AS7261N AMSOSRAM | Alldatasheet
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Technical content
[v1-02] 2017-Feb-27 Document Feedback AS7261N XYZ Tri-Stimulus and NIR Sensor with Electronic Shutter The AS7261N provides direct XYZ sensor data which conforms to the tri-stimulus standard ob server color response of the human eye. A near-IR channel enables additional application flexibility. LED drivers with programmable currents are provided for electronic shutter applications. The AS7261N integrates Gaussian filters into standard CMOS silicon via nano-optic deposited interference filter technology and is packaged in an LGA package that provides a built in aperture to control the ligh t entering the sensor array. Control and spectral data access is implemented through an I²C register set. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of AS 7261N, XYZ Tri-Stimulus and NIR Sensor with Electronic Shutter are listed below: Figure 1: AS7261N Benefits and Features Benefits Features
- XYZ channel data conforming to human eye response to color information • XYZ tri-stimulus standard observer filter set
- High accuracy ambient light measurements • Ambient light sensing (photopic response)
- Direct register read and write with interrupt on sensor ready
- I²C slave digital Interface with optional interrupt operation
- High stability over lifetime with minimal drift over temperature • Filter set realized by silicon interference filters
- No additional signal conditioning required • 16-bit ADC with digital access
- Direct register read and write with interrupt on sensor ready
- I²C slave digital Interface with optional interrupt operation General Description
Document Feedback [v1-02] 2017-Feb-27 AS7261N − General Description Application The AS7261N applic ations include:
- Color measurement and absorbance
- Color matching and identification
- Precision color tuning/calibration System Block Diagram Figure 2: AS7261N Sensor System
- Electronic shutter control/synchronization • Programmable LED drivers
- Low voltage operation • 2.7V to 3.6V with I²C interface
- Small, robust package, with built-in aperture • 20-pin LGA package 4.5mm x 4.7mm x 2.5mm -40°C to 85°C temperature range Benefits Features 100nF SCL_S GN D LED_DRV VDD1 VDD2 AS7261N MCU 10uF 3.3V 3.3V SDA_S LED_IND 3.3V X, Y, Z, NIR, C & D Sensors Light Source Light in Reflective Surface INT
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Pin Assignments The device pin assignments are described below. Figure 3: Pin Diagram of AS7261N (Top View) Pin Description Figure 4: Pin Description of AS7261N Pin Number Pin Name Description 1 NF Not Functional. Do not connect.
2 RESN Reset, Active LOW
3 NF Not Functional. Do not connect. 4 NF Not Functional. Do not connect. 5 NF Not Functional. Do not connect. 6 NF Not Functional. Do not connect. 7 NF Not Functional. Do not connect. 8 NF Not Functional. Do not connect.
9 SCL_S I²C Slave Clock pin
10 SDA_S I²C Slave Data pin
11 NF Not Functional. Do not connect. Pin Assignments 61 0 1620
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Pin Assignments 12 NF Not Functional. Do not connect.
13 INT Interrupt, active high
14 VDD2 Voltage Supply
15 LED_DRV LED Driver Output for Driving LED Current Sink
16 GND Ground
17 VDD1 Voltage Supply
18 LED_IND LED Driver Output for Indicator LED Current Sink
19 NF Not Functional. Do not connect. 20 NF Not Functional. Do not connect. Pin Number Pin Name Description
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Electrical Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The device is not designed for high energy UV (ultraviolet) environments, including upward looking outdoor applications, which could affect long term optical performance. Figure 5: Absolute Maximum Ratings Symbol Parameter Min Max Units Comments Electrical Parameters VDD_MAX Supply Voltages VDD1, VDD2 -0.3 5 V Pins VDD1 & VDD2 must be sourced from the same supply voltage VDD_IO Input/Output Pin Voltage -0.3 VDD+0.3 V Input/Output Pin to GND ISCR Input Current (latch-up immunity) ±100 mA JESD78D Electrostatic Discharge ESDHBM Electrostatic Discharge HBM ±1000 V JS-001-2014 ESDCDM Electrostatic Discharge CDM ±500 V JSD22-C101F Temperature Ranges and Storage Conditions TSTRG Storage Temperature -40 85 °C TBODY Package Body Temperature 260 °C IPC/JEDEC J-STD-020. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices” RHNC Relative Humidity (non-condensing) 5 85 % MSL Moisture Sensitivity Level
3 Maximum floor life time of
