistance RSSI

12.5 kΩ C 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29

2.21 Blocking

Sensitivity (BER = 10–3) is reduced by 6 dB if a continuous wave blocking signal at ±∆f is ∆PBlock higher than the useful signal level (bit rate = 20 Kbit/s, FSK, fDEV ±16kHz, Manchester code) fRF = 315 MHz ∆f ±0.75 MHz ∆f ±1.0 MHz ∆f ±1.5 MHz ∆f ±5 MHz ∆f ±10 MHz (4) ∆PBlock dBC C fRF = 345 MHz ∆f ±0.75 MHz ∆f ±1.0 MHz ∆f ±1.5 MHz ∆f ±5 MHz ∆f ±10 MHz (4) ∆PBlock dBC C fRF = 433.92 MHz ∆f ±0.75 MHz ∆f ±1.0 MHz ∆f ±1.5 MHz ∆f ±5 MHz ∆f ±10 MHz (4) ∆PBlock dBC C fRF = 868.3 MHz ∆f ±0.75 MHz ∆f ±1.0 MHz ∆f ±1.5 MHz ∆f ±5 MHz ∆f ±10 MHz (4) ∆PBlock dBC C fRF = 915 MHz ∆f ±0.75 MHz ∆f ±1.0 MHz ∆f ±1.5 MHz ∆f ±5 MHz ∆f ±10 MHz (4) ∆PBlock dBC C

2.22 CDEM

pin 37 (CDEM) –5% +5% nF D 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 Power Amplifier/TX Mode 3.1 Supply current TX mode power amplifier OFF fRF = 868.3 MHz fRF = 915 MHz IS_TX_PAOFF 6.50 mA A fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz IS_TX_PAOFF 6.95 mA A 3.2 Output power 1 VVS1 = VVS2 = 3V Tamb = 25°C VPWR_H = 0V fRF = 315 MHz RR_PWR = 56 kΩ RLopt = 2.5 kΩ fRF = 345 MHz RR_PWR = 56 kΩ RLopt = 2.4 kΩ fRF = 433.92 MHz RR_PWR = 56 kΩ RLopt = 2.3 kΩ fRF = 868.3 MHz RR_PWR = 30 kΩ RLopt = 1.3 kΩ fRF = 915 MHz RR_PWR = 33 kΩ RLopt = 1.1 kΩ RF_OUT matched to RLopt // j/(2 × π × fRF × 1.0 pF) (10) PREF1 –2.5 +2.5 dBm B 3.3 Supply current TX mode power amplifier ON 1 PA on/0 dBm fRF = 315 MHz 17, 18 IS_TX_PAON1 8.5 mA B fRF = 345 MHz 17, 18 IS_TX_PAON1 8.6 mA B fRF = 433.92 MHz 17, 18 IS_TX_PAON1 8.6 mA B fRF = 868.3 MHz 17, 18 IS_TX_PAON1 9.6 mA B fRF = 915 MHz 17, 18 IS_TX_PAON1 9.6 mA B 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 3.4 Output power 2 VVS1 = VVS2 = 3V Tamb = 25°C VPWR_H = 0V fRF = 315 MHz RR_PWR = 30 kΩ RLopt = 1.0 kΩ fRF = 345 MHz RR_PWR = 33 kΩ RLopt = 1.1 kΩ fRF = 433.92 MHz RR_PWR = 27 kΩ RLopt = 1.1 kΩ fRF = 868.3 MHz RR_PWR = 16 kΩ RLopt = 0.5 kΩ fRF = 915 MHz RR_PWR = 15 kΩ RLopt = 0.25 kΩ RF_OUT matched to RLopt// j/(2 × π × fRF × 1.0 pF) (10) PREF2 3.5 5.0 6.5 dBm B 3.5 Supply current TX mode power amplifier ON 2 PA on/5 dBm fRF = 315 MHz 17, 18 IS_TX_PAON2 10.3 mA B fRF = 345 MHz 17, 18 IS_TX_PAON2 10.4 mA B fRF = 433.92 MHz 17, 18 IS_TX_PAON2 10.5 mA B fRF = 868.3 MHz 17, 18 IS_TX_PAON2 11.2 mA B fRF = 915 MHz 17, 18 IS_TX_PAON2 11.8 mA B 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 3.6 Output power 3 VVS1 = VVS2 = 3V Tamb = 25°C VPWR_H = AVCC fRF = 315 MHz RR_PWR = 30 kΩ RLopt = 0.38 kΩ fRF = 345 MHz RR_PWR = 31 kΩ RLopt = 0.38 kΩ fRF = 433.92 MHz RR_PWR = 27 kΩ RLopt = 0.36 kΩ fRF = 868.3 MHz RR_PWR = 20 kΩ RLopt = 0.22 kΩ fRF = 915 MHz RR_PWR = 16 kΩ RLopt = 0.24 kΩ RF_OUT matched to RLopt// j/(2 × π × fRF × 1.0 pF) (10) PREF3 8.5 11.5 dBm B 3.7 Supply current TX mode power amplifier ON 3 PA on/10dBm fRF = 315 MHz 17, 18 IS_TX_PAON3 15.7 mA B fRF = 345 MHz 17, 18 IS_TX_PAON3 15.8 mA B fRF = 433.92 MHz 17, 18 IS_TX_PAON3 15.8 mA B fRF = 868.3 MHz 17, 18 IS_TX_PAON3 17.3 mA B fRF = 915 MHz 17, 18 IS_TX_PAON3 19.3 mA B 3.8 Output power variation for full temperature and supply voltage range Tamb = –40°C to +85°C Pout = PREFX + ∆PREFX X = 1, 2 or 3 VVS1 = VVS2 = 3.0V (10) ∆PREF –0.8 –1.5 dB B VVS1 = VVS2 = 2.7V (10) ∆PREF –2.5 dB B VVS1 = VVS2 = 2.4V (10) ∆PREF –3.5 dB B 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 3.9 Impedance RF_OUT in RX mode fRF = 315 MHz ZRF_OUT_RX (36 – j502) Ω C fRF = 345 MHz ZRF_OUT_RX (33 – j480) Ω C fRF = 433.92 MHz ZRF_OUT_RX (19 – j366) Ω C fRF = 868.3 MHz ZRF_OUT_RX (2.8 – j141) Ω C fRF = 915 MHz ZRF_OUT_RX (2.6 – j135) Ω C

