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Technical content

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice.

FEATURES

  • Access Times: 12, 15, 20, 25, 35, 45, 55, 70, & 100ns
  • Battery Backup: 2V data retention
  • Low power standby
  • High-performance, low-power CMOS double-metal process
  • Single +5V (+10%) Power Supply
  • Easy memory expansion with CE\\
  • All inputs and outputs are TTL compatible OPTIONS MARKING
  • Timing 12ns access -12 15ns access -15 20ns access -20 25ns access -25 35ns access -35 45ns access -45 55ns access 1 -55 70ns access 1 -70 100ns access -100
  • Package(s)2 Ceramic DIP (300 mil) C No. 108 Ceramic DIP (600 mil) CW No. 110 Ceramic LCC (28 leads) EC No. 204 Ceramic LCC (32 leads) ECW No. 208 Ceramic Flat Pack F No. 302 Ceramic SOJ DCJ No. 500
  • Operating Temperature Ranges Military -55 oC to +125oC XT Industrial -40 oC to +85oC IT
  • 2V data retention/low power L NOTES: 1. Electrical characteristics identical to those provided for the 45ns access devices. 2. Plastic SOJ (DJ Package) is available on the AS5C2568 datasheet. PIN ASSIGNMENT (Top View) AVAILABLE AS MILITARY SPECIFICATIONS
  • SMD 5962-88662
  • SMD 5962-88552
  • MIL-STD-883 28-PIN SOJ (DCJ) 28-Pin DIP (C, CW) 32-Pin LCC (ECW) 28-Pin Flat Pack (F) 28-Pin LCC (EC) GENERAL DESCRIPTION The Micross Components SRAM family employs high-speed, low power CMOS designs using a four-transistor memory cell. These SRAMs are fabricated using double-layer metal, double-layer polysilicon technology. For fl exibility in high-speed memory applications, Mi- cross Components offers chip enable (CE\\) and output enable (OE\\) capability. These enhancements can place the outputs in High-Z for additional fl exibility in system design. Writing to these devices is accomplished when write enable (WE\\) and CE\\ inputs are both LOW. Reading is accomplished when WE\\ remains HIGH and CE\\ and OE\\ go LOW. The device offers a reduced power standby mode when disabled. This allows system designs to achieve low standby power requirements. The “L” version provides a battery backup/low volt- age data retention mode, offering 2mW maximum power dis- sipation at 2 volts. All devices operate from a single +5V power supply and all inputs and outputs are fully TTL compatible. 4 3 2 1 32 31 30 A12 A14 NC VCC WE\\ A13 14 15 16 17 18 19 20DQ2 DQ3 VSS NC DQ4 DQ5 DQ6 NC DQ1 A11 NC OE\\ A10 CE\\ DQ8 DQ7 3 2 1 28 27 A12 A14 V CC WE\\ 13 14 15 16 17 DQ3 VSS DQ4 DQ5 DQ6 DQ1 DQ2 A13 A11 OE\\ A10 CE\\ DQ8 DQ7 A14 1 28 VCC A12 2 27 WE\\ A7 3 26 A13 A6 4 25 A8 A5 5 24 A9 A4 6 23 A11 A3 7 22 OE\\ A2 8 21 A10 A1 9 20 CE\\ A0 10 19 DQ8 DQ1 11 18 DQ7 DQ2 12 17 DQ6 DQ3 13 16 DQ5 VSS 14 15 DQ4 32K x 8 SRAM SRAM MEMORY ARRAY For more products and information please visit our web site at www.micross.com A14 1 28 VCC A12 2 27 WE\\ A7 3 26 A13 A6 4 25 A8 A5 5 24 A9 A4 6 23 A11 A3 7 22 OE\\ A2 8 21 A10 A1 9 20 CE\\ A0 10 19 DQ8 DQ1 11 18 DQ7 DQ2 12 17 DQ6 DQ3 13 16 DQ5 V SS 14 15 DQ4

