AS7263 AMSOSRAM | Alldatasheet
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Datasheet, Public Page 1 [v4-00] 2022-Nov-30 Document Feedback AS7263 6-Channel NIR Spectral_ID Device with Electronic Shutter and Smart Interface The AS7263 is a digital 6-channel spectrometer for spectral identification in the near IR (NIR) light wavelengths. AS7263 consists of 6 independent optical filters whose spectral response is defined in the NIR wavelengths from approximately 600nm to 870nm with full-width half-max (FWHM) of 20nm. An integrated LED driver with programmable current is provided for electronic shutter applications. The AS7263 integrates Gaussian filters into standard CMOS silicon via Nano-optic deposited interference filter technology and is packaged an LGA package that provides a built in aperture to control the ligh t entering the sensor array. Control and Spectral data access is implemented through either the I²C register set, or with a high level AT Spectral Command set via a serial UART. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of AS7263, 6-Channel NIR Spectral_ID Device with Electronic Shutter and Smart Interface are listed below: Figure 1: Added Value of Using AS7263 Benefits Features
- Compact 6-channel spectrometry solution • 6 near-IR channels: 610nm, 680nm, 730nm, 760nm, 810nm and 860nm, each with 20nm FWHM
- Simple text-based command interface via UART o r direct register read and write with interrupt on sensor ready option on I²C
- UART or I²C slave digital Interface
- Lifetime-calibrated sensing with no drift over ti me or temperature • NIR filter set realized by silicon interference filters
- No additional signal conditioning required • 16-bit ADC with digital access
- Electronic shutter control/synchronization • Programmable LED drivers
- Low voltage operation • 2.7V to 3.6V with I²C interface
- Small, robust package, with built-in aperture • 20-pin LGA package 4.5mm x 4.7mm x 2.5mm, 40°C to 85°C temperature range General Description
Page 2 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − General Description
Applications
The AS7263 applications include:
- Product authentication
- Bank note/document validation
- Chemical analysis
- Food/beverage safety Block Diagram The functional blocks of this device are shown below: Figure 2: AS7263 NIR Spectral_ID System 100nF RX / SCL_S GND LED_DRV SCK CSN_EE MISO MOSI VDD1 VDD2 AS7263 uP 10uF TX / SDA_S LED_IND Flash Memory 6-channel NIR Sensor Light Source Light in Reflective Surface INT
Page 4 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Pin Assignment 15 LED_DRV LED Driver Output for Driving LED, Current Sink. 16 GND Ground. 17 VDD1 Voltage Supply. 18 LED_IND LED Driver Output for Indicator LED, Current Sink. 19 NF Not Functional. Do not connect. 20 NF Not Functional. Do not connect. Pin Number Pin Name Description
Datasheet, Public Page 5 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The device is not designed for high energy UV (ultraviolet) environments, including upward looking outdoor applications, which could affect long term optical performance. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments Electrical Parameters VDD1_MAX Supply voltage VDD1 -0.3 5 V Pin VDD1 to GND VDD2_MAX Supply voltage VDD2 -0.3 5 V Pin VDD2 to GND VDD_IO Input/Output pin voltage -0.3 VDD+0.3 V Input/Output Pin to GND ISCR Input current (latch-up immunity) ± 100 mA JESD78D Electrostatic Discharge ESDHBM Electrostatic discharge HBM ± 1000 V JS-001-2014 ESDCDM Electrostatic discharge CDM ± 500 V JSD22-C101F Temperature Ranges and Storage Conditions TSTRG Storage temperature range -40 85 °C TBODY Package body temperature 260 °C IPC/JEDEC J-STD-020 The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” RH NC Relative humidity (non-condensing) 58 5% MSL Moisture sensitivity level 3 Maximum floor life time of 168 hours Absolute Maximum Ratings
Page 6 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Electrical Characteristics All limits are guaranteed with VDD = VDD1 = VDD2 = 3.3V, TAMB=25°C. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Figure 6: Symbol Parameter Conditions Min Typ Max Unit General Operating Conditions VDD1 /VDD2 Voltage operating supply UART Interface 2.97 3.3 3.6 V VDD1 /VDD2 Voltage operating supply I2C Interface 2.7 3.3 3.6 V TAMB Operating temperature -40 25 85 °C IVDD Operating current 5 mA ISTANDBY (1) Standby current 12 μA Internal RC Oscillator FOSC Internal RC oscillator frequency 15.7 16 16.3 MHz tJITTER (2) Internal clock jitter @25°C 1.2 ns Temperature Sensor DTEMP Absolute accuracy of the temperature measurement -8.5 8.5 °C Indicator LED I IND LED current 1 4 8 mA IACC Accuracy of current -30 30 % VLED Voltage range of connected LED Vds of current sink 0.3 VDD V LED_DRV ILED1 LED current 12.5, 25, 50 or 100 12.5 100 mA IACC Accuracy of current -10 10 % VLED Voltage range of connected LED Vds of current sink 0.3 VDD V
