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Features

 Medium-voltage and Standard-voltage Operation ̶ 2.5 (VCC = 2.5V to 5.5V)  Automotive Temperature Range -40C to +125C  Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), or 1,024 x 8 (8K)  2-wire Serial Interface  Schmitt Trigger, Filtered Inputs for Noise Suppression  Bidirectional Data Transfer Protocol  400kHz (2.5V) Compatibility  Write Protect Pin for Hardware Data Protection  8-byte Page (1K, 2K) or 16-byte Page (4K, 8K) Write Modes  Partial Page Writes are allowed  Self-timed Write Cycle (5ms Max)  High Reliability ̶ Endurance: 1,000,000 Write Cycles ̶ Data Retention: 100 Years  8-lead JEDEC SOIC and 8-lead TSSOP packages

Description

The Atmel® AT24C01C/02C/04C/08C provides 1,024/2,048/4,096/8,192 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 128/256/512/1,024 words of eight bits each. The device is optimized for use in many automotive applications where low-power and low-voltage operation are essential. AT24C01C/02C/04C/08C is available in space-saving 8-lead JEDEC SOIC and 8-lead TSSOP packages and is accessed via a 2-wire serial interface. In addition, the entire family is available in 2.5V (2.5V to 5.5V) versions. AT24C01C, AT24C02C, AT24C04C, AT24C08C 2-wire Automotive Temperature Serial EEPROMs 1K (128 x 8), 2K (256 x 8), 4K (512 x 8), 8K (1,024 x 8) DATASHEET

AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 1. Pin Configurations and Pinouts Table 1-1. Pin Configurations 2. Absolute Maximum Ratings* Pin Name Function A0 Address Input (1K and 2K) A1 Address Input (1K, 2K, and 4K) A2 Address Input (1K, 2K, 4K, and 8K) GND Ground SDA Serial Data SCL Serial Clock Input WP Write Protect VCC Device Power Supply Note: Drawings are not to scale. 8-lead TSSOP (Top View) GND VCC WP SCL SD A GND VCC WP SCL SDA 8-lead SOIC (Top View) Voltage on Any Pin *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

3AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 3. Block Diagram Start Stop Logic VCC GND WP SCL SDA Serial Control Logic EN H.V. Pump/Timing EEPROM Data Recovery Serial MUX X DEC DOUT/ACK Logic COMP LOAD INC Data Word ADDR/Counter Y DEC R/W DOUT DIN LOAD Device Address Comparator

AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 4. Pin Description Serial Clock (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. Serial Data (SDA): The SDA pin is bi-directional for serial data transfer. This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open-collector devices. Device/Page Addresses (A2, A1, A0): The A2, A1, and A0 pins are device address inputs that are hard wired for the AT24C01C/02C/04C/08C. As many as eight 1K/2K devices may be addressed on a single bus system (device addressing is discussed in detail in Section 6. “Device Operation”). The AT24C04C uses the A 2 and A1 inputs for hardwire addressing and a total of four 4K devices may be addressed on a single bus system. The A0 pin is a no connect. The AT24C08C only uses the A2 input for hardwire addressing and a total of two 8K devices may be addressed on a single bus system. The A0 and A1 pins are no connect. Write Protect (WP): AT24C01C/02C/04C/08C has a Write Protect pin that provides hardware data protection. The Write Protect pin allows normal read/write operations when connected to ground (GND). When the Write Protect pin is connected to V CC, the write protection feature is enabled and operates as shown in the following table. Figure 4-1. Write Protect WP Pin Status Part of the Array Protected At VCC Full Array At GND Normal Read/Write Operations

5AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 5. Memory Organization AT24C01C, 1K Serial EEPROM: Internally organized with 16 pages of 8 bytes each, the 1K requires a 7-bit data word address for random word addressing. AT24C02C, 2K Serial EEPROM: Internally organized with 32 pages of 8 bytes each, the 2K requires an 8-bit data word address for random word addressing. AT24C04C, 4K Serial EEPROM: Internally organized with 32 pages of 16 bytes each, the 4K requires a 9-bit data word address for random word addressing. AT24C08C, 8K Serial EEPROM: Internally organized with 64 pages of 16 bytes each, the 8K requires a 10-bit data word address for random word addressing. Table 5-1. Pin Capacitance (1) Note: 1. This parameter is characterized and is not 100% tested. Table 5-2. DC Characteristics Note: 1. V IL min and VIH max are reference only and are not tested. Applicable over recommended operating range from TA = 25C, f = 400KHz, VCC = 2.5V. Symbol Test Condition Max Units Conditions CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V CIN Input Capacitance (A0, A1, A2, SCL) 6 pF VIN = 0V Applicable over recommended operating range from: TA = 40C to +125C, VCC = 2.5V to 5.5V (unless otherwise noted). Symbol Parameter Test Condition Min Typ Max Units VCC1 Supply Voltage 2.5 5.5 V ICC Supply Current VCC = 5.0V Read at 100kHz 0.4 1.0 mA ICC Supply Current VCC = 5.0V Write at 100kHz 2.0 3.0 mA ISB1 Standby Current VCC = 2.5V VIN = VCC or VSS 1.6 4.0 μA ISB2 Standby Current VCC = 5.0V VIN = VCC or VSS 4.0 6.0 μA ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0 μA ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0 μA VIL Input Low Level(1) 0.6 VCC x 0.3 V VIH Input High Level(1) VCC x 0.7 VCC + 0.5 V VOL Output Low Level VCC = 2.5V IOL = 3.0mA 0.4 V

AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 Table 5-3. AC Characteristics Notes: 1. This parameter is characterized and is not 100% tested (T A = 25C). 2. This parameter is characterized only. Applicable over recommended operating range from TA = 40C to 125C, VCC = 2.5V to 5.5V, CL = 1 TTL Gate and 100pF (unless otherwise noted). Symbol Parameter Min Max Units fSCL Clock Frequency, SCL 400 kHz tLOW Clock Pulse Width Low 1200 ns tHIGH Clock Pulse Width High 600 ns tI Noise Suppression Time(1) 50 ns tAA Clock Low to Data Out Valid 100 900 ns tBUF Time the bus must be free before a new transmission can start(2) 1200 ns tHD.STA Start Hold Time 600 ns tSU.STA Start Set-up Time 600 ns tHD.DAT Data In Hold Time 0 ns tSU.DAT Data In Set-up Time 100 ns tR Inputs Rise Time(2) 300 ns tF Inputs Fall Time(2) 300 ns tSU.STO Stop Set-up Time 600 ns tDH Data Out Hold Time 50 ns tWR Write Cycle Time 5 ms Endurance(2) 5.0V, 25C, Page Mode 1,000,000 Write Cycles

AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 7. Device Addressing The 1K/2K/4K/8K EEPROM devices require an 8-bit device address word following a Start condition to enable the device for a read or write operation. The device address word consists of a mandatory '1010' sequence for the first four Most Significant Bits (MSB). This is common to all the Serial EEPROM devices. For the 1K/2K EEPROM, the next three bits are the A2, A1, and A0 device address bits. These three bits must compare to their corresponding hardwired input A2, A1, and A0 pins. The 4K EEPROM only uses the A2 and A1 device address bits with the A0 bit being a memory address bit (P0). The two device address bits must compare to their corresponding hardwired input A2 and A1 pins. The A0 pin is not connected. The 8K EEPROM only uses the A2 device address bit with the next two bits (P1, P0) being for memory page addressing. The A2 bit must compare to its corresponding hardwired input pin. The A1 and A0 pins are not connected. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. After a valid comparison of the device address, the EEPROM will output a zero. If the comparison is invalid, the device will return to a standby state. Figure 7-1. Device Address 1K/2K 1 0 1 0 A2 A1 A0 R/W MSB LSB 4K 1 0 1 0 A2 A1 P0 R/W 8K 1 0 1 0 A2 P1 P0 R/W

13AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 Sequential Read: Sequential Reads are initiated by either a Current Address Read or a Random Address Read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the Sequential Read will continue. To end the command, the microcontroller does not respond with a zero but does generate a Stop condition in the subsequent clock cycle. Figure 9-3. Sequential Read 10. Power Recommendation The device internal POR (Power-On Reset) threshold is just below the minimum operating voltage of the device. Power shall rise monotonically from 0.0Vdc to full V CC in less than 1ms. Hold at full VCC for at least 100μs before the first operation. Power shall drop from full VCC to 0.0Vdc in less than 1ms. Power dropping to a non-zero level and then slowly going to zero is not recommended. Power shall remain off (0.0Vdc) for 0.5s minimum. Please consult Atmel if your power conditions do not meet the above recommendations. SDA Line Device Address R E A D A C K A C K A C K S T O P A C K R W N O A C K Data (n) Data (n + 1) Data (n + 2) Data (n + x)

AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 11. Product Markings DRAWING NO. REV. TITLE 24C01-02-04-08CAM B 11/13/12 24C01-02-04-08CAM, AT24C01C, AT24C02C, AT24C04C, and AT24C08C Automotive Package Marking InformationPackage Mark Contact: DL-CSO-Assy_eng@atmel.com AAAAAAAA###D @ATMLPYWW 8-lead SOIC 8-lead TSSOP AAAAAAA ###D @ ATPYWW Note 2: Package drawings are not to scale Note 1: designates pin 1 AT24C01C, AT24C02C, AT24C04C and AT24C08C: Package Marking Information Catalog Number Truncation AT24C01C Truncation Code ###: 01C AT24C02C Truncation Code ###: 02C AT24C04C Truncation Code ###: 04C AT24C08C Truncation Code ###: 08C Date Codes Voltages Y = Year WW = Work Week of Assembly % = Minimum Voltage 2: 2012 6: 2016 02: Week 2 D: 2.5V min 3: 2013 7: 2017 04: Week 4 5: 2015 9: 2019 52: Week 52 Country of Assembly Lot Number Grade/Lead Finish Material @ = Country of Assembly AAA...A = Atmel Wafer Lot Number P: Automotive/NiPdAu Atmel Truncation AT: Atmel ATM: Atmel ATML: Atmel

15AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 12. Ordering Code Information Note: 1. T = Tape and Reel  SOIC 4,000 per reel.  TSSOP 5,000 per reel. Atmel Ordering Code Lead Finish Package Voltage Operation Range AT24C01C-SSPD-T(1) NiPdAu (Lead-free/Halogen-free) 8S1 2.5V to 5.5V Automotive Temperature (40C to 125C)AT24C01C-XPD-T(1) 8X AT24C02C-SSPD-T(1) NiPdAu (Lead-free/Halogen-free) 8S1 2.5V to 5.5V Automotive Temperature (40C to 125C)AT24C02C-XPD-T(1) 8X AT24C04C-SSPD-T(1) NiPdAu (Lead-free/Halogen-free) 8S1 2.5V to 5.5V Automotive Temperature (40C to 125C)AT24C04C-XPD-T(1) 8X AT24C08C-SSPD-T(1) NiPdAu (Lead-free/Halogen-free) 8S1 2.5V to 5.5V Automotive Temperature (40C to 125C)AT24C08C-XPD-T(1) 8X Package Type 8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.4mm body, Plastic Thin Shrink Small Outline Package (TSSOP)

AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 13. Packaging Information 13.1 8S1 — 8-lead JEDEC SOIC DRAWING NO. REV. TITLE GPC COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A1 0.10 – 0.25 A 1.35 – 1.75 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e 1.27 BSC L 0.40 – 1.27 ØØ 0° – 8° Ø E N TOP VIEW C END VIEW A b L e D SIDE VIEW Package Drawing Contact: packagedrawings@atmel.com 8S1 G 6/22/11 Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) SWB

17AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 13.2 8X — 8-lead TSSOP DRAWING NO. REV. TITLE GPC COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 D 2.90 3.00 3.10 2, 5 E 6.40 BSC E1 4.30 4.40 4.50 3, 5 b 0.19 0.25 0.30 4 e 0.65 BSC L 0.45 0.60 0.75 L1 1.00 REF C 0.09 - 0.20 Side View End ViewTop View A L D N b Pin 1 indicator this corner E e Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. Package Drawing Contact: packagedrawings@atmel.com 8X E 2/27/14 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) TNR C

AT24C01C/02C/04C/08C Automotive [DATASHEET] Atmel-8819B-SEEPROM-AT24C01C-02C-04C-08C-Auto-Datasheet_072014 14. Revision History Doc. Rev. Date Comments 8819B 07/2014 Increase tAA maximum from 90ns to 900ns. Update the 8X package drawing, footers, and the disclaimer page. 8819A 12/2012 Initial document release.

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