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. FUNCTIONAL BLOCK DIAGRAM TRUTH TABLE A0 Vcc GND A14 I/O0 I/O7 CE\\ OE\\ WE\\ 9A128-1 DECODER I/O DATA CIRCUIT CONTROL CIRCUIT 256 x 1024 MEMORY ARRAY COLUMN I/O MODE OE\\ CE\\ WE\\ DQ POWER STANDBY X H X HIGH-Z STANDBY READ L L H Q ACTIVE READ H L H HIGH-Z ACTIVE WRITE X L L D ACTIVE

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. ABSOLUTE MAXIMUM RATINGS* oC to +150oC oC *Stresses greater than those listed under “Abso- lute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation section of this speci fi cation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli- ability. ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS (-55 oC < TC < 125oC or -40oC to +85oC; VCC = 5.0V +10%) CAPACITANCE DESCRIPTION CONDITIONS SYM MIN MAX UNITS NOTES Input High (Logic 1) Voltage VIH 2.2 VCC+0.5 V1 Input Low (Logic 0) Voltage VIL -0.5 0.8 V 1,2 Input Leakage Current 0V<VIN<VCC ILI -10 10 μA Output Leakage Current Output(s) disabled 0V<VOUT<VCC ILo -10 10 μA Output High Voltage IOH = -4.0mA V OH 2.4 V 1 Output Low Voltage IOL = 8.0mA V OL 0.4 V 1 SYM -12 -15 -20 -25 -35 -45 UNITS NOTES Icc 190 180 170 160 150 150 mA 3 TTL ISBT 60 50 40 35 35 35 mA ISBC 20 20 20 20 20 20 mA "L" Version Only ISBC2 444444m A MAX

DESCRIPTION

Current: Operating CE\\<VIL; Vcc = MAX f = MAX = 1/ tRC (MIN) Output Open CONDITIONS Power Supply Current: Standby CMOS CE\\<VIH; Outputs Open Vcc = MAX CE\\>Vcc-0.2V; Vcc = MAX VIN<+0.2V or >Vcc-0.2V; f = 0 Hz, Outputs Open PARAMETER CONDITIONS SYM MAX UNITS NOTES Input Capacitance C IN 11 pF 4 Output Capacitance C IO 11 pF 4 TA = 25oC, f = 1MHz Vcc = 5V

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS (Note 5) (-55oC < TC < 125oC or -40oC to +85oC; VCC = 5.0V +10%) MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX READ CYCLE READ cycle time tRC 12 15 20 25 35 45 ns Address access time tAA 12 15 20 25 35 45 ns Chip enable access time tACE 12 15 20 25 35 45 ns Output hold from address change tOH 23 3 3 3 3 n s Chip enable to output in Low-Z tLZCE 23 3 3 3 3 n s 7 Chip disable to output in High-Z tHZCE 71 01 01 5 3 52 0 n s 6 , 7 Output enable to access time tAOE 6 8 10 15 20 20 ns Output enable to output in Low-Z tLZOE 00 0 0 2 0 n s Output disable to output in High-Z tHZOE 71 01 01 5 3 52 0 n s 6 WRITE CYCLE WRITE cycle time tWC 12 15 20 25 35 45 ns Chip enable to end of write tCW 10 12 15 20 30 40 ns Address valid to end of write tAW 10 12 15 20 30 40 ns Address setup time tAS 00 0 0 0 0 n s Address hold from end of write tAH 20 0 0 0 0 n s WRITE pulse width tWP 10 12 15 20 30 40 ns Data setup time tDS 8 1 0 1 0 1 52 0 2 0n s Data hold time tDH 00 0 0 0 3 n s Write disable to output in Low-Z tLZWE 00 0 3 3 3 n s 7 Write enable to output in High-Z tHZWE 71 01 01 5 3 52 0 n s 6 , 7 DESCRIPTION SYM UNITS NOTES-12 -15 -45 -20 -25 -35

