AT88SC0104CA_09 ATMEL | Alldatasheet
Document overview
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Technical content
Features
- One of a Family of Devices with User Memories from 1-Kbit to 8-Kbits
- 1-Kbit (128-byte) EEPROM User Memory ⎯ Four 256-bit (32-byte) Zones ⎯ Self-timed Write Cycle ⎯ Single Byte or 16-byte Page Write Mode ⎯ Programmable Access Rights for Each Zone
- 2-Kbit Configuration Zone ⎯ 37-byte OTP Area for User-defined Codes ⎯ 160-byte Area for User-defined Keys and Passwords
- High Security Features ⎯ 64-bit Mutual Authentication Protocol (Under License of ELVA) ⎯ Cryptographic Message Authentication Codes (MAC) ⎯ Stream Encryption ⎯ Four Key Sets for Authentication and Encryption ⎯ Eight Sets of Two 24-bit Passwords ⎯ Anti-Tearing Function ⎯ Voltage and Frequency Monitors
- Smart Card Features ⎯ ISO 7816 Class B (3V) Operation ⎯ ISO 7816-3 Asynchronous T=0 Protocol (Gemplus® Patent) * ⎯ Multiple Zones, Key Sets and Passwords for Multi-application Use ⎯ Synchronous 2-wire Serial Interface for Faster Device Initialization * ⎯ Programmable 8-byte Answer-To-Reset Register ⎯ ISO 7816-2 Compliant Modules
- Embedded Application Features ⎯ Low Voltage Supply: 2.7V – 3.6V ⎯ Secure Nonvolatile Storage for Sensitive System or User Information ⎯ 2-wire Serial Interface (TWI, 5V Compatible) ⎯ 1.0 MHz Compatibility for Fast Operation ⎯ Standard 8-lead Plastic Packages, Green compliant (exceeds RoHS) ⎯ Same Pin Configuration as AT24CXXX Serial EEPROM in SOIC and PDIP Packages
- High Reliability ⎯ Endurance: 100,000 Cycles ⎯ Data Retention: 10 years ⎯ ESD Protection: 2,000V min * Note: Modules available with either T = 0 / 2-wire modes or 2-wire mode only. CryptoMemory® AT88SC0104CA Summary 5200ES–CRYPT–08/09
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Table 1. Pin Assignments Figure 1. Pin Configuration reduced code space requirements.
protocol (Gemplus Patent) defined in ISO 7816-3. as AT24CXXX serial EEPROM devices. Note: Does not apply to either the TSSO P or the Ultra Thin Mini-Map pinouts. Figure 2. Block Diagram
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Figure 3. Connection Diagram The VCC input is a 2.7V to 3.6V positive voltage supplied by the host. nominal length of one bit emitted on I/O is defined as an “elementary time unit” (ETU) and is equal to 372/ f. device and on the negative edge of the clock when reading from the device. AT88SC0104CA does not support an Answer-To-Reset sequence in the synchronous mode of operation. both asynchronous and synchronous protocols.
- *Absolute Maximum Ratings
Table 2. DC Characteristics turned on before applying VIH. For Powering Down, VIH must be removed before turning VCC off.
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Table 3. AC Characteristics
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Figure 5. Write Cycle Timing. SCL: Se rial Clock, SDA: Serial Data I/O Figure 6. Data Validity Figure 7. START and STOP Definitions
Figure 8. Output Acknowledge
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of data or files in different zones. Access to user zones is permitted only after meeting proper security requirements. Figure 9. User Zones access registers, key registers and keys programmed into the configuration memory dur ing device personalization.
defined in the control logic and are not alterable by the user after completion of personalization. Figure 10. Configuration Memory of the device and blowing of the fuses may be performed at one final step.
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- Communication Security Modes
is activated by a successful encryption activation following a successful authentication. Table 4. Communication Security Modes (1) MDC: Modification Detection Code. MAC: Message Authentication Code. data is limited to a maximum of eight bytes for each write request. volatile buffering of the data is done automatically by the device. device needs to carry out the data recovery process. byte for the bytes of that page. For example, the write lock byte at $080 controls the bytes from $081 to $087. Figure 11. Write Lock Example mode is activated, the write lock byte can only be programmed – that is, bits written to “0” cannot return to “1”. than one byte will result in writing of just the first byte into the device.
