AT73C209_14 ATMEL | Alldatasheet
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Features
- Power Management – Supply Input from USB or 1x Disposal Battery (Alkaline, NimH, NiCd) – Input Voltage Range: 0.9V to 1.8V – 2.7V/2.9V/3.1V/3.3V - 100 mA Step-Up DC/DC Converter for Main Supply – 2.7V to 3.5V (100mV step) - 150 mA LDO from USB supply – 2.4V to 3.0V (200mV step) - 60 mA LDO for Analog Supply – Reset Generator – SPI Interface and Intern al Programming Registers – Dynamic Power Management – Very Low Quiescent Current Operation Stereo Audio DAC – Programmable Stereo Audio DAC (16-bits, 18-bits or 20-bits) – 93 dB SNR Playback Stereo Channels – 32 Ohm/20 mW Stereo Headset Drivers wi th Master Volume and Mute Controls – Stereo Line Level Input with Volume Control/Mute and Playback through the Headset Driver – Microphone Preamplifier – Stereo, Mono and Reverse Stereo Mixer – Left/Right Speaker Shor t-Circuit Detection Flag – 8, 11.024, 16, 22.05, 24, 32, 44 .1 and 48 kHz Sampling Rates – 256x or 384xFs Master Clock Frequency – I2S Serial Audio Interface – Low Power Operation Applications: – Ideally Suited to Interface with At mel’s AT8xC51SNDxC MP3 Microcontroller – Portable Music Players, Digital Cameras, CD Players, Handheld GPS 1. Description The AT73C209 is a fully integrated, low cost, combined Stereo Audio DAC and Power Management Circuit targeted for battery pow ered devices such as MP3 players in “walkman” format or “mass storage” USB format. The stereo DAC section is a complete high performance, stereo audio digital-to-ana- log converter delivering a 93 dB dynamic range. It comprises a multibit sigma-delta modulator with dither, continuous time analog filters and analog output drive circuitry. This architecture provides a high insensitivity to clock jitter. The digital interpolation fil- ter increases the sample rate by a factor of 8, using 3 linear phase half-band cascaded filters, followed by a first order SINC interpolator with a sample-rate factor of 8. This filter eliminates the images of baseband audio, retaining only the image at 64x the input sample rate, which is eliminated by the analog post filter. Optionally, a dither signal can be added that reduces possible noise tones at the output. However, the use of a multibit sigma-delta modulator provides extremely low noise tone energy. Master clock is 256 or 384 times the input da ta rate, allowing multiple choice of input data rate up to 48 kHz, including standard audio rates of 48, 44.1, 32, 16 and 8 kHz. The DAC section also comprises volume and mute control and can be simultaneously played back directly on the line outputs and through a 32-Ohms stereo headset. Power Management and Analog Companions (PMAAC) AT73C209 Audio and Power Management 6365A–PMAAC–12-Mar-08
6365A–PMAAC–12-Mar-08 AT73C209 The 32-Ohms pair of stereo-headset drivers also includes a LINEL and LINER channel-mixer pair of stereo inputs. Every DAC can be powered down separately via internal register control. Each single left or right DAC can be directed in MONO mode to the stereo headset and line outputs while the other is set in off mode. In addition, a microphone preamplifier with a microphone bias switch is integrated, reducing external ICs and saving board space. The volume, mute, power down, de-emphasis controls and 16-bit, 18-bit and 20-bit audio for- mats are digitally programmable via a 4-wire SPI bus and the digital audio data is provided through a multi-format I2S interface. The Power Management section can tolerate several types of input supply, such as: Battery: voltage is converted to 3.3V via a DC/DC step up converter using 1 external inductor, 1 schottky diode and a capacitor. – Disposable AA or AAA size – coin cell size, 1 cell, as low as 0.9V for alkaline USB: 5V VBUS supply from a USB connector or a Lithium-Ion battery The Power Management section also includes a set of low dropout (LDO) voltage regulators with different voltages to supply specific chip and analog requirements: LDO1 is designed to drive up to 150 mA from a USB port with 9-step programmable output represents the initial output voltage of LDO1 at start up. When RSTB is activated, the external MCU can change the output voltage via the SPI serial interface. This LDO is designed to supply the complete chip when the device is connected to a USB port. LDO2 is designed to drive up to 60 mA from LDO1 with 4-step programmable output represents the initial output voltage of LDO2 at start up. When RSTB is activated, the MCU can change the output voltage via the SPI serial interface. This LDO is designed to supply the internal analog section.
6365A–PMAAC–12-Mar-08 AT73C209 2. Block Diagram Figure 2-1. AT73C209 Functional Block Diagram Power Management Logic LDO1 3.4V / 150mA AT73C209 Temperature Monitoring Unit LDO2 3.0V / 60mA LX FBSW1 DC-DC Step Up 3.3V / 100mA RSTB ITB ONOFF VBOOST VANA INUSB SDIN LRFS BCLK Serial Audio I/F GNDSW1S LINER LINEL HSR AGNDHS -6 to +6dB/ 3dB step Voltage ReferenceVREF VCM VBG GNDB Internal Analog Section Left Volume Control -36 to +12dB/ 3dB step -36 to +12dB/ 3dB step SPI_DOUT SPI_CLK SPI_CSB SPI SPI_DIN Integrated RC Oscillator Status Registers MICB en_DAR -46.5dB to 0dB 1.5dB step PGA MICINN MICOUT Internal VCM to LDO2 GNDSW1 MCLK Band Gap AVDDHS Right Volume Control DAC32Ω Driver PGA PGA PGA INGND Σ HSL en_DAL -6 to +6dB/ 3dB step DAC32Ω Driver Σ -46.5dB to 0dB 1.5dB step Codec & Mixer
6365A–PMAAC–12-Mar-08 AT73C209 3. Application Diagram Figure 3-1. Application Using One Cell Battery 22µF 100mΩ Battery Cell 0.9V to 1.8V LX FB GNDSW1 GNDSW1S IN DC-DC LDO2 USB VBOOST VANA 2.2µF 3.1V to 5.5V Push Button ONOFF RSTB ITB MICINN MICOUT VCM 1µF 2.2KΩ TO ADC MIC MICB C12 10µF LINER 470nF LINEL 470nF HSR 100µF HSL 100µF CODEC & MIXER RIGHT HEADSET LEFT HEADSET I²S VREF C7* 1µF GNDB = DGND = AGND NOTE: AVDDHS AGNDHS C13 1µF Connected to VANA SPI LRFS BCLK MCLK SDIN DIGITAL AUDIO INTERFACE SPI_DOUT SERIAL INTERFACE SPI_DIN SPI_CLK SPI_CSB BANDGAP LDO1 LOGIC CONTROL C14 22µF 100nF VBG C10 10µF INGND AC73C209 C11 1µF C7* =~ C3 + C4 Analog Signal Analog Signal
6365A–PMAAC–12-Mar-08 AT73C209 4. Components List Table 4-1. Components List Reference Value Techno Size Manufacturer & Reference C1 22 µF Tantalum Case A (AVX) or equivalent C2 2.2 µF / 10V Ceramic 0603 C1608X5R1A225MT (TDK) or GRM188R61A225 (Murata) C3 470 nF / 10V Ceramic 0402 C1005X5R1A47 4KT (TDK) or GRM155F51A474 (Murata) C4 470 nF / 10V Ceramic 0402 C1005X5R1A47 4KT (TDK) or GRM155F51A474 (Murata) C5 100 µF / 6.3V Ceramic 1210 C3225X5R0J10 7MT (TDK) or GRM32ER60J107 (Murata) C6 100 µF / 6.3V Ceramic 1210 C3225X5R0J107M T (TDK) or GRM32ER60J107 (Murata) C7 1 µF / 6.3V Ceramic 0402 C1005X5R0J105KT (TDK) or GRM155R60J105 (Murata) C8 100 nF / 16V Ceramic 0402 C1005X5R1C104KT (TDK) or GRM155F51C104 (Murata) C9 1 µF / 6.3V Ceramic 0402 C1005X5R0J105KT (TDK) or GRM155R60J105 (Murata) C10 10 µF / 6.3V Ceramic 0402 C1608X5R0J106M T (TDK) or GRM188R60G106 (Murata) C11 1 µF / 6.3V Ceramic 0402 C1005X5R0J105KT (TDK) or GRM155R60J105 (Murata) C12 10 µF / 6.3V Ceramic 0603 C1608X5R0J106M T (TDK) or GRM188R60G106 (Murata) C13 1 µF / 6.3V Ceramic 0402 C1005X5R0J105KT (TDK) or GRM155R60J105 (Murata) C14 22 µF / 4V Ceramic 0805 C2012X5R0J226M T (TDK) or GRM21BR60J226 (Murata) D1 -- Schottky MBRA120LT3 (ON Semiconductors) or equivalent L1 10 µH /550mA 1812 NLC453232T -100K-PF (TDK) or LQH43CN100K03 (Murata) R1 0.1 Ohms 1% -- in 0805 Case or can be made by PCB tracks R2 2.2 kOhms 5% 0402 SW1 Push Button N/A N/A Series DSTMxx (APEM COMPONENTS) or equivalent
