AT29C010A-70TI

AT29C010A-70TI ATMEL | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 18

Technical content

Features

• Fast Read Access Time – 70 ns  5-volt Only Reprogramming  Sector Program Operation – Single Cycle Reprogram (Erase and Program) – 1024 Sectors (128 Bytes/sector) – Internal Address and Data Latches for 128 Bytes  Two 8K Bytes Boot Blocks with Lockout  Internal Program Control and Timer  Hardware and Software Data Protection  Fast Sector Program Cycle Time – 10 ms  DATA Polling for End of Program Detection  Low Power Dissipation – 50 mA Active Current – 100 µA CMOS Standby Current  Typical Endurance > 10,000 Cycles  Single 5V ± 10% Supply  CMOS and TTL Compatible Inputs and Outputs  Commercial and Industrial Temperature Ranges

Description

The AT29C010A is a 5-volt-only in-system Flash programmable and erasable read only memory (PEROM). Its 1 megabit of memory is organized as 131,072 words by 8 bits. Manufactured with Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 70 ns with power dissipation of just 275 mW over the commer- cial temperature range. When the device is deselected, the CMOS standby current is 1-megabit (128K x 8) 5-volt Only Flash Memory AT29C010A Rev. 0394F–FLASH–02/03 Pin Configurations Pin Name Function A0 - A16 Addresses CE Chip Enable OE Output Enable WE Write Enable I/O0 - I/O7 Data Inputs/Outputs NC No Connect TSOP Top View Type 1 A11 A13 A14 NC WE VCC NC A16 A15 A12 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 PLCC Top View I/O0 A14 A13 A11 OE A10 CE I/O7 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 A12 A15 A16 NC VCC WE NC DIP Top View NC A16 A15 A12 I/O0 I/O1 I/O2 GND VCC WE NC A14 A13 A11 OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3

2 AT29C010A

0394F–FLASH–02/03 less than 100 µA. The device endurance is such that any sector can typically be written to in excess of 10,000 times. To allow for simple in-system reprogrammability, the AT29C010A does not require high input voltages for programming. Five-volt-only commands determine the operation of the device. Reading data out of the device is similar to reading from an EPROM. Repro- gramming the AT29C010A is performed on a sector basis; 128 bytes of data are loaded into the device and then simultaneously programmed. During a reprogram cycle, the address locations and 128 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a program cycle, the device will automatically erase the sector and then program the latched data using an internal control timer. The end of a program cycle can be detected by DATA polling of I/O7. Once the end of a program cycle has been detected, a new access for a read or program can begin. Block Diagram Device Operation READ: The AT29C010A is accessed like an EPROM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in the high impedance state whenever CE or OE is high. This dual-line control gives designers flexibility in preventing bus contention. BYTE LOAD: Byte loads are used to enter the 128 bytes of a sector to be programmed or the software codes for data protection. A byte load is performed by applying a low pulse on the WE or CE input with CE or WE low (respectively) and OE high. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. PROGRAM: The device is reprogrammed on a sector basis. If a byte of data within a sector is to be changed, data for the entire sector must be loaded into the device. The data in any byte that is not loaded during the programming of its sector will be indetermi- nate. Once the bytes of a sector are loaded into the device, they are simultaneously programmed during the internal programming period. After the first data byte has been loaded into the device, successive bytes are entered in the same manner. Each new byte to be programmed must have its high to low transition on WE (or CE) within 150 µs of the low to high transition of WE (or CE) of the preceding byte. If a high to low transi- tion is not detected within 150 µs of the last low to high transition, the load period will end and the internal programming period will start. A7 to A16 specify the sector address.