Electrical Characteristics
Datasheet, Public Page 7 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Electrical Characteristics Note(s): 1. 15μA over temperature. 2. Guaranteed, not tested in production. Digital Inputs and Outputs IIH, IIL Logic input current Vin=0V or VDD -1 1 μA IILRESN Logic input current (RESN pin) Vin=0V -1 -0.2 mA VIH CMOS logic high input 0.7* VDD VDD V VIL CMOS logic low input 0 0.3* VDD V VOH CMOS logic high output I=1mA VDD - 0.4 V VOL CMOS logic low output I=1mA 0.4 V tRISE (2) Current rise time C(Pad)=30pF 5 ns tFALL (2) Current fall time C(Pad)=30pF 5 ns Symbol Parameter Conditions Min Typ Max Unit
Page 8 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Timing Characteristics Figure 7: AS7263 I²C Slave Timing Characteristics Symbol Parameter Condition Min Typ Max Unit I²C Interface fSCLK SCL clock frequency 400 kHz tBUF Bus free time between a STOP and START 1.3 μs t HS:STA Hold time (Repeated) START 0.6 μs tLOW LOW period of SCL clock 1.3 μs tHIGH HIGH period of SCL clock 0.6 μs tSU:STA Setup time for a repeated START 0.6 μs tHS:DAT Data hold time 0 0.9 μs tSU:DAT Data setup time 100 ns tR Rise time of both SDA and SCL 300 ns tF Fall time of both SDA and SCL 300 ns tSU:STO Setup time for STOP condition 0.6 μs CB Capacitive load for Each bus line CB — total capacitance of one bus line in pF 400 pF CI/O I/O capacitance (SDA, SCL) 10 pF Timing Characteristics
Datasheet, Public Page 11 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Timing Characteristics Optical Characteristics Figure 12: Optical Characteristics of AS7263 (Pass Band) (1) Note(s): 1. Calibration & measurements are made using diffused light. 2. Each channel is tested with GAIN = 16x, Integration Time (INT_T) = 16 6ms and VDD = VDD1 = VDD2 = 3.3V, T AMB=25°C. 3. The accuracy of the channel counts/μW/cm 2 is ±12%. 4. The light source is an incandescent light with an irradi ance of ~1500μW/cm 2 (300-1000nm). The energy at each channel (R, S, T, U, V, W) is calculated with a ±33nm bandwidth around the center wavelengths (610, 680, 730, 760, 810, 860nm). Symbol Parameter Test Conditions Channel (nm) Min Typ Max Unit RC h a n n e l R Incandescent (2),(4) 610 35 (3),(4) counts/ (μW/cm2) SC h a n n e l S Incandescent (2),(4) 680 35 (3),(4) counts/ (μW/cm2) TC h a n n e l T Incandescent (2),(4) 730 35 (3),(4) counts/ (μW/cm2) UC h a n n e l U Incandescent (2),(4) 760 35 (3),(4) counts/ (μW/cm2) VC h a n n e l V Incandescent (2),(4) 810 35 (3),(4) counts/ (μW/cm2) WC h a n n e l W Incandescent (2),(4) 860 35 (3),(4) counts/ (μW/cm2) FWHM Full Width Half Max 20 20 nm Wacc Wavelength Accuracy ±5 nm dark Dark Channel Counts GAIN=64, T AMB=25°C 5 counts f Angle of Incidence On the sensors ±20.0 deg
Page 12 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Typical Operating Characteristics Figure 13: Spectral Responsivity Typical Operating Characteristics 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 550 600 650 700 750 800 850 900 950 Normalized Responsivity λ - Wavelength (nm) AS7263 R S T U V W
Datasheet, Public Page 13 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Detailed Description Figure 14: Internal Block Diagram 6-Channel NIR Spectral_ID Detector The AS7263 6-channel Spectral_ID is a next-generation digital spectral sensor device. Each channel has a Gaussian filter characteristic with a full width half maximum (FWHM) bandwidth of 20nm. The channels are spaced roughly at 50nm intervals in the NIR spec trum: R, S, T, U, V, W. The sensor contains analog-to-digital converters (16-bit resolution ADC), which integrate the current from each channel’s photodiode. Upon completion of the conversion cycle, the integrated result is transferred to the corresponding data registers. The transfers are double-buffered to ensure that the integrity of the data is maintained. Interference filters enable high temperature stability and eliminate lifetime drift. Filter accuracy will be affected by the angle of incidence, and require 0° angle of incidence ±20.0° for specified accuracy. Angles of li ght beyond this will shift the spectral response of the filters. The LGA package aperture assists in the control of the ligh t input, helping to maintain the proper angle of incidence at the sensors. Detailed Description RC Osc Spectral_ID Engine VDD1 VDD2 GND 16MHz MISO SCK MOSI CSN_SD SYNC / RESN SPI Master TX / SDA_S RX / SCL_S UART / I2C LED_DRV RST Multi Spectral Sensor U LED_IND V W I2C_ENB INT