3.10 Noise floor power

at ±10 MHz/at 5 dBm fRF = 315 MHz (10) LTX10M –127 dBC/Hz C fRF = 345 MHz (10) LTX10M –126 dBC/Hz C fRF = 433.92 MHz (10) LTX10M –126 dBC/Hz C fRF = 868.3 MHz (10) LTX10M –125 dBC/Hz C fRF = 915 MHz (10) LTX10M –125 dBC/Hz C

3.11 ASK modulation rate

10 Kbit/s Manchester

fData_ASK kHz C XTO 4.1 Pulling XTO due to XTO, CL1 and CL2 tolerances Pulling at nominal temperature and supply voltage fXTAL = resonant frequency of the XTAL C0 ≥ 1.0 pF Rm ≤120Ω 24, 25 ∆fXTO1 A Cm ≤7.0 fF Cm ≤14 fF –50 –100 fXTAL +50 +100 ppm 4.2 Transconductance XTO at start At start-up; after start-up the amplitude is regulated to VPPXTAL 24, 25 gm, XTO ms B 4.3 XTO start-up time C0 ≤2.2 pF Cm < 14fF Rm ≤120Ω 24, 25 TPWR_ON_IRQ_1 300 800 µs A 4.4 Maximum C0 of XTAL Required for stable operation with internal load capacitors 24, 25 C0max 3.8 pF D 4.5 Internal capacitors CL1 and CL2 24, 25 CL1, CL2 14.8 18 pF 21.2 pF B 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 4.6 Pulling of radio frequency fRF due to XTO, CL1 and CL2 versus temperature and supply changes 1.0 pF ≤C0 ≤2.2 pF Cm ≤14.0 fF Rm ≤120Ω PLL adjusted with FREQ at nominal temperature and supply voltage 4, 10 ∆fXTO2 ppm C 4.7 Amplitude XTAL after start-up Cm = 5 fF, C0 = 1.8 pF Rm =15Ω V(XTAL1, XTAL2) peak-to-peak value 24, 25 VPPXTAL 700 mVpp C V(XTAL1) peak-to-peak value 24, 25 VPPXTAL 350 mVpp C 4.8 Real part of XTO impedance at start-up C0 ≤2.2 pF, small signal start impedance, this value is important for crystal oscillator startup 24, 25 ReXTO –2,000 –1,500 Ω B 4.9 Maximum series resistance Rm of XTAL after start-up C0 ≤2.2 pF Cm ≤14 fFΩ 24, 25 Rm_max 120 Ω B

4.10 Nominal XTAL load

fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz 24, 25 fXTAL 12.73193 13.94447 13.25311 13.41191 14.13324 MHz MHz MHz MHz MHz D 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29

4.11 External CLK frequency

fRF = 315 MHz CLK division ratio = 3 CLK has nominal 50% duty cycle fCLK 4.244 MHz D fRF = 345 MHz CLK division ratio = 3 CLK has nominal 50% duty cycle fCLK 4.648 MHz D fRF = 433.92 MHz CLK division ratio = 3 CLK has nominal 50% duty cycle fCLK 4.418 MHz D fRF = 868.3 MHz CLK division ratio = 3 CLK has nominal 50% duty cycle fCLK 4.471 MHz D fRF = 915 MHz CLK division ratio = 3 CLK has nominal 50% duty cycle fCLK 4.711 MHz D

