APX9031

APX9031 ANPEC | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 10

Technical content

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw1 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Hall Effect Sensor IC Features General Description The APX9031 is an integrated Hall Effect Sensor IC designed for electric commutation of DC brushless motor applications. Even with a reverse voltage pro- tection diode, the APX9031 still can operate at as low as 3 volts. The APX9031 is available in low cost TO-92M3 and SOT-89 packages with 3 different magnetic ranks. Pin Description 1 : VDD 2 : GND 3 : OUTPUT

Ordering Information

• •••• On-chip Hall Sensor
• •••• Low Operating Supply Voltage : 3 V with Re- verse Voltage Protection
• •••• Versatile sensitivity and hysteresis setting
• •••• Reliable and Rugged
• •••• TO-92M3 and SOT-89 packages

Applications

• •••• Revolution Counting APX9031 Magnetic Rank Handling Code Temp. Range Package Code Magnetic Rank A : l Bop , Brp l < 70Gauss B : l Bop , Brp l < 100 Gauss C : l Bop , Brp l < 150 Gauss Package Code E : TO - 92M D : SOT - 89 Temp. Range E: - 20 to 85 C Handling Code PB : Plastic Bag TR : Tape & Reel

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw2 Gnd Output APX9031 Reverse Voltage Protection Temperature Compensated Voltage Regulator Hall Element Current Amplifier Latch Circuit Output Buffer Hysteresis Control Sensitivity Control VDD Block Diagram APX9031Symbol Parameter Test Condition Min. Typ. Max. Unit VDD Supply Voltage Operating 3 20 V VSAT Output Saturation Voltage I OUT=20mA, B>Bop 0.2 V IDD Supply Current V DD=20V, B<Brp 3.5 6 mA ILeak Output Leakage Current V OUT=20V, B<Brp 0.5 2 µA tr a Output Rise Time 0.6 µs tf a Output Fall Time VDD=12V, RL=820Ω /G2C/G20CL=20pF 0.3 µs Symbol Parameter Rating Unit VDD Supply Voltage 20 V IDD Supply Current 8 mA IO Output Current 20 mA PD Maximum Power Dissipation 400 mW TA Operating Ambient Temperature -20 to 85 TSTG Storage Temperature Range -55 to 150 TS Soldering Temperature (10 seconds) 260 Absolute Maximum Ratings TA = 25°C unless otherwise noted Notes a : use Figure 1 TA = 25°C, VDD=12V unless otherwise notedElectical Characteristics

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw3 Rank Maximum Operate Point Bop Maximum Release Point Brp Unit A+ 7 0 - 7 0 B +100 -100 C +150 -150 Gauss Magnetic Characteristics TA = 25°C, VDD=12V unless otherwise noted Definition of Magnetic Switching Points and Hysteresis Bop max.Brp min. 0 BHYS Output Voltage VDD ScopeRL CL VDD APX9031 Signal Generator Figure 1 : Switching Circuit for Output Rise Time and Fall Time Measurement Test Information

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw4 231 VDD APX9031 L1 L2 C1 C2 Q1 Q2 VDD Application Circuit Figure 2 Typical DC brushless fan application circuit -30 -20 -10 0 10 20 30 -10 100 125 150 175 200 0 5 10 15 20 Typical Characteristics Supply Current Vs Supply Voltage Supply Voltage - V Supply Current - mA Output Low Voltage Vs Supply Voltage Supply Voltage - V Output Low Voltage - mV TA= 25°C TA= 25°C

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw5 -20 0 20 40 60 80 100 100 125 150 175 200 225 IOUT=20mA VDD=20V -20 0 20 40 60 80 100 VDD=20V Output Low Voltage vs Ambient Temperature Temperature - °C Output Low Voltage- mV Supply Current vs Temperature Temperature - °C Supply Current - mA Typical Characteristics Cont. 0 51 0 15 20-100 -75 -50 -25 100 Bop Brp IOUT=20mA Magnetic Switch Points vs Supply Voltage Supply Voltage - V Magnetic Switch Points - G -200 -150 -100 -50 100 150 200 -20 0 20 40 60 80 100 Bop Brp IOUT=20mA VDD=20V Magnetic Switch Points vs Temperature Magnetic Switch Points - G Temperature - °C TA= 25°C

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw6

Package Information

A S C B OVERLOOK E H e F PIN 1 : VDD PIN 2 : GND PIN 3 : OUTPUT FRONT H 2.05mm 1.30mm D Position of Hall Sensor reference to the top-left of package X= 1.30 0.1mm Y= 2.05 0.1mm Millimeters Inches Dim Min. Max. Min. Max. A 1.40 1.60 0.055 0.063 10 11 0.394 0.433B 14 15 0.551 0.591 C 0.35 0.41 0.014 0.016 D 2.80 3.20 0.110 0.126 e 1.24 1.30 0.049 0.051 E 3.90 4.30 0.154 0.169 F 2.34 2.64 0.092 0.104 G 4.04 4.24 0.159 0.167 H 0.35 0.41 0.014 0.016 I 2.51 2.57 0.099 0.101 S 0.63 0.81 0.025 0.032 φ 15 ° 5° φ 23 ° 3° φ 34 5 ° 45°

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw7 Packaging Information SOT-89 ( Reference EIAJ ED-7500A Registration SC-62) Millimeters InchesDim Min. Max. Min. Max. A 1.40 1.60 0.055 0.063 B 0.40 0.56 0.016 0.022 B1 0.35 0.48 0.014 0.019 C 0.35 0.44 0.014 0.017 D 4.40 4.60 0.173 0.181 D1 1.35 1.83 0.053 0.072 e 1.50 BSC 0.059 BSC e1 3.00 BSC 0.118 BSC E 2.29 2.60 0.090 0.102 H 3.75 4.25 0.148 0.167 L 0.80 1.20 0.031 0.047 α 10° 10° D e B 123 L H E α A C α

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw8 Reference JEDEC Standard J-STD-020A APRIL 1999 Reflow Condition (IR/Convection or VPR Reflow) Physical Specifications Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Packaging 1000 devices per reel Pre-heat temperature 183 C Peak temperature Time temperature Classification Reflow Profiles Convection or IR/ Convection VPR Average ramp-up rate(183 °C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25 °C) 120 seconds max Temperature maintained above 183 °C 60 – 150 seconds Time within 5°C of actual peak temperature 10 –20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0 °C 215-219 °C or 235 +5/-0 °C Ramp-down rate 6 °C /second max. 10 °C /second max. Time 25°C to peak temperature 6 minutes max. Package Reflow Conditions pkg. thickness ≥≥≥≥ 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw9 Carrier Tape & Reel Dimensions Reliability test program Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C , 5 SEC HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @ 125 °C PCT JESD-22-B, A102 168 Hrs, 100 % RH , 121 °C TST MIL-STD-883D-1011.9 -65°C ~ 150 °C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms , I tr > 100mA A J B C t Ao E W Po P Ko Bo D F Application A B C J T1 T2 W P E - 0.1 8± 0.1 1.75 ± 0.1 Application F D D1 Po P1 Ao Bo Ko t (mm)

Copyright  ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APX9031 www.anpec.com.tw10 Cover Tape Dimensions Carrier Width 12 Cover Tape Width 9.3 (mm) Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 24F-1. No. 268, Sec. 2, PeiHsin Rd. HsinDian, Taipei County, Taiwan, R. O. C. Tel : 886-2-86658533 Fax : 886-2-86658529 Customer Service