Page 14 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Detailed Description Data Conversion Description AS7263 spectral conversion is implemented via two photodiode banks per device. Bank 1 consists of data from the S, T, U, V photodiodes. Bank 2 cons ists of data from the R, T, U, W photodiodes. Spectral conver sion requires the integration time (IT in ms) set to complete. If both photodiode banks are required to complete the conversion, the 2nd bank requires an additional IT ms. Minimum IT for a single bank conversion is 2.8 ms. If data is required from all 6 photodiodes then the device must perform 2 full conversi ons (2 x Integration Time). The spectral conversion process is controlled with BANK Mode settings as follows: BANK Mode 0: Data will be available in registers S, T, U & V (R and W registers will be zero). BANK Mode 1: Data will be available in registers R, T, U & W (V and W registers will be zero). BANK Mode 2: Data will be available in registers R, S, T, U, V & W When the bank setting is Mode 0, Mode 1, or Mode 2, the spectral data conversion process operates continuously, with new data available after each IT ms period. In the continuous modes, care should be taken to assure prompt interrupt servicing so that integration values from both banks are all derived from the same spectral conversion cycle. BANK Mode 3: Data will be available in registers R, S, T, U, V & W in One-Shot mode. When the bank setting is Mode 3, the device operates in One-Shot mode. Spectral conversion occurs only when bit 0 of the control register (1SHOT) is set to 1. The 1SHOT bit in the control register is subsequently cleared by hardware at the same time the DATA_RDY bit is set to 1 indicating the availability of spectral conversion result data. The One-Shot mode is intended for use when it is critical to ensure that spectral conversion results are obtained contemporaneously.
Page 16 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Detailed Description Temperature Sensor The Temperature Sensor is constantly measuring the on-chip temperature and enables temperature compensation procedures. Reset Pulling down the RESN pin for longer than 100ms resets the AS7263. Figure 17: Reset Circuit Indicator LED The LED, connected to pin LED_IND, can be used to indicate programming progress of the device. While programming the AS7263 via the external SD card the indicator LED starts flashing (500ms pulses). When programming is completed the indicator LED is switched off. The LED (LED0) can be turned ON/OFF via AT commands or via I²C register control. The LED sink current is programmable from 1mA, 2mA, 4mA and 8mA. Electronic Shutter with LED_DRV Driver Control There are two LED driver outputs that can be used to control up to 2 LEDs. This will allow different wavelength light sources to be used in the same system. The LED output sink currents are programmable and can drive exte rnal LED sources: LED_IND from 1mA, 2mA, 4mA and 8mA and LED_DRV from 12.5mA, 25mA, 50mA and 100mA. The sources can be turned off and on via I²C registers control or AT commands and provides the device with an electronic shutter. Reset AS7263 CLE RESN Push > 100ms
Datasheet, Public Page 17 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Detailed Description Interrupt Operation If BANK is set to Mode 0 or Mode 1 then the data is ready after the 1st integration time. If BANK is set to Mode 2 or Mode 3 then the data is ready after two integration times. If the interrupt is enabled (INT = 1) then when the data is ready, the INT line is pulled low and DATA_RDY is set to 1. The INT line is released (returns high) when the control register is read. DATA_RDY is cleared to 0 when any of the sensor registers R, S, T, U, V, W are read. Since each sensor value is 2 bytes, after the 1 st byte is read the 2 nd byte is shadow-protected in case