6365A–PMAAC–12-Mar-08 AT73C209 5. Pin Description Table 5-1. Pin Description Pin Name I/O Pin Type Function Value SPI_DIN I 1 Digital SPI Data Input 0 - VANA SPI_DOUT O 2 Digital SPI Data Output 0 - VANA SPI_CLK I 3 Digital SPI Clock 0 - VANA SPI_CSB I 4 Digital SPI Chip Select 0 - VANA ITB O 5 Digital Open Drain Interruption / Test Analog Signal Output 0 to VANA MICB O 6 Analog Microphone Bias -- MICINN I 7 Analog Microphone Amplifier Input Half VANA MICOUT O 8 Analog Microphone Amplifier Output 0 to VANA VREF O 9 Analog Voltage Reference Pin For Audio Part -- HSL O 10 Analog Line-out/Headphone Left channel output 0 - AVDDHS HSR O 11 Analog Line-out/Headphone Right channel output 0 - AVDDHS AVDDHS I 12 Supply Headset Amplifier Supply VANA AGNDHS Ground 13 Ground Headset Amplifier Ground -- LINEL I 14 Analog Line-in, Left channel input -- LINER I 15 Analog Line-in, Right channel input -- INGND O 16 Analog Line-in, virtual signal ground pin for decoupling. -- VCM O 17 Analog Common Mode Reference Half VANA SDIN I 18 Digital Serial Data Input For Audio Interface 0 - VANA BCLK I 19 Digital Bit Clock Input For Audio Interface 0 - VANA MCLK I 20 Digital Master Clock Input For Audio Interface 0 - VANA LRFS I 21 Digital Audio interface left/right channel synchronization frame pulse 0 - VANA RSTB O 22 Digital Reset Active Low Power 0 - VBOOST GNDSW1 Ground 23 Ground SW1 Ground -- GNDSW1S I 24 Analog SW1 Current Sense. Connected to 0.1 Ohms external limiting current sense resistor -- LX O 25 Analog SW1 Inductor Switching Node -- FB I 26 Analog SW1 Feedback 2.7V - 3.5V ONOFF I 27 Analog SW1 Switch On IN Level IN I 28 Supply Input power supply voltage. Connected to single Alkaline battery 0.9V - 1.8V USB I 29 Supply USB Supply Input 3.1 V to 5.5 V VBOOST O 30 Analog LDO1 Output Voltage 0 to 3.5 V VANA O 31 Analog LDO2 Output Voltage 0 to 3V VBG O 32 Analog Band Gap Voltage GNDB Ground 33 Ground Analog Ground --
6365A–PMAAC–12-Mar-08 AT73C209 6. Absolute Maximum Ratings Table 6-1. Absolute Maximum Ratings* 7. Digital IOs All the digital IOs: SDIN, BCLK, LRFS , MCLK, RSTB, SPI_DOUT, SPI_DIN, SP I_CLK, SPI_CSB are referred to as VBOOST. Operating Temperature (Industrial) -40°C to +85°C *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reli- ability. Storage Temperature -55°C to +150°C Power Supply Input: on Battery Input -0.3V to +1.8V on USB Input -0.3V to +5.5V Table 7-1. Digital IOs Symbol Parameter Conditions VBOOST Min Max Unit VIL Low level input voltage Guaranteed input low Voltage 2.7V to 3.5V -0.3 0.2 x VBOOST V VIH High level input voltage Guaranteed input high Voltage 2.7V to 3.5V 0. 8 x VBOOST VBOOST + 0.3 V VOL Low level output voltage IOL = 2 mA 2.7V to 3.5V -- 0.4 V VOH High level output voltage IOH = 2 mA 2.7V to 3.5V VBOOST - 0.5V -- V
6365A–PMAAC–12-Mar-08 AT73C209 8. SPI Interface
8.1 SPI architecture
The SPI is a 4 wire bi-directional asynchronous serial link. It works only in slave mode. The pro- tocol is the following: Figure 8-1. SPI Protocol Diagram
8.2 SPI Protocol
On SPI_DIN, the first bit is a read/write bit. 0 indicates a write operation while 1 is for a read operation. The 7 following bits are used for the register address and the 8 last ones are the write data. For both address and data, the most significant bit is the first one. In case of a read operation, SPI_DOUT provides the contents of the read register, MSB first. The transfer is enabled by the SPI_CSB signal, active low. When there is no operation on the SPI interface, SPI_DOUT is set in high impedanc e to allow sharing of MCU serial interface with other devices. The interface is reset at every rising edge of SPI_CSB in order to return to an idle state, even if the transfer does not succeed. The SPI is synchronized with the serial clock SPI_CLK. Falling edge latches SPI_DIN input and rising edge shifts SPI_DOUT output bits. Note that MCLK (Audio Interface Master Clock Input) must run during any SPI write access reg- isters (from address 0x00 to 0x0C). rw a6 a5 a4 a3 a2 a1 d7 d6 d5 d3 d7 d6 d5 d4 d1 d0 d2 d3 d0 d1 d2 d4 a0 SPI_CSB SPI_CLK SPI_DIN SPI_DOUT
6365A–PMAAC–12-Mar-08 AT73C209
8.3 Timing Diagram for SPI Interface
Figure 8-2. SPI Timing Diagram
8.4 SPI Timing
8.5 SPI Register Tables
Table 8-1. SPI Timing Table Timing Parameter Description Min Max Tc SPI_CLK min period 150 ns -- Twl SPI_CLK min pulse width low 50 ns -- Twh SPI_CLK min pulse width high 50 ns -- Tssen Setup Time SPI_CSB falling to SPI_CLK rising 50 ns -- Thsen Hold Time SPI_CLK falling to SPI_CSB rising 50 ns -- Tssdi Setup Time SPI_DIN valid to SPI_CLK falling 20 ns -- Thsdi Hold Time SPI_CLK falling to SPI_DIN not valid 20 ns -- Tdsdo Delay Time SPI_CLK rising to SPI_DOUT valid -- 20 ns Thsdo Hold Time SPI_CLK rising to SPI_DOUT not valid 0 ns -- Table 8-2. SPI Register Mapping Offset Register Name Access Reset 0x00 DAC_CTRL DAC Control Read/Write 0x00 0x01 DAC_LLIG DAC Left Line in Gain Read/Write 0x05 0x02 DAC_RLIG DAC Right Line in Gain Read/Write 0x05 0x03 DAC_LPMG DAC Left Master Playback Gain Read/Write 0x08 0x04 DAC_RPMG DAC Right Master Playback Gain Read/Write 0x08 Thsdi Tssen Tc Twl Twh Thsen Tssdi SPI_DOUT SPI_DIN SPI_CLK Tdsdo Thsdo SPI_CSB
6365A–PMAAC–12-Mar-08 AT73C209 0x05 DAC_LLOG DAC Left Line Out Gain Read/Write 0x00 0x06 DAC_RLOG DAC Right Line Out Gain Read/Write 0x00 0x07 DAC_OLC DAC Output Level Control Read/Write 0x22 0x08 DAC_MC DAC Mixer Control Read/Write 0x09 0x09 DAC_CSFC DAC Clock and Sampling Frequency Control Read/Write 0x00 0x0A DAC_MISC DAC Miscellaneous Read/Write 0x02 0x0C DAC_PRECH DAC Precharge Control Read/Write 0x00 0x10 DAC_RST Dac Reset Read/Write 0x00 0x11 MISC_STATUS USB and Headset Short Status Read Only 0x00 0x12 INT_MASK Interrupt Mask Read/Write 0x00 0x14 REG_CTRL Regulators Control Read/Write 0x00 0x15 SW_CTRL Switcher Control Read/Write 0x00 0x17 MIC_CTRL Microphone Amplifier Control Read/Write 0x00 0x20 DC_SEL_VOUT DC/DC Output Voltage Control Read/Write DC_SEL_VOUT = 00 Table 8-2. SPI Register Mapping (Continued) Offset Register Name Access Reset
6365A–PMAAC–12-Mar-08 AT73C209
8.5.1 DAC Control Register
Register Name: DAC_CTRL Access Type: Read/Write Address: 0x00 Register (0x00): DAC Control 76543210 RSRV1 RSRV2 ONDACR ONDACL ONLNOR ONLNOL ONLNIR ONLNIL Bit Name Description Reset Value
0 ONLNIL Left channel line in amplifier (L to power down, H to power up) ONLNIL = 0
1 ONLNIR Right channel line in amplifier (L to power down, H to power up) ONLNIR = 0
2 ONLNOL Left channel line out driver (L to power down, H to power up) ONLNOL = 0
3 ONLNOR Right channel line out driver (L to power down, H to power up) ONLNOR = 0
4 ONDACL Left channel DAC (L to power down, H to power up) ONDACL = 0
5 ONDACR Right channel DAC (L to power down, H to power up) ONDACR = 0
6 RSRV2 Reserved Bit 0
7 RSRV1 Reserved Bit 0
6365A–PMAAC–12-Mar-08 AT73C209
8.5.2 DAC Left Line In Gain Register