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. NOTES 1. All voltages referenced to V SS (GND). 2. -3V for pulse width < 20ns 3. I CC is dependent on output loading and cycle rates. The specifi ed value applies with the outputs unloaded, and f = 1 Hz. tRC (MIN) 4. This parameter is guaranteed but not tested. 5. Test conditions as speci fi ed with the output loading as shown in Fig. 1 unless otherwise noted. t HZCE, tHZOE and tHZWE are specifi ed with CL = 5pF as in Fig. 2. Transition is measured ±500mV typical from steady state voltage, allowing for actual tester RC time constant. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, and tHZWE is less than tLZWE. 8. WE\\ is HIGH for READ cycle. 9. Device is continuously selected. Chip enables and output enables are held in their active state. 10. Address valid prior to, or coincident with, latest occurring chip enable. 11. t RC = Read Cycle Time. 12. Chip enable (CE\\) and write enable (WE\\) can initiate and terminate a WRITE cycle. DATA RETENTION ELECTRICAL CHARACTERISTICS (L Version Only) LOW Vcc DATA RETENTION WAVEFORM DON’T CARE UNDEFINED AC TEST CONDITIONS DESCRIPTION CONDITIONS SYM MIN MAX UNITS NOTES VCC for Retention Data V DR 2V Data Retention Current CE\\ > (VCC-0.2V) VIN > (VCC-0.2V) or < 0.2V ICCDR 1m A Chip Deselect to Data Retention Time tCDR 0- - n s 4 Operation Recovery Time tR tRC ns 4, 11 DATA RETENTION MODE VDR > 2V4.5V 4.5V VDR tCDR tR VIH VIL VCC CE\\ Fig. 2 OUTPUT LOAD EQUIVALENT Fig. 1 OUTPUT LOAD EQUIVALENT +5V Q 255 30 pF 480 5 pF +5V Q 255 480

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. tAA tOH tRCtRC PREVIOUS DATA VALID VALID DATA VALID ADDRESS DQ tPD tPU tHZCEtACE tLZCE tHZOE tLZOE tAOE tRCtRC DATA VALID CE\\ OE\\ DQ Icc READ CYCLE NO. 1 8, 9 READ CYCLE NO. 2 7, 8, 10, 12

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. WRITE CYCLE NO. 1 12 (Chip Enabled Controlled) WRITE CYCLE NO. 2 7, 12 (Write Enabled Controlled) tDHtDS tWP1tWP1 tAH tCW tAW tCWtAS tWCtWC HIGH Z DATA VAILD ADDRESS CE\\ WE\\ D Q tDH tWP1tWP1 tAS tAW tCW tAH tCW tWCtWC DATA VALID ADDRESS CE\\ WE\\ D Q HIGH-Z NOTE: Output enable (OE\\) is inactive (HIGH).

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. MECHANICAL DEFINITIONS* Micross Case #108 (Package Designator C) SMD 5962-88662, Case Outline N SMD 5962-88552, Case Outline U NOTE: These dimensions are per the SMD. Micross’ package dimensional limits may differ, but they will be within the SMD limits. * All measurements are in inches. A Q L e bb2S1 D E eA c MIN MAX A --- 0.225 b 0.014 0.026 b2 0.045 0.065 c 0.008 0.018 D --- 1.485 E 0.240 0.310 eA e L 0.125 0.200 Q 0.015 0.070 S1 0.005 --- S2 0.005 --- SYMBOL

0.100 BSC

0.300 BSC

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. * All measurements are in inches. MECHANICAL DEFINITIONS* Micross Case #110 (Package Designator CW) SMD 5962-88552, Case Outline X NOTE: These dimensions are per the SMD. Micross’ package dimensional limits may differ, but they will be within the SMD limits. A Q L e bb2S1 D E eA c MIN MAX A --- 0.232 b 0.014 0.026 b2 0.045 0.065 c 0.008 0.018 D --- 1.490 E 0.500 0.610 eA e L 0.125 0.200 Q 0.015 0.060 S1 0.005 --- S2 0.005 --- SYMBOL

0.600 BSC

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. * All measurements are in inches. MECHANICAL DEFINITIONS* Micross Case #204 (Package Designator EC) SMD 5962-88662, Case Outline U SMD 5962-88552, Case Outline M NOTE: These dimensions are per the SMD. Micross’ package dimensional limits may differ, but they will be within the SMD limits. E D hx45o AA1 L e MIN MAX A 0.060 0.120 A1 0.050 0.088 B1 0.022 0.028 D 0.342 0.358 D3 --- 0.358 E 0.540 0.560 E3 --- 0.558 e h L 0.045 0.055 L1 0.075 0.095 SYMBOL SMD SPECIFICATIONS