an integration cycle completes just after the 1 st byte is read. In continuous spectral conversion mode (BANK setting of Mode 0, Mode 1, or Mode 2), the sensors continue to gather informa- tion at the rate of the integration time, hence if the sensor reg- isters are not read when the interrupt line goes low, it will stay low and the next cycle’s sensor data will be available in the registers at the end of the next integration cycle. When the con- trol register BANK bits are written with a value of Mode 3, One-Shot Spectral Conversion mode is entered. When a single set of contemporaneous sensor readings is desired, writing BANK Mode 3 to the control register immediately triggers ex- actly two spectral data conversion cycles. At the end of these two conversion cycles, the DATA_RDY bit is set as for the other BANK modes. To perform a new One-Shot sequence, the control register BANK bits should be written with a value of Mode 3 again. This process may continue until the user writes a different value into the BANK bits. I²C Slave Interface If selected by the I2C_ENB pin setting, interface and control can be accomplished through an I²C compatible slave interface to a set of registers that provide access to device control functions and output data. These registers on the AS7263 are, in reality, implemented as virtual registers in software. The actual I²C slave hardware registers number only three and are described in the table below. The steps necessary to access the virtual registers defined in the following are explained in pseudocode for exter- nal I²C master writes and reads below. I²C Feature List
- Fast mode (400kHz) and stan dard mode (1 00kHz) support.
- 7+1-bit addressing mode.
- Write format: Byte.
- Read format: Byte.
- SDA input delay and SCL spik e filtering by integrated RC-components.
Page 18 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Detailed Description Figure 18: I²C Slave Device Address and Physical Registers I²C Virtual Register Write Access Figure 19 shows the pseudocode ne cessary to write virtual registers on the AS7263. Note th at, because the actual registers of interest are realized as virtual registers, a means of indicating whether there is a pending read or write operation of a given virtual register is needed. To convey this information, the most significant bit of the virtual regist er address is used as a marker. If it is 1, then a write is pending, otherwise the slave is expecting a virtual read operation. The pseudocode illustrates the proper technique for polling of the I²C slave status register to ensure the slave is ready for each transaction. Entity Description Note Device Slave Address 8-bit Slave Address Byte = 1001 001x x= 1 for Master Read (byte = 93 hex) x= 0 for Master Write (byte = 92 hex) STATUS Register I²C slave interface STATUS register. Read-only. Register Address = 0x00 Bit 1: TX_VALID 0 -> New data may be written to WRITE register 1 -> WRITE register occupied. Do NOT write. Bit 0: RX_VALID 0 -> No data is ready to be read in READ register. 1 -> Data byte available in READ register. WRITE Register I²C slave interface WRITE register. Write-only. Register Address = 0x01
8 Bits of data written by the I²C Master intended
for receipt by the I²C slave. Used for both virtual register addresses and write data. READ Register I²C slave interface READ register. Read-only. Register Address = 0x02 8 Bits of data to be read by the I²C Master.
Datasheet, Public Page 19 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Detailed Description Figure 19: I²C Virtual Register Byte Write Pseudocode Poll I²C slave STATUS register; If TX_VALID bit is 0, a write can be performed on the interface; Send a virtual register address and set the MSB of the register address to 1 to indicate the pending write; Poll I²C slave STATUS register; If TX_VALID bit is 0, the vi rtual register address for the write has been received and the data may now be written; Write the data. Sample Code: #define I2C_AS72XX_SLAVE_STATUS_REG0x00 #define I2C_AS72XX_SLAVE_WRITE_REG0x01 #define I2C_AS72XX_SLAVE_READ_REG0x02 #define I2C_AS72XX_SLAVE_TX_VALID0x02 #define I2C_AS72XX_SLAVE_RX_VALID0x01 void i2cm_AS72xx_write(uint 8_t virtualReg, uint8_t d) volatile uint8_tstatus; while (1) // Read slave I²C status to see if the write buffer is ready. status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG); if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0) // No inbound TX pending at slave. Okay to write now. break ; // Send the virtual register address (setti ng bit 7 to indicate a pending write). i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, (virtualReg | 0x80)) ; while (1) // Read the slave I2C status to see if the write buffer is ready. status = i2cm_read(I2C_AS72XX_SLAVE_STATUS_REG) ; if ((status & I2C_AS72XX_SLAVE_TX_VALID) == 0) // No inbound TX pending at slave. Okay to write data now. break; // Send the data to co mplete the operation. i2cm_write(I2C_AS72XX_SLAVE_WRITE_REG, d);