Register Name: DAC_LLIG Access Type: Read/Write Address: 0x01 Register (0x01): Left Line In Gain 76543210 RSRV1 RSRV2 RSRV3 LLIG Bit Name Description Reset Value 4:0 LLIG<4:0> Left channel line in anal og gain selector LLIG<4:0>=00101 (0dB) 7:5 RSRV<1:3> Reserved Bits 000 LLIG<4:0> Gain Unit LLIG<4:0> Gain Unit 00000 20 dB 01001 -12 dB 00001 12 dB 01010 -15 dB 00010 9 dB 01011 -18 dB 00011 6 dB 01100 -21 dB 00100 3 dB 01101 -24 dB 00101 (Default) 0 dB 01110 -27 dB 00110 -3 dB 01111 -30 dB 00111 -6 dB 10000 -33 dB 01000 -9 dB >10001 <-60 dB
6365A–PMAAC–12-Mar-08 AT73C209
8.5.3 DAC Right Line In Gain Register
Register Name: DAC_RLIG Access Type: Read/Write Address: 0x02 Register (0x02): Right Line In Gain 76543210 RSRV1 RSRV2 RSRV3 RLIG Bit Name Description Reset Value 4:0 RLIG<4:0> Right channel line in analog gain selector RLIG<4:0>=00101 (0dB) 7:5 RSRV<1:3> Reserved Bits 000 RLIG<4:0> Gain Unit RLIG<4:0> Gain Unit 00000 20 dB 01001 -12 dB 00001 12 dB 01010 -15 dB 00010 9 dB 01011 -18 dB 00011 6 dB 01100 -21 dB 00100 3 dB 01101 -24 dB 00101 (Default) 0 dB 01110 -27 dB 00110 -3 dB 01111 -30 dB 00111 -6 dB 10000 -33 dB 01000 -9 dB >10001 <-60 dB
6365A–PMAAC–12-Mar-08 AT73C209
8.5.4 DAC Left Master Playback Gain Register
Register Name: DAC_LMPG Access Type: Read/Write Address: 0x03 Register (0x03): Left Master Playback Gain 76543210 RSRV1 RSRV2 LMPG Bit Name Description Reset Value 5:0 LMPG<5:0> Left channel master playback digital gain selector LMPG<5:0>=001000 (0dB) 7:6 RSRV<1:2> Reserved Bits 00 LMPG<5:0> Gain Unit LMPG<5:0> Gain Unit 000000 12 dB 010001 -13.5 dB 000001 10.5 dB 010010 -15 dB 000010 9 dB 010011 -16.5 dB 000011 7.5 dB 010100 -18 dB 000100 6 dB 010101 -19.5 dB 000101 4.5 dB 010110 -21 dB 000110 3 dB 010111 -22.5 dB 000111 1.5 dB 011000 -24 dB 001000 (Default) 0 dB 011001 -25.5 dB 001001 -1.5 dB 011010 -27 dB 001010 -3 dB 011011 -28.5 dB 001011 -4.5 dB 011100 -30 dB 001100 -6 dB 011101 -31.5 dB 001101 -7.5 dB 011110 -33 dB 001110 -9 dB 011111 -34.5 dB 001111 -10.5 dB >100000 Mute dB 010000 -12 dB
6365A–PMAAC–12-Mar-08 AT73C209
8.5.5 DAC Right Master Playback Gain Register
Register Name: DAC_RMPG Access Type: Read/Write Address: 0x04 Register (0x04): Right Master Playback Gain 76543210 RSRV1 RSRV2 RMPG Bit Name Description Reset Value 5:0 RMPG<5:0> Right channel master playback digital gain selector RMPG<5:0>=001000 (6dB) 7:6 RSRV<1:2> Reserved Bits 00 RMPG<5:0> Gain Unit RMPG<5:0> Gain Unit 000000 12 dB 010001 -13.5 dB 000001 10.5 dB 010010 -15 dB 000010 9 dB 010011 -16.5 dB 000011 7.5 dB 010100 -18 dB 000100 6 dB 010101 -19.5 dB 000101 4.5 dB 010110 -21 dB 000110 3 dB 010111 -22.5 dB 000111 1.5 dB 011000 -24 dB 001000 0 dB 011001 -25.5 dB 001001 -1.5 dB 011010 -27 dB 001010 -3 dB 011011 -28.5 dB 001011 -4.5 dB 011100 -30 dB 001100 -6 dB 011101 -31.5 dB 001101 -7.5 dB 011110 -33 dB 001110 -9 dB 011111 -34.5 dB 001111 -10.5 dB >100000 Mute dB 010000 -12 dB
6365A–PMAAC–12-Mar-08 AT73C209
8.5.6 DAC Left Line Out Gain Register
Register Name: DAC_LLOG Access Type: Read/Write Address: 0x05 Register (0x05) Left Line Out Gain 76543210 RSRV1 RSRV2 LLOG Bit Name Description Reset Value 5:0 LLOG<5:0> Left channel line out digita l gain selector LLOG<5:0>=000000 (0dB) 7:6 RSRV<1:2> Reserved Bits 00 LLOG<5:0> Gain Unit LLOG<5:0> Gain Unit 000000 0 dB 010001 -25.5 dB 000001 -1.5 dB 010010 -27 dB 000010 -3 dB 010011 -28.5 dB 000011 -4.5 dB 010100 -30 dB 000100 -6 dB 010101 -31.5 dB 000101 -7.5 dB 010110 -33 dB 000110 -9 dB 010111 -34.5 dB 000111 -10.5 dB 011000 -36 dB 001000 -12 dB 011001 -37.5 dB 001001 -13.5 dB 011010 -39 dB 001010 -15 dB 011011 -40.5 dB 001011 -16.5 dB 011100 -42 dB 001100 -18 dB 011101 -43.5 dB 001101 -19.5 dB 011110 -45 dB 001110 -21 dB 011111 -46.5 dB 001111 -22.5 dB >100000 Mute dB 010000 -24 dB
6365A–PMAAC–12-Mar-08 AT73C209
8.5.7 DAC Right Line Out Gain Register
Register Name: DAC_RLOG Access Type: Read/Write Address: 0x06 Register (0x06): Right Line Out Gain 76543210 RSRV1 RSRV2 RLOG Bit Name Description Reset Value 5:0 RLOG<5:0> Right channel line out digital gain selector RLOG<5:0>=000000 (0dB) 7:6 RSRV<1:2> Reserved Bits 00 RLOG<5:0> Gain Unit RLOG<5:0> Gain Unit 000000 0 dB 010001 -25.5 dB 000001 -1.5 dB 010010 -27 dB 000010 -3 dB 010011 -28.5 dB 000011 -4.5 dB 010100 -30 dB 000100 -6 dB 010101 -31.5 dB 000101 -7.5 dB 010110 -33 dB 000110 -9 dB 010111 -34.5 dB 000111 -10.5 dB 011000 -36 dB 001000 -12 dB 011001 -37.5 dB 001001 -13.5 dB 011010 -39 dB 001010 -15 dB 011011 -40.5 dB 001011 -16.5 dB 011100 -42 dB 001100 -18 dB 011101 -43.5 dB 001101 -19.5 dB 011110 -45 dB 001110 -21 dB 011111 -46.5 dB 001111 -22.5 dB >100000 Mute dB 010000 -24 dB
6365A–PMAAC–12-Mar-08 AT73C209
8.5.8 DAC Output Level Control Register
Register Name: DAC_OLC Access Type: Read/Write Address: 0x07 Register (0x07): Output Level Control 76543210 RSHORT ROLC LSHORT LOLC Bit Name Description Reset Value 2:0 LOLC<2:0> Left channel output leve l control selector LLOC<2:0>=010 (0dB) 3L S H O R T Left channel short circuit indicator (Persistent; after being set, bit is not cleared automatically even after the short circuit is eliminated. Must be cleared by reset cycle or direct register write operation.) LSHORT = 0 6:4 ROLC<6:4> Right channel output level control selector ROLC<6:4>=010 (0dB) 7R S H O R T Right channel short circuit indicator (Persistent; after being set, bit is not cleared automatically even after the short circuit is eliminated. Must be cleared by reset cycle or direct register write operation.) RSHORT = 0 LOLC<2:0> - ROLC<6:4> Gain Unit 000 -6 dB 001 -3 dB 010 0 dB 011 +3 dB >100 +6 dB
6365A–PMAAC–12-Mar-08 AT73C209
8.5.9 DAC Mixer Control Register
Register Name: DAC_MC Access Type: Read/Write Address: 0x08 Register (0x08): Mixer Control Digital Mixer Control The Audio DAC features a digital mixer that allows the mixing and selection of multiple input sources. The mixing/multiplexing functions are described in the figure below: Note: Whenever the two mixer inputs are selected, a -6 dB gain is applied to the output signal. Whenever only one input is selected, no gain is applied. 76543210 RSRV1 RSRV2 INVR INVL RMSMIN2 RSMIN1 LMSMIN2 LMSMIN1 Bit Name Description Reset Value 0 LMSMIN1 Left Channel Mono/Stereo Mixer Left Mixed input enable (H to enable, L to disable) LMSMIN1 = 1 1 LMSMIN2 Left Channel Mono/Stereo Mixer Right Mixed input enable (H to enable, L to disable) LMSMIN2 = 0 2 RMSMIN1 Right Channel Mono/Stereo Mixer Left Mixed input enable (H to enable, L to disable) RMSMIN1 = 0 3 RMSMIN2 Right Channel Mono/Stereo Mixer Right Mixed input enable (H to enable, L to disable) RMSMIN2 = 1
4 INVL Left channel mixer output invert (H to enable, L to disable) INVL = 0
5 INVR Right channel mixer output invert (H to enable, L to disable) INVR = 0
7:6 RSRV<1:2> Reserved Bits 00 Volume Control Left channel Right channel To DACs Volume Control Volume Control Volume Control From digital filters
6365A–PMAAC–12-Mar-08 AT73C209
8.5.10 Clock and Sampling Frequency Control Register
Register Name: DAC_CSFC Access Type: Read/Write Address: 0x09 Register (0x09): Clock and Sampling Frequency Control Master Clock and Sampling Frequency Selection The following table describes the modes available for master clock and sampling frequency selection. 76543210 RSRV1 RSRV2 RSRV3 OVRSEL RSRV4 RSRV5 RSRV6 RSRV7 Bit Name Description Reset Value 3:0 RSRV<4:7> Reserved Bits 0000