4.12 DC voltage after start-up

VDC(XTAL1, XTAL2) XTO running (IDLE mode, RX mode and TX mode) 24, 25 VDCXTO –150 –30 mV C 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 Synthesizer 5.1 Spurious TX mode At ±fCLK, CLK enabled fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz SPTX –72 –74 –68 –70 –69 dBC C At ±fXTO fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz SPTX –70 –68 –66 –60 –60 dBC C 5.2 Spurious RX mode At ±fCLK, CLK enabled fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz SPRX < –75 < –75 < –75 < –75 < –75 dBC C At ±fXTO fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz SPRX –75 –73 –75 –68 –67 dBC C 5.3 In loop phase noise TX mode Measured at 20 kHz distance to carrier fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz LTX20k –85 –85 –80 –75 –75 dBC/Hz A 5.4 Phase noise at 1M RX mode fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz LRX1M –121 –120 –120 –113 –113 dBC/Hz C 5.5 Phase noise at 1M TX mode fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz LTX1M –113 –113 –111 –107 –107 dBC/Hz C 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 5.6 Phase noise at 10M RX mode Noise floor PLL LRX10M –135 dBC/Hz C 5.7 Loop bandwidth PLL TX mode Frequency where the absolute value loop gain is equal to 1 fLoop_PLL kHz B 5.8 Frequency deviation TX mode fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz fDEV_TX ±15.54 ±17.02 ±16.17 ±16.37 ±17.25 kHz D 5.9 Frequency resolution fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz 4, 10 ∆fStep_PLL 777.1 851.1 808.9 818.6 862.6 Hz D

5.10 FSK modulation rate

20 Kbit/s Manchester

fData_FSK kHz B RX/TX Switch 6.1 Impedance RX mode RX mode, pin 38 with short connection to GND, fRF = 0 Hz (DC) ZSwitch_RX 23000 Ω A fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz ZSwitch_RX (11.3 – j214) (11.1 – j181) (10.3 – j153) (8.9 – j73) (9 – j65) Ω C 6.2 Impedance TX mode TX mode, pin 38 with short connection to GND, fRF = 0 Hz (DC) ZSwitch_TX Ω A fRF = 315 MHz fRF = 345 MHz fRF = 433.92 MHz fRF = 868.3 MHz fRF = 915 MHz ZSwitch_RX (4.8 + j3.2) (4.7 + j3.4) (4.5 + j4.3) (5 + j9) (5 + j9.2) Ω C 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 Microcontroller Interface 7.1 Voltage range for microcontroller interface IVSINT < 10 µA if CLK is disabled and all interface pins are in stable condition and unloaded 27, 28, 29, 30, 31, 32, 33, 34, 2.4 5.25 V A 7.2 CLK output rise and fall time fCLK < 4.5 MHz CL = 10 pF CL = Load capacitance on pin CLK 2.4V ≤VVSINT ≤5.25V 20% to 80% VVSINT trise tfall ns ns B 7.4 Current consumption of the microcontroller interface CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled VVSOUT disabled CL = Load capacitance on pin CLK (All interface pins, except pin CLK, are in stable condition and unloaded) IVSINT < 10 µA < 10 µA 7.5 Internal equivalent capacitance Used for current calculation 30, 27 CCLK pF B 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22. IVSINT CCLK CL VVSINT fXTO

4841C–WIRE–05/06 ATA5423/25/28/29 Power Supply General Definitions and AUX Mode 8.1 Current consumption of an external device connected to pin VSOUT IEXT IEXT = IVSOUT – IVSINT IEXT = IVSOUT 8.2 AUX mode 8.3 Power supply output voltage AUX mode VVAUX ≥ 4V IVSOUT ≤13.5 mA (3.25V regulator mode, V_REG2, see Figure 5-1 on page 30) VVSOUT 2.7 3.5 V A 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22. VSINT VSOUT IVSINT IVSOUT IEXT VSINT VSOUT IVSINT IEXT = IVSOUT VAUX IAUX_VAUX

4841C–WIRE–05/06 ATA5423/25/28/29 8.4 Current in AUX mode on pin VAUX IVSOUT = 0 VVAUX = 6V VVAUX = 4V to 7V IAUX_VAUX 380 500 500 µA µA B 8.5 Supply current AUX mode CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled 19, 22, IS_AUX IS_AUX = IAUX_VAUX + IVSINT + IEXT IS_AUX = IAUX_VAUX + IEXT 8.6 Supported voltage range VAUX VVAUX V 12. Electrical Characteristics: General (Continued) This device is manufactured with an industrial (not automotive) grade process and process controls. Although this device may meet certain automotive grade criteria in performance, Atmel can not recommend that this device be used in any automotive application. All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V (1-battery application), VVS2 = 6.0V (2-battery application) and VVS2 = VVAUX = 5.0V (Base-station Application). Typical values are given at fRF = 433.92 MHz unless otherwise specified. Details about current consumption, timing and digital pin properties can be found in the specific sections of the “Electrical Characteristics”. No. Parameters Test Conditions Pin(1) Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. Pin numbers in brackets mean they were measured with RF_IN matched to 50Ω according to Figure 3-1 on page 11 with component values according to Table 3-2 on page 12 and RF_OUT matched to 50Ω according to Figure 3-10 on page 21 with component values according to Table 3-7 on page 22.