0394F–FLASH–02/03 The sector address must be valid during each high to low transition of WE (or CE). A0 to A6 specify the byte address within the sector. The bytes may be loaded in any order; sequential loading is not required. Once a programming operation has been initiated, and for the duration of t WC, a read operation will effectively be a polling operation. SOFTWARE DATA PROTECTION: A software controlled data protection feature is available on the AT29C010A. Once the software protection is enabled a software algo- rithm must be issued to the device before a program may be performed. The software protection feature may be enabled or disabl ed by the user; when shipped from Atmel, the software data protection feature is disabled. To enable the software data protection, a series of three program commands to spec ific addresses with specific data must be performed. After the software data protection is enabled the same three program com- mands must begin each program cycle in order for the programs to occur. All software program commands must obey the sector program timing specifications. Once set, the software data protection feature remains ac tive unless its disable command is issued. Power transitions will not reset the software data protection feature, however the soft- ware feature will guard against inadvertent program cycles during power transitions. Once set, software data protection will remain active unless the disable command sequence is issued. After setting SDP, any attempt to write to the device without the 3-byte command sequence will start the internal write timers . No data will be written to the device; how- ever, for the duration of t WC, a read operation will effectively be a polling operation. After the software data protection’s 3-byte command code is given, a byte load is per- formed by applying a low pulse on the WE or CE input with CE or WE low (respectively) and OE high. The address is latched on the falling edge of CE or WE, whichever occurs last. The data is latched by the first rising edge of CE or WE. The 128 bytes of data must be loaded into each sector by the same procedure as outlined in the program section under device operation. HARDWARE DATA PROTECTION: Hardware features protect against inadvertent pro- grams to the AT29C010A in the following ways: (a) V CC sense – if V CC is below 3.8V (typical), the program function is inhibited; (b) V CC power on delay – once V CC has reached the VCC sense level, the device will automatically time out 5 ms (typical) before programming; (c) Program inhibit – holding any one of OE low, CE high or WE high inhibits program cycles; and (d) Noise filter— pulses of less than 15 ns (typical) on the WE or CE inputs will not initiate a program cycle. PRODUCT IDENTIFICATION: The product identification mode identifies the device and manufacturer as Atmel. It may be accessed by hardware or software operation. The hardware operation mode can be used by an external programmer to identify the correct programming algorithm for the Atmel product. In addition, users may wish to use the software product identification mode to identify the part (i.e. using the device code), and have the system software use the appropriate sector size for program operations. In this manner, the user can have a common board design for 256K to 4-megabit densities and, with each density’s sector size in a memory map, have the system software apply the appropriate sector size. For details, see Operating Modes (for hardware operation) or Software Product Identifi- cation. The manufacturer and device code is the same for both modes. DATA POLLING: The AT29C010A features DATA polling to indicate the end of a pro- gram cycle. During a program cycle an attempted read of the last byte loaded will result in the complement of the loaded data on I/O7. Once the program cycle has been com- pleted, true data is valid on all outputs and the next cycle may begin. DATA polling may begin at any time during the program cycle.

4 AT29C010A

0394F–FLASH–02/03 TOGGLE BIT: In addition to DATA polling the AT29C010A provides another method for determining the end of a program or erase cycle. During a program or erase opera- tion, successive attempts to read data from the device will result in I/O6 toggling between one and zero. Once the program cycle has completed, I/O6 will stop toggling and valid data will be read. Examining the toggle bit may begin at any time during a pro- gram cycle. OPTIONAL CHIP ERASE MODE: The entire device can be erased by using a 6-byte software code. Please see Software Chip Erase application note for details. BOOT BLOCK PROGRAMMING LOCKOUT: The AT29C010A has two designated memory blocks that have a programming lock out feature. This feature prevents pro- gramming of data in the designated block once the feature has been enabled. Each of these blocks consists of 8K bytes; the programming lockout feature can be set indepen- dently for either block. While the lockout feature does not have to be activated, it can be activated for either or both blocks. These two 8K memory sections are referred to as boot blocks. Secure code which will bring up a system can be contained in a boot block. The AT29C010A blocks are located in the first 8K bytes of memory and the last 8K bytes of memory. The boot block pro- gramming lockout feature can therefore support systems that boot from the lower addresses of memory or the higher addresses. Once the programming lockout feature has been activated, the data in that block can no longer be erased or programmed; data in other memory locations can still be changed through the regular programming meth- ods. To activate the lockout feature, a series of seven program commands to specific addresses with specific data must be perf ormed. Please see Boot Block Lockout Fea- ture Enable Algorithm. If the boot block lockout feature has been activated on either block, the chip erase func- tion will be disabled. BOOT BLOCK LOCKOUT DETECTION: A software method is available to determine whether programming of either boot block section is locked out. See Software Product Identification Entry and Exit sections. When the device is in the software product identifi- cation mode, a read from location 00002 will show if programming the lower address boot block is locked out while reading location 1FFF2 will do so for the upper boot block. If the data is FE, the corresponding block can be programmed; if the data is FF, the pro- gram lockout feature has been activated and the corresponding block cannot be pro- grammed. The software product identificati on exit mode should be used to return to standard operation. Absolute Maximum Ratings* Maximum Ratings” may cause permanent dam- age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. All Input Voltages (including NC Pins) All Output Voltages CC + 0.6V Voltage on OE