4 OVRSEL Master clock selector (L to 256xFs, H to 384xFs) OVRSEL = 0
7:5 RSRV<1:3> Reserved Bits 000 OVRSEL Master Clock 0 256 x Fs 1 384 x Fs
6365A–PMAAC–12-Mar-08 AT73C209
8.5.11 DAC Miscellaneous
Register Name: DAC_MISC Access Type: Read/Write Address: 0x0A Register (0x0A): Miscellaneous Interface Word Length The selection of input sample size is done using the nbits<1:0> register according to the following table: De-emphasis and Dither Enable The circuit features a de-emphasis filter for the playback channel. To enable the de-emphasis filtering the deemphen signal must be set to high. Likewise, the dither option (added in the playback channel) is enabled by setting the dithen signal to High. I2S Data Format Selector The selection between modes is done using the dintsel<1:0> signal according to the following table: 7 6543210 RSRV1 RSRV2 DINTSEL DITHEN DEEMPEN NBITS Bit Name Description Reset Value 1:0 NBITS<1:0> Data interface word length NBITS<1:0>=10
2 DEEMPEN De-emphasis enable (L to disable, H to enable) DEEMPEN = 0
3 DITHEN Dither enable (L to disable, H to enable) DITHEN = 0
5:4 DINTSEL<5:4> I2S data format selector DINTSEL<5:4>=00 7:6 RSRV<1:2> Reserved Bits 00 NBITS<1:0> Format 00 16 bits 01 18 bits 10 20 bits DINTSEL<5:4> Format
00 I2S Justified
01 MSB Justified
10 LSB Justified
6365A–PMAAC–12-Mar-08 AT73C209
8.5.12 DAC Precharge
Register Name: DAC_PRECH Access Type: Read/Write Address: 0x0C Register (0x0C): Pre-Charge Control
8.5.13 DAC Reset
Register Name: DAC_RST Access Type: Read/Write Address: 0x10 Register (0x10): DAC Reset Note: It’s important to never change bit 2. It must stay at 0 (low state). 7 6 5 4 3 210 RSRV1 RSRV2 PRCHGLNOR PRCHGLNOL PRCHGLNIR PRCHGLNIL PRCHG ONMSTR Bit Name Description Reset Value
0 ONMSTR Master power on control (L: power down, H: power up) ONMSTR = 0
1 PRCHG Master pre-charge (H to charge) PRCHG = 0
2 PRCHGLNIL Left channel line in pre-charge (H to charge) PRCHGLNIL = 0
3 PRCHGLNIR Right channel line in pre-charge (H to charge) PRCHGLNIR = 0
4 PRCHGLNOL Left channel line out pre-c harge (H to charge) PRCHGLNOL = 0
5 PRCHGLNOR Right channel line out pre-charge (H to charge) PRCHGLNOR = 0
7:6 RSRV<1:2> Reserved Bits 00 7 6 5 4 3 210 RSRV1 RSRV2 RSRV3 RSRV4 RSRV5 UNCHANGE RESFILZ RSTZ Bit Name Description Reset Value
0 RSTZ Active low reset of the audio codec RSTZ = 0
1 RESFILZ Active low reset of the audio codec filter RESFILZ = 0
2 UNCHANGE This Register Bit could not be changed UNCHANGE = 0
7:3 RSRV<1:5> Reserved Bits 00000
6365A–PMAAC–12-Mar-08 AT73C209
8.5.14 DAC Miscellaneous Status
Register Name: MISC_STATUS Access Type: Read-Only Address: 0x11 Register (0x11): Miscellaneous Status
8.5.15 Interrupt Mask: INT_ MASK (0x12)
Register Name: MISC_STATUS Access Type: Read/Write Address: 0x12 Register (0x12): Interrupt Mask 7 6 5 4 3 210 RSRV1 RSRV2 RSRV3 RSRV4 RSRV5 RSRV6 USBOK HSSHORT Bit Name Description Reset Value
0 HSSHORT Headset Short Flag HSSHORT = 0
1 USBOK USB Supply Flag USBOK = 0
7:2 RSRV<1:6> Reserved Bits 000000 7 6 5 4 3 210 RSRV1 RSRV2 RSRV3 RSRV4 RSRV5 USBFMSK USBRMSK HSSMSK Bit Name Description Reset Value
0 HSSMSK Headset short interrupt mask (1 to enable interrupt) HSSMSK = 0
1 USBRMSK USB supply rising interrupt ma sk (1 to enable interrupt) USBRMSK = 0
2 USBFMSK USB supply falling interrupt mask (1 to enable interrupt) USBFMSK = 0
7:3 RSRV<1:5> Reserved Bits 00000
6365A–PMAAC–12-Mar-08 AT73C209
8.5.16 Regulator Control
Register Name: REG_CTRL Access Type: Read/Write Address: 0x14 Register (0x14) Regulators Control SELVBOOST SELVANA ONVANA 7 6 5 4 3 210 RSRV1 ONVANA SELVANA SELVBOOST Bit Name Description Reset Value 3:0 SELVBOOST<3:0> LDO1 VBOOST r egulator output voltage selection SELVBOOST<3:0>=0000 (3.4 V) 5:4 SELVANA<1:0> LDO2 VANA regulator output voltage selection SELVANA<1:0>=00 (2.8 V)
6 ONVANA LDO2 VANA regulator enable (active high) ONVANA = 0
SELVBOOST<3:0> Output Value x001 2.7 V x010 2.8 V x011 2.9 V x100 3.0 V x101 3.1 V x110 3.2 V x111 3.3 V 0000 3.4 V 1000 3.5 V SELVANA<1:0> Output Value 00 2.8 V 01 2.6 V 10 3.0 V 11 2.4 V ONVANA VANA Output
0 High Impedance
1 Enable
6365A–PMAAC–12-Mar-08 AT73C209
8.5.17 Switcher Control
Register Name: SW_CTRL Access Type: Read/Write Address: 0x15 Register (0x15): Switcher Control
8.5.18 Microphone Amplifier Control
Register Name: MIC_CTRL Access Type: Read/Write Address: 0x17 Read/Write Register (0x17): Microphone Amplifier Control 7 6 5 4 3 210 RSRV1 RSRV2 RSRV3 RSRV4 RSRV5 RSRV6 RSRV7 UPONOFF Bit Name Description Reset Value
0 UPONOFF Microprocessor ON/OFF (1 to enable SW1) UPONOFF = 0
7:1 RSRV<1:7> Reserved Bits 0000000 7 6 5 4 3 210 RSRV1 RSRV2 RSRV3 RSRV4 RSRV5 RSRV6 ONAMP ONMIC Bit Name Description Reset Value
0 ONMIC Microphone bias enable, active high ONMIC = 0
1 ONAMP Microphone amplifier enable, active high ONAMP = 0
7:2 RSRV<1:6> Reserved Bits 000000
6365A–PMAAC–12-Mar-08 AT73C209
8.5.19 DC/DC Output Voltage Control
Register Name: DC_SEL_VOUT Access Type: Read/Write Address: 0x20 Read/Write Register (0x20): DC/DC Output Voltage Control DC_SEL_VOUT Notes: 1. Important: In the Register 0x20, only the Bits #4 and #3 can be modified. The others bits should keep there initial values. It’s important to apply the sequence as follows: – Read The register 0x20 – Copy the values – Only modify the bits #4 and #3 of DC_SEL_VOUT – Write the register 0x20 2. It’s important to have an output voltage correlation between DC/DC output and VBOOST_LDO output. The correlation should be as shown in Table 8-3 that follows: 765 4 3 2 1 0 RSRV1 RSRV2 RSRV3 DC_SEL_VOUT RSRV4 RSRV5 RSRV6 Bit Name Description Reset Value 2:0 RSRV<4:6> Reserved Bits and Never Change value Don’t Change 4:3 DC_SEL_VOUT<4:3> DC/DC Output Voltage Control DC_SEL_VOUT = 00 (3.3V) 7:5 RSRV<1:3> Reserved Bits and Never Change value Don’t Change DC_SEL_VOUT<4:3> Output Value 00 3.3 V 01 2.6 V 10 2.8 V 11 3.0 V
6365A–PMAAC–12-Mar-08 AT73C209 Table 8-3. DC/DC Output Voltage vs. VBOOST LDO Output Voltage Reg DC_SEL_VOUT<4:3> Output Valu e Reg SELVBOOST<3:0> Output Value 0x20 01 2.6 V 0x14 Min - x001 2.7 V Up to Max - 1000 3.5 V 10 2.8 V Min - x011 2.9 V Up to Max - 1000 3.5 V 11 3.0 V Min - x101 3.1 V Up to Max - 1000 3.5 V 00 3.3 V Min - 0000 3.4V Up to Max - 1000 3.5 V
6365A–PMAAC–12-Mar-08 AT73C209 9. Power Supplies
9.1 DC to DC Boost Converter (SW1)
9.1.1 Features
Input Voltage Range: 0.9V to 1.8V (Single Alkaline Battery) From 0 to 100 mA Maximum Output Current When Started Peak Efficiency with 50 mA Output Current Overcurrent Protection Through External Resistor
9.1.2 Description
DCDC is a high-efficiency DC/DC boost converter designed for single cell alkaline batteries found in PDA's, MP3 players, and other handheld portable devices. It can work with battery voltage as low as 0.9V, and lower than 1.8V. The Boost Converter is optimized for current load of 50 mA and 3.3V output voltage. It includes a low resistive 0.2 Ohms N-channel power switch, a start-up oscillator, and an integrated current limitation. In particular, this current limitation can be achieved using a low- value 100 mOhms external resistor.
