APR3001_08 ANPEC | Alldatasheet

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Technical content

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw1 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. MicroPower Microprocessor Reset Circuit

  • 1.2V to 6V Input Voltage Range
  • Low Quiescent Current : less than 1.5 mA
  • High Accuracy Detection Threshold : ±1.5%
  • Fixed Trimmed Reset Thresholds for 1.5V, 1.75V,
  • Reset Timeout Period 250ms
  • Available Output Configurations - Open-Drain Output - CMOS Active High Output - CMOS Active Low Output
  • SOT-23, SOT-23-5, and SOT-89 Packages
  • No External Components
  • Lead Free and Green Devices Available (RoHS Compliant) Features General Description

Applications

  • Computers
  • Cell Phones
  • Portable Electronics
  • mP Power Supply Monitoring The APR3001/2/3 are designed to monitor voltage sup- plies in µP and digital systems. The quiescent current is extremely low, typically 1.5 µA, making it ideal for portable battery operated equipment. The APR3001/2/3 are oper- ated by monitoring the system power supply voltage. When the input voltage drops below a fixed threshold, the device asserts a reset signal for a fixed time period after Vcc rises above the fixed threshold. The APR3001/2/3 series are available with three output stage versions : APR3001 push-pull active low output, APR3002 push- pull active high output and APR3003 open drain active low output. They are also designed to reject fast line transient glitches on Vcc. The APR3001/2/3 come in a miniature SOT-23, SOT-23-5, and SOT-89 packages. Pin Configuration SOT-23 (Top View) Reset 1 2 GND V CC Reset (3001/3) (3002) SOT-23-5 (Top View) SOT-89 (Top View) VCC GND NCNC 1 2 3 Reset Reset (3001/3) (3002) GNDVCC 21 3 Reset Reset (3001/3) (3002)

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw2 Package Code A : SOT-23 B : SOT-23-5 D : SOT-89 Temperature Range I : -40 to 85 C Handling Code TR : Tape & Reel Voltage Code : 15 : 1.5V ~ 43 : 4.38V Assembly Material L : Lead Free Device G : Halogen and Lead Free Device APR3001/2/3 - Handling Code Temperature Range Package Code Voltage Code Date CodeX X Voltage Code 01/2/3 APR3001/2/3 XXXXX 15APR3001/2/3 -15 D : APR3001/2/3 A/B : ° Assembly Material Symbol Parameter Rating Unit VCC VCC to GND -0.3 to 6 V RESET to GND (Push-Pull Output) -0.3 to VCC +0.3 VRESET RESET to GND (Open Drain Output) -0.3 to 6 V IMAX Maximum Continuous Input Current 20 mA IRESET RESET/RESET Current 20 mA dVcc/dt Rate of Rise of VCC 100 V/µs TJ Junction Temperature Range -40 to 150 °C TL Lead Soldering Temperature, 10 Seconds 260 °C SOT-23 357 SOT-23-5 357 RTH,JA Thermal Resistance – Junction to Ambient SOT-89 180 °C/W PD Power Dissipation Internally Limited W Ordering and Marking Information Absolute Maximum Ratings Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Part Number Description PART NUMBER PART DESCRIPTION APR3001 Reset Output Push Pull Active Low with Delay APR3002 Reset Output Push Pull Active High with Delay APR3003 Reset Output Open Drain Active Low with Delay

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw3 PIN NO. NAME FUNCTION RESET (APR3001/3) RESET output remains low while VCC is below the reset threshold and remains so for a fixed time period after VCC raises above the reset threshold

1 RESET

(APR3002) RESET output remains high while VCC is below th e reset threshold and remains so for a fixed time period after VCC raises above the reset threshold.

2 GND Ground connection

3 VCC Supply Voltage (+1.2V to +6V) Pin Description

Electrical Characteristics

VIN = 5V, TA = -40 to 85°C unless otherwise noted. Typical values are at TA=25°C, VCC = 5V for 4.38V versions, VCC = versions , VCC = 1.8V for 1.5V versions. APR3001/2/3 Symbol Parameter Test Conditions Min. Typ. Max. Unit VCC Supply Voltage 1.2 - 6 V ICC Supply Current VCC=1.5V~6V - 1.5 4 µA T A=-40 to 85°C - 3 5 T A=25°C - ±1.5% - VTH Reset Threshold VHYST Hysteresis Range - 20 - mV TRTP Reset Timeout Period 150 250 350 ms VOL Reset Output Low ISINK=1.2mA - - 0.5 V VOH Reset Output High ISOURCE=0.6mA 0.8*VCC - - TD VCC to Reset Delay VCC=VTH to (VTH-100mV) - 25 - µS ILE Reset Output Leakage - - 0.5 µA VCC VCC GND 100k APR3003 RESET RESET INPUT µP VCC GND VCC VCC GND RESET (RESET) RESET INPUT µP VCC GND APR3001 APR3002 Typical Application Circuit Note: The pin sequence here might not be correct for all different package types, and please refer pin configuration in page1 for correct pin assignment.