0394F–FLASH–02/03 Notes: 1. X can be V IL or VIH. 2. Refer to AC Programming Waveforms. 4. Manufacturer Code: 1F , Device Code: D5. 5. See details under Software Product Identification Entry/Exit. DC and AC Operating Range AT29C010A-70 AT29C010A-90 AT29C010A-12 AT29C010A-15 Operating Temperature (Case) VCC Power Supply 5V ± 5% 5V ± 10% 5V ± 10% 5V ± 10% Note: Not recommended for New Designs. Operating Modes Mode CE OE WE Ai I/O Read V IL VIL VIH Ai D OUT Program(2) VIL VIH VIL Ai D IN 5V Chip Erase V IL VIH VIL Ai Standby/Write Inhibit V IH X(1) XX H i g h Z Program Inhibit X X V IH Program Inhibit X V IL X Output Disable X V IH XH i g h Z Product Identification Hardware V IL VIL VIH A1 - A16 = VIL, A9 = VH,(3) A0 = VIL Manufacturer Code(4) A1 - A16 = VIL, A9 = VH,(3) A0 = VIH Device Code(4) Software(5) A0 = VIL Manufacturer Code(4) A0 = VIH Device Code(4) DC Characteristics Symbol Parameter Condition Min Max Units I LI Input Load Current V IN = 0V to VCC 10 µA ILO Output Leakage Current V I/O = 0V to VCC 10 µA ISB1 VCC Standby Current CMOS CE = VCC - 0.3V to VCC 0° - 40°C 30 µA Com. 100 µA Ind. 300 µA ISB2 VCC Standby Current TTL CE = 2.0V to VCC 3m A ICC VCC Active Current f = 5 MHz; I OUT = 0 mA 50 mA VIL Input Low Voltage 0.8 V VIH Input High Voltage 2.0 V VOL Output Low Voltage I OL = 2.1 mA 0.45 V VOH1 Output High Voltage I OH = -400 µA 2.4 V VOH2 Output High Voltage CMOS I OH = -100 µA; VCC = 4.5V 4.2 V

6 AT29C010A

0394F–FLASH–02/03 AC Read Waveforms(1)(2)(3)(4) Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC. 3. t DF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. AC Read Characteristics Symbol Parameter AT29C010A-70 AT29C010A-90 AT29C010A-12 AT29C010A-15 UnitsMin Max Min Max Min Max Min Max tACC Address to Output Delay 70 90 120 150 ns tCE (1) CE to Output Delay 70 90 120 150 ns tOE (2) OE to Output Delay 0 35 0 40 0 50 0 70 ns tDF (3)(4) CE or OE to Output Float 0 25 0 25 0 30 0 40 ns tOH Output Hold from OE, CE or Address, whichever occurred first 000 0 ns Note: Not recommended for New Designs.

0394F–FLASH–02/03 Input Test Waveforms and Measurement Level Output Test Load Note: 1. This parameter is canharacterized and is not 100% tested. Pin Capacitance f = 1 MHz, T = 25°C(1) Symbol Typ Max Units Conditions CIN 46 p F V IN = 0V COUT 81 2 p F V OUT = 0V tR, tF < 5 ns 70 ns 90/120/150 ns

8 AT29C010A

0394F–FLASH–02/03 AC Byte Load Waveforms WE Controlled CE Controlled AC Byte Load Characteristics Symbol Parameter Min Max Units tAS, tOES Address, OE Set-up Time 0 ns tAH Address Hold Time 50 ns tCS Chip Select Set-up Time 0 ns tCH Chip Select Hold Time 0 ns tWP Write Pulse Width (WE or CE)9 0 n s tDS Data Set-up Time 35 ns tDH, tOEH Data, OE Hold Time 0 ns tWPH Write Pulse Width High 100 ns

0394F–FLASH–02/03 Program Cycle Waveforms(1)(2)(3) Notes: 1. A7 through A16 must specify the sector address during each high to low transition of WE (or CE). 2. OE must be high when WE and CE are both low. 3. All bytes that are not loaded within the sector being programmed will be indeterminate. Program Cycle Characteristics Symbol Parameter Min Max Units tWC Write Cycle Time 10 ms tAS Address Set-up Time 0 ns tAH Address Hold Time 50 ns tDS Data Set-up Time 35 ns tDH Data Hold Time 0 ns tWP Write Pulse Width 90 ns tBLC Byte Load Cycle Time 150 µs tWPH Write Pulse Width High 100 ns

