AT27BV400 ATMEL | Alldatasheet

Document overview

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Technical content

Features

  • Fast Read Access Time - 120 ns
  • Word-wide or Byte-wide Configurable
  • Dual Voltage Range Operation – Unregulated Battery Power Supply Range, 2.7V to 3.6V or Standard 5V ±±±± 10% Supply Range
  • 4-Megabit Flash and Mask ROM Compatable
  • Low Power CMOS Operation –2 0 µµµµA Maximum Standby – 10 mA Max. Active at 5 MHz for VCC = 3.6V
  • JEDEC Standard Packages – 44-Lead PLCC – 44-Lead SOIC (SOP) – 48-Lead TSOP (12 mm x 20 mm)
  • High Reliability CMOS Technology – 2,000 ESD Protection – 200 mA Latchup Immunity
  • Rapid™ Programming Algorithm - 50 µµµµs/word (typical)
  • CMOS and TTL Compatible Inputs and Outputs – JEDEC Standard for LVTTL and LVBO
  • Integrated Product Identification Code
  • Commercial and Industrial Temperature Ranges

Description

The AT27BV400 is a high performance low-power, low-voltage 4,194,304-bit one time programmable read only memory (OTP EPROM) organized as either 256K by 16 or 512K by 8 bits. It requires only one supply in the range of 2.7 to 3.6V in normal read Rev. 0989A–03/98 Pin Configurations Pin Name Function A0 - A17 Addresses O0 - O15 Outputs O15/A-1 Output/Address BYTE /VPP Byte Mode/ Program Supply CE Chip Enable OE Output Enable NC No Connect TSOP Type 1 A15 A14 A13 A12 A11 A10 NC NC NC NC NC NC NC NC A17 A16 BYTE/VPP GND 015/A-1 O14 O13 O12 VCC O11 O10 OE GND CE SOIC (SOP) NC NC A17 CE GND OE O10 O11 NC NC A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND 015/A-1 O14 O13 O12 VCC (continued) AT27BV400 Preliminary PLCC CE GND OE A12 A13 A14 A15 A16 BYTE/VPP GND O15/A-1 O14 O10 O11 NC VCC O12 O13 A17 NC GND NC A10 A11

mode operation. The by-16 organization makes this part ideal for portable and hand held 16- and 32-bit micropro- cessor systems using either regulated or unregulated bat- tery power. Atmel’s innovative design techniques provide fast speeds that rival 5V parts while keeping the low power consump- tion of a 3V supply. At V CC = 2.7V, any word can be accessed in less than 120ns. With a typical power dissipa- tion of only 10 mW at 5mHZ and V CC = 3V, the AT27BV400 consumes less than one fifth the power of a standard 5V EPROM. Standby mode supply current is typically less than 1 mA at 3V. The AT27BV400 simplifies system design and stretches battery lifetime even further by eliminating the need for power supply regulation. The AT27BV400 can be organized as either word-wide or byte-wide. The organization is selected via the BYTE /VPP pin. When BYTE/VPP is asserted high (VIH), the word-wide organization is selected and the O15/A-1 pin is used for O15 data output. When BYTE /VPP is asserted low (VIL),the byte wide organization is selected and the O15/A-1 pin is used for the address pin A-1. When the A T27BV400 is logi- cally regarded as x16 (word-wide), but read in the byte- wide mode, then with A-1= V IL the lower 8 bits of the 16-bit word are selected with A-1 = VIH the upper 8 bits of the 16- bit word are selected. The AT27BV400 is available in industry standard JEDEC- approved one-time programmable (OTP) PLCC, SOIC (SOP), and TSOP packages. The device features two-line control(CE ,OE) to eliminate bus contention. With high density 256K word or 512K byte storage capabil- ity, the AT27BV400 allows firmware to be to be stored reli- ably and to be accessed by the system without the delays of mass storage media. The AT27BV400 operating with V CC at 3.0V produces TTL level outputs that are compatible with standard TTL logic devices operating at VCC = 5V. At VCC = 2.7V, the part is compatible with JEDEC approved low voltage battery oper- ation (LVBO) interface specifications. The device is also capable of standard 5-volt operation making it ideally suited for dual supply range systems or card products that are pluggable in both 3-volt and 5-volt hosts. Atmel’s AT27BV400 has additional features that ensure high quality and efficient production use. The Rapid TM Pro- gramming Algorithm reduces the time required to program the part and guarantees reliable programming. Program- ming time is typically only 50µs/word. The Integrated Prod- uct Identification Code electronically identifies the device and manufacturer. This feature is used by industry standard programming equipment to select the proper programming equipment and voltages. The AT27BV400 programs exactly the same way as a standard 5V AT27C400 and uses the same programming equipment. System Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these tran- sients may exceed data sheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be uti- lized for each device. This capacitor should be connected between the V CC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the V CC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. Block Diagram