0.072 REF

0.200 BSC

0.040 REF

0.050 BSC

0.400 BSC

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. * All measurements are in inches. E D hx45o AA1 L e MECHANICAL DEFINITIONS* Micross Case #208 (Package Designator ECW) SMD 5962-88662 & SMD 5962-88552, Case Outline Y NOTE: These dimensions are per the SMD. Micross’ package dimensional limits may differ, but they will be within the SMD limits. MIN MAX A 0.060 0.120 A1 0.050 0.088 B1 0.022 0.028 D 0.442 0.458 D3 --- 0.458 E 0.540 0.560 E3 --- 0.558 e h L 0.045 0.055 L1 0.075 0.095

0.150 BSC

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. * All measurements are in inches. MECHANICAL DEFINITIONS* Micross Case #302 (Package Designator F) SMD 5962-88662 & SMD 5962-88552, Case Outline T L c A Q E NOTE: These dimensions are per the SMD. Micross’ package dimensional limits may differ, but they will be within the SMD limits. D e b Top View S MIN MAX A 0.090 0.130 b 0.015 0.019 c 0.004 0.009 D --- 0.740 E 0.380 0.420 E2 0.180 --- E3 0.030 --- e L 0.250 0.370 Q 0.026 0.045 S 0.000 0.045 SYMBOL SMD SPECIFICATIONS

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. * All measurements are in inches. Micross Case #500 (Package Designator DCJ) MECHANICAL DEFINITIONS* E1B1 A e b D E MIN MAX A 0.116 0.166 A2 0.026 0.036 A3 --- 0.166 B1 0.030 0.040 b 0.015 0.01 9 D --- 0.740 E 0.380 0.420 E1 0.3 95 0.410 e SYMBOL

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice.

ORDERING INFORMATION

*AVAILABLE PROCESSES IT = Industrial Temperature Range -40 oC to +85oC XT = Extended Temperature Range -55 oC to +125oC 883C = Full Military Processing -55 oC to +125oC DEFINITION OF OPTIONS 2V Data Retention / Low Power L Device Number Package Type Speed ns Options Process Device Number Package Type Speed ns Options** Process MT5C2568 MT5C2568 C CW -12 -12 L L MT5C2568 MT5C2568 EC ECW -12 -12 L L MT5C2568 MT5C2568 C CW -15 -15 L L MT5C2568 MT5C2568 EC ECW -15 -15 L L MT5C2568 MT5C2568 C CW -20 -20 L L MT5C2568 MT5C2568 EC ECW -20 -20 L L MT5C2568 MT5C2568 C CW -25 -25 L L MT5C2568 MT5C2568 EC ECW -25 -25 L L MT5C2568 MT5C2568 C CW -35 -35 L L MT5C2568 MT5C2568 EC ECW -35 -35 L L MT5C2568 MT5C2568 C CW -45 -45 L L MT5C2568 MT5C2568 EC ECW -45 -45 L L MT5C2568 MT5C2568 C CW -55 -55 L L MT5C2568 MT5C2568 EC ECW -55 -55 L L MT5C2568 MT5C2568 C CW -70 -70 L L MT5C2568 MT5C2568 EC ECW -70 -70 L L MT5C2568 CW -100 L /* MT5C2568 ECW -100 L /* Device Number Package Type Speed ns Options Process Device Number Package Type Speed ns Options Process MT5C2568 F -12 L /* MT5C2568 DCJ -12 L /* MT5C2568 F -15 L /* MT5C2568 DCJ -15 L /* MT5C2568 F -20 L /* MT5C2568 DCJ -20 L /* MT5C2568 F -25 L /* MT5C2568 DCJ -25 L /* MT5C2568 F -35 L /* MT5C2568 DCJ -35 L /* MT5C2568 F -45 L /* MT5C2568 DCJ -45 L /* MT5C2568 F -55 L /* MT5C2568 DCJ -55 L /* MT5C2568 F -70 L /* MT5C2568 DCJ -70 L /* MT5C2568 F -100 L /* EXAMPLE: MT5C2568CW-25L/XT EXAMPLE: MT5C2568F-55/XT EXAMPLE: MT5C2568ECW-15L/IT EXAMPLE: MT5C2568DCJ-70L/IT