Presenting the correct WRITE password also grants READ access privileges. authentication which must be presented again to gain access. Only the latest request is memorized. Figure 12. Password and Aut hentication Operations verification attempts futile.
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5200ES–CRYPT–08/09 12.5. Cryptographic Message Authentication Codes AT88SC0104CA implements a data validity check function in the standard, authentication or encryption modes of operation. In the standard mode, data validity check is done through a Modification Detection Code (MDC), in which the host may read an MDC from the device in order to verify that the data sent was received correctly. In authentication and encryption modes, the data validity check becomes more powerful since it provides a bidirectional data integrity check and data origin authentication capability in the form of a Message Authentication Codes (MAC). Only the host/device that carried out a vali d authentication is capable of computing a valid MAC. While operating in the authentication or encryption modes, the use of MAC is requi red. For an ingoing command, if the device calculates a MAC different from the MAC transmitted by the host, not only is the command abandoned but the security privilege is revoked. A new authentication and/or encryption activation will be required to reactivate the MAC. 12.6. Encryption The data exchanged between the device and the host during read, write and verify password commands may be encrypted to ensure data confidentiality. The issuer may choose to require encryption for a user zo ne by settings made in the configuration memory. Any one of four keys may be selected for use with a user zone. In this case, activation of the encryption mode is required in order to read/write data in the zone and only encrypted data will be transmitted. Even if not requi red, the host may still elect to activate encryption provided the proper keys are known. 12.7. Supervisor Mode Enabling this feature allows the holder of one specific password to gain full access to all eight password sets, including the ability to change passwords. 12.8. Modify Forbidden No write access is allowed in a user zone protected with th is feature at any time. The user zone must be written during device personalization prior to blowing the security fuses. 12.9. Program Only For a user zones protected by this f eature, data can only be programmed (bits c hange from a “1” to a “0”), but not erased (bits change from a “0” to a “1”).
The AT88SC0104CA supports two different communication protocols. interoperability with industry standard smartcard readers. A 2-wire serial interface provides fast and efficient connectivity with other logic devices or microcontrollers. selection is allowed only during power-up. The synchronous mode is the default mode after power up. This is due to the presence of an internal pull-up on RST. After stable VCC, SCL(CLK) and SDA(I/O) may be driven. Figure 13. Synchronous 2-Wire Protocol Note: Five clock pulses must be sent before the first command is issued.
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This power-up sequence complies to ISO 7816-3 for a cold reset in smart card applications. VCC goes high; RST, I/O (SDA) and CLK (SCL) are low. Set I/O (SDA) in receive mode. Provide a clock signal to CLK (SCL). RST goes high after 400 clock cycles. Figure 14. Asynchronous T = 0 Protocol (Gemplus Patent)
- Initial Device Programming
with verification using simple WRITE and READ commands, and then blowing fuses to lock this information in place. password. The user may elect to change the signature of the secure code anytime after successful presentation. from the product page at www.atmel.com/products/securemem.
Table 5. Ordering Information Table 6. Ordering Information Note: 1. Formal drawings may be obtained from an Atmel sales office. 2 . Both the J and P Module Packages are used for either ISO (T=0 / 2-wire mode) or TWI (2-wire mode only).