9.1.3 Functional Diagram and Typical Application
Figure 9-1. DC/DC Typical Application Diagram in lx DC/DC fb gndsw1s gndsw1 Current Control Digital Control ref L = 10 µH Schottky Diode 22 µF
0.1 Ohms
0.9V - 1.8V Vout Push Button on/off
6365A–PMAAC–12-Mar-08 AT73C209
9.1.4 Electrical Specifications
.No load current in start-up phase (load resistor higher than 10 KOhms).
9.1.5 Control Modes
L = 10 µH (0.1 Ohms ESR) C = 22µF (0.1 Ohm ESR) Schottky Diode: MBRA120LT3 IN = 1.2V OUT = 0mA-100mA -40°C <TA < +85°C FB = + 3.3V, typical values at 27°C unless otherwise noted. Table 9-1. DC to DC Boost Converter (SW1)Electrical Characteristics Symbol Parameter Conditions Min Typ Max Unit IN Input Voltage 0.9 1.2 1.8 V VFB Output Voltage DC_SEL_VOUT = 00 3.10 3.3 3.45 V ISD Shutdown Current DC/DC is Off 10 µA IL Inductor Current Limitation IN = 1.2V, V FB > 2.4V 600 mA Ic Output Current 50 100 mA tSTART Start Up Time From disabled to enabled RLOAD = 10 kOhms 5m s RNMOS NMOS switch resistance V FB = 3.3V 0.2 Ohms Yield Power efficiency Load of 3 mA and IN = 1.2V 45 50 %Load of 50 mA and IN = 1.2V 65 70 Load of 100 mA and IN = 1.2V 65 70 tR_LOAD Transient Load Regulation I N =1.2V, Iout = 0 to 100 mA in 0.5µs 30 mV FRIPP Frequency Ripple Load of 10 mA, IN = 1.2V VFB = 3.3V and 100 mOhms Rsense 30 mVLoad of 50 mA, IN = 1.2V VFB = 3.3V and 100 mOhms Rsense 50 Load of 100mA, IN = 1.2V VFB = 3.3V and 100 mOhms Rsense 60
6365A–PMAAC–12-Mar-08 AT73C209 The FB voltage can be selected with DC_SEL_VOUT<4:3>, according to the following table. When DCDC starts SEL_VOUT must be set to <00>. The FB voltage can be modified by changing bits 4 and 3 of the register 0x20. It’s important to only modify this two bits in this register. (see § 8.5.19 for the sequence)
9.1.6 Typical Performance Characteristics
Typical condition means: Figure 9-2. Spice Simulation Results Table 9-2. Control Modes DC_SEL_VOUT<4:3> Minimum Output Value Output Value Maximum Output Value 00 (default) 3.10V 3.3V 3.45V 01 2.52V 2.6V 2.66V 10 2.67V 2.8V 2.88V 11 2.82V 3.0V 3.10V Typical process conditions I N = 1.2V and ILOAD = 50 mA VFB = 3.3V Recommended external components
6365A–PMAAC–12-Mar-08 AT73C209 9.2 LDO1: 3.3V From USB Port
9.2.1 Features
Stand Alone Voltage Regulator with Internal Bandgap Voltage Generator Max Load Current 4.5V to 5.5V Supply Voltage 3.1V to 5.5V Supply Voltage for 2.7V and 2.9V output voltage
9.2.2 Description
LDO1 is a low drop out voltage regulation module that can be used to provide 9-step program- mable output voltages and 150 mA of maximum load current. It is designed to be integrated with other analog cells, digital logic, microcontrollers, DSP cores, and memory blocks into system-on- chip products. An internal reference voltage (bandgap voltage) is provided to the regulator, so only a compensation capacitor connected at the output node versus ground is needed for cor- rect operations.
9.2.3 Functional Diagram and Typical Application
Figure 9-3. LDO1 Typical Application Diagram
9.2.4 Electrical Specifications
Table 9-3. LDO1 Electrical Specifications Symbol Parameter Conditions Min Typ Max Unit VDD Operating Supply Voltage 3.1V operation required (Li-Ion Battery) 3.1 -- 5.5 V tJ Temperature Range -20 -- 125 °C USB LDO1 gnd ref DC USB 3.1V - 5.5V VBOOST VBOOST 22 µF
6365A–PMAAC–12-Mar-08 AT73C209
9.2.5 Control Modes - Enable/Disable
The LDO is enabled by applying a voltage on the USB pin. It is automatically disabled by remov- ing the USB supply.
9.2.6 Output Voltage Selection
The VBOOST voltage can be modified by changing SELVBOOST<3:0> of the register 0x14. (See Section 8.5.16 “Regulator Control”.) VOUT Output Voltage Programmed @ 3.5V 3.45 3.5 3.55 V Programmed @ 3.4V 3.35 3.4 3.45 Programmed @ 3.3V 3.25 3.3 3.35 Programmed @ 3.2V 3.15 3.2 3.25 Programmed @ 3.1V 3.05 3.1 3.15 Programmed @ 3.0V 2.95 3.0 3.05 Programmed @ 2.9V 2.85 2.9 2.95 Programmed @ 2.8V 2.75 2.8 2.85 Programmed @ 2.7V 2.65 2.7 2.75 I O Output Current -- -- 150 mA ILIMIT Current Limit 300 500 800 mA IQ Quiescent Current -- 40 60 µA ∆VDC Line Regulation 3.1V < V DD < 5.5V; I_Load = 150 mA -- -- 15 mV ∆VDC Load Regulation V DD = 5V; I_Load = 0 to 150 mA -- -- 10 mV VNOISE Output Noise I_Load = 150 mA; BW: 10 Hz - 100 kHz -- -- 1 mVrms tR Rise Time -- -- 700 µs ISD Shut Down Current On = 0 -- -- 1 µA PSRR Power Supply Rejection Ratio @ f = 200 Hz 28 40 48 dB @ f = 20 kHz 8 12 19 dB Table 9-3. LDO1 Electrical Specifications (Continued) Symbol Parameter Conditions Min Typ Max Unit Table 9-4. LDO Output Voltage Selection SELVBOOST<3:0> Output Voltage x001 2.7 V x010 2.8 V x011 2.9 V x100 3.0 V x101 3.1 V x110 3.2 V x111 3.3 V 0000 3.4 V 1000 3.5 V
6365A–PMAAC–12-Mar-08 AT73C209 9.3 LDO2: 2.4V to 3.0V for Internal Analog Section Supply
9.3.1 Features
Low Noise Low Drop Out Voltage Regulator 2.4V to 3V Programmable Output Voltage 3.2V to 3.5V Supply Operation (VANA = 3V) 60mA of Max Load Current Power-down Mode (Consumption <1mA) Typical cUrrent Consumption 195 µA
9.3.2 Description
LDO2 is a Low Drop Out (LDO) voltage regulator with a programmable 2.4V to 3V output volt- age, rated for loads up to 20 mA. The circuit comprises a PMOS pass device, an error amplifier, a feedback resistive network sized to have closed loop gain. These blocks constitute the regulat- ing loop. A 2-bit decoder allows controlling th e programmable output voltage. Available output voltages are 2.4V, 2.6V, 2.8V and 3V. An over-c urrent and short-circuit protection circuit has been included to limit the output current delivered by the regulator, thus avoiding its destruction in short circuit configuration. An external reference voltage (bandgap voltage) is needed. The target reference voltage is 1.231V delivered. A ceramic or low ESR tantalum capacitor is needed (2.2 µF minimum value) as external compensation.