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. *Micross part number is for reference only. Orders received referencing the SMD part number will be processed per the SMD. MICROSS TO DLA (DSCC) PART NUMBER CROSS REFERENCE* MicrossPackageDesignatorC&CW Micross PackageDesignatorEC&ECW MicrossPart# SMDPart# MicrossPart# SMDPart# AS5C2568CͲ12L/883C 5962Ͳ8855213UA AS5C2568ECͲ12L/883C 5962Ͳ8855213MA AS5C2568CͲ15L/883C 5962Ͳ8855212UA AS5C2568ECͲ15L/883C 5962Ͳ8855212MA AS5C2568CͲ17L/883C 5962Ͳ8855211UA AS5C2568ECͲ17L/883C 5962Ͳ8855211MA AS5C2568CͲ20L/883C 5962Ͳ8855210UA AS5C2568ECͲ20L/883C 5962Ͳ8855210MA AS5C2568CͲ25L/883C 5962Ͳ8855206UA AS5C2568ECͲ25L/883C 5962Ͳ8855206MA AS5C2568CͲ35L/883C 5962Ͳ8855205UA AS5C2568ECͲ35L/883C 5962Ͳ8855205MA AS5C2568CͲ45L/883C 5962Ͳ8855204UA AS5C2568ECͲ45L/883C 5962Ͳ8855204MA AS5C2568CͲ45L/883C 5962Ͳ8855209UA AS5C2568ECͲ45L/883C 5962Ͳ8855209MA AS5C2568CͲ55L/883C 5962Ͳ8855203UA AS5C2568ECͲ55L/883C 5962Ͳ8855203MA AS5C2568CͲ55L/883C 5962Ͳ8855208UA AS5C2568ECͲ55L/883C 5962Ͳ8855208MA AS5C2568CͲ70L/883C 5962Ͳ8855202UA AS5C2568ECͲ70L/883C 5962Ͳ8855202MA AS5C2568CͲ70L/883C 5962Ͳ8855207UA AS5C2568ECͲ70L/883C 5962Ͳ8855207MA AS5C2568CͲ100L/883C 5962Ͳ8855201UA AS5C2568ECͲ100L/883C 5962Ͳ8855201MA MT5C2568CͲ12/883C 5962Ͳ8866209NA MT5C2568ECͲ12/883C 5962Ͳ8866209UA MT5C2568CͲ15/883C 5962Ͳ8866208NA MT5C2568ECͲ15/883C 5962Ͳ8866208UA MT5C2568CͲ20/883C 5962Ͳ8866207NA MT5C2568ECͲ20/883C 5962Ͳ8866207UA MT5C2568CͲ25/883C 5962Ͳ8866206NA MT5C2568ECͲ25/883C 5962Ͳ8866206UA MT5C2568CͲ35/883C 5962Ͳ8866205NA MT5C2568ECͲ35/883C 5962Ͳ8866205UA MT5C2568CͲ45/883C 5962Ͳ8866204NA MT5C2568ECͲ45/883C 5962Ͳ8866204UA MT5C2568CͲ55/883C 5962Ͳ8866203NA MT5C2568ECͲ55/883C 5962Ͳ8866203UA MT5C2568CͲ70/883C 5962Ͳ8866202NA MT5C2568ECͲ70/883C 5962Ͳ8866202UA MT5C2568CͲ100/883C 5962Ͳ8866201NA MT5C2568ECͲ100/883C 5962Ͳ8866201UA AS5C2568CWͲ12L/883C 5962Ͳ8855213XA AS5C2568ECWͲ12L/883C 5962Ͳ8855213YA AS5C2568CWͲ15L/883C 5962Ͳ8855212XA AS5C2568ECWͲ15L/883C 5962Ͳ8855212YA AS5C2568CWͲ17L/883C 5962Ͳ8855211XA AS5C2568ECWͲ17L/883C 5962Ͳ8855211YA AS5C2568CWͲ20L/883C 5962Ͳ8855210XA AS5C2568ECWͲ20L/883C 5962Ͳ8855210YA AS5C2568CWͲ25L/883C 5962Ͳ8855206XA AS5C2568ECWͲ25L/883C 5962Ͳ8855206YA AS5C2568CWͲ35L/883C 5962Ͳ8855205XA AS5C2568ECWͲ35L/883C 5962Ͳ8855205YA AS5C2568CWͲ45L/883C 5962Ͳ8855204XA AS5C2568ECWͲ45L/883C 5962Ͳ8855204YA AS5C2568CWͲ45L/883C 5962Ͳ8855209XA AS5C2568ECWͲ45L/883C 5962Ͳ8855209YA AS5C2568CWͲ55L/883C 5962Ͳ8855203XA AS5C2568ECWͲ55L/883C 5962Ͳ8855203YA AS5C2568CWͲ55L/883C 5962Ͳ8855208XA AS5C2568ECWͲ55L/883C 5962Ͳ8855208YA AS5C2568CWͲ70L/883C 5962Ͳ8855202XA AS5C2568ECWͲ70L/883C 5962Ͳ8855202YA AS5C2568CWͲ70L/883C 5962Ͳ8855207XA AS5C2568ECWͲ70L/883C 5962Ͳ8855207YA AS5C2568CWͲ100L/883C 5962Ͳ8855201XA AS5C2568ECWͲ100L/883C 5962Ͳ8855201YA MT5C2568ECWͲ12/883C 5962Ͳ8866209YA MT5C2568ECWͲ15/883C 5962Ͳ8866208YA MT5C2568ECWͲ20/883C 5962Ͳ8866207YA MT5C2568ECWͲ25/883C 5962Ͳ8866206YA MT5C2568ECWͲ35/883C 5962Ͳ8866205YA MT5C2568ECWͲ45/883C 5962Ͳ8866204YA MT5C2568ECWͲ55/883C 5962Ͳ8866203YA MT5C2568ECWͲ70/883C 5962Ͳ8866202YA MT5C2568ECWͲ100/883C 5962Ͳ8866201YA