4841C–WIRE–05/06 ATA5423/25/28/29 13. Electrical Characteristics: 1 Li Battery Application (3V) All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V. Application according to Figure 2-1 on page 7. fRF = 315 MHz/345 MHz/433.92 MHz/868.3 MHz/915 MHz unless otherwise specified No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* 9.1 Supported voltage range (every mode except high power TX mode)

1 Li battery application

(3V) PWR_H = GND 17, 18 VVS1, VVS2 2.4 3.6 V A 9.2 Supported voltage range (high power TX mode) (3V) PWR_H = AVCC 17, 18 VVS1, VVS2 2.7 3.6 V A 9.3 Power supply output voltage (3V) VVS1 = VVS2 ≥2.6V VAUX open(1) IVSOUT ≤13.5 mA (no voltage regulator to stabilize VVSOUT) VVS1 = VVS2 ≥ 2.425V VAUX open(1) IVSOUT ≤1.5 mA (no voltage regulator to stabilize VVSOUT) VVSOUT 2.4 VVS1 V B 9.4 Supply voltage for microcontroller interface VVSINT 2.4 5.25 V A 9.5 Threshold hysteresis VThres_2 – VThres_1 ∆VThres 100 mV B 9.6 Reset threshold voltage at pin VSOUT (N_RESET) VThres_1 2.18 2.3 2.42 V A 9.7 Reset threshold voltage at pin VSOUT (Low_Batt) VThres_2 2.26 2.38 2.5 V A 9.8 Supply current OFF mode VVS1 = VVS2 ≤3.6V VVSINT = 0V 17, 18, 22, 27 IS_OFF 350 nA A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. The voltage of VAUX may rise up to 2V. The current IVAUX may not exceed 100 µA. IIDLE_VS1,2 or IRX_VS1,2 or IStartup_PLL_VS1,2 or ITX_VS1,2 VS1 VS2

4841C–WIRE–05/06 ATA5423/25/28/29 9.9 Current in IDLE mode on pin VS1 and VS2 VVS1 = VVS2 ≤3V IVSOUT = 0 CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled VVSOUT disabled 17, 18 IIDLE_VS1, 2 312 260 225 430 370 320 µA µA µA A B B 9.10 Supply current IDLE mode 17, 18, 22, 27 IS_IDLE IS_IDLE = IIDLE_VS1, 2 + IVSINT + IEXT 9.11 Current in RX mode on pin VS1and VS2 VVS1 = VVS2 ≤3V IVSOUT = 0 17, 18 IRX_VS1, 2 10.5 mA A 9.12 Supply current RX mode CLK enabled VVSOUT enabled 17, 18, 22, 27 IS_RX IS_RX = IRX_VS1, 2 + IVSINT + IEXT 9.13 Current during TStartup_PLL on pin VS1 and VS2 VVS1 = VVS2 ≤3V IVSOUT = 0 17, 18 IStartup_PLL_VS1, 2 8.8 11.5 mA C 9.14 Current in RX polling mode on pin VS1 and VS2 9.15 Supply current RX polling mode CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled VVSOUT disabled 17, 18, 22, 27 IS_Poll IS_Poll = IP + IVSINT + IEXT IS_Poll = IP + IEXT IS_Poll = IP 9.16 Current in TX mode on pin VS1 and VS2 VVS1 = VVS2 ≤3V IVSOUT = 0 Pout = 5 dBm/10 dBm

315 MHz/5 dBm

315 MHz/10 dBm

345 MHz/5 dBm

345 MHz/10 dBm

433.92 MHz/5 dBm

433.92 MHz/10 dBm

868.3 MHz/5 dBm

868.3 MHz/10 dBm

915 MHz/5 dBm

915 MHz/10 dBm

17, 18 ITX_VS1_VS2 10.3 15.7 10.4 15.8 10.5 15.8 11.2 17.3 11.8 19.3 13.4 20.5 13.5 20.6 13.5 20.5 14.5 22.5 15.3 25.1 mA B 9.17 Supply current TX mode CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled 17, 18, 22, 27 IS_TX IS_TX = ITX_VS1, 2 + IVSINT + IEXT IS_TX = ITX_VS1, 2 + IEXT 13. Electrical Characteristics: 1 Li Battery Application (3V) (Continued) All parameters refer to GND and are valid for Tamb = 25°C, VVS1 = VVS2 = 3.0V. Application according to Figure 2-1 on page 7. fRF = 315 MHz/345 MHz/433.92 MHz/868.3 MHz/915 MHz unless otherwise specified No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. The voltage of VAUX may rise up to 2V. The current IVAUX may not exceed 100 µA. IP IIDLE_VS1,2 TSLEEP IStartup_PLL_VS1,2 TStartup_PLL IRX_VS1,2 TStartup_Sig_Proc TBitcheck TSleep TStartup_PLL TStartup_Sig_Proc TBitcheck

4841C–WIRE–05/06 ATA5423/25/28/29 14. Electrical Characteristics: 2 Li Battery Application (6V) All parameters refer to GND and are valid for Tamb = 25°C, VVS2 = 6.0V. Application according to Figure 2-3 on page 9 fRF = 315 MHz/345 MHz/433.92 MHz/868.3 MHz/915 MHz unless otherwise specified No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* 10.1 Supported voltage range