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5200ES–CRYPT–08/09 16. Package Information Ordering Code: MJ or MJTG Ordering Code: MP or MPTG Module Size: M2 Dimension*: 12.6 x 11.4 [mm] Glob Top: Round – Æ 8.5 [mm] Thickness: 0.58 [mm] Pitch: 14.25 mm Module Size: M2 Dimension*: 12.6 x 11.4 [mm] Glob Top: Square - 8.8 x 8.8 [mm] Thickness: 0.58 [mm] Pitch: 14.25 mm *Note: The module dimensions listed refer to the dimensi ons of the exposed metal contact area. The actual dimensions of the module after excise or punching from the carrier tape are generally 0.4 mm greater in both
5200ES–CRYPT–08/09 17. Ordering Code: SU 17.1. 8-lead SOIC Note: COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A1 0.10 – 0.25 These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. A 1.35 – 1.75 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e 1.27 BSC L 0.40 – 1.27 0˚ –8 ˚ Top View End View Side View e D A N E C L DRAWING NO.1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 REV. 8S1 C 3/17/05 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) b
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5200ES–CRYPT–08/09 18. Ordering Code: PU 18.1. 8-lead PDIP COMMON DIMENSIONS (Unit of Measure = inches) SYMBOL MIN NOM MAX NOTE D E e Lb2 b A2 A N eA c
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DRAWING NO.2325 Orchard Parkway San Jose, CA 95131R REV. 8P3 B 01/09/02 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) A b c D E e eA L 0.115 0.014 0.045 0.030 0.008 0.355 0.005 0.300 0.240 0.115 0.130 0.018 0.060 0.039 0.010 0.365 0.310 0.250 0.130 0.210 0.195 0.022 0.070 0.045 0.014 0.400 0.325 0.280 0.150
0.100 BSC
0.300 BSC
Notes: 1. This drawing is for general information only; refer to JEDEC D rawing MS-001, Variation BA, for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are pre ferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
5200ES–CRYPT–08/09 19. Ordering Code: TH 19.1. 8-lead TSSOP COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D 2.90 3.00 3.10 2, 5 E 6.40 BSC E1 4.30 4.40 4.50 3, 5 A– – 1 . 2 0 A2 0.80 1.00 1.05 b0 . 1 9 – 0 . 3 0 4 e 0.65 BSC L 0.45 0.60 0.75 L1 1.00 RE3 Side View A D b End View Top View L 123 N Pin 1 indicator this corner E e DRAWING NO. REV. 8A2 C 10/29/08 TITLE Notes: 1. This drawing is for general information only. Refer to JEDEC D rawing MO-153, Variation AA, for proper dimension s, tolerances, datums, etc. 2. Dimension D does not include mold Flash, prot rusions or gate burrs. Mold Flash, prot rusions and gate burrs shall not exceed 0.15 mm (0.006 in) per sid e. 3. Dimension E1 does not include inter-lead Flash or prot rusions. Inter-lead Flash and prot rusions shall not exceed 0.25 mm (0.010 in) per sid e. 4. Dimension b does not include Dambar prot rusion. Allowable Dambar prot rusion shall be 0.08 mm total in excess of the b dimension at maxi mum material condition. Dambar cannot be located on the l ower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm . 5. Dimension D and E1 to be dete rmined at Datum Plane H . Package Drawing Contact: 8A2, 8-lead, 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) TNR GPC packagedrawings@atmel.com
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5200ES–CRYPT–08/09 20. Ordering Code: Y6H-T 20.1. 8-lead Ultra Thin Mini-Map DRAWING NO. REV. 8Y6 E 11/21/08 TITLE Package Drawing Contact: 8Y6, 8-lead, 2.0x3.0 mm Body, 0.50 mm Pitch, UltraThin Mini-MAP , Dual No Lead Package (Sawn)(UDFN) YNZ GPC Pin 1 Index Area D E b (8X) Pin 1 ID A L (8X) e (6X) 1.50 REF . COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE D 2.00 BSC E 3.00 BSC D2 1.40 1.50 1.60 E2 - - 1.40 A - - 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 A3 0.20 REF L 0.20 0.30 0.40 e 0.50 BSC b 0.20 0.25 0.30 2 Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the te rminal, the dimension should not be measured in that radius area. 3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the device through this pad, so if soldered it should be tied to ground packagedrawings@atmel.com
5200ES–CRYPT–08/09 Appendix A. Revision History Doc. Rev. Date Comments 5200ES 08/2009 Minor edits and TWI module updates 5200DS 07/2009 Minor updates to package drawing information and ordering information. 5200CS 05/2009 Added Mini-MAP column to Table 1-1 and Mini-MAP pin-out drawing. 5200BS 02/2009 Connection Diagram inserted; DC Characteristics table updated. 5200AS 07/2008 Initial document release.
5200eS–CRYPT–08/09 Headquarters International Atmel Corporation
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