APM9966OC-TR

APM9966 ANPEC | Alldatasheet

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Dual N-Channel Enhancement Mode MOSFET Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw1 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. APM9966/C Features Applications

• SOP-8 20V/6A , R DS(ON)=19mΩ (typ.) @ VGS=4.5V R DS(ON)=27mΩ (typ.) @ VGS=2.5V TSSOP-8 20V/6A , R DS(ON)=21mΩ (typ.) @ VGS=4.5V R DS(ON)=29mΩ (typ.) @ VGS=2.5V
• •••• Super High Dense Cell Design for Extremely Low RDS(ON)
• •••• Reliable and Rugged
• •••• SO-8 and TSSOP-8 Packages
• Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems. Pin Description SO-8 TSSOP-8 8S1 G2 D2 8D1 G1 G2 D2 D2 SO-8 TSSOP-8 8S1 G2 D D D D G1 G2 D D D D D APM9966 APM9966C D1 D1

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw2 APM9966/C Absolute Maximum Ratings (TA = 25°C unless otherwise noted) Symbol Parameter Rating Unit VDSS Drain-Source Voltage 20 VGSS Gate-Source Voltage ±10 V ID * Maximum Drain Current – Continuous 6 IDM Maximum Drain Current – Pulsed 20 A SO-8 1.6 TA=25°C TSSOP-8 1.0 SO-8 0.625 PD Maximum Power Dissipation TA=100°C TSSOP-8 0.4 W TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -55 to 150 °C RθjA Thermal Resistance – Junction to Ambient 50 °C/W * Surface Mounted on FR4 Board, t ≤ 10 sec. Ordering and Marking Information APM9966/C Handling Code Temp. Range Package Code Package Code K : SO-8 O : TSSOP-8 Operation Junction Temp. Range C : -55 to 150 C Handling Code TR : Tape & Reel APM9966/C K/O : APM9966/C XXXXX XXXXX - Date Code

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw3 APM9966/C APM9966/CSymbol Parameter Test Condition Min. Typ. Max. Unit Static BVDSS Drain-Source Breakdown Voltage VGS=0V , IDS=250µA 20 V IDSS Zero Gate Voltage Drain Current V DS=16V , VGS=0V 1 µA VGS(th) Gate Threshold Voltage VDS=VGS , IDS=250µA 0.5 0.7 1 V IGSS Gate Leakage Current VGS=±10V , VDS=0V ±100 nA VGS=4.5V , IDS=6A 19 23 SOP-8 VGS=2.5V , IDS=5.2A 27 33 VGS=4.5V , IDS=6A 21 25 RDS(ON) a Drain-Source On-state Resistance TSSOP-8 VGS=2.5V , IDS=5.2A 29 35 mΩ VSD a Diode Forward Voltage I SD=1.7A , VGS=0V 0.8 1.1 V Dynamicb Qg Total Gate Charge 14 18 Qgs Gate-Source Charge 3.5 Qgd Gate-Drain Charge VDS=10V , IDS= 1A VGS=4.5V , 2.1 nC td(ON) Turn-on Delay Time 25 47 Tr Turn-on Rise Time 22 42 td(OFF) Turn-off Delay Time 67 122 Tf Turn-off Fall Time VDD=10V , IDS=1A , VGEN=4.5V , RG=0.2Ω 36 67 ns Ciss Input Capacitance 780 Coss Output Capacitance 165 Crss Reverse Transfer Capacitance VGS=0V VDS=15V Frequency=1.0MHz 105 pF Notes a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% b : Guaranteed by design, not subject to production testing Electrical Characteristics (Cont.) (TA = 25°C unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw4 APM9966/C 048 1 2 1 6 2 0 0.00 0.01 0.02 0.03 0.04 0.05 -50 -25 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 012345 Typical Characteristics 0.5V Threshold Voltage vs. Junction Temperature Tj - Junction Temperature (°C) VGS(th)-Threshold Voltage (V) (Normalized) IDS=250uA RDS(ON)-On-Resistance (Ω ) On-Resistance vs. Drain Current ID - Drain Current (A) VGS=2.5V Output Characteristics ID-Drain Current (A) VDS - Drain-to-Source Voltage (V) VGS=4.5V SOP-8 ID-Drain Current (A) Transfer Characteristics TJ=-55°C TJ=25°C TJ=125°C VGS - Gate-to-Source Voltage (V)