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Electrical Characteristics All limits are guaranteed with VDD = VDD1 = VDD2 = 3.3V, TAMB = 25°C. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. VDD1 and VDD2 must be sourced from the same power supply. Figure 6: Symbol Parameter Conditions Min Typ Max Unit General Operating Conditions VDD Voltage Operating Supply I²C Interface 2.7 3.3 3.6 V TAMB Operating Temperature -40 25 85 °C IVDD Operating Current 5 mA ISTANDBY (1) Standby Current 12 μA Internal RC Oscillator FOSC Internal RC Oscillator Frequency 15.7 16 16.3 MHz tJITTER (2) Internal Clock Jitter @25°C 1.2 ns Temperature Sensor DTEMP Absolute Accuracy of the Internal Temperature Measurement -8.5 8.5 °C Indicator LED IIND LED Current 1, 2, 4 or 8 1 8 mA IACC Accuracy of Current -30 30 % VLED Voltage Range of Connected LED Vds of current sink 0.3 VDD V LED_DRV ILED1 LED Current 12.5, 25, 50 or 100 12.5 100 mA IACC Accuracy of Current -10 10 % VLED Voltage Range of Connected LED Vds of current sink 0.3 VDD V
Electrical Characteristics
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Electrical Characteristics Note(s): 1. 15μA over temperature 2. Guaranteed, not tested in production Digital Inputs and Outputs IIH, IIL Logic Input Current Vin=0V or VDD -1 1 μA IIL RESN Logic Input Current (RESN pin) Vin=0V -1 -0.2 mA VIH CMOS Logic High Input 0.7* VDD VDD V VIL CMOS Logic Low Input 0 0.3* VDD V VOH CMOS Logic High Output I=1mA VDD - 0.4 V VOL CMOS Logic Low Output I=1mA 0.4 V tRISE (2) Current Rise Time C(Pad)=30pF 5 ns tFALL (2) Current Fall Time C(Pad)=30pF 5 ns Symbol Parameter Conditions Min Typ Max Unit
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Operation Characteristics Note(s): 1. Each channel is tested with GAIN = 3. 7x, Integration Time (INT_T) = 166ms and T AMB=25°C 2. The accuracy of each channel count is ±25% Figure 11: of View ±20.5 deg Symbol Parameter Test Conditions Min Typ Max Unit
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Figure 12: Internal Block Diagram XYZ Sensor The AS7261N XYZ sensor is a next-generation digital color sensor device. It senses X, Y, Z standard observer filters compliant with the CIE 1931 standard observer color response in addition to near IR (NIR), Clear (C) and Dark (D) spectrum filters. The sensor contains analog-to-digital converters (16-bit resolution ADC), which integrate current from each channel’s photodiode. Upon completion of conversion cycle, the integrated result is transferred to the corresponding data register. Transfers are double-buffe red to ensure integrity of the data is maintained. Interference filters realize all filter responses and enable minimal life-time drift and very high temperature stability. Filter accuracy is affected by the optical angle of incidence which itself is limited by an inte grated aperture and an internal micro-lens structure in the AS7261N. The package field of view (PFOV) is ±20.5° to deliver th e specified accuracy. External optics can be used as needed to expand or reduce this built in PFOV. Detailed Descriptions SDA_S SCL_S AS7261N I2C Control VDD1 VDD2 GND RESN INT XY Z XYZ True Color Se nsor D CN I R LED_IND LED_DRV
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Spectral Conversion and Data Acquisition Spectral conversion uses a regi ster set for integration time (register INT_T). If both phot odiode banks are required to complete the conversion, the second bank requires an additional integration time. Minimum conversion time for a single bank is 2.8 milliseconds. If data is required from all 6 photodiodes the device must perform 2 full conversions (2 x integration time). The user has control of gain for the photodiode current, programmed into bits 0 and 1 of the GAIN_ IDRV register where gain can be set to 1x, 3.7x, 16x or 64x. A wait time between integration cycles can be programmed into register WTIME using the same units as the INT_T register. An auto zero function is automatically performed before the first data conversion after a po wer-on or reset, in order to achieve the best data quality. Auto zero corrects for internal device temperature. But since it’s automatically done only once, it can also be manually run. Typically, if the temperature changes by 15 degrees C or more the auto zero should be manually run by writing to the Auto_Zero register (temperature is user calculated based on TMPL & TMPH registers values). But auto zero can also be manually done before every conversion. When auto zero function is co mplete the DONE bit (bit7) of Auto_Zero register will be set to 1. The BANK bit (bit7) in the BANK register can be changed as needed before data conversion to acquire the desired channels. While conversion is continuous, ti ming is done using registers. Both polling and interrupt oper ation are then supported for “conversion complete” timing. Both require programming the INTR_POLL_EN register bit 2 to a 1. The conversion process is started by writing a 0x01 to the DATA_EN register followed by clearing