Datasheet, Public Page 21 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Detailed Description I²C Virtual Register Set The figure below provides a summ ary of the AS7263 I²C register set. Figures after that provide additional details. All register data is hex or, where noted, 32 -bit floating point, and all multi-byte entities are Big Endian (most significant byte is situated at the lowest register address). Figure 21: I²C Register Set Overview Version Registers 0x00: 0x01 HW_Version Hardware Version 0x02: 0x03 FW_Version Firmware Version Control Registers 0x04 Control_Setup RST INT GAIN Bank DATA_ RDY RSVD 0x05 INT_T Integration Time 0x06 Device_Temp Device Temperature 0x07 LED_Control RSVD ICL_DRV LED_ DRV ICL_IND LED_IND Sensor Raw Data Registers 0x08 R_High Channel R High Data Byte 0x09 R_Low Channel R Low Data Byte 0x0A S_High Channel S High Data Byte 0x0B S_Low Channel S Low Data Byte 0x0C T_High Channel T High Data Byte 0x0D T_Low Channel T Low Data Byte 0x0E U_High Channel U High Data Byte 0x0F U_Low Channel U Low Data Byte 0x10 V_High Channel V High Data Byte 0x11 V_Low Channel V Low Data Byte 0x12 W_High Channel W High Data Byte 0x13 W_Low Channel W Low Data Byte
Page 22 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Detailed Description Detailed Register Description Figure 22: HW Version Registers Sensor Calibrated Data Registers 0x14: 0x17 R_Cal Channel R Calibrated Data (float) 0x18: 0x1B S_Cal Channel S Calibrated Data (float) 0x1C: 0x1F T_Cal Channel T Calibrated Data (float) 0x20: 0x23 U_Cal Channel U Calibrated Data (float) 0x24: 0x27 V_Cal Channel V Calibrated Data (float) 0x28: 0x2B W_Cal Channel W Calibrated Data (float) Addr: 0x00 HW_Version Bit Bit Name Default Access Bit Description 7:0 Device Type 0100000 R Device type number. Addr: 0x01 HW_Version Bit Bit Name Default Access Bit Description 7:0 HW Version 00111111 R Hardware version.
Datasheet, Public Page 23 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Detailed Description Figure 23: FW Version Registers Figure 24: Control Setup Register Addr: 0x02 FW_Version Bit Bit Name Default Access Bit Description 7:6 Minor Version R Minor Version [1:0]. 5:0 Sub Version R Sub Version. Addr: 0x03 FW_Version Bit Bit Name Default Access Bit Description 7:4 Major Version R Major Version. 3:0 Minor Version R Minor Version [5:2]. Addr: 0x04/0x84 Control_Setup Bit Bit Name Default Access Bit Description 7R S T 0 R / W Soft Reset, Set to 1 for soft reset, goes to 0 automatically after the reset. 6I N T 0 R / W Enable interrupt pin output (INT), 1: Enable, 0: Disable. 5:4 GAIN 0 R/W Sensor Channel Gain Setting (all channels) ‘b11=64x 3:2 BANK 10 R/W Data Conversion Type (continuous) ‘b00=Mode 0; ‘b01=Mode 1; ‘b10=Mode 2; ‘b11=Mode 3 One-Shot
1 DATA_RDY 0 R/W
1: Data Ready to Read, sets INT active if interrupt is enabled. Can be polled if not using INT. 0 RSVD 0 R Reserved; Unused.
Datasheet, Public Page 25 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Detailed Description Figure 28: Sensor Raw Data Registers Addr: 0x08 R_High Bit Bit Name Default Access Bit Description 7:0 R_High R Channel R High Data Byte. Addr: 0x09 R_Low Bit Bit Name Default Access Bit Description 7:0 R_Low R Channel R Low Data Byte. Addr: 0x0A S_High Bit Bit Name Default Access Bit Description 7:0 S_High R Channel S High Data Byte. Addr: 0x0B S_Low Bit Bit Name Default Access Bit Description 7:0 S_Low R Channel S Low Data Byte. Addr: 0x0C T_High Bit Bit Name Default Access Bit Description 7:0 T_High R Channel T High Data Byte. Addr: 0x0D T_Low Bit Bit Name Default Access Bit Description 7:0 T_Low R Channel T Low Data Byte. Addr: 0x0E U_High Bit Bit Name Default Access Bit Description 7:0 U_High R Channel U High Data Byte. Addr: 0x0F U_Low Bit Bit Name Default Access Bit Description 7:0 U_Low R Channel U Low Data Byte.