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw5 APM9966/C 0123456789 1 0 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 0123456789 1 0 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 0 4 8 1 21 62 0 0.00 0.01 0.02 0.03 0.04 0.05 Typical Characteristics (Cont.) RDS(ON)-On-Resistance (Ω ) On-Resistance vs. Drain Current ID - Drain Current (A) VGS=2.5V VGS=4.5V TSSOP-8 VGS - Gate-to-Source Voltage (V) RDS(ON)-On-Resistance (Ω ) ID=6A On-Resistance vs. Gate-to-Source Voltage -50 -25 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 RDS(ON)-On-Resistance (Ω ) (Normalized) On-Resistance vs. Junction Temperature VGS=4.5V ID=6A TJ - Junction Temperature (°C)VGS - Gate-to-Source Voltage (V) RDS(ON)-On-Resistance (Ω ) ID=6A On-Resistance vs. Gate-to-Source Voltage TSSOP-8 SOP-8

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw6 APM9966/C 0 2 4 6 8 1 01 21 41 6 048 1 2 1 6 2 0 200 400 600 800 1000 1200 Typical Characteristics (Cont.) VDS - Drain-to-Source Voltage (V) Capacitance Capacitance (pF) Coss Ciss Crss Gate Charge QG - Gate Charge (nC) VGS-Gate-Source Voltage (V) VDS=10V ID=1A Frequency=1MHz 0.1 Source-Drain Diode Forward Voltage IS-Source Current (A) TJ=150°C TJ=25°C VSD -Source-to-Drain Voltage (V) 0.01 0.1 1 10 Power (W) Single Pulse Power Time (sec)

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw7 APM9966/C Typical Characteristics (Cont.) 1E-4 1E-3 0.01 0.1 1 10 0.01 0.1 Square Wave Pulse Duration (sec) Normalized Effective Transient Thermal Impedance Normalized Thermal Transient Impedence, Junction to Ambient 1.Duty Cycle, D=t1/t2 2.Per Unit Base=R thJA=50°C/W 3.TJM-TA=PDMZthJA Duty Cycle=0.5 D=0.2 D=0.1 D=0.05 D=0.02 SINGLE PULSE

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw8 APM9966/C Packaging Information Millimeters InchesDim Min. Max. Min. Max. A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC φ 18 ° 8° HE e1 e2 0.015X45 D AA1 0.004max. L SOP-8 pin ( Reference JEDEC Registration MS-012)

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw9 APM9966/C Millimeters InchesDim Min. Max. Min. Max. A 1.2 0.047 A1 0.00 0.15 0.000 0.006 A2 0.80 1.05 0.031 0.041 b 0.19 0.30 0.007 0.012 D 2.9 3.1 0.114 0.122 e 0.65 BSC 0.026 BSC E 6.40 BSC 0.252 BSC E1 4.30 4.50 0.169 0.177 L 0.45 0.75 0.018 0.030 L1 1.0 REF 0.039REF R 0.09 0.004 R1 0.09 0.004 S 0.2 0.008 φ10 ° 8° 0° 8° φ21 2 ° REF 12 ° REF φ31 2 ° REF 12 ° REF L (L1) (3 ) S (2 ) 0.25 GAUGE PLANE b D e 2 x E / 2 12 e/2 E1 E A TSSOP-8 Packaging Information (Cont.)

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw10 APM9966/C Reflow Condition (IR/Convection or VPR Reflow) Physical Specifications Pre-heat temperature 183 C Peak temperature Time temperature Classification Reflow Profiles Convection or IR/ Convection VPR Average ramp-up rate(183 °C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25 °C) 120 seconds max Temperature maintained above 183 °C 60 – 150 seconds Time within 5°C of actual peak temperature 10 –20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0 °C 215-219 °C or 235 +5/-0 °C Ramp-down rate 6 °C /second max. 10 °C /second max. Time 25°C to peak temperature 6 minutes max. Package Reflow Conditions pkg. thickness ≥≥≥≥ 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw11 APM9966/C Carrier Tape & Reel Dimensions Application A B C J T1 T2 W P E 330 ± 16 2 + 1 . 5 12.75+ F D D1 Po P1 Ao Bo Ko tSOP- 8 Application A B C J T1 T2 W P E 330 ± 16 2 + 1 . 5 12.75+ F D D1 Po P1 Ao Bo Ko tTSSOP-8 A J B C t Ao E W Po P Ko Bo D F Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability test program

Copyright  ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 www.anpec.com.tw12 APM9966/C Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Cover Tape Dimensions Application Carrier Width Cover Tape Width Devices Per Reel SOP- 8 12 9.3 2500 TSSOP- 8 12 9.3 2500