any previous Data Valid bit in the INTR_POLL_CLR register. This is followed by a separate write of 0x03 to the DATA_EN register. If the AS7261N interrupt output is to be used for data conversion timing the INTR_PIN _Config register should be programmed to 0xCA. The INT pin will then be asserted high at the completion of the conversion cycle. A 0x04 should be written to the INTR_POLL_CLR regi ster to clear this interrupt which also clears polling bit 2 in the register. If only polling is to be used for conversion timing, an external interrupt is not required and the INTR_PIN_Config register should be programmed to 0x00. Polling of bit 2 in the INTR_ POLL_CLR register will return 0x00 if the conversion is not complete, and 0x04 if complete. Once complete a 0x04 should be written to the INTR_POLL_CLR register to clear bit 2, the polled bit. For acquisition, done after conver sion, data needs to be latched by writing 0x83 to the DATA_EN register. The purpose of latching the data by the user is to provide a mechanism for data to be coherent and under user control. Now, the data bank register can be read (one bank per single conversion-acquisition cycle). The CLR bit (bit2) should be
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Detailed Descriptions cleared by writing a 1 to the CLR bit (bit2) of the INTR_POLL_ CLR register (0xF8) after each conversion-acquisition cycle is completed. Temperature Sensor The Temperature Sensor measures on-chip temperature on demand, and enables temperature compensation procedures. The basic equation for calculating the internal temperature of the device is: TMP_VALUE is the derived from TMPL & TMPH (0xD2 [1:0] and 0xD1 [7:0]) register data. Temperature conversions are performed by writing 0x24 to the TMP_Config register. Polling the TMP_Config register will indicate data acquisition is complete upon reading 0x84. After reading 0x84 the TMP_ Config register should be written to either 0x00 for idle or 0x24 to perform another temperature measurement. The result of the calculation is the device temperature in degree Celsius (°C). Electronic Shutter with LED_IND or LED_DRV Driver Control Under user control there are two LED driver outputs that can be used to control LEDs on the two driver pins. This allows different wavelength light sources to be used in the same system. The LED output sink currents are programmable and can drive external LED sources. After programming for current the sources can be turned off an d on via registers to provide the AS7261N with an electronic shutter capability. If turning LEDs on, they should be fully on optically before a conversion begins and not shut off until after the conversion-acquisition cycle completes The LED_IND pin can be turned on /off via the LED_IND register with values 0x01, 0x05, 0x09 and 0x0D for sink currents of 1mA, 2mA, 4mA and 8mA respectively. For the LED_DRV pin, the GAIN_IDR V Register (0xB9) bits 7 and 6 control the drive strength of the pin for current values 12.5mA, 25mA, 50mA and 100mA. This register also controls the gain of all light acquisitions so care shou ld be taken when writing to it. The LED_DRV pin can be turned on/off via the LED_DRV register bit 2. (EQ1) 0.7604 TMP– VALUE 2.048• 2.046 10 3–•
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Low Power Mode AS7261N can be put into the low power mode by writing 0x02 to the POWER MODE Register (0x73). Write 0x00 to set it back to normal mode. Wait at least 50μs before doing further AS7261N operations after powering back to normal. The sequence to configure AS7261N into low power mode:
- Write 0x00 to Register 0xFA
- Write 0x02 to Register 0x73
- AS7261N is in low power mode The sequence to configure AS7261N out of low power mode:
- Write 0x00 to Register 0x73
- Wait for at least 50μS
- Write 0x03 to Register 0xFA
- AS7261N is in normal mode Device Initialization and Pin Assignment On power up device needs to be initialized as follows before programming registers to do da ta conversion and acquisition:
- Device Config 1 register: 0x70 written to 0x8A
- Device Config 2 register: 0x71 written to 0x02
- Device Config 3 register: 0xB0 written to 0x02
- Device Config 4 register: 0x88 written to 0x00
- Device Config 5 register: 0x9A written to 0x02
- Interrupt Operation: The only user defined pin functionality is whether to use pin 13 as an interrupt signal at the completion of data co nversion. This is done by programming the INTR_PIN_Config register (0x22) to 0xCA. To disable interrupt fu nction the INTR_PIN_Config register should be programmed to 0x00, which is the power-on and reset default. RC Oscillator An internal on-chip timing generation circuit provides a 16MHz temperature compensated oscillator for the AS7261N master clock.