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. * Micross part number is for reference only. Orders received referencing the SMD part number will be processed per the SMD. MICROSS TO DLA (DSCC) PART NUMBER CROSS REFERENCE* MicrossPackageDesignatorF MicrossPart# SMDPart# AS5C2568FͲ12L/883C 5962Ͳ8855213TA AS5C2568FͲ15L/883C 5962Ͳ8855212TA AS5C2568FͲ17L/883C 5962Ͳ8855211TA AS5C2568FͲ20L/883C 5962Ͳ8855210TA AS5C2568FͲ25L/883C 5962Ͳ8855206TA AS5C2568FͲ35L/883C 5962Ͳ8855205TA AS5C2568FͲ45L/883C 5962Ͳ8855204TA AS5C2568FͲ45L/883C 5962Ͳ8855209TA AS5C2568FͲ55L/883C 5962Ͳ8855203TA AS5C2568FͲ55L/883C 5962Ͳ8855208TA AS5C2568FͲ70L/883C 5962Ͳ8855202TA AS5C2568FͲ70L/883C 5962Ͳ8855207TA AS5C2568FͲ100L/883C 5962Ͳ8855201TA MT5C2568FͲ12/883C 5962Ͳ8866209TA MT5C2568FͲ15/883C 5962Ͳ8866208TA MT5C2568FͲ20/883C 5962Ͳ8866207TA MT5C2568FͲ25/883C 5962Ͳ8866206TA MT5C2568FͲ35/883C 5962Ͳ8866205TA MT5C2568FͲ45/883C 5962Ͳ8866204TA MT5C2568FͲ55/883C 5962Ͳ8866203TA MT5C2568FͲ70/883C 5962Ͳ8866202TA MT5C2568FͲ100/883C 5962Ͳ8866201TA

Rev. 4.7 10/11 Micross Components reserves the right to change products or specifi cations without notice. DOCUMENT TITLE 32K x 8 SRAM SRAM MEMORY ARRAY Rev # History Release Date Status

4.7 Updated DLA part number cross October 2011 Release