ASDL-4360 AVAGO | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • 885nm Wavelength
  • Industry Standard Footprint: PLCC-2 SMT Package
  • High Speed
  • High Power
  • Low Forward Voltage
  • High Pulse Rate
  • Lead Free and ROHS Compliant
  • Tape & Reel for automation placement Part Number Packaging Shipping Option ASDL-4360-C22 Tape & Reel 2000pcs

All Dimensions are in Millimeters Tape and Reel Dimension All Dimensions are in Millimeters

Absolute Maximum Ratings at 25 °C Parameter Symbol Min. Max Unit Reference Peak Forward Current IFPK 500 mA Tp=500ns Tw = 100ns Duty Cycle = 20% Continuous Forward Current IFDC 100 mA Power Dissipation PDISS 200 mW Reverse Voltage Vr 11 V Ir=100uA Operating Temperature TO -40 85 °C Storage Temperature TS -40 100 °C LED Junction Temperature TJ 110 °C Lead Soldering Temperature 260 for 5 sec °C Electrical Characteristics at 25 °C Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage VF 1.4 1.6 1.7 2.0 V V IF=20mA IF=100mA Reverse Voltage Vr 11 V IR=10uA Thermal Resistance 250 °C/W Diode Capacitance CO 90 pF Vr=0V, f=1MHz Optical Characteristics at 25 °C Parameter Symbol Min. Typ. Max. Unit Condition Radiant On-Axis Intensity IE 1.0 5.1 2.0 10.0 mW/Sr IF = 20mA IF =100mA Viewing Angle 2θ1/2 120 deg Peak wavelength λPK 885 nm IF = 20mA Spectral Width Δλ 55 nm IF = 20mA Optical Rise Time tr 20 ns IFPK=500mA Duty Factor=20% Pulse Width=100ns Optical Fall Time tf 17 ns IFPK=500mA Duty Factor=20% Pulse Width=100ns

(SECONDS) 120 150 180 200 230 255 T - TEMPERATURE (°C) R3 R4 217 MAX 260C 60 sec to 90 sec Above 217 C HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN Process Zone Symbol DT Maximum DT/Dtime or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 P3, R4 200°C to 260°C 260°C to 200°C 3°C/s -6°C/s Cool Down P4, R5 200°C to 25°C -6°C/s Time maintained above liquidus point , 217°C > 217°C 60s to 90s Peak Temperature 260°C - Time within 5°C of actual Peak Temperature - 20s to 40s Time 25°C to Peak Temperature 25°C to 260°C 8mins The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice. Recommended Reflow Profile

All Dimensions are in Millimeters For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0274EN - April 27, 2007