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Detailed Descriptions Reset Pulling down the RESN pin for longer than 100ms resets the AS7261N. Figure 15: Reset Circuit Reset AS72 61 N I2C Registers RESN Push > 100ms
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Figure 16: I²C Register Programming Flow Chart Note(s): 1. When using shuttered LEDs, the LED source(s) should be at desired brightness before conversion starts. YES Turn off Low Power Mode (if on) PWR_MODE, DATA_EN Sensor Configuration INT_T, GAIN_IDRV, BANK, WTIME Read For Conversion Complete INTR_POLL_CLR = 0x04 ? NO Read Sensor Data If BANK MODE 0, read X, Y, D & C If BANK MODE 1, read X, Y, Z, & NIR More Data? Turn on Low Power Mode DATA_EN, PWR_MODE Latch Data for Acquisition DATA_EN NO One Time Device Configuration DEV_Config_1, DEV_Config_2, DEV_Config_3, DEV_Config_4, DEV_Config_5 AS7261N Power-on or device reset AS7261N System Configuration Interrupt Configuration INTR_PIN_Config, INTR_POLL_CLR, INTR_POLL_EN Start AS7261N Data Cycle Conversion Start INTR_POLL_CLR, DATA_EN (first write), DATA_EN (separate, second write) Interrupt Service Entry Point YES Clear Poll Bit INTR_POLL_CLR Configure LEDs (if needed) LED_IND, LED_DRV Turn off LEDs LED_IND, LED_DRV Perform Auto Zero (optional) Auto_Zero, TMPH, TMPL, TMP_Config External Micro- Controller (MCU) AS7261N Interrupt Enabled? YES NO
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Detailed Descriptions I²C Slave Interface Interface, control and reading sensor data is accomplished through an I²C compatible slave interface via a set of registers. I²C Feature List
- Fast mode (400 kHz) and stan dard mode (100 kHz) support
- 7+1-bit addressing mode
- Write format: Byte
- Read format: Byte I²C Register Set The 7-bit I²C slave address of AS7261N is 0x49 plus one bit for read/write. When reading from I²C registers, the 7 + 1-bit address should be 0x93. When writing to I²C registers, the 7+1-bit address should be 0x92. The figure below provides a summary of the AS7261N I²C register set. Figures after that provide additional details. All register data is hex, and all multi-byte entities are Big Endian (most significant byte is situated at the lower register address). I²C register addresses not listed should be treated as reserved and not used. Figure 17: I²C Register Set Overview Device Version Registers 0x10 DEV_ID Device Identification 0x11 DEV_VER Device Version Device Configuration Registers 0x70 DEV_Config_1 Device Configuration 1 0x71 DEV_Config_2 Device Configuration 2 0xB0 DEV_Config_3 Device Configuration 3 0x88 DEV_Config_4 Device Configuration 4 0x9A DEV_Config_5 Device Configuration 5 Power Mode Register 0x73 PWR_MODE RESV PM RESV
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Interrupt and Polling Control Registers 0x22 INTR_PIN_Config OPIN FUNCT 0xF8 INTR_POLL_CLR RESV CLR RESV 0xF9 INTR_POLL_EN RESV EN RESV LED Control Registers 0xEA LED_DRV RESV ON_OFF RESV 0x84 LED_IND RESV CURRENT RESV ON_OFF Auto Zero and Temperature Control Registers 0xBA Auto_Zero RESV C_EN X_EN Y_EN Z_EN 0xD1 TMPH Most Significant bits (9:2) of Temperature Measurement 0xD2 TMPL RESV TMPL 0xD3 TMP_Config ISTAT RESVSTRT RESV SRC Sensor Control Registers 0xDB BANK BANK RESV 0xB9 GAIN_IDRV IDRV RESV GAIN 0xD9 INT_T Integration Time 0xDA WTIME Wait Time 0xFA DATA_EN DL RESV WAIT RESV CON PON Sensor Data Registers 0xDC NDATA_L N Channel Low Byte 0xDD NDATA_H N Channel High Byte 0xDE YDATA_L Y Channel Low Byte 0xDF YDATA_H Y Channel High Byte 0xEC ZDATA_L Z Channel Low Byte 0xED ZDATA_H Z Channel High Byte 0xEE XDATA_L X Channel Low Byte 0xEF XDATA_H X Channel High Byte