Notes: 1. X can be VIL or VIH. 3. Refer to the programming characteristics tables in this data sheet. 5. T wo identifier words may be selected. All Ai inputs are held low (VIL) except A9,which is set to VH , and A0, which is toggled low (VIL) to select the Manufacturer’s Identification word and high (VIH) to select the Device Code word. 6. Standby VCC current (ISB ) is specified with VPP = VCC . VCC > VPP will cause a slight increase in ISB. Absolute Maximum Ratings* Maximum Ratings” may cause permanent dam- age to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: 1. Minimum voltage is -0.6V DC which undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is Vcc + 0.75V DC which may overshoot to + 7.0V for pulses of less than 20 ns. Voltage on Any Pin with (1) Voltage on A9 with VPP Supply Voltage with Operating Modes Mode/Pin CE OE Ai BYTE /VPP Outputs O 0-O7 O 8-O14 O 15/A-1 Read Word-wide V IL VIL X(1) VIH D OUT D OUT D OUT Read Byte-wide Upper V IL VIL X(1) VIL D OUT High Z V IH Read Byte-wide Lower V IL VIL X(1) VIL D OUT High Z V IL Output Disable X (1) VIH X(1) XH i g h Z Standby V IH X(1) X(1) X(6) High Z Rapid Program(3) VIL VIH Ai V PP D IN PGM Verify X V IL Ai V PP D OUT PGM Inhibit V IH VIH X(1) VPP High Z Product Identification(5) VIL VIL A9 = VH (4) A0 = VIH or VIL A1 - A17 = VIL VIH Identification Code

Notes: 1. VCC must be applied simultaneously or before VPP , and removed simultaneously or after VPP . 2. VPP may be connected directly to VCC except during programming. The supply current would then be the sum of ICC and IPP. DC and AC Operating Conditions for Read Operation AT27BV400 -12 -15 Operating Temperature (Case) Com. 0 °C - 70°C0 °C - 70°C VCC Power Supply 2.7V to 3.6V 2.7V to 3.6V 5V ± 10% 5V ± 10% DC and Operating Characteristics for Read Operation Symbol Parameter Condition Min Max Units VCC = 2.7V to 3.6V ILI Input Load Current V IN = 0V to VCC ±1 µA ILO Output Leakage Current V OUT = 0V to VCC ±5 µA IPP1 (2) VPP (1) Read/Standby Current V PP = VCC 10 µA ISB VCC (1) Standby Current ISB1 (CMOS), CE = VCC ± 0.3V 20 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 100 µA ICC VCC Active Current f = 5MHz, I OUT = 0 mA, CE = VIL, VCC = 3.6V 10 mA VIL Input Low Voltage VCC = 3.0 to 3.6V -0.6 0.8 V VCC = 2.7 to 3.6V -0.6 0.2 x V CC V VIH Input High Voltage VCC = 3.0 to 3.6V 2.0 V CC + 0.5 V VCC = 2.7 to 3.6V 0.7 x V CC VCC + 0.5 V VOL Output Low Voltage IOL = 2.0 mA 0.4 V IOL = 100 µA0 . 2 V IOL = 20 µA0 . 1 V VOH Output High Voltage IOH = -2.0 mA 2.4 V IOH = -100 µAV CC - 0.2 V IOH = -20 µAV CC - 0.1 V VCC = 4.5V to 5.5V ILI Input Load Current V IN = 0V to VCC ±1 µA ILO Output Leakage Current V OUT = 0V to VCC ±5 µA IPP1 (2) VPP (1) Read/Standby Current V PP = VCC 10 µA ISB VCC (1) Standby Current ISB1 (CMOS), CE = VCC ± 0.3V 100 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1 mA ICC VCC Active Current f = 5 MHz, I OUT = 0 mA, CE = VIL 40 mA VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 V CC + 0.5 V VOL Output Low Voltage I OH = 2.1 mA 0.4 V VOH Output High Voltage I OH = -400 µA2 . 4 V

Notes: 1. 2,3,4,5. See the AC Waveforms for Read Operation diagram. Byte-Wide Read Mode AC Waveforms Note: BYTE /VPP = VIL Word-Wide Read Mode AC Waveforms Note: BYTE /VPP = VIH AC Characteristics for Read Operation VCC = 2.7V to 3.6V and 4.5V to 5.5V Symbol Parameter Condition AT27BV400 Units -12 -15 Min Max Min Max tACC (2) Address to Output Delay CE = OE = VIL 120 150 ns tCE (2) CE to Output Delay OE = VIL 120 150 ns tOE (2)(3) OE to Output Delay CE = VIL 40 50 ns tDF (4)(5) OE or CE High to Output Float, whichever occured first 30 35 ns tOH (4) Output Hold from Address CE or OE, whichever occured first 55n s tST BYTE High to Output Valid 120 150 ns tSTD BYTE Low to Output T ransition 50 60 ns

Note: C L = 100 pF including jig capacitance. Note: 1. T ypical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. Pin Capaticance f = 1 MHz, T = 25°C (1) Typ Max Units Conditions C IN 41 0 p F V IN = 0V C OUT 81 2 p F V OUT = 0V Input Test Waveforms and Measurement Levels tR , tF < 20 ns (10% to 90%) BYTE Transition AC Waveforms 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC . 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven.