9.3.3 Functional Diagram and Typical Application
Figure 9-4. LDO2 Typical Application Diagram VBOOST VANA LDO2 gnd ref 2,2 µF VANAfrom Input LDO1 Output
6365A–PMAAC–12-Mar-08 AT73C209
9.3.4 Electrical Specifications
9.3.5 Control Modes - Truth Table
Figure 9-5. The LDO2 can be enabled and disabled by activating the bit #6 (ONVANA) on the register 0x14. (See Section 8.5.16 “Regulator Control”) All digital signals are referred to the supply voltage VBOOST. Table 9-5. General Power Supply Parameters Parameter Symbol Conditions Min Typ Max Unit Operating Supply Voltage (#1) V BOOST2 VBOOST2 - VANA >= 0.2V 2.7 3.2 3.5 V Operating Supply Voltage (#2) V BOOST2 VBOOST2 - VANA >= 0.2V 3.2 3.3 3.5 V Output Current I C For all Sel<1:0> conditions -- 40 60 mA Output Noise V NOISE BW: 10 Hz to 100 kHz, Sel <10> = xx -- -- 70 µVrms Table 9-6. LDO2 Parameters Parameter Symbol Conditions Min Typ Max Unit Output Voltage V ANA Sel <10> = 00 2.75 2.8 2.85 V Sel <10> = 01 2.55 2.6 2.65 Sel <10> = 10 2.95 3.0 3.05 Sel <10> = 11 2.35 2.4 2.45 Quiescent Current I C Worst case VBOOST2 = 3.0V, 179 189 300 µA Line Regulation ∆VANA VBOOST2: 3.1 V to 3.5V, IOUT = 2 0mA -- -- 10 mV Load Regulation ∆VANA 10% - 90% IOUT VBOOST2 = 3.3V -- -- 10 mV Rise Time t C 10% - 90% VANA RLOAD = 120 Ohms CLOAD = 2.2µF worst case @VBOOST2 = 3V -- -- 10 µs Shut Down Current I SD On = 0 -- 140 -- nA Power Supply Rejection Ratio PSRR Band Pass: 0 Hz to 500 kHz IOUT = 10 mA worst case @ VBOOST2 = 3.2V 34 -- -- dB PSRR DC 54 -- -- dB PSRR 20 kHz 53 -- -- dB PSRR 100 kHz 45 -- -- dB Table 9-7. LDO2 Activation ONVANA (bit #6) VANA Output
0 Power Down (HiZ)
1 Power On
6365A–PMAAC–12-Mar-08 AT73C209
9.3.6 Output Voltage Selection
The VANA voltage can be modified by changing the value of SELVANA<5:4> of the register 0x14. (See Section 8.5.16 “Regulator Control”) Table 9-8. LDO2 Output Voltage Selection SELVANA<5:4> Output Values 00 2.8 V 01 2.6 V 10 3.0 V 11 2.4 V
6365A–PMAAC–12-Mar-08 AT73C209 10. Audio DAC
10.1 Description
The Audio DAC IP core includes the functions of Stereo D-to-A conversion, channel filtering, line-in/microphone and line-out/headphone interfacing with integrated short-circuit detection. Oversampling sigma delta technology is used in the D-to-A conversion. The channel filters are implemented digitally, embedded in the interpolation filters associated with the converter. Stereo single-ended interfaces are available fo r line-in/microphone and line-out/headphone connec- tions. Mono differential interfaces are available for auxiliary input amplifier and PA driver. The line-out/headphone amplifier can drive an external load of 32 Ohms with 20 mWrms. The line- in/microphone amplifier has an input range of 70 mVrms at maximum gain. The data port is I2S serial at 8 to 48kHz. In full power-down mode the standby current consumption is less than 10 µA.
10.2 Functional Diagram
Figure 10-1. Audio DAC Functional Diagram PGA PGA DAC DAC Volume Control Volume Control+ + + Status Registers Volume Control Volume Control Digital Filter Digital Filter Serial Audio Interface SPKR DRV SPKR DRV hsr hsl linel liner ingnd lrfs mclk sdin bclk spi_din spi_clk spi_dout spi_csb agndhs avddhs
6365A–PMAAC–12-Mar-08 AT73C209
10.3 Electrical Specifications
AVDD, AVDDHS = 2.8 V, TA = 25°C, typical case, unless otherwise noted. All noise and distortion specifications are measured in the 20 Hz to 0.425xFs and A-weighted fil- tered. Full-scale levels scale proportionally with the analog supply voltage. Table 10-1. Audio DAC Electrical Specifications Parameters Min Typ Max Units Overall Analog Supply Voltage (AVDD, AVDDHS) 2.7 2.8 3.3 V Digital Supply Voltage (VDIG) 2.4 2.8 3.3 V Digital Inputs/outputS Resolution 20 bits Logic Family CMOS Logic Coding 2's Complement ANALOG PERFORMANCE - DAC to Line-out/Headphone Output -- 1.65 -- Vpp Output Common Mode Voltage -- 0.5 x AVDDHS -- V Output load resistance (on HSL, HSR) Headphone load Line load 16 32 Ohm kOhm Output load capacitance (on HSL) Headphone load Line load 1000 150 pF pF Signal to Noise Ratio (-1dBFS @ 1kHz input and 0dB Gain) Line and Headphone loads 87 92 dB Total Harmonic Distortion (-1dBFS @ 1kHz input and 0dB Gain) Line Load Headphone Load Headphone Load (16 Ohm) -80 -65 -40 -76 -60 dB dB dB Dynamic Range (measured with -60 dBFS @ 1kHz input, extrapolated to full- scale) Line Load Headphone Load dB dB Interchannel mismatch 0.1 1 dB Left-channel to right-channel crosstalk (@ 1kHz) -90 -80 dB Output Headset Driver Level Control Range -6 6 dB Output Headset Driver Level Control Step 3 dB PSRR 1 kHz 20 kHz dB dB Maximum output slope at power up (100 to 220 µF coupling capacitor) 3 V/s
6365A–PMAAC–12-Mar-08 AT73C209 Analog Performance - Line-in to Line-out/Headphone Output Input level for full scale output - 0dBFS Level @ AVDD, AVDDHS = 2.8 V and 0 dB gain 1.65 583 Vpp mVrms @ AVDD, AVDDHS = 2.8 V and 20 dB gain 0.165 58.3 Vpp mVrms Input common mode voltage 0.5 x AVDD V Input impedance 7 10 kOhm Signal to Noise Ratio -1 dBFS @ 1kHz input and 0 dB gain -21 dBFS @ 1kHz input and 20 dB gain 81 85 dB dB Dynamic Range (extrapolated to full scale level) -60 dBFS @ 1kHz input and 0 dB gain -60 dBFS @ 1kHz input and 20 dB gain 82 86 dB dB Total Harmonic Distortion -1dBFS @ 1kHz input and 0 dB gain -1dBFS @ 1kHz input and 20 dB gain -80 -75 -76 -68 dB dB Interchannel mismatch 0.1 1 dB Left-channel to right-channel crosstalk (@ 1kHz) -90 -80 dB Master Clock Master Clock Maximum Long Term Jitter 1.5 ns pp Digital Filter Performance Frequency response (10 Hz to 20 kHz) ± 0.1 dB Deviation from linear phase (10 Hz to 20 kHz) ± 0.1 deg Passband 0.1 dB corner 0.4535 Fs Stopband 0.5465 Fs Stopband Attenuation 65 dB De-emphasis Filter Performance (for 44.1kHz Fs) Frequency Gain Margin Pass band 0 Hz to 3180 Hz -1dB 1dB Transition band 3180 Hz to 10600 Hz Logarithm decay 1 dB Stop Band 10600 Hz to 20 kHz -10.45dB 1 dB Table 10-1. Audio DAC Electrical Specifications (Continued) Parameters Min Typ Max Units
6365A–PMAAC–12-Mar-08 AT73C209 Power Performance Current consumption from Analog supply in power on 9.5 mA Current consumption from Analog supply in power down 10 µA Power on Settling Time From full power down to full power up (Vref and VCM decoupling capacitors charge) Line in amplifier (line in coupling capacitors charge) Driver amplifier (out driver DC blocking capacitors charge) 500 500 ms ms ms Table 10-1. Audio DAC Electrical Specifications (Continued) Parameters Min Typ Max Units
6365A–PMAAC–12-Mar-08 AT73C209
10.4 Data Interface
Normal operation is entered by applying correct LRFS, BCLK and SDIN waveforms to the serial interface, as illustrated in the timing diagrams below. To avoid noise at the output, the reset state is maintained until proper synchronization is achieved in the serial interface. The data interface allows three different data transfer modes as described below. Figure 10-2. 20-bit I2S Justified Mode Figure 10-3. 20-bit MSB Justified Mode Figure 10-4. 20-bit LSB Justified Mode The selection between modes is done using the DINTSEL<5:4> bits in the register 0x0A accord- ing with the following table. The data interface always works in slave mode. This means that the LRFS and the BCLK sig- nals are provided by the host controller. In order to achieve proper operation, the LRFS and the BCLK signals must be synchronous with the MCLK master clock signal and their frequency rela- tionship must reflect the selected data mode. For example, if the data mode selected is the 20- bit MSB Justified, then the BCLK frequency must be 40 times higher than the LRFS frequency. BCLK LRFS SDIN BCLK LRFS SDIN BCLK LRFS SDIN DINTSEL <5:4> Format
6365A–PMAAC–12-Mar-08 AT73C209
10.5 Timing Specifications
Figure 10-5. Data Interface Timing Diagram The timing constraints of the data interface are described in the following diagram and table. Figure 10-6. I2S Timing Diagram MCLK BCLK
1 N 19N+1 20N
20 M/2+1 M
M/2.N+1 M/2.(N+1) (M-1).N+1 M.N LRFS SDIN td1 td2 ts3 th3 Table 10-2. Data Interface Timing Parameters Parameter Min Typ Max Unit td1 Delay from MCLK rising edge to BCLK edges 2.5 -- 7.5 ns td2 Delay from BCLK falling edge to LRFS edges 0 -- 5 ns ts3 din set-up time before BCLK rising edge 10 -- -- ns th3 din hold time after BCLK rising edge 10 -- -- ns
6365A–PMAAC–12-Mar-08 AT73C209 11. Microphone Preamplifier (OP065)
11.1 Features
Standard Quality Amplifier for Electret Microphone Preamplifier Low Power Consumption Few External Components Necessary for a Complete Preamplifier Internal Bias Internal Bias for the Electret Microphone Stand-by Mode
11.2 Description
The OP065 is a low-voltage operational amplifier designed for a standard quality electret micro- phone preamplifier. It presents a frequency response, a supply rejection and a noise compatible with voice quality applications. All voltages are referred to gnda. The OP065 is powered by vdda pin, with a nominal voltage of 2.8V. The normal operating mode is defined with ONAMP and ONMIC pins set to 1 (referred to vdda).