10 AT29C010A

0394F–FLASH–02/03 Software Data Protection Enable Algorithm(1) Notes: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. Data Protect state will be activated at end of pro- gram cycle. 3. Data Protect state will be deactivated at end of pro- gram period. 4. 128 bytes of data MUST BE loaded. LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA A0 TO ADDRESS 5555 LOAD DATA TO PAGE (128 BYTES)(4) WRITES ENABLED ENTER DATA PROTECT STATE(2) Software Data Protection Disable Algorithm(1) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 80 TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 20 TO ADDRESS 5555 LOAD DATA TO PAGE (128 BYTES)(4) EXIT DATA PROTECT STATE (3) Software Protected Program Cycle Waveform(1)(2)(3) Notes: 1. A7 through A16 must specify the sector address during each high to low transition of WE (or CE) after the software code has been entered. 2. OE must be high when WE and CE are both low. 3. All bytes that are not loaded within the sector being programmed will be indeterminate.

0394F–FLASH–02/03 Notes: 1. These parameters are characterized and not 100% tested. 2. See t OE spec in AC Read Characteristics. Data Polling Waveforms Notes: 1. These parameters are characterized and not 100% tested. 2. See t OE spec in AC Read Characteristics. Toggle Bit Waveforms(1)(2)(3) Notes: 1. Toggling either OE or CE or both OE and CE will operate toggle bit. 2. Beginning and ending state of I/O6 will vary. 3. Any address location may be used but the address should not vary. Data Polling Characteristics(1) Symbol Parameter Min Typ Max Units tDH Data Hold Time 10 ns tOEH OE Hold Time 10 ns tOE OE to Output Delay(2) ns tWR Write Recovery Time 0 ns Toggle Bit Characteristics(1) Symbol Parameter Min Typ Max Units t DH Data Hold Time 10 ns tOEH OE Hold Time 10 ns tOE OE to Output Delay(2) ns tOEHP OE High Pulse 150 ns tWR Write Recovery Time 0 ns

12 AT29C010A

0394F–FLASH–02/03 Software Product Identification Entry(1) Software Product Identification Exit(1) Notes: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. A1 - A15 = V IL. Manufacturer Code is read for A0 = V IL; Device Code is read for A0 = VIH. 3. The device does not remain in identification mode if powered down. 4. The device returns to standard operation mode. 5. Manufacturer Code is 1F . The Device Code is D5. LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 90 TO ADDRESS 5555 PAUSE 10 mS ENTER PRODUCT IDENTIFICATION MODE (2)(3)(5) LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA F0 TO ADDRESS 5555 PAUSE 10 mS EXIT PRODUCT IDENTIFICATION MODE (4) Boot Block Lockout Feature Enable Algorithm(1) Notes: 1. Data Format: I/O7 - I/O0 (Hex); Address Format: A14 - A0 (Hex). 2. Lockout feature set on lower address boot block. 3. Lockout feature set on higher address boot block. LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 80 TO ADDRESS 5555 LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA 40 TO ADDRESS 5555 LOAD DATA 00 TO ADDRESS 00000H(2) PAUSE 20 mS LOAD DATA FF TO ADDRESS 1FFFFH(3) PAUSE 20 mS

0394F–FLASH–02/03 NORMALIZED SUPPLY CURRENT vs. TEMPERATURE TEMPERATURE (C) -55 1.4 1.3 1.2 1.1 1.0 0.8 0.9 -25 5 35 65 95 125 N O R M A L I Z E D I C C NORMALIZED SUPPLY CURRENT vs. ADDRESS FREQUENCY FREQUENCY (MHz) 1.1 1.0 0.9 0.8 0.7 1234567 N O R M A L I Z E D I C C V CC = 5V T = 25C NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE SUPPLY VOLTAGE (V) 4.50 1.4 1.2 1.0 0.8 0.6 4.75 5.00 5.25 5.50 N O R M A L I Z E D I C C