Programming Waveforms (1) Notes: 1. The Input Timing reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer. 3. When programming the A T27BV400, a 0.1 µF capacitor is required across VPP and ground to suppress voltage transients. DC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Symbol Parameter Test Conditions Limits UnitsMin Max ILI Input Load Current V IN = VIL, VIH ±10 µA VIL Input Low Level -0.6 0.8 V VIH Input High Level 2.0 V CC + 0.5 V VOL Output Low Voltage I OL = 2.1 mA 0.4 V VOH Output High Voltage I OH = -400 µA2 . 4 V ICC2 VCC Supply Current (Program and Verify) 50 mA IPP2 VPP Supply Current CE = VIL 30 mA VID A9 Product Identification Voltage 11.5 12.5 V

Notes: 1. Vcc must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven— see timing diagram. 3. Program Pulse width tolerance is 50 µsec ± 5%. Note: 1. The A T27BV400 has the same Product Identification Code as the A T27C400. Both are programming compatible. AC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Symbol Parameter Test Conditions (1) Limits UnitsMin Max tAS Address Setup Time Input Rise and Fall Times: (10% to 90%) 20 ns Input Pulse Levels: 0.45V to 2.4V Input Timing Reference Level: 0.8V to 2.0V Output Timing Reference Level: 0.8V to 2.0V 2 µs tOES OE Setup Time 2 µs tDS Data Setup Time 2 µs tAH Address Hold Time 0 µs tDH Data Hold Time 2 µs tDFP OE High to Output Float Delay(2) 0 130 ns tVPS VPP Setup Time 2 µs tVCS VCC Setup Time 2 µs tPW CE Program Pulse Width(3) 47.5 52.5 µs tOE Data Valid from OE 150 ns tPRT BYTE /VPP Pulse Rise Time During Programming 50 ns Atmel’s 27BV800 Integrated Product Identification Code(1) Codes Pins Hex Data A0 O15 O14 O13 O12 O11 O10 O9 O8 O7 O6 O5 O4 O3 O2 O1 O0 M a n u f a c t u r e r 000011110 1 E 1 E D e v i c e T y p e 111110100 F 4 F 4

Rapid Programming Algorithm A 50 µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and BYTE/VPP is raised to 13.0V. Each address is first programmed with one 50 µs CE pulse without verification. Then a verifica- tion/reprogramming loop is executed for each address. In the event a word fails to pass verification, up to 10 succes- sive 50 µs pulses are applied with a verification after each pulse. If the word fails to verify after 10 pulses have been applied, the part is considered failed. After the word verifies properly, the next address is selected until all have been checked. V PP is then lowered to 5.0V and VCC to 5.0V. All words are read again and compared with the original data to determine if the device passes or fails.

Ordering Information

(ns) ICC (mA) Ordering Code Package Operation RangeActive Standby 120 10 0.02 A T27BV400-12JC A T27BV400-12RC A T27BV400-12TC 44J 44R 48T Commercial (0°C to 70°C) 10 0.02 A T27BV400-12JI A T27BV400-12RI A T27BV400-12TI 44J 44R 48T Industrial (-40°C to 85°C) 150 10 0.02 A T27BV400-15JC A T27BV400-15RC A T27BV400-15TC 44J 44R 48T Commercial (0°C to 70°C) 10 0.02 A T27BV400-15JI A T27BV400-15RI A T27BV400-15TI 44J 44R 48T Industrial (-40°C to 85°C) Package Type 44J 44-Lead, Plastic J-Leaded Chip Carrier (PLCC) 44R 44-Lead, 0.450" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP) 48T 48-Lead, Plastic Thin Small Outline Package (TSOP) 12 x 20 mm

*Controlling dimension: millimeters .045(1.14) X 45° PIN NO. 1 IDENTIFY .008(.203) .021(.533) .013(.330) .630(16.0) .590(15.0) .043(1.09) .020(.508) .120(3.05) .090(2.29) .180(4.57) .165(4.19) .500(12.7) REF SQ .032(.813) .026(.660) .050(1.27) TYP .656(16.7) .650(16.5) .695(17.7) .685(17.4)SQ SQ 44R , 44-Lead, 0.450" Wide, Plastic Gull Wing Small Outline Package (SOIC) Dimensions in Inches and (Millimeters) 48T, 48-Lead, 12 x 20 mm, Plastic Thin Small Outline Package(TSOP) Dimensions in Millimeters and (Inches)* 44J, 44-Lead, Plastic J-Leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AC