11.3 Functional Diagram
Figure 11-1. Microphone Preamplifier Functional Diagram 6.8k 560k 2.2k micinn vcm micb micout OP065
6365A–PMAAC–12-Mar-08 AT73C209
11.4 Detailed Description
The OP065 is a two-stage class A amplifier with a nominal 40 dB gain. The gain can be reduced simply by adding a resistor in serie with the MICINN input. Included input resistor is 2.2 KOhms. Few external components are needed for a complete electret microphone preamplifier solution: Input capacitor between the microphone and the MICINN input of the OP065 (2.2 µF recommended), Resistive bridge and the decoupling capacitor for the VCM common mode input (100 KOhms + 100 KOhms bypassed by a 10 µF capacitor recommended) Power supply decoupling capacitor for the microphone (10 µF recommended, on MICOUT) Refer to the typical application suggestion presented in Figure 2-1 “AT73C209 Functional Block Diagram” on page 3. The common mode is to be set externally to half supply. The output MICOUT is then centered to half supply. It is self-biased. The biasing of the electret microphone is included, through a 1.2 KOhms resistor in serie with the VDDA supply, and available on MICOUT. This bias can be shut down by ONMIC input (bias available with ONMIC = 1). The MICINN input should be AC coupled to the micr ophone, its DC value is normally set to half supply (as soon as VCM input is biased to half supply). The output stage is a class A linear structure with an internal low quiescent current. This current will be actually essentially fixed by the external load to be conn ected (DC coupled) between the output (MICOUT) and the ground. A typical 50 KOhms load is recommended. A maximum 100pF load can be connected to the output. The OP065 is not optimized for general buffer purpose. The biasing of the electret microphone is included, through a 2.2 KOhms resistor in serie with the VDDA supply, and available on MIC output. The MICINN input should be AC coupled to the microphone, its DC value is set to half supply.
11.5 Electrical Specifications
TA = 25°C, VSUPPLY = 2.4V to 3.0V, unless otherwise specified. Table 11-1. Microphone Preamplifier (OP065) Electrical Specifications Parameter Symbol Conditions Min Typ Max Unit Operating Supply Voltage V ANA 2.4 2.8 3.0 V Output swing Vc 50 KOhms load 0.2 -- Vana-0.2 V Voltage gain Gv With an ideal voltage source -- 40 -- dB Input impedance Z IN -- 2200 -- Ohms Output offset voltage V OFF AC input coupling -10 -- 10 mV Output noise, 40dB gain, without power Supply and microphone contribution onoise 20 Hz - 20 KHz bandwidth, unweighted 50 kOhms // 100 pF load -- -67 -62 dBV Slew-rate SR 50 kOhms // 100 pF load ± 0.2 -- ± 0.4 V/µs
6365A–PMAAC–12-Mar-08 AT73C209
11.6 Control Modes
The Preamplifier can be enabled or disabled by ac tivating the bit #1 (ONAMP) on the register 0x17. (See Section 8.5.18 “Microphone Amplifier Control”.) Microphone Preamplifier Mode The microphone bias of the preamplifier can be ac tivated or deactivated by changing the bit #0 (ONMIC) on the register 0x17. (See Section 8.5.18 “Microphone Amplifier Control”.) Microphone Bias Mode Note: when onmic = 0, the MIC pin is pulled do wn to the ground through a 3 kOhms resistor. Frequency response F-3 50 kOhms // 100 pF load 40 dB gain 15 18 -- kHz Phase margin PM 50 kOhms // 100 pF load 45 50 -- ° Start-up time t STUP -- 40 50 µs Supply current, active mode I CC Not including microphone bias current -- 15 30 µA Supply current, stand-by mode I SBY -- -- 1 µA Table 11-1. Microphone Preamplifier (OP065) Electrical Specifications (Continued) Parameter Symbol Conditions Min Typ Max Unit onamp Active Mode
0 Stand By Mode
1 Active Mode
onmic Microphone Bias Mode
0 No Microphone Bias
1 Microphone Bias Available
6365A–PMAAC–12-Mar-08 AT73C209
11.7 Typical Application
Figure 11-2. Microphone Preamplifier Typical Application Diagram The OP065 is used as a 37 dB gain amplifier. Grounds of the microphone and the OP065 are common (GNDA in the schematic). The amplifier is internally supplied by VANA. A capacitive filter (C2) is added for the microp hone supply, since its noise is amplified by the OP065 and then is very critical. A 10 uF minimum value is recommended. The gain can be attenuated simply by adding an input resistor in serie with MICINN input. The gain is also determined by Gv[dB] = 20.log(220000/(2200+Rsad)), with Rsad the additional input resistor added. The common mode input (VCM) is internally biased, and has to be decoupled with a 10 uF mini- mum external capacitor. It is very important for the total output noise. Care should be taken to avoid coupling between the input of the OP065 and noisy environments (digital power, burst mode of GSM, etc.) The input capacitor determines the low cut-off frequency with the internal 2.2 kOhms resistor: Fcutt-off = 0.159/(2200. Cin) with Cin: value of the input capacitor Cin. Cmc Rbias - 2.2k 1µF 10µF 10µF micp micn micinn 6.8k 560k 2.2k vcm micb micout OP065 vdda gnda micout Cin Rb1 - 100k Rb2 - 100k
6365A–PMAAC–12-Mar-08 AT73C209 12. Power On/Off Procedure There are two different inputs for supplying AT73C209. The first one, is to apply a cell on IN pin. The DC/DC converter should be activated by the ONOFF pin. The second one, is to apply a USB_Voltage on USB pin. Each power_up is described below.
12.1 DC/DC Power On /Off Operation
The Power-On of the DC/DC boost converter is activated by a push_button. The Power-Off of the DC/DC boost converter is controlled by the micro-controller MCU using 1 signal register. The DC/DC boost converter is enabled with th e ONOFF signal (Push_button activation). If ONOFF is high, the FB output voltage of the DC/DC converter begins to rise. The load resistor in this start-up phase must be higher than 10 KOhms. Once FB reaches the 2.4V threshold voltage, a DC/DC internal low-quiescent voltage supervisor sets the DC/DC internal STARTV signal to high (FB level). Then, the DC/DC output voltage FB rises to 3.3V. The DC/DC boost converter is kept enabled by the micro-controller by setting the UPONOFF bit to high level (register 0x15, bit # 0). Then, the ONOFF signal can be released to 0. Once FB reaches 2.4V threshold, a counter is started and after 256 cycles of internal oscillator, a reset signal (high level) is generated on RSTB pin. The reset time should be calculated as follows: (5kHz < F oscillator < 20kHz The off mode is entered as soon as the micro-controller resets the UPONOFF bit to 0 (provided ONOFF=0). Then, the DC/DC boost converter is disabled 12 8 ms, 256 1 fOSCILLATOR MAX– fOSCILLATOR MIN–
6365A–PMAAC–12-Mar-08 AT73C209 Figure 12-1. DC/DC Power On/Off Procedure Diagram ONOFF IN Time UPONOFF Time FB/VBOOST 2.4V Time 2.2V RSTB VBOOST Time 1 msec. 12.8 msec. up to 51.2 msec. With 1 Cell Supply
6365A–PMAAC–12-Mar-08 AT73C209
12.2 USB Power On/Off Operation (USB Alone)
This paragraph describes the power on/off procedure if only a USB power supply is applied. The DC/DC converter is in Off Mode. When a voltage over 4.5V is applied on the USB pin, the LDO1 starts itself automatically. The FB/VBOOST output voltage begins to rise. Once the output voltage reaches the 2.4V threshold voltage, an internal low-quiescent voltage supervisor sets the LDO1 enable signal to high. Then, the LDO1 output voltage rises to 3.4V. Once FB/VBOOST reaches 2.4V threshold, a co unter is started and after 256 cycles of internal oscillator, a reset signal (high level) is generated on RSTB pin. The reset time should be calculated as follows The off mode is entered as soon as USB input voltage is removed or under 4.5V. Figure 12-2. USB Power ON/OFF Procedure Diagram 12 8 ms, 256 1 fOSCILLATOR MAX– fOSCILLATOR MIN– USB 5.5V 4.5V TimeFB/VBOOST 2.4V Time 2.2V RSTB VBOOST Time 1 msec. 12.8 msec. up to 51.2 msec. With USB SUpply