2 Li battery

application (6V) VVS2 4.4 6.6 V A 10.2 Power supply output voltage application (6V) VVS2 ≥ 4.4V VAUX open(1) IVSOUT ≤13.5 mA (3.3V regulator mode, V_REG1, see Figure 5-1 on page 30) VVSOUT 3.0 3.5 V A 10.3 Supply voltage for microcontroller interface VVSINT 2.4 5.25 V A 10.4 Threshold hysteresis VThres_2 – VThres_1 ∆VThres 100 mV B 10.5 Reset threshold voltage at pin VSOUT (N_RESET) VThres_1 2.18 2.3 2.42 V A 10.6 Reset threshold voltage at pin VSOUT (Low_Batt) VThres_2 2.26 2.38 2.5 V A 10.7 Supply current OFF mode VVS2 ≤6.6V VVSINT = 0V 17, 22, 27 IS_OFF 350 nA A 10.8 Current in IDLE mode on pin VS2 VVS2 ≤6V IVSOUT = 0 CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled VVSOUT disabled IIDLE_VS2 410 348 309 560 490 430 µA µA µA A B B 10.9 Supply current IDLE mode 17, 22, 27 IS_IDLE IS_IDLE = IIDLE_VS2 + IVSINT + IEXT 10.10 Current in RX mode on pin VS2 IVSOUT = 0 IRX_VS2 10.8 14.5 mA B 10.11 Supply current RX mode CLK enabled VVSOUT enabled 17, 22, 27 IS_RX IS_RX = IRX_VS2 + IVSINT + IEXT *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. The voltage of VAUX may rise up to 2 V. The current IVAUX may not exceed 100 µA. VS2 IIDLE_VS2 or IRX_VS2 or IStartup_PLL_VS2 or ITX_VS2

4841C–WIRE–05/06 ATA5423/25/28/29 10.12 Current during TStartup_PLL on pin VS2 IVSOUT = 0 IStartup_PLL_VS2 9.1 mA C 10.13 Current in RX polling mode on on pin VS2 10.14 Supply current RX polling mode CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled VVSOUT disabled 17, 22, 27 IS_Poll IS_Poll = IP + IVSINT + IEXT IS_Poll = IP + IEXT IS_Poll = IP 10.15 Current in TX mode on pin VS2 IVSOUT = 0 Pout = 5 dBm/10 dBm 17, 19 ITX_VS2 10.7 16.2 10.8 16.3 10.9 16.3 11.6 17.8 12.3 20.0 13.9 21.0 14.0 21.2 14.0 21.0 15.0 23.0 16.0 26.0 mA B 10.16 Supply current TX mode CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled 17, 22, 27 IS_TX IS_TX = ITX_VS2 + IVSINT + IEXT IS_TX = ITX_VS2 + IEXT 14. Electrical Characteristics: 2 Li Battery Application (6V) (Continued) All parameters refer to GND and are valid for Tamb = 25°C, VVS2 = 6.0V. Application according to Figure 2-3 on page 9 fRF = 315 MHz/345 MHz/433.92 MHz/868.3 MHz/915 MHz unless otherwise specified No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. The voltage of VAUX may rise up to 2 V. The current IVAUX may not exceed 100 µA. IP IIDLE_VS2 TSLEEP IStartup_PLL_VS2 TStartup_PLL IRX_VS2 TStartup_Sig_Proc TBitcheck TSleep TStartup_PLL TStartup_Sig_Proc TBitcheck

4841C–WIRE–05/06 ATA5423/25/28/29 15. Electrical Characteristics: Base-station Application (5V) All parameters refer to GND and are valid for Tamb = 25°C, VVS2 = 5.0V. Application according to Figure 2.2 on page 8 fRF = 315 MHz/345 MHz/433.92 MHz/868.3 MHz/915 MHz unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* Base-station Application (5V) 11.1 Supported voltage range Base-station application (5V) 17, 19, 27 VVS2, VAUX 4.75 5.25 V A 11.2 Power supply output voltage Base-station application (5V) VVS2 = VVAUX IVSOUT ≤13.5 mA (3.25V regulator mode, V_REG2, see Figure 5-1 on page 30) VVSOUT 3.0 3.5 V A 11.3 Supply voltage for microcontroller- interface VVSINT 2.4 5.25 V A 11.4 Threshold hysteresis VThres_2 – VThres_1 ∆VThres 100 mV B 11.5 Reset threshold voltage at pin VSOUT (N_RESET) VThres_1 2.18 2.3 2.42 V A 11.6 Reset threshold voltage at pin VSOUT (Low_Batt) VThres_2 2.26 2.38 2.5 V A 11.7 Current in IDLE mode on pin VS2 and VAUX IVSOUT = 0 CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled VVSOUT disabled 17, 19 IIDLE_VS2_VAUX 444 380 310 580 500 400 µA B 11.8 Supply current in IDLE mode 17, 19, 22, 27 IS_IDLE IS_IDLE = IIDLE_VS2_VAUX + IVSINT + IEXT 11.9 Current in RX mode on pin VS2 and VAUX IVSOUT = 0 17, 19 IRX_VS2_VAUX 10.8 14.5 mA B 11.10 Supply current in RX mode CLK enabled VVSOUT enabled 17, 19, 22, 27 IS_RX IS_RX = IRX_VS2_VAUX + IVSINT + IEXT 11.11 Current during TStartup_PLL on pin VS2 and VAUX IVSOUT = 0 17, 19 IStartup_PLL_VS2, VAUX 9.1 mA C *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter VAUX VS2 IIDLE_VS2,VAUX or IRX_VS2,VAUX or IStartup_PLL_VS2,VAUXor ITX_VS2,VAUX