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Figure 20: Power Mode Register Figure 21: Interrupt Pin Configuration Register Figure 22: Interrupt and Polling Clear Register Figure 23: Interrupt and Polling Enable Register Addr: 0x04/0x84 PWR_MODE Bit Bit Name Default Access Bit Description 7:2 RESV 0 R/W Reserved, set to 000000 if writing the register
1 PM 1 R/W 1= Normal Operation Power Mode
0= Low Power Mode
0 RSVD 0 R/W Reserved, set to 0 if writing the register
Addr: 0x22 INTR_PIN_Config Bit Bit Name Default Access Bit Description 7:0 INTR_PIN_Config 0x00 R/W 0x00 = INT pin disabled 0xCA = INT pin enabled Addr: 0xF8 INTR_POLL_CLR Bit Bit Name Default Access Bit Description 7:3 RESV 00000 R/W Reserved, set to 00000 if writing the register
2 CLR 0 R/W
Set to 1 to clear any asserted interrupt pin INT (the interrupt channel ready must be enabled). If the interrupt channel ready is enabled this bit will read a 1. 1:0 RSVD 00 R/W Reserved, set to 00 if writing the register Addr: 0xF9 INT_POLL_EN Bit Bit Name Default Access Bit Description 7:3 RESV 0 R/W Reserved, set to 00000 if writing the register 2:1 EN 0 R/W Set to 1 to enable the channel data ready for polling or interrupt.
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Detailed Descriptions Figure 24: LED Driver Register Figure 25: LED Indicator Register Addr: 0xEA LED_DRV Bit Bit Name Default Access Bit Description 7:3 RESV 0 R/W Reserved, set to 00000 if writing the register
2 ON_OFF 0 R/W
Set to 1 to enable the LED_DRV pin to the current level specified by the register GAIN_IDRV (0xB9). Set to 0 to turn off. 0:1 RSVD 0 R/W Reserved, set to 00 if writing the register Addr: 0x84 LED_IND Bit Bit Name Default Access Bit Description 7:4 RESV 0 R/W Reserved, set to 0 if writing the register 3:2 CURRENT 00 R/W For LED_IND pin current value (when on). Set to: ‘b00=1mA; ‘b01=2mA; ‘b10=4mA; ‘b11=8mA;
1 RSVD 0 R/W Reserved, set to 0 if writing the register
0 ON_OFF 0 R/W Set to 1 to enable the LED_DRV pin to the current level
specified by the CURRENT bits. Set to 0 to turn off.
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Figure 26: Auto Zero Register Addr: 0xBA Auto_Zero Bit Bit Name Default Access Bit Description
7 DONE 0 R/W Will be set to 1 when any auto zero function is
completed. Set to 0 if writing to the register. 6:4 RESV 0 R/W Reserved, set to 000 if writing the register 3 C_EN 0 R/W Set to 1 to manually run auto zero on the C channel. Will be automatically set to 0 when DONE bit is set. 2 X_EN 0 R/W Set to 1 to manually run auto zero on the X channel. Will be automatically set to 0 when DONE bit is set. 1 Y_EN 0 R/W Set to 1 to manually run auto zero on the Y channel. Will be automatically set to 0 when DONE bit is set. 0 Z_EN 0 R/W Set to 1 to manually run auto zero on the Z channel. Will be automatically set to 0 when DONE bit is set.
