AR3399RK BCM | Alldatasheet

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BCM Advanced Research www.bcmcom.com

11 Chrysler, Irvine, CA 92618 USA

An industry leader in industrial motherboards & embedded computing BCMSales@bcmcom.com (949) 470-1888 * All product specifications and images are subject to change without notice. Last update: Ordering Info AR3399RK Rockchip® RK3399 Dual Core Cortex-A72 + Quad Core Cortex-A53 (6-Core) SoC ARM Motherboard 2021/02/11 Internal I/O COM 1 x RS-232 COM USB 1 x USB 2.0 Header (2 Ports) Camera Interface 1 x MIPI-CSI Connector Switch 1 x Power/Reset Switch Header GPIO 1 x 8 bit GPIO Header I2C 1 x I2C Header I2S 1 x I2S Header Audio 1 x Stereo Speaker Header (Through Audio Amplifier) 1 x Mic-in/Line-in Header Optional 1 x Cable Type Battery, 1 x DC-In Header Mechanical & Environment Power 12V DC Input Operating Temp 0 ~ 60°C Storage Temp -20 ~ 80°C Operating Humidity 5 ~ 80% Relative Humidity, Non-condensing Storage Humidity 5 ~ 90% Relative Humidity, Non-condensing Dimension 4.4” x 5.7” (110mm x 145mm) Certification Information CE, FCC Class B System CPU Rockchip® RK3399 Dual Core Cortex-A72 + Quad Core Cortex-A53 (6-Core) SoC System Memory 2GB DDR3L Onboard (Expandable to 4GB Max) Storage 1 x uSD Card Socket 16GB eMMC Onboard Audio Wolfson® WM8960 Ultra Low Power Audio Codec TI® TPA2008D2 3W Stereo Class D Audio Amplifier Ethernet Micrel® KSZ9031 Gigabit Ethernet Expansion 1 x 2230 M.2 E Key (with PCIe x1 Channel & USB Signal for WIFI/ BT) 1 x 2242 M.2 B Key with Nano SIM Socket (USB 3.0 for Cellular Module) OS Support Android 9 Linux Kernel 4.4 Display Video Interface HDMI, eDP/LVDS Video Chip ARM® Mali-T860MP4 Integrated Graphics LVDS Bridge Chrontel® CH7511B eDP to LVDS Bridge External I/O HDMI 1 x HDMI 1.4b Connector USB 2 x USB 3.0 Connectors 1 x USB 3.0 Type C OTG Connector LAN 1 x RJ-45 Connector Audio 1 x Line-out Jack DC-in 1 x Barrel Type DC-In Connector LED 1 x Status LED

  • Rockchip® RK3399 Dual Core Cortex-A72 + Quad Core Cortex-A53 (6-Core) SoC
  • 2GB DDR3L Onboard (Expandable to 4GB Max)
  • ARM® Mali-T860MP4 Integrated Graphics
  • HDMI, LVDS, MIPI-CSI
  • 1 x uSD Card Socket
  • 16GB eMMC Onboard
  • 2 x USB 3.0, 2 x USB 2.0, 1 x USB 3.0 Type C OTG Connector
  • 1 x 2230 M.2 E Key and 1 x 2242 M.2 B Key
  • I2C, I2S, GPIO
  • 12V DC-In
  • 4.4” x 5.7” (110mm x 145mm)
  • Supports Android 9, Linux Rockchip® RK3399 Dual Core + Quad Core SoC (6-Core) ARM MotherboardAR3399RK Front Panel COM 1 Console I2C I2S MIPI-CSI Line-out RJ-45 LSN 2 x USB 3.0 USB Type C HDMI DC-in LVDS GPIO SIM Card Slot uSD Card Socket (back) M.2 Key B 2 x USB 2.0 M.2 Key E Mic-in Speaker-out (R) Speaker-out (L)