14 AT29C010A

0394F–FLASH–02/03

Ordering Information

(ns) ICC (mA) Ordering Code Package Operation RangeActive Standby 70 50 0.1 AT29C010A-70JC AT29C010A-70PC AT29C010A-70TC 32J 32P6 32T Commercial (0° to 70°C) AT29C010A-70JI AT29C010A-70PI AT29C010A-70TI 32J 32P6 32T Industrial (-40° to 85°C) 90 50 0.1 AT29C010A-90JC AT29C010A-90PC AT29C010A-90TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT29C010A-90JI AT29C010A-90PI AT29C010A-90TI 32J 32P6 32T Industrial (-40° to 85°C) 120 50 0.1 AT29C010A-12JC AT29C010A-12PC AT29C010A-12TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT29C010A-12JI AT29C010A-12PI AT29C010A-12TI 32J 32P6 32T Industrial (-40° to 85°C) 150 50 0.1 AT29C010A-15JC AT29C010A-15PC AT29C010A-15TC 32J 32P6 32T Commercial (0° to 70°C) 50 0.3 AT29C010A-15JI AT29C010A-15PI AT29C010A-15TI 32J 32P6 32T Industrial (-40° to 85°C) Note: Not recommended for New Designs. Package Type 32J 32-lead, Plastic J-leaded Chip Carrier (PLCC) 32P6 32-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 32T 32-lead, Thin Small Outline Package (TSOP)

0394F–FLASH–02/03 Packaging Information 32J – PLCC DRAWING NO. REV.

2325 Orchard Parkway

San Jose, CA 95131R TITLE 32J, 32-lead, Plastic J-leaded Chip Carrier (PLCC) B32J 10/04/01 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.51(0.020)MAX 0.318(0.0125) 0.191(0.0075) 45˚ MAX (3X) A B1 E2 B e E1 E D COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. A 3.175 – 3.556 A1 1.524 – 2.413 A2 0.381 – – D 12.319 – 12.573 D1 11.354 – 11.506 Note 2 D2 9.906 – 10.922 E 14.859 – 15.113 E1 13.894 – 14.046 Note 2 E2 12.471 – 13.487 B 0.660 – 0.813 B1 0.330 – 0.533 e 1.270 TYP

16 AT29C010A

0394F–FLASH–02/03 32P6 – PDIP San Jose, CA 95131 TITLE DRAWING NO. R REV. 32P6, 32-lead (0.600"/15.24 mm Wide) Plastic Dual Inline Package (PDIP) B32P6 09/28/01 PIN B REF E C L SEATING PLANE A 0º ~ 15º D e eB COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A – – 4.826 A1 0.381 – – D 41.783 – 42.291 Note 1 E 15.240 – 15.875 E1 13.462 – 13.970 Note 1 B 0.356 – 0.559 B1 1.041 – 1.651 L 3.048 – 3.556 C 0.203 – 0.381 eB 15.494 – 17.526 e 2.540 TYP Note: 1. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").

0394F–FLASH–02/03 32T – TSOP San Jose, CA 95131 TITLE DRAWING NO. R REV. 32T, 32-lead (8 x 20 mm Package) Plastic Thin Small Outline Package, Type I (TSOP) B32T 10/18/01 PIN 1 D1 D Pin 1 Identifier be E A 0º ~ 8º c L GAGE PLANESEATING PLANE COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE Notes: 1. This package conforms to JEDEC reference MO-142, Variation BD. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion on E is 0.15 mm per side and on D1 is 0.25 mm per side. 3. Lead coplanarity is 0.10 mm maximum. A – – 1.20 A1 0.05 – 0.15 A2 0.95 1.00 1.05 D 19.80 20.00 20.20 D1 18.30 18.40 18.50 Note 2 E 7.90 8.00 8.10 Note 2 L 0.50 0.60 0.70 L1 0.25 BASIC b 0.17 0.22 0.27 c 0.10 – 0.21 e 0.50 BASIC

Printed on recycled paper. 0394F–FLASH–02/03 xM © Atmel Corporation 2003. Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change de vices or specifications detailed herein at any time without n otice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of At mel are granted by the Company in connection with the sale of Atmel products, expr essly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems. Atmel Headquarters Atmel Operations Corporate Headquarters San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 487-2600 Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland TEL (41) 26-426-5555 FAX (41) 26-426-5500 Asia Room 1219 Chinachem Golden Plaza

77 Mody Road Tsimshatsui

TEL (852) 2721-9778 FAX (852) 2722-1369 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 Memory San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 Microcontrollers San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 La Chantrerie BP 70602

44306 Nantes Cedex 3, France

13106 Rousset Cedex, France

1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL 1(719) 576-3300 FAX 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland TEL (44) 1355-803-000 FAX (44) 1355-242-743 RF/Automotive Theresienstrasse 2 Postfach 3535

74025 Heilbronn, Germany

FAX (49) 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL 1(719) 576-3300 FAX 1(719) 540-1759 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123

38521 Saint-Egreve Cedex, France

literature@atmel.com Web Site http://www.atmel.com ATME L® is the registered trademark of Atmel. Other terms and product names may be the trademarks of others.