Page 26 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Detailed Description Figure 29: Sensor Calibrated Data Registers Addr: 0x10 V_High Bit Bit Name Default Access Bit Description 7:0 V_High R Channel V High Data Byte. Addr: 0x11 V_Low Bit Bit Name Default Access Bit Description 7:0 V_Low R Channel V Low Data Byte. Addr: 0x12 W_High Bit Bit Name Default Access Bit Description 7:0 W_High R Channel W High Data Byte. Addr: 0x13 W_Low Bit Bit Name Default Access Bit Description 7:0 W_Low R Channel W Low Data Byte. Addr: 0x14:0x17 R_Cal Bit Bit Name Default Access Bit Description 31:0 R_Cal R Channel R Calibrated Data (float). Addr: 0x18:0x1B S_Cal Bit Bit Name Default Access Bit Description 31:0 S_Cal R Channel S Calibrated Data (float). Addr: 0x1C:0x1F T_Cal Bit Bit Name Default Access Bit Description 31:0 T_Cal R Channel T Calibrated Data (float). Addr: 0x20:0x23 U_Cal Bit Bit Name Default Access Bit Description 31:0 U_Cal R Channel U Calibrated Data (float).
Datasheet, Public Page 27 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Detailed Description 4-Byte Floating-Point (FP) Registers Several 4-byte registers (hex) are shown in the tables. Here is an example of how the registers are used to represent floating point data (based on the IEEE 754 standard): Figure 30: Example of the IEEE 754 Standard The floating point (FP) value assumed by 32 bit binary32 data with a biased exponent e (the 8 bit unsigned integer) and a 23 bit fraction is (for the above example). Addr: 0x24:0x27 V_Cal Bit Bit Name Default Access Bit Description 31:0 V_Cal R Channel V Calibrated Data (float). Addr: 0x28:0x2B W_Cal Bit Bit Name Default Access Bit Description 31:0 W_Cal R Channel W Calibrated Data (float). FPvalue 1 –() sign 1b 23 i–() 2 i–() i1= x2 e 127–()= FPvalue 1 –() 0 1b 23 i–() 2 i–() i1= 124 127–()=
Page 28 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Detailed Description UART Interface If selected by the I2C_ENB pin setting, the UART module imple- ments the TX and RX signals as defined in the RS-232 / V.24 standard communication protocol. It has on both, receive and transmit path, a 16 entry deep FIFO. It can generate interrupts as required. UART Feature List 1
- Full Duplex Operation (Indep endent Serial Receive and Transmit Registers) with FIFO buffer of 8 byte for each.
- At a clock rate of 16MHz it supports communication at 115200Baud.
- Supports Serial Frames with 8 Data Bits, 1 Parity Bit and 1 Stop Bit.
- High Resolution Baud Rate Generator. Theory of Operation Transmission If data is available in the transmit FIFO, it will be moved into the output shift register and the data will be transmitted at the configured Baud Rate, starting with a Start Bit (logic zero) and followed by a Stop Bit (logic one). Reception At any time, with the receiver be ing idle, if a falling edge of a start bit is detected on the input, a byte will be received and stored in the receive FIFO. The following Stop Bit will be checked to be logic one.1. With UART operation, min VDD of 2.97V is required as shown in Electrical Characteristics Figures.
Page 30 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Detailed Description In the Figure below, numeric values may be specified with no leading prefix, in which case they will be interpreted as decimals, or with a leading “0x” to indicate that they are hexadecimal numbers, or with a leading “‘b” to indicate that they are binary numbers. The commands are loosely grouped into functional areas. Texts appearing between angle brackets (‘<‘ and ‘>‘) are commands or response arguments. A carriage return character, a linefeed character, or both may terminate commands and responses. Note that any command that encounters an error will generate the “ERROR” response shown, for example, in the NOP command at the top of the first table, but has been omitted elsewhere in the interest of readability and clarity. Figure 33: AT Commands Command Response Description / Parameters Spectral Data per Channel ATDATA <R_value>, <S_value>, <T_value>, <U_value>, <V_value>, <W_value> OK Read R, S, T, U, V & W data. Returns comma-separated 16-bit integers. ATCDATA <Cal_R_value>, <Cal_S_value>, <Cal_T_value>, <Cal_U_value>, <Cal_V_value>, <Cal_W_value> OK Read calibrated R, S, T, U, V & W data. Returns comma-separated 32-bit floating point values. Sensor Configuration ATINTTIME=<value>O K Set sensor integration time. Values should be in the range [1... 255], with integration time = <value> * 2.8ms. ATINT TIME < value> OK Read sensor integration time, with integration time = <value> * 2.8ms. ATGAIN=<value> OK Set sensor gain: 0=1X, 1=3.7x, 2=16x, 3=64x. ATGAIN < value>OK Read sensor gain setting, returning 0, 1, 2, or 3 as defined immediately above. AT TEMP < value>OK Read temperature of chip in degree Celsius.
Datasheet, Public Page 31 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Detailed Description AT TCSMD=<value> OK Set Sensor Mode 0 = BANK Mode 0; 1 = BANK Mode 1; 2 = BANK Mode 2; 3 = BANK Mode 3 One-Shot; 4 = Sensors OFF In One-Shot mode, each ATTCSMD=3 command triggers a One-Shot reading. AT TCSMD < value> OK Read Sensor Mode, see above. ATBURST=<value> OK <value>= # of samples (ATBURST=1 means run until ATBURST=0 is received (a special case for continuous output). LED Driver Controls ATLED0=<value> OK Sets LED_IND: 100=ON, 0=OFF ATLED0 <100|0>OK Reads LED_IND setting: 100=ON, 0=OFF ATLED1=<value> OK Sets LED_DRV: 100=ON, 0=OFF ATLED1 <100|0>OK Reads LED_DRV setting: 100=ON, 0=OFF ATLEDC=<value> OK Sets LED_IND and LED_DRV current LED_IND: bits 3:0; LED_DRV: 7:4 bits LED_IND: ‘b00=1mA; ‘b01=2mA; ‘b10=4mA; ‘b11=8ma LED_DRV: ‘b00=12.5mA; ‘b01=25mA; ‘b10=50mA; ‘b11=100mA ATLEDC <value>OK Reads LED_IND and LED_DRV current settings as shown above. NOP , Version Access, System Reset AT OK → Success ERROR → Failure NOP ATRST None Software Reset – no response. AT VERSW <SWversion#>→OK ERROR → Failure Returns the system software version number. AT VERHW <HWversion#>→ OK ERROR → Failure Returns the system hardware revision and product ID, with bits 7:4 containing the part ID, and bits 3:0 yielding the chip revision value. Firmware Update ATFWU=<value>O K <value>= 16-bit checksum. Initial the firmware update process. Bytes that follow is always 56k bytes. ATFW=<value>O K Download new firmware Up to 7 Bytes represented as hex chars with no leading or trailing 0x. Repeat command till all 56k bytes of firmware are downloaded. ATFWS OK Causes the active image to switch between the two possible current images and then resets the IC. Command Response Description / Parameters
Page 32 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Application Information Figure 34: AS7263 Typical Application Circuit
Application Information
LED_DRV LED_IND RX/SCL_S TX/SDA_S INT CSN_SD CSN_EE MISO MOSI SCK I2C_ENB NC NC NC NC NC Fla sh Memory 1/ C S DO DI CL K VCCGND/HOLD /WP 3V3 3V3 3V3 Vl ed RST RX TX INT 100nF 10uF 10K 1uF DNP
Datasheet, Public Page 33 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Package Drawings & Markings Figure 35: Package Drawing LGA Note(s): 1. All dimensions are in mill imeters. Angles in degrees. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. This package contains no lead (Pb). 4. XXXXX = tracecode. 5. This drawing is subject to change without notice. Package Drawings & Markings RoHS Green
Page 34 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − PCB Pad Layout Suggested PCB pad layout guidelines for the LGA device are shown. Figure 36: Recommended PCB Pad Layout PCB Pad Layout 4.40 0.30 0.65 1.10 4.60 Unit: mm
Datasheet, Public Page 35 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Mechanical Data Figure 37: Tape & Reel Information Note(s): 1. Each reel contains 2000 parts. 2. Measured from centreline of spro cket hole to centreline of pocket. 3. Cumulative tolerance of 10 sprocket holes is ±0.20. 4. Other material available. 5. All dimensions in millimeters unless otherwise stated. Mechanical Data
Datasheet, Public Page 37 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Storage & Soldering Information Manufacturing Process Considerations The AS7263 package is compatible with standard reflow no-clean and cleaning processes including aqueous, solvent or ultrasonic techniques. However, as an open-aperture device, precautions must be taken to avoid particulate or solvent contamination as a result of any manufacturing processes, including pick and place, reflow , cleaning, integration assembly and/or testing. Temporary covering of the aperture is allowed. To avoid degradation of accuracy or performance in the end product, care should be taken that any temporary covering and associated sealants/debris are th oroughly removed prior to any optical testing or final packaging. Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previous ly absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:
- Shelf Life: 12 months
- Ambient Temperature: <40°C
- Relative Humidity: <90% Rebaking of the devices will be required if the devices exceed the 12 months shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region.
Page 38 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Storage & Soldering Information Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions:
- Floor Life: 168 hours
- Ambient Temperature: <30°C
- Relative Humidity: <60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
Datasheet, Public Page 39 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Ordering & Contact Information Figure 40: Ordering Information (1),(2) Note(s): 1. Required companion serial flash memory (must be ams OSRA M verified) is ordered from the flash memory supplier (e.g. AT25SF041-SSHD-B from Adesto Technologies) 2. AS7263 flash memory software is available from ams OSRAM. Online product information is available at www.ams.com/AS7263 Buy our products or get free samples online at: www.ams.com/Products Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/Contact Headquarters ams-OSRAM AG Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Package Marking Description Delivery Form Delivery Quantity AS7263-BLGT 20-pin LGA AS7263 6-Channel NIR Spectral_ID Device with Electronic Shutter & Smart Interface 13-inch Tape & Reel 2000 pcs/reel AS7263-BLGM 7-inch Tape & Reel 500pcs/reel Ordering & Contact Information
Page 40 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams-OSRAM AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories plus additional 4 substance categories (per amendment EU 2015/863), including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br/Cl): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) and do not contain Chlorine (Cl not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams-OSRAM AG knowledge and belief as of the date that it is provided. ams-OSRAM AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams-OSRAM AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams-OSRAM AG and ams-OSRAM AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
Datasheet, Public Page 41 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Copyrights & Disclaimer Copyright ams-OSRAM AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams-OSRAM AG are covered by the warranty and patent indemnification provis ions appearing in its General Terms of Trade. ams-OSRAM AG makes no warranty, express, statutory, implied, or by desc ription regarding the information set forth herein. ams-OSRAM AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams-OSRAM AG for current information. This product is intended for use in commercial applications. Applications re quiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams-OSRAM AG for each application. This product is provided by ams-OSRAM AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams-OSRAM AG shall not be liable to recipient or any third party for any damages, including but no t limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams-OSRAM AG rendering of technical or other services. Copyrights & Disclaimer
Page 42 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams-OSRAM AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams-OSRAM AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
Datasheet, Public Page 43 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 3-00 (2022-Sep-29) to current revision 4-00 (2022-Nov-30) Page Updated Figure 7 8 Updated Figure 35 and notes below 33 Revision Information
Page 44 Datasheet, Public Document Feedback [v4-00] 2022-Nov-30 AS7263 − Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 Block Diagram
3 Pin Assignment
5A b s o l u t e M a x i m u m R a t i n g s
6 Electrical Characteristics
8 Timing Characteristics
11 Optical Characteristics
12 Typical Operating Characteristics
13 Detailed Description
13 6-Channel NIR Spectral_ID Detector
14 Data Conversion Description
15 RC Oscillator
16 Temperature Sensor
16 Reset
16 Indicator LED
16 Electronic Shutter with LED_DRV Driver Control
17 Interrupt Operation
17 I²C Slave Interface
17 I²C Feature List
18 I²C Virtual Register Write Access
20 I²C Virtual Register Read Access
21 I²C Virtual Register Set
22 Detailed Register Description
27 4-Byte Floating-Point (FP) Registers
28 UART Interface
28 UART Feature List
28 Theory of Operation
28 Transmission
28 Reception
29 AT Command Interface
34 PCB Pad Layout
35 Mechanical Data
36 Storage & Soldering Information
36 Soldering Information
37 Manufacturing Process Considerations
37 Storage Information
37 Moisture Sensitivity
37 Shelf Life
38 Floor Life
38 Rebaking Instructions
Datasheet, Public Page 45 [v4-00] 2022-Nov-30 Document Feedback AS7263 − Content Guide