BELAGO1-1 AMSOSRAM | Alldatasheet

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Technical content

Belago1.1 Dot-Pattern Infrared Illuminator v1-00 • 2021-Apr-21 Abstract The Belago1.1 infrared illuminator is the most compact dot-projector for stereoscopic imaging available today. It produces a high-contrast that stereo-matching algorithms can use to mitigate the problem of lack of texture, and to produce high-accuracy depth maps. Belago1.1 enables active stereoscopic imaging to be implemented on a variety of platforms, from robotics to mobile devices.

Document Feedback Belago1.1 Content Guide Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 2 Content Guide

8.1 PCB Pad Layout and Solder Mask

10 Soldering & Storage Information 16

Document Feedback Belago1.1 General Description Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 3

1 General Description

1.1 Key Benefits & Features

Stereoscopic imaging systems often suffer from impaired performance when the scene lacks features: an example is a flat, smooth surface such as a wall. In such cases, the 3D information captured by stereoscopic imaging systems is typically incomplete or inaccurate. Furthermore, the search for features in the images often results in high computational loading. ams has developed a unique, proprietary solution to this problem. The Belago1.1 infrared illuminator, the most compact dot-projector for stereoscopic imaging available today, produces a high-contrast dot pattern that stereo-matching algorithms can use to mitigate the problem of lack of texture, and to produce high-accuracy depth maps. The presence of the infrared pattern also reduces considerably the computational load imposed by the software, as it offers many features to facilitate matching of the left and right images. Belago1.1 enables active stereoscopic imaging to be implemented on a variety of platforms, from robotics to mobile devices. Belago1.1 provides a feedback loop, integrated on the lens, that allows monitoring of a lens or package damage by the operating platform. Belago1.1 provides an improved non-periodic pattern for single IR illuminator camera configurations. The benefits and features of Belago1.1, Dot-Pattern Infrared Illuminator for 3D Stereoscopic Imaging, are listed below: Figure 1: Added Value of Using Belago1.1 Benefits Features Small package size 4.2 mm x 3.6 mm x 3.325 mm Module height compatible with integration in mobile platforms 3.325 mm ± 0.05 Power efficient High optical efficiency, high VCSEL efficiency Easy component mounting Standard lead-free solder reflow compatible Randomized high density, high contrast dot pattern Optimized for active stereo vision systems Eye Safety interlock Integrated feedback loop on the lens

Document Feedback Belago1.1 General Description Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 4

1.2 Applications

  • Active stereo 3D sensors
  • Integrated mobile 3D sensors
  • Integrated tablets and all-in-one 3D sensors
  • Front-facing and world-facing 3D cameras

1.3 Block Diagram

The functional blocks of this device are shown below: Figure 2 : Functional Blocks of Belago1.1

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Ordering Information

Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 5

2 Ordering Information

Ordering Code Description Delivery Form Delivery Quantity AQAA-20 Belago1.1 Dot Pattern Illuminator Tray 490 pcs per tray

Document Feedback Belago1.1 Pin Assignment Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 6

3 Pin Assignment

3.1 Pin Diagram

Figure 3: Module Bottom View

3.2 Pin Description

Figure 4: Pin Description of Belago1.1 Pin Number Pin Name Description

1 Sense 1 Resistive Interlock connection

2 Anode VCSEL Power

3 Sense 2 Resistive Interlock connection

4 Cathode VCSEL Power

Document Feedback Belago1.1 Absolute Maximum Ratings Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 7

4 Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 5 Absolute Maximum Ratings of Belago1.1 Symbol Parameter Min Max Unit Comments Electrical Parameters VF Forward Voltage 3 V 25 °C, Pulse >10 nsec IF Forward Current 7 A 25 °C, Pulse >10 nsec Irev Reverse Current 10 µA 25 °C instantaneous Continuous Power Dissipation (TCase = 70 °C) PT Continuous Power Dissipation 1000 mW Input power Temperature Ranges and Storage Conditions TSTRG Storage Temperature Range - 40 80 °C TOp Operating Temperature 0 80 °C IPC/JEDEC J-STD-020 MSL Moisture Sensitivity Level 3 JESD22-A113D

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Electrical Characteristics

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6 Electrical Characteristics

All limits are guaranteed. The parameters with Min and Max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. Figure 8: Electrical Characteristics of Belago1.1 Symbol Parameter Conditions (1) Min Typ Max Unit Iop1 Operating current At RT, 10 ms / 30 fps 350 mA Pop1 Operating power At Iop=350 mA At RT, 10 ms / 30 fps 200 250 280 mW Vop1 Operating voltage At Iop=350 mA At RT, 10 ms / 30 fps 1.6 2.2 V Iop2 Operating current At RT, 1 ms / 30 fps 425 mA Pop2 Operating power At Iop=425 mA At RT, 1 ms / 30f ps 260 300 340 mW Vop2 Operating voltage At Iop=425 mA At RT, 1 ms / 30 fps 1.6 2.3 V PCEop Operating PCE At Iop=350-425 mA At RT, 1 ms / 30 fps 32 37 % Duty cycle PWM control 5 30 % RInterlock Resistance At RT 10.8 13 21 kOhm trise Rise time 5 ns Ith Threshold current At RT, CW 32 130 mA (1) Specified temperatures refer to the emitter case temperature (the emitter is mounted on a temperature-controlled stage); RT stands for Room Temperature (25 °C). (2) Pulsed operating condition as reference parameter set.

Document Feedback Belago1.1 Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 10

6.1 Typical Operating Characteristics

Figure 9: Electro-Optical Performance Figure 10: Projected Dot Pattern (1) Projected dots pattern measured from Belago1.1 (cropped image showing a magnified section of the FOI)

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6.2 Imaging Setup

For the pattern characterization, the output is projected onto a white, matte-finished target board (Lambertian surface), at a distance. Images are taken inside a dark chamber with a monochrome CCD camera and a wide angle objective.

6.3 Hotspot Detection

Every individual Belago1.1 module is inspected during production to detect the presence of hotspots and similar non-uniformities that cause excessive brightness of the infrared pattern and could be harmful to the human eye.

Document Feedback Belago1.1 Mechanical Drawings Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 12

7 Mechanical Drawings

Figure 11: Package Dimensions (1) Outline dimensions Belago1.1 (2) All dimensions in mm

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Application Information

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8 Application Information

8.1 PCB Pad Layout and Solder Mask Recommendation

The drawings below are showing a recommendation for pad layouts and solder mask. This is only to be used as guide and not to be considered as a firm specification. Figure 15: Solder Mask Layout (1) All dimensions in mm

8.2 Orientation of the Field of Illumination

Figure 16: FOI Orientation (1) Orientation of the Field of Illumination with respect to the Belago1.1 module.

Document Feedback Belago1.1 Packing Information Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 15

9 Packing Information

9.1 Overview

Figure 17: Shipping Tray Dimensions and Overview (1) All dimensions in mm

9.2 Tray Label

Trays are individually labeled. The label information is as follows:

  • Part number (XXXX-XX)
  • Tray ID
  • Quantity
  • Shipment date
  • Manufacturing country

Document Feedback Belago1.1 Soldering & Storage Information Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 16

10 Soldering & Storage Information

Belago1.1 modules have been tested for lead-free solder reflow compatibility with peak temperatures up to 250 °C (MSL3). An example reflow profile is provided in Figure 18. The exact reflow profile may depend on exact solder used. An example of solder paste that can be used is Tamura LFSOLDER TLF -204-NH(20-38). Figure 18: Solder Reflow Profile Graph Attention The module contains a ventilation hole to allow pressure equalization with the ambient. It is not advised to proceed to cleaning after SMT reflow process. The modules MUST NOT be cleaned using ultrasonic cleaning. We suggest to use flux free solder paste and not to clean after SMT. In case a cleaning is un-avoidable, rinse with DI water, followed by a 2h bake @70 °C

Document Feedback Belago1.1 Handling Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 17

11 Handling

11.1 Pick Up

Recommended pick up position on the top window (green circle), touching directly the glass. Figure 19: Pick Up Location (1) Picking area within green area

Document Feedback Belago1.1 Appendix Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 18

12 Appendix

12.1 RoHS & REACH Compliance

The Belago1.1 module is compliant with the European RoHS Directive 2002/95/EC (Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) and REACH (Registration, Authorization and Restriction of Chemicals, European Union Regulation (EC) 1907/2006).

12.2 Safety Advice

Depending on the operational use of the device, the modules can emit highly concentrated no n-visible infrared light, which can be hazardous to the human eyes. Products incorporating these modules may have to follow the safety precautions described by IEC 60825-1:2014. This product emits infrared radiation and has not yet been classified under IEC 60825-1:2014. All appropriate safety precautions should be exercised in the operation and use of this product. CAUTION Avoid direct eye exposure except as may be determined and directed by Purchaser. Appropriate protective eyewear should be worn when operating. Use of magnifying optical instruments with this component may increase eye hazard. LASER PRODUCT LASER RADIATION – AVOID DIRECT EYE EXPOSURE WAVELENGTH: 940nm MAXIMUM OUTPUT POWER: Depends on drive mode WEAR PROTECTIVE GLASSES

Document Feedback Belago1.1 Revision Information Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 19 Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Changes from previous version to current revision v1-00 Page Initial production version

  • Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
  • Correction of typographical errors is not explicitly mentioned.

Document Feedback Belago1.1 Legal Information Datasheet • PUBLIC DS000676 • v1-00 • 2021-Apr-21 20 │ 20

14 Legal Information

Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. RoHS Compliant & ams Green Statement RoHS Compliant: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories plus additional 4 substance categories (per amendment EU 2015/863), including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br/Cl): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) and do not contain Chlorine (Cl not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Headquarters ams AG Tobelbader Strasse 30

8141 Premstaetten

Austria, Europe Tel: +43 (0) 3136 500 0 Please visit our website at www.ams.com Buy our products or get free samples online at www.ams.com/Products Technical Support is available at www.ams.com/Technical-Support Provide feedback about this document at www.ams.com/Document-Feedback For sales offices, distributors and representatives go to www.ams.com/Contact For further information and requests, e-mail us at ams_sales@ams.com