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Detailed Descriptions Temperature Measurement High Register (bits 9:2) TMP_VALUE is the value from TMPL & TMPH (0xD2 [1:0] and 0xD1 [7:0]) registers (see the Temperature Sensor section of this datasheet). Temperature conversion controlled by the TEMP_ Config register. Figure 27: Temperature Measurement High Register Temperature Measurement Low Register (bits 1:0) TMP_VALUE is the value from TMPL & TMPH (0xD2 [1:0] and 0xD1 [7:0]) registers (see the Temperature Sensor section of this datasheet). Temperature conversion controlled by the TEMP_ Config register. Figure 28: Temperature Measurement Low Register Figure 29: Temperature Configure Register Addr: 0xD1 TMPH Bit Bit Name Default Access Bit Description 7:0 TMPH R Most significant 8 bits (9:2) of the Temperature Measurement. Addr: 0xD2 TMPL Bit Bit Name Default Access Bit Description 7:0 TMPL R Least significant 2 bits (1:0) of the Temperature Measurement. Addr: 0xD3 TEMP_Config Bit Bit Name Default Access Bit Description
7 ISTAT 0 R/W Will be set to 1 when internal temperature measurement
is complete. Set to 0 if writing to the register.
6 RESV 0 R/W Reserved, set to 0 if writing the register
5 START 0 R/W Set to 1 to start a temperature conversion cycle. Set to 0 for IDLE state.
4 RESV 0 R/W Reserved, set to 0 if writing the register
3:0 SRC 0 R/W Set to 0100 to start a temperature conversion cycle. Set to 0000 for IDLE state.
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Figure 30: Bank Register Figure 31: Sensor Gain and LED_DRV Current Drive Register Figure 32: Integration Time Register Addr: 0xDB BANK Bit Bit Name Default Access Bit Description
7 BANK 0 R/W
Sets Bank mode for sensor channel selection: 0= Mode 0 for X, Y, D and D sensor data 1= Mode 1 for X, Y, Z and NIR sensor data 6:0 RESV 0 R/W Reserved, set to 0000000 if writing the register Addr: 0xB9 GAIN_IDRV Bit Bit Name Default Access Bit Description 7:6 IDRV 0 R/W For LED_DRV pin current limit (when on). Set to: ‘b00=100mA; ‘b01=50mA; ‘b10=25mA; ‘b11=12.5mA; 5:2 RESV 0 R/W Reserved, set to 0000 if writing the register 1:0 GAIN 0 R/W Sensor Channel Gain Setting (all channels) Addr: 0xD9 INT_T Bit Bit Name Default Access Bit Description 7:0 INT_T 0xFF R/W Sets sensor integration time Integration time = (256 - value) * 2.8ms
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Detailed Descriptions Figure 33: Integration Wait Time Register Figure 34: Data Enable Register Addr: 0xDA INT_WT Bit Bit Name Default Access Bit Description 7:0 INT_WT 0xFF R/W Sets time between sensor integrations Integration wait time = (256 - value) * 2.8ms Addr: 0xFA DATA_EN Bit Bit Name Default Access Bit Description 7 DL 0 R/W Data Latch. Set to 1 to latch the data after acquisition completes 6:4 RESV 0 R/W Reserved, set to 000 if writing the register
3 WAIT 0 R/W Set to 1 to enable the wait timer between data channel
2 RESV 0 R/W Reserved, set to 0 if writing the register
1 CON 0 R/W Set to 1 to enable data channel acquisitions
0 PON 0 R/W Set to 1 if writing the register
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Detailed Descriptions Figure 35: Sensor Data Registers Addr: 0xDC NDATA_L Bit Bit Name Default Access Bit Description 7:0 NDATA_L R Channel N Low Data Byte Addr: 0xDD NDATA_H Bit Bit Name Default Access Bit Description 7:0 NDATA_H R Channel N High Data Byte Addr: 0xDE YDATA_L Bit Bit Name Default Access Bit Description 7:0 YDATA_L R Channel Y Low Data Byte Addr: 0xDF YDATA_H Bit Bit Name Default Access Bit Description 7:0 YDATA_H R Channel Y High Data Byte Addr: 0xEC ZDATA_L Bit Bit Name Default Access Bit Description 7:0 ZDATA_L R Channel Z Low Data Byte Addr: 0xED ZDATA_H Bit Bit Name Default Access Bit Description 7:0 ZDATA_H R Channel Z High Data Byte Addr: 0xEE XDATA_L Bit Bit Name Default Access Bit Description 7:0 XDATA_L R Channel X Low Data Byte Addr: 0xEF XDATA_H Bit Bit Name Default Access Bit Description 7:0 XDATA_H R Channel X High Data Byte
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Application Information Schematic Figure 36: AS7261N Typical Application Circuit
Application Information
LED_DRV LED_IND SCL_S SDA_S INT NF NF NF NF NF NF NF NF NF NF NF 3V3 3V3 3V3 RST SCL_M SDA_M INT 100nF 10uF 10K Micro Controller Unit
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Application Information PCB Layout Figure 37: Typical Layout Routing In order to prevent interference, avoid trace routing feedthroughs with exposure directly under the AS7261N. An example routing is illustrated in the diagram.
