AT97SC3201 ATMEL | Alldatasheet
Document overview
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Technical content
Features
- Full TCG/TCPA V1.1b Compatibility Single Chip Turnkey Solution Hardware Asymmetric Crypto Engine 2048 RSA Sign in 500 ms Using CRT AVR 8-bit RISC Microprocessor Internal EEPROM Storage for 10+ RSA Keys 33 MHz LPC (Low Pin Count) Bus for Easy PC Interface 100 KHz System Management Bus (SMBus) Two-wire Interface Secure Hardware and Firmware Design and Chip Layout True Random Number Generator (RNG) Secure Real-time Clock Option 3.3V ±10% Supply Voltage 28-lead TSSOP Package or 40-lead MLF Package 0–70°C Temperature Range
Description
The AT97SC3201 is a fully integrated security module designed to be integrated into personal computers and other embedded systems. It implements version 1.1b of the Trusted Computing Platform Alliance (TCP A) specification for Trusted Platform Modules (TPM). This specification has been adopted by the Trusted Computing Group (TCG). The TPM includes a crypto accelerator capable of computing a 2048-bit RSA signature in 500 ms and a 1024-bit RSA signature in 100 ms, both using CRT. Communication to and from the TPM can occur through one of two interface protocols: either a 33-MHz LPC interface or a 100-KHz SMBus two-wire interface. Figure 1. AT97SC3201 Block Diagram
33 MHz
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2015DS-TPM–7/04 A real-time clock function is available using an external battery and crystal. The chip provides tamper detection if the battery or crystal are removed or tampered with, and the current time value can be signed by the appropriate internal keys to verify its accuracy. (Contact Atmel for current status of this option.) The battery detector can be used without the crystal for lower cost. In this mode, the TPM can indicate to the system if it has been removed from the PC in any way and can also take actions internally. The chip uses a dynamic internal memory management scheme to store from 10 to 20 keys. Other than the standard TCG commands (TPM_Evictkey, TPM_Loadkey), no system inter- vention is required to manage this internal key cache. The TPM is offered to OEM manufacturers as a turnkey solution, including the firmware inte- grated on the chip. In addition, Atmel provides the necessary driver software for integration into certain operating systems, along with BIOS drivers. A TCG Software Stack (TSS), also supplied by Atmel and available under license, provides communication support to any appli- cation using MSCAPI or PKCS #11 Cryptographic APIs. (Contact Atmel for a complete list of operating systems supported.) Full documentation for TCG primitives can be found on the TCG Web site, www.trustedcomputinggroup.org . This specification includes only mechanical and electrical information.
Note: These parameters guaranteed but not tested. extended periods may affect device reliability. Table 1. DC Parameters* IBB Battery Current 2 4 µA V CC = 0V; fxtal = 0 Hz.
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Note: 1. All parameters measured with respect to signal crossing Vtest = 0.4 * V CC unless otherwise noted.
- These parameters guaranteed but not tested.
- The minimum parameter must never be violated under any circumstances unless Ireset# is asserted. If proper CLKRUN#
signaling is observed, the maximum specification can be violated. Table 2. AC Parameters* Table 3. Ordering Information
2015DS-TPM–7/04 Package Drawing 28A3 – TSSOP
2325 Orchard Parkway
San Jose, CA 95131 TITLE DRAWING NO. R REV. 1/8/02 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D 9.60 9.70 9.80 2, 5 E 8.10 BSC E1 6.00 6.10 6.20 3, 5 A –– 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 4 e 0.65 BSC L 0.45 0.60 0.75 L1 1.00 REF 28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch, Thin Shrink Small Outline Package (TSSOP) Notes: 1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional informa tion. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.0 10 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 28A3 A A L D A2 E E1 e b Top View Side View End View
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2015DS-TPM–7/04 40ML1 San Jose, CA 95131 TITLE DRAWING NO. R REV. A Side View 40ML1, 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded Quad Flat No Lead Package (MLF2) A40ML1 3/9/04 Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D 6.00 BSC E 6.00 BSC D2 3.95 4.10 4.25 E2 3.95 4.10 4.25 A - 0.85 0.90 A1 0.0 0.01 0.05 A2 - 0.65 0.70 A3 0.20 REF L 0.30 0.40 0.50 e 0.50 BSC b 0.18 0.23 0.30 2 D E Top View N Pin 1 Indicator L PIN1 ID b N e Bottom View
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