6365A–PMAAC–12-Mar-08 AT73C209 12.3 USB vs. DC/DC Power On/Off Operation AT73C209 has a power selection priority. The USB pin powers the LDO1 and the IN pin powers the DC/DC Converter. If the output value of t he DC/DC is higher than the LDO1 output value, then the LDO1 is stopped. If the output value of the LDO1 is higher than the DC/DC output value, then the DC/DC is put in standby mode. Figure 12-3. Power Supply Priority Diagram Using default values (In the registers), the power-on and power-off sequences when both power supplies are connected, should be as described below. Power On Sequence: A cell is connected to the IN pin. The DC/DC can be started by ONOFF pin activation and latched by UPONOFF bit activation. FB output rises until 3.3V (default voltage value). Once FB reaches 2.4V, a counter is launched and after “Reset-Time”, a reset is generated on RSTB pin. DC/DC is running. A USB power supply is connected on the USB pin. The LDO1 starts automatically. FB/VBOOST rises to 3.4V (default voltage value). The DC/DC is in Standby Mode Power Off Sequence: The USB power supply is disconnected from the USB pin. The LDO1 is stopped The DC/DC is start (in case of UPONOFF bit activated) FB/VBOOST is falling down until 3.3V (default voltage value). The DC/DC is stopped when the UPONOFF bit is set to Low. FB/VBOOST USB IN LDO1 LDO1 Stop Standby DC/DC > LDO1
6365A–PMAAC–12-Mar-08 AT73C209 Figure 12-4. USB vs. DC/DC Power On/Off Procedure Diagram (with Default Values) 3.4V 3.3V 2.4V 2.2V LDO1_ON DCDC_ON RSTB FB/VBOOST UPONOFF ONOFF USB IN Reset Time Time Time Time Time Time Time Time Time
6365A–PMAAC–12-Mar-08 AT73C209
12.4 Audio DAC Start-up Sequences
The power up of the circuit can be performed independently for several blocks. The figure below presents the sequence carried out for powering up a specific block XX where XX can be any of the several blocks described below0 Figure 12-5. DAC Startup DIagram The sequence flow starts by setting to High the block specific fast-charge control bit and subse- quently the associated power control bit. Once the power control bit is set to High, the fast charging starts. This action begins a user contro lled fast-charge cycle. When the fast-charge period is over, the user must reset the associated fast-charge bit and the block is ready for use. If a power control bit is cleared a new power up sequence is needed. The several blocks with independent power control are identified in Table 12-1 below. The table describes the power-on control and fast-charge bits for each block. The power-on settling times for each of the different blocks are described in Table 12-1 below. Table 12-1. Power-on Control and Fast-charge Bits Table Powered Up Block Power On Control Bit Precharge Control Bit Vref & Vcm generator onmstr (reg 0x0C ; bit #0) prcharge (reg 0x0C; bit #1) Left line in amplifier onlnil (reg 0x00; bit #0) prchargeil (reg 0x0C; bit #2) Right line in amplifier onlnir (reg 0x00; bit #1) prchargeir (reg 0x0C; bit #3) Left line out amplifier onlnol (reg 0x00; bit #2) prchargeol (reg 0x0C; bit #4) Right line out amplifier onlnor (reg 0x00; bit #3) prchargeor (reg 0x0C; bit #5) Left D-to-A converter ondacl (reg 0x00; bit #4) Not Needed Right D-to-A converter ondacr (reg 0x00; bit #5) Not Needed Circuit in Reset State (rstz low) Fastcharge XX Set Low End Fastcharge Circuit pre-charging User Controlled Disable Reset All Blocks are in Power Down (rstz high) XX Block in Power Down XX Block Ready On XX Set to High begin fastcharge On XX Set to Low Fastcharge XX Set High = Register Write Operation *Circuit must be in this state for the specified fastcharge interval.
6365A–PMAAC–12-Mar-08 AT73C209 Note: All the blocks can be precharged simultaneously Table 12-2. Power On Settling Time Power On Signal Powered Up Block Power On Settling Time Equivalent Charge Capacitance Max dV/dt while Charging osmstr Vref generator 500 ms 10 µF -- onlnil Left Line In Amplifier 50 ms 2.2 µF -- onlnir Right Line In Amplifier 50 ms 2.2 µF -- onlnol Left Line Out Amplifier 500 ms 100 µF to 220 µF 3V/sec. onlnor Right Line Out Amplifier 500 ms 100 µF to 220 µF 3V/sec. ondacl Left D to A Converter 100 µs -- -- ondacr Right D to A Converter 100 µs -- --
6365A–PMAAC–12-Mar-08 AT73C209 13. Interrupts There are three possible interrupts. Two for USB (for Plugin and Unplug) and one for Headset Short-Circuit. These three interrupts generate a low signal on ITB output pin and are generated as described in the following paragraphs. To see each interrupt, it’s necessary to mask it by using the register “INT_MASK” at 0x11 regis- ter address.
13.1 USB Interrupt
There are two in terrupt generation possib ilities for USB. USB Rising interrupt and USB Falling interrupt. The dedicated registers for these interrupts are 0x11 (MISC_STATUS) and 0x12 (INT_MASK). These registers are described below . (Only the used bits for USB interrupt are Register (0x11): Miscellaneous Status (MISC_STATUS) Register (0x12): Interrupt Mask (INT_MASK) Bit Name Description Reset Value Bit Name Description Reset Value
6365A–PMAAC–12-Mar-08 AT73C209
13.1.1 USB Rising Interrupt
The sequence of USB Rising Interrupt generation, is shown below. Figure 13-1. USB Rising Interrupt DIagram The sequence of the USB Rising Interrupt is described below. Put bit #1 of register 0x12 to High → USB Mask Rising (USBRMSK) goes to High Plug USB input → bit #1 of register 0x11 (USBOK), goes to High Level → ITB output goes to Low Level Put bit #1 of register 0x12 to Low → USB Mask Rising (USBRMSK) goes to Low → bit #1 of register 0x11 (USBOK), stay to High Level → ITB output goes to High Level Time Time Time Time Time Interrupt Generation ITB USBOK USBFMSK USBRMSK USB Vusb 4.5V High Level High Level High Level High Level
6365A–PMAAC–12-Mar-08 AT73C209
13.1.2 USB Falling Interrupt
The Falling Interrupt generation sequence is shown below. Figure 13-2. USB Falling Interrupt Diagram The sequence of the USB Falling Interrupt is described below. Put bit #2 of register 0x12 to High → USB Mask Rising (USBRMSK) goes to High Unplug USB input → bit #1 of register 0x11 (USBOK), goes to Low Level → ITB output goes to Low Level Put bit #2 of register 0x12 to Low → USB Mask Rising (USBRMSK) goes to Low → bit #1 of register 0x11 (USBOK), stays at Low Level → ITB output goes to Low Level Time Time Time Time Time Interrupt Generation ITB USBOK USBFMSK USBRMSK USB Vusb 4.5V High Level High Level High Level High Level
6365A–PMAAC–12-Mar-08 AT73C209
13.2 Headset Short-Circuit Interrupt
There is one interrupt generation for Headset Short-Circuit (see diagram below). The dedicated registers for this in terrupt are 0x11 (MISC_STATUS) and 0x12 (INT_MASK). These registers are described below. (Only the used bits for Headset Short-Circuit interrupt are described. For Register (0x11): Miscellaneous Status (MISC_STATUS)
13.2.1 Headset Short-Circuit Sequence
Figure 13-3. Headset Short-Circuit Interrupt Diagram The sequence of the Head Short-Circuit Interrupt is described below. The Headset Short Circuit Flag (HSSHORT) should be removed by switching off the headset driver. Register Bit Name Description Reset Value 0x11 0 HSSHORT Headset Short Flag HSSHORT = 0 0x12 0 HSSMSK Headset short interrupt mask (1 to enable interrupt) HSSMSK = 0 Time Time Time Time High Level High Level High Level ITB HSSHORT HSSMSK Headset Driver Output Headset Driver Off Headset Driver Off Short-Circuit on Headset Driver Headset Driver Off Headset Short Circuit Debounce Put bit #0 of register 0x12 to High. →Headset Short-Circuit Mask (HSSMSK) goes to High. Power on the headset output driver. Make a short circuit on the headset output (right or left channel. →After Debounce Time bit #0 of register 0x11 (HSSHORT), goes to High Level. →Then ITB output goes to High Level.
6365A–PMAAC–12-Mar-08 AT73C209 The ITB signal (Interrupt Output) should be removed by putting bit #0 of register 0x12 (HSSMSK) to Low.
13.2.2 Debounce Time
The debounce time depend s on the internal oscilla tor deviation. It operates after 512 cycles of internal oscillator period time. It should be calculated as follows: Debounce - Time equation: Internal Frequency Oscillator Deviation: Debounce-Time Min. and Max.: Debounce Time– 512 1 fOSCILLATOR ⎛⎞×= 5kHz f OSCILLATOR 20kHz<< 25·· 6ms, Debounce Time– 104 2ms,<<
6365A–PMAAC–12-Mar-08 AT73C209 14. Current Consumption in Different Modes Table 14-1. Current Consumption with Battery Operation Mode Current Consumption (typ) Current Consumption (max) Unit 0: Off Internal Monitoring Total TBD 10 µA 1: Standby No Play DC/DC is on MCU & Nand Flash Ready Total TBD 10 mA 2: Play DC/DC is on MCU Flash Reading Audio DAC Headset 0dB Total TBD 45 mA 3: Record DC/DC is on MCU Flash Writing Audio DAC Headset 0dB Total TBD 45 mA
6365A–PMAAC–12-Mar-08 AT73C209 16. Revision History Table 16-1. Revision History Doc. Rev. Date Comments Change Request Ref. 12-Mar-08 First issue.
i 6365A–PMAAC–12-Mar-08 AT73C209 Table of Contents
6365A–PMAAC–12-Mar-08 AT73C209
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