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw4 Block Diagram Vc c GND VREF Reset Generator + Timer Oscillator RESET APR3001 Vc c GND VREF Reset Generator + Timer Oscillator RESET APR3002 Vc c GND VREF Reset Generator + Timer Oscillator RESET APR3003

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw5 Timing Chart Vcc RESET Reset Timeout Period 250ms Vcc to Reset Delay 25us Reset Threshold Reset Threshold RESET (APR3002) (APR3001/3)

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw6 0 1 2 3 4 5 6 Vcc=2.9V Vcc=2V Vcc=2.5V Vcc=1.5 V 0 1 2 3 4 5 6 Vcc=4V Vcc=3V V Vcc=5V 0.4 0.8 1.2 1.6 0 1 2 3 4 5 6 100 120 10 100 1000 Typical Operating Characteristics Supply Current vs. Supply Voltage Supply Current ( µA) Supply Voltage (V) Maximum Transient Duration vs. Reset Threshold Overdrive VTH - VCC Maximum Transient Duration (µs) Reset Threshold Overdrive VTH - VCC (mV) Output Source Current vs. Reset High Output Voltage Output Source Current (mA) Reset High Output Voltage (V) Output Sink Current vs. Reset Low Output Voltage Output Sink Current (mA) Reset Low Output Voltage (V) generate a reset signal never generate a reset signal

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw7 0.994 0.996 0.998 1.002 1.004 1.006 1.008 -40 -20 0 20 40 60 80 100 120 0.5 1.5 2.5 3.5 -40 -20 0 20 40 60 80 100 120 Vcc=3V Vcc=5V 100 200 300 400 500 600 -40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120 VOD=100mV Typical Operating Characteristics (Cont.) Normalized Reset Threshold vs. Temperature Normalized Reset Threshold (%) Temperature (°C) Reset Propagation Delay vs. Temperature Reset Propagation Delay (µs) Temperature (°C) Reset Timeout Period vs. Temperature Reset Timeout Period (ms) Temperature (°C) Supply Current vs. Temperature Supply Current ( µA) Temperature (°C)

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw8 Power Up Power Down Time (200ms/div) Vcc to RESET Delay Vcc(0.5V/div) Vcc=VTH to (VTH-100mV) RESET(2V/div) Time (10µs/div) Vcc(2V/div) RESET(2V/div) Vcc(2V/div) RESET(2V/div) Time (50ms/div) Typical Operating Characteristics (Cont.)

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw10

Package Information

0.25 GAUGE PLANE SEATING PLANE A A2A1 e D E SEE VIEW A b c MAX. 0.057 0.051 0.024 0.006 0.009 0.0200.012 L 0.30 e E D c b 0.08 0.30 0.60 0.012

0.95 BSC

1.90 BSC

0.22 0.50

0.037 BSC

0.075 BSC

0.003 MIN. MILLIMETERS SYMBOL A 0.00 0.90 SOT-23-3 MAX. 1.45 0.15 1.30 MIN. 0.000 0.035 INCHES °8°0 °8°0 1.40 2.60 1.80 3.00 2.70 3.10 0.122 0.071 0.1180.102 0.055 0.106 Note : Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw11 MAX. 0.057 0.051 0.024 0.006 0.009 0.0200.012 L 0.30 e E D c b 0.08 0.30 0.60 0.012 0.22 0.50 0.003 MIN. MILLIMETERS SYMBOL A 0.00 0.90 SOT-23-5 MAX. 1.45 0.15 1.30 MIN. 0.000 0.035 INCHES °8°0 °8°0 b c VIEW A 0.25 GAUGE PLANE SEATING PLANE A A2A1 e D E SEE VIEW A 1.40 2.60 1.80 3.00 2.70 3.10 0.122 0.071 0.1180.102 0.055 0.106 Note : 1. Follow JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw12 SYMBO MIN. MAX. MILLIMETERS SOT-89 MIN. MAX. INCHES A C e BB1 D H EL 1.60 0.44 0.35 0.44 4.40 4.60 1.62 1.83 0.56 2.13 A B C D E e B1 0.36 0.48

3.00 BSC

3.94 4.25 2.29 2.60 2.29

0.118 BSC

0.063 0.017 0.014 0.019 0.014 0.017 0.173 0.181 0.064 0.072 0.084 0.155 0.167 0.090 0.102 0.090 0.022 L 0.89 0.035 H 1.50 BSC 0.059 BSC 1.40 1.20 0.047 0.055 L Note : Follow JEDEC TO-243 AA.

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw13 Application A H T1 C d D W E1 F -0.00 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-3 Application A H T1 C d D W E1 F -0.00 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-5 Application A H T1 C d D W E1 F -0.00 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 SOT- 89 (mm) Carrier Tape & Reel Dimensions A AB W F T P0OD0 B SECTION B-B SECTION A-A OD1 H A d

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw14 Package Type Unit Quantity SOT-23-3 Tape & Reel 3000 SOT-23-5 Tape & Reel 3000 SOT-89 Tape & Reel 1000 Devices Per Unit Taping Direction Information SOT-23-3 USER DIRECTION OF FEED SOT-23-5 USER DIRECTION OF FEED SOT-89 USER DIRECTION OF FEED

Copyright  ANPEC Electronics Corp. Rev. A.4 - Dec., 2008 APR3001/2/3 www.anpec.com.tw15 Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C, 5 sec HOLT MIL-STD-883D-1005.7 1000 Hrs Bias @125°C PCT JESD-22-B,A102 168 Hrs, 100%RH, 121°C TST MIL-STD-883D-1011.9 -65°C~150°C, 200 Cycles ESD MIL-STD-883D-3015.7 VHBM > 2KV, VMM > 200V Latch-Up JESD 78 10ms, 1tr > 100mA Reflow Condition (IR/Convection or VPR Reflow) t 25 C to Peak tp Ramp-up tL Ramp-down ts Preheat Tsmax Tsmin TL TP Temperature Time Critical Zone TL to TP Reliability Test Program Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak/Classification Temperature (Tp) See table 1 See table 2 Time within 5°C of actual Peak Temperature (tp) 10-30 seconds 20-40 seconds Ramp-down Rate 6°C/second max. 6°C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface.

Copyright  ANPEC Electronics Corp. Table 2. Pb-free Process – Package Classification Reflow Temperatures Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures