APX9131 ANPEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 14

Technical content

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw1 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Hall Effect Micro Switch IC Features General Description The APX9131 integrated circuit is an ultra-sensitive, pole independent Hall-effect switch with a latched digital output. 2.5 volt to 3.5 volt operation and a unique clocking scheme reduce the average operating power requirements. Either a north or south pole of sufficient flux will turn the output on; in the absence of a magnetic field, the output is off. The polarity independence and minimal power requirement allow this device to be easily replaced reed switch for superior for signal conditioning. Advanced CMOS processing is used to take advantage of low-voltage and low-power requirements, SOT-23 and TO-92 packages provide an optimized package for most applications. Pin Description

Ordering Information

  • Micro Power Operation for Battery Applications
  • Chopper Stabilized Amplifier
  • Independent of North or South Pole Magnet, Easy for Manufacture
  • Small Size Package
  • Lead Free Available (RoHS Compliant)

Applications

  • Micro Switch
  • Handheld Wireless Application Wake Up Switch
  • Clamp Shell Type Application Switch
  • Magnet Switch in Low Duty Cycle Applications SOT-23 APX9131 Handling Code Temp. Range Package Code Package Code A: SOT-23 AT : SOT-23 Thin E : TO-92M3 Operating Ambient Temp. Range I : -40 to 85 C Handling Code TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device Lead Free Code APX9131 A/AT: X31X X: Date Code APX 9131 XXXXX XXXXX - Date CodeAPL9131 E: VOUT APX9131 VDD GND Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. 1 : VDD 2 3 2 : GND 3 : VOUT TO-92M3 Front View

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw2 No Name Function

1 VDD Power Input

2 VOUT

When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than B OPN) the output turns on (output is low). When the magnetic field is below the release point B RPS (or above B RPN), the output turns off (output is high). It is design with open drain configuration and connecting a pull up resistor from VOUT to VDD is necessary. It cannot be floating.

3 GND Ground Connection

Awake & Sleep Timing Logic Hall Plane Dynamic Offset Cancellation Chopper Amplifier Latch Circuit VDD VOUT GNDHysteresis Control 50KΩ 2.5V-3.5V SOT-23 (Top View) VOUT APX9131 VDD GND 0.1uF Typical Applications

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw3 APX9131 Symbol Characteristic Test Condition Min. Typ. Max. Unit VDD Supply Voltage Range Operating 2.5 3.5 V Average 5 10 µA Awake 1.2 2 mA IDD Supply Current sleep 2 8 µA IOFF Output Leakage Current VOUT = 3.5V, BRPN<B<BRPS 1.0 µA VOL Output Low Voltage ISINK = 1mA 20 40 mV tawake Wake up Time 180 µs tperiod Period 60 mS d.c. Duty Cycle 0.3 % fc Chopping Frequency 11 KHz Symbol Parameter Rating Unit VDD Supply Voltage 5 V VOUT Output Voltage 5 V TJ Junction Temperature Range 150 TSTG Storage Temperature Range -65 to +150 Magnetic Characteristics (TA = 25°C, VDD=3V unless otherwise noted) APX9131 Symbol Characteristic Test Condition Min. Typ. Max. Unit BOPS 50 75 G BOPN Operate Points -75 -50 G BRPS 10 35 G BRPN Release Points -35 -10 G Bhys Hysteresis 15 G Electrical Characteristics (TA = 25°C, VDD=3V unless otherwise noted) Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw4 -40 -20 0 20 40 60 80 100 -80 -60 -40 -20 -40 -20 0 20 40 60 80 100 -60 -40 -20 2.5 3 3.5 4 4.5 5 2.5 3 3.5 4 4.5 5 Typical Characteristics Ambient Temperature (°C) Switching Points (G) Switching Points vs. Ambient Temperature Switching Points (G) Supply Voltage (V) Switching Points vs. Supply Voltage Supply Voltage (V) Average Supply Current (uA) Average Supply Current vs.Supply Voltage Average Supply Current (uA) Ambient Temperature (°C) Average Supply Current vs. Ambient Temperature TA=25°C TA=25°C BOPS BRPS BOPN BRPN BOPS BRPS BOPN BRPN

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw5 0 0.2 0.4 0.6 0.8 1 Typical Characteristics Output Low Voltage (V) Output Sink Current (mA) Time (2us/div) Time (50us/div) Output Sink Current vs. Output Low Voltage VDD=3V RL=5.1kΩ CL=12pF VOUT=0.5V/div VDD=3V RL=5.1kΩ CL=12pF VOUT=0.5V/div VDD=4V VDD=5V VDD=3V Output Switch Waveform Output Sink Voltage (0.5V/div) Output Switch Waveform Output Sink Voltage (0.5V/div)

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw6 OUTPUT OFF BOPN BOPS BRPN BRPS OUTPUT ON MAGNETIC FLUX 0 +B-B MAXOUTPUT VOLTAGE Operation The output of APX9131 switches low (turns on) when in presence of strong flux density facing the marked side of package exceeds the operate point BOPS (or is less than BOPN). After turn-on, the output is capable of sinking up to 1 mA and the output voltage is low (turns on). In absence of flux density below the release point BRPS (or increased above BRPN), the APX9131 output switches high (turns off). The difference in the magnetic operated and released point is the hysteresis (Bhys) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical bouncing vibration and electrical noise. Function Description Pole-independent The pole-independent sensing technique allows for operation with either a north or south pole magnet orientation, enhancing the manufacturability of the device. The state-of-the-art technology provides the same output polarity for either pole in presence. Awake & Sleep Internal awake & sleep timing block circuit activates the sensor for 180 us and deactivates it for the remainder of the period (60 ms). A short “awake” time allows for stabilization prior to the sensor sampling and data latching on the falling edge of the timing pulse. While in sleep cycle the output is latched in its previous state. Chopper Stabilized Technique The chopper stabilized technique cancels the mismatching of the hall element, the amplifier offset voltage and temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique produces devices have an extremely stable Hall output voltage, therefore the magnetic switch points are stable.

Application Information

It is strongly recommended that an external bypass capacitor be connected (in close to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies.The output is an open drain output, it must be connected a pull-up resistor to a supply voltage which is lower than 5V, connect a 50kΩ resistor to VDD in common use.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw7 Packaging Information SOT-23 D E H e A A1 L C B Millimeters Inches Dim Min. Max. Min. Max. A 1.00 1.30 0.039 0.051 A1 0.00 0.10 0.000 0.004 B 0.35 0.51 0.014 0.020 C 0.10 0.25 0.004 0.010 D 2.70 3.10 0.106 0.122 E 1.40 1.80 0.055 0.071 H 2.40 3.00 0.094 0.118 L 0.37 0.015

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw8

Package Information

Millimeters Inches Dim Min. Max. Min. Max. A 0.70 0.90 0.028 0.035 A1 0.00 0.10 0.000 0.004 A2 0.70 0.80 0.028 0.031 b 0.35 0.51 0.014 0.020 c 0.10 0.25 0.004 0.010 D 2.80 3.00 0.110 0.118 E 2.60 3.00 0.102 0.118 E1 1.50 1.70 0.059 0.067 e 0.95 BSC 0.0374 BSC e1 1.90 BSC 0.0748 BSC L 0.37 - 0.015 L1 0.60 REF 0.0236 REF R 0.10 - 0.004 - θ 0° 8° 0° 8° D E1 E Lc b e R θ A

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw9 A S C B OVERLOOK E H e F PIN 1 : VDD PIN 2 : GND PIN 3 : OUTPUT FRONT HD Millimeters Inches Dim Min. Max. Min. Max. A 1.40 1.60 0.055 0.063 10 11 0.394 0.433 B 14 15 0.551 0.591 C 0.35 0.41 0.014 0.016 D 2.80 3.20 0.110 0.126 e 1.24 1.30 0.049 0.051 E 3.90 4.30 0.154 0.169 F 2.34 2.64 0.092 0.104 G 4.04 4.24 0.159 0.167 H 0.35 0.41 0.014 0.016 I 2.51 2.57 0.099 0.101 S 0.63 0.81 0.025 0.032 φ 1 5° 5° φ 2 3° 3° φ 3 45° 45°

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw10 Physical Specifications Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Packaging 3000 devices per reel t 25 C to Peak tp Ramp-up tL Ramp-down ts Preheat Tsmax Tsmin TL TP Temperature Time Critical Zone TL to T P Reflow Condition (IR/Convection or VPR Reflow) Classificatin Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak/Classificatioon Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package .Measured on the body surface.

Copyright  ANPEC Electronics Corp. Table 2. Pb -free Process – Package Classification Reflow Temperatures including the stated classification temperature (this means Peak reflow temperature +0 °C. For example 260 °C+0 °C) at the rated MSL level. Table 1. SnPb Entectic Process – Package Peak Reflow Temperature s

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw12 Application A B C J T1 T2 W P E - 0.3 4.0 1.75 F D D1 Po P1 Ao Bo Ko t SOT-23 Application A B C J T1 T2 W P E 8.0+ 0.2 4.0±0.1 1.75±0.1 F D D1 Po P1 Ao Bo Ko t SOT-23 Thin 3.5 ± 0.05 φ 1.55+ 0.05 Application A0 A1 A2 A3 B0 B1 B2 C0 C1 3.18~12 90±1 76±1 30±1 90±1 31±1 76±1 5.8 3.8 C2 D D1 D2 F1=F2 F1-F2 M H H1 H2 H2A H3 H4 H5=H0+M L L1 P P1 P2 T T1 T2 T3 T4 W W1 W2 TO-92 Carrier Tape & Reel Dimensions(Cont.) (mm) Cover Tape Dimensions Application Carrier Width Cover Tape Width Devices Per Reel SOT- 23 8 5.3 3000 SOT- 23 Thin 8 5.3 3000 TO-92 17.5~19 5.0~7.0 2000 (mm) A J B C

Copyright  ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 www.anpec.com.tw13 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369