4841C–WIRE–05/06 ATA5423/25/28/29 11.12 Current in RX_Polling_Mode on pin VS2 and VAUX 11.13 Supply current in RX polling mode CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled VVSOUT disabled 17, 19, 22, 27 IS_Poll IS_Poll = IP + IVSINT + IEXT IS_Poll = IP + IEXT IS_Poll = IP 11.14 Current in TX mode on pin VS2 and VAUX IVSOUT = 0 Pout = 5dBm/10dBm

315 MHz/5dBm

315 MHz/10dBm

345 MHz/5dBm

345 MHz/10dBm

433.92 MHz/5dBm

433.92 MHz/10dBm

868.3 MHz/10dBm

915 MHz/5dBm

915 MHz/10dBm

17, 19 ITX_VS2_VAUX 10.7 16.2 10.8 16.3 10.9 16.3 11.6 17.8 12.3 20.0 13.9 21.0 14.0 21.2 14.0 21.0 15.0 23.0 16.0 26.0 mA B 11.15 Supply current in TX mode CLK enabled VVSOUT enabled CLK disabled VVSOUT enabled 17, 19, 22, 27 IS_TX IS_TX = ITX_VS2_VAUX + IVSINT + IEXT IS_TX = ITX_VS2_VAUX + IEXT 15. Electrical Characteristics: Base-station Application (5V) (Continued) All parameters refer to GND and are valid for Tamb = 25°C, VVS2 = 5.0V. Application according to Figure 2.2 on page 8 fRF = 315 MHz/345 MHz/433.92 MHz/868.3 MHz/915 MHz unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter IP IIDLE_VS2,VAUX TSLEEP IStartup_PLL_VS2,VAUX TStartup_PLL IRX_VS2,VAUX TStartup_Sig_Proc TBitcheck TSleep TStartup_PLL TStartup_Sig_Proc TBitcheck

4841C–WIRE–05/06 ATA5423/25/28/29 16. Digital Timing Characteristics All parameters refer to GND and are valid for Tamb = 25°C. VVS1 = VS2 = 3.0V (1 Li battery application (3V)), VVS2 = 6.0V (2 Li battery application (6V)) and VVS2 = 5.0V (Base-station Application(5V)) unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* Basic Clock Cycle of the Digital Circuitry 12.1 Basic clock cycle TDCLK 16/fXTO 16/fXTO µs A 12.2 Extended basic clock cycle XLIM = 0 BR_Range_0 BR_Range_1 BR_Range_2 BR_Range_3 XLIM = 1 BR_Range_0 BR_Range_1 BR_Range_2 BR_Range_3 TXDCLK × TDCLK × TDCLK × TDCLK × TDCLK µs A RX Mode/RX Polling Mode 13.1 Sleep time Sleep and XSleep are defined in control register 4 TSleep Sleep × XSleep × 1024 × TDCLK Sleep × XSleep × 1024 × TDCLK ms A 13.2 Start-up PLL RX mode from IDLE mode TStartup_PLL 798.5 × TDCLK 798.5 × TDCLK µs A 13.3 Start-up signal processing BR_Range_0 BR_Range_1 BR_Range_2 BR_Range_3 TStartup_Sig_Proc 882 498 306 210 × TDCLK 882 498 306 210 × TDCLK A 13.4 Time for bit check Average time during polling. No RF signal applied. fSignal = 1/(2 × tee) Signal data rate Manchester (Lim_min and Lim_max up to ±50% of tee, see Figure 9-4 on page 56) Bit-check time for a valid input signal fSignal NBit-check = 0 NBit-check = 3 NBit-check = 6 NBit-check = 9 TBit_check 3/fSignal 6/fSignal 9/fSignal 1/fSignal 3.5/fSignal 6.5/fSignal 9.5/fSignal ms C 13.5 Bit-rate range BR_Range = BR_Range0 BR_Range1 BR_Range2 BR_Range3 BR_Range 1.0 2.0 4.0 8.0 2.5 5.0 10.0 20.0 Kbit/s A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter

4841C–WIRE–05/06 ATA5423/25/28/29 13.6 Minimum time period between edges at pin SDO_TMDO in RX transparent mode XLIM = 0 BR_Range_0 BR_Range_1 BR_Range_2 BR_Range_3 XLIM = 1 BR_Range_0 BR_Range_1 BR_Range_2 BR_Range_3 TDATA_min 10 × TXDCLK µs A 13.7 Edge-to-edge time period of the data signal for full sensitivity in RX mode BR_Range_0 BR_Range_1 BR_Range_2 BR_Range_3 TDATA 200 100 500 250 125 62.5 µs B TX Mode 14.1 Start-up time From IDLE mode TStartup 331.5 × TDCLK 331.5 × TDCLK µs A Configuration of the Transceiver with 4-wire Serial Interface 15.1 CS set-up time to rising edge of SCK 33, 35 TCS_setup 1.5 × TDCLK µs A 15.2 SCK cycle time TCycle µs A 15.3 SDI_TMDI set-up time to rising edge of SCK 32, 33 TSetup 250 ns C 15.4 SDI_TMDI hold time from rising edge of SCK 32, 33 THold 250 ns C 15.5 SDO_TMDO enable time from rising edge of CS 31, 35 TOut_enable 250 ns C 15.6 SDO_TMDO output delay from falling edge of SCK CL = 10 pF 31, 35 TOut_delay 250 ns C 15.7 SDO_TMDO disable time from falling edge of CS 31, 33 TOut_disable 250 ns C 15.8 CS disable time period TCS_disable 1.5 × TDCLK µs A 15.9 Time period SCK low to CS high 33, 35 TSCK_setup1 250 ns C 15.10 Time period SCK low to CS low 33, 35 TSCK_setup2 250 ns C 15.11 Time period CS low to SCK high 33, 35 TSCK_hold 250 ns C 16. Digital Timing Characteristics (Continued) All parameters refer to GND and are valid for Tamb = 25°C. VVS1 = VS2 = 3.0V (1 Li battery application (3V)), VVS2 = 6.0V (2 Li battery application (6V)) and VVS2 = 5.0V (Base-station Application(5V)) unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter

4841C–WIRE–05/06 ATA5423/25/28/29 Start Time Push Button Tn and PWR_ON Timing of Wake-up via PWR_ON or Tn 16.1 PWR_ON high to positive edge on pin IRQ (see Figure 7-4 on page 46) From OFF mode to IDLE mode, applications according to Figure 2-1 on page 7, Figure 2.2 on page 8 and Figure 2-3 on page 9 XTAL: Cm < 14 fF (typ. 5 fF) C0 < 2.2 pF (typ. 1.8 pF) Rm ≤ 120Ω (typ. 15Ω) (3V) C1 = C2 = 68 nF C3 = C4 = 68 nF C5 = 10 nF

2 Li battery application

(6V) C1 = C4 = 68 nF C2 = C3 = 2.2 µF C5 = 10 nF Base-station Application (5V) C1 = C3 = C4 = 68 nF C2 = C12 = 2.2 µF C5 = 10 nF 29, 40 TPWR_ON_IRQ_1 0.3 0.45 0.45 0.8 1.3 1.3 ms ms ms B 16. Digital Timing Characteristics (Continued) All parameters refer to GND and are valid for Tamb = 25°C. VVS1 = VS2 = 3.0V (1 Li battery application (3V)), VVS2 = 6.0V (2 Li battery application (6V)) and VVS2 = 5.0V (Base-station Application(5V)) unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter

4841C–WIRE–05/06 ATA5423/25/28/29 16.2 PWR_ON high to positive edge on pin IRQ (see Figure 7-4 on page 46) Every mode except OFF mode 29, 40 TPWR_ON_IRQ_2 2 × TDCLK µs A 16.3 Tn low to positive edge on pin IRQ (see Figure 7-2 on page 44) From OFF mode to IDLE mode, applications according to Figure 2-1 on page 7, Figure 2.2 on page 8 and Figure 2-3 on page 9 XTAL: Cm < 14 fF (typ 5 fF) C0 < 2.2 pF (typ 1.8 pF) Rm ≤120Ω (typ 15Ω) (3V) C1 = C2 = 68 nF C3 = C4 = 68 nF C5 = 10 nF (6V) C1 = C4 = 68 nF C2 = C3 = 2.2 µF C5 = 10 nF Base-station Application (5V) C1 = C3 = C4 = 68 nF C2 = C12 = 2.2 µF C5 = 10 nF 29, 41, 42, 43, 44, 45 TTn_IRQ 0.3 0.45 0.45 0.8 1.3 1.3 ms ms ms B 16.4 Push button debounce time Every mode except OFF mode 29, 41, 42, 43, 44, 45 TDebounce 8195 × TDCLK 8195 × TDCLK µs A 16. Digital Timing Characteristics (Continued) All parameters refer to GND and are valid for Tamb = 25°C. VVS1 = VS2 = 3.0V (1 Li battery application (3V)), VVS2 = 6.0V (2 Li battery application (6V)) and VVS2 = 5.0V (Base-station Application(5V)) unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter

4841C–WIRE–05/06 ATA5423/25/28/29 17. Digital Port Characteristics All parameters refer to GND and are valid for Tamb = –40°C to +85 °C, VVS1 = VS2 = 2.4V to 3.6V (1 Li battery application (3V)) and VVS1 = VVS2 = 3V and Tamb = 25°C unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* Digital Ports 17.1 CS input Low level input voltage VVSINT = 2.4V to 5.25V VIl 0.2 × VVSINT V A High level input voltage VVSINT = 2.4V to 5.25V VIh 0.8 × VVSINT VVSINT V A 17.2 SCK input Low level input voltage VVSINT = 2.4V to 5.25V VIl 0.2 × VVSINT V A High level input voltage VVSINT = 2.4V to 5.25V VIh 0.8 × VVSINT VVSINT V A 17.3 SDI_TMDI input Low level input voltage VVSINT = 2.4V to 5.25V VIl 0.2 × VVSINT V A High level input voltage VVSINT = 2.4V to 5.25V VIh 0.8 × VVSINT VVSINT V A 17.4 TEST1 input TEST1 input must always be directly connected to GND V 17.5 TEST2 input TEST2 input must always be direct connected to GND V 17.6 PWR_ON input Low level input voltage Internal pull-down with series connection of 40 kΩ ±20% resistor and diode VIl 0.4 V A High level input voltage(1) Internal pull-down with series connection of 40 kΩ ±20% resistor and diode VIh 0.8 × VVS2 V A 17.7 Tn input Low level input voltage Internal pull-up resistor of 50 kΩ ±20% 41, 42, 43, 44, VIl 0.2 × VVS2 V A High level input voltage(1) Internal pull-up resistor of 50 kΩ ±20% 41, 42, 43, 44, VIh × VVS2 –0.5V V A 17.8 433_N868 input Low level input voltage VIl 0.25 V A Input current low IIl µA A High level input voltage VIh 1.7 AVCC V A Input current high IIh µA A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. If a logic high level is applied to this pin, a minimum serial impedance of 100Ω must be ensured for proper operation over full temperature range.

4841C–WIRE–05/06 ATA5423/25/28/29 17.9 PWR_H input Low level input voltage VIl 0.25 V A Input current low IIl µA A High level input voltage VIh 1.7 AVCC V A Input current high IIh µA A 17.10 SDO_TMDO output Saturation voltage low VVSINT = 2.4V to 5.25V ISDO_TMDO = 250 µA Vol 0.15 0.4 V B Saturation voltage high VVSINT = 2.4V to 5.25V ISDO_TMDO = –250 µA Voh VVSINT – 0.4 VVSINT – 0.15 V B 17.11 IRQ output Saturation voltage low VVSINT = 2.4V to 5.25V IIRQ = 250 µA Vol 0.15 0.4 V B Saturation voltage high VVSINT = 2.4V to 5.25V IIRQ = –250 µA Voh VVSINT – 0.4 VVSINT – 0.15 V B 17.12 CLK output Saturation voltage low VVSINT = 2.4V to 5.25V ICLK = 100 µA internal series resistor of 1 kΩ for spurious emission reduction in PLL Vol 0.15 0.4 V B Saturation voltage high VVSINT = 2.4V to 5.25V ICLK = –100 µA internal series resistor of 1 kΩ for spurious emission reduction in PLL Voh VVSINT – 0.4 VVSINT – 0.15 V B 17.13 N_RESET output Saturation voltage low VVSINT = 2.4V to 5.25V IN_RESET = 250 µA Vol 0.15 0.4 V B Saturation voltage high VVSINT = 2.4V to 5.25V IN_RESET = –250 µA Voh VVSINT – 0.4 VVSINT – 0.15 V B 17.14 RX_ACTIVE output Saturation voltage low VVSINT = 2.4V to 5.25V IRX_ACTIVE = 25 µA Vol 0.25 0.4 V B Saturation voltage high VVSINT = 2.4V to 5.25V IRX_ACTIVE = –1500 µA Voh VAVCC –0.5 VAVCC –0.15 V B 17.15 DEM_OUT output Saturation voltage low Open drain output IDEM_OUT = 250 µA Vol 0.15 0.4 V B 17. Digital Port Characteristics (Continued) All parameters refer to GND and are valid for Tamb = –40°C to +85 °C, VVS1 = VS2 = 2.4V to 3.6V (1 Li battery application (3V)) and VVS1 = VVS2 = 3V and Tamb = 25°C unless otherwise specified. No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Note: 1. If a logic high level is applied to this pin, a minimum serial impedance of 100Ω must be ensured for proper operation over full temperature range.

4841C–WIRE–05/06 ATA5423/25/28/29 19. Package Information 18. Ordering Information Extended Type Number Package Remarks Delivery ATA5423-PLQW QFN48 7 mm × 7 mm Taped and reeled + Dry pack ATA5425-PLQW QFN48 7 mm × 7 mm Taped and reeled + Dry pack ATA5428-PLQW QFN48 7 mm × 7 mm Taped and reeled + Dry pack ATA5429-PLQW QFN48 7 mm × 7 mm Taped and reeled + Dry pack ATA5423-PLSW QFN48 7 mm × 7 mm Tubes + Dry pack ATA5425-PLSW QFN48 7 mm × 7 mm Tubes + Dry pack ATA5428-PLSW QFN48 7 mm × 7 mm Tubes + Dry pack ATA5429-PLSW QFN48 7 mm × 7 mm Tubes + Dry pack Note: W = RoHS compliant

4841C–WIRE–05/06 ATA5423/25/28/29 20. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. History 4841C-WIRE-05/06

• Put datasheet in a new template
• kBaud replaced through Kbit/s
• Baud replaced through bit
• Table 9-6 “Interrupt Handling” on page 65 changed

4841C–WIRE–05/06 ATA5423/25/28/29 21. Table of Contents

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