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Package Drawings & Markings Figure 38: Package Drawing Note(s): 1. All linear dimensions are in millimeters 2. XXXXX = tracecode Package Drawings & Markings AS7261N Green RoHS
[v1-02] 2017-Feb-27 Document Feedback AS7261N − PCB Pad Layout Suggested PCB pad layout guidelines for the LGA device are shown. Figure 39: Recommended PCB Pad Layout Note(s): 1. Unless otherwise specified, all dimensions are in millimeters. 2. Dimensional tolerances are ±0.05mm unless otherwise noted. 3. This drawing is subject to change without notice. PCB Pad Layout 4.40 0.30 0.65 1.10 4.60 Unit: mm
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Mechanical Data Figure 40: Tape & Reel Information Note(s): 1. All dimensions in millimeter s unless of otherwise stated. 2. Measured from centreline of spro cket hole to centreline of pocket. 3. Cumulative tolerance of 10 sprocket holes is ±0.20. 4. Measured from centreline of spro cket hole to centreline of pocket. 5. Other material available. Mechanical Data
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Soldering & Storage Information Manufacturing Process Considerations The AS7261N package is compatible with standard reflow no-clean and cleaning processes including aqueous, solvent or ultrasonic techniques. However, as an open-aperture device, precautions must be taken to avoid particulate or solvent contamination as a result of any manufacturing processes, including pick and place, reflow , cleaning, integration assembly and/or testing. Temporary covering of the aperture is allowed. To avoid degradation of accuracy or performance in the end product, care should be taken that any temporary covering and associated sealants/debris are th oroughly removed prior to any optical testing or final packaging. Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previous ly absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:
- Shelf Life: 12 months
- Ambient Temperature: <40°C
- Relative Humidity: <90% Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region.
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Soldering & Storage Information Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions:
- Floor Life: 168 hours
- Ambient Temperature: <30°C
- Relative Humidity: <60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Ordering & Contact Information Figure 43:
Ordering Information
Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Package Marking Description Delivery Form Delivery Quantity AS7261N-BLGT 20-pin LGA AS7261N XYZ and NIR Sensor with Electronic Shutter Tape & Reel 2000 pcs/reel Ordering & Contact Information
[v1-02] 2017-Feb-27 Document Feedback AS7261N − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Copyrights & Disclaimer Copyright ams AG, Tobelbader St rasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used with out the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any th ird party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-01 (2017-Feb-08) to current revision 1-02 (2017-Feb-27) Page Updated Figure 10 9 Revision Information
[v1-02] 2017-Feb-27 Document Feedback AS7261N − Content Guide
1 General Description
1 Key Benefits & Features
2 Application
2 System Block Diagram
3 Pin Assignments
3 Pin Description
5A b s o l u t e M a x i m u m R a t i n g s
6 Electrical Characteristics
8 Timing Characteristics
9 Operation Characteristics
11 Detailed Descriptions
11 XYZ Chromatic White Color Sensor
12 Data Conversion
13 Spectral Conversion and Data Acquisition
14 Temperature Sensor
14 Electronic Shutter with LED_IND or LED_DRV Driver
15 Low Power Mode
15 Device Initialization and Pin Assignment
15 RC Oscillator
15 Reset
18 I²C Slave Interface
18 I²C Feature List
18 I²C Register Set
20 Detailed Register Description
22 Temperature Measurement High Register (bits 9:2)
22 Temperature Measurement Low Register (bits 1:0)
27 Schematic
27 PCB Layout
29 PCB Pad Layout
30 Mechanical Data
31 Soldering & Storage Information
31 Soldering Information
32 Manufacturing Process Considerations
32 Storage Information
32 Moisture Sensitivity
32 Shelf Life
32 Floor Life
33 Rebaking Instructions
Document Feedback [v1-02] 2017-Feb-27 AS7261N − Content Guide