APM9410 ANPEC | Alldatasheet

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Technical content

Features

Applications

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

  • 30V/8A , RDS(ON)=15mΩ (typ.) @ VGS=10V R DS(ON)=23mΩ (typ.) @ VGS=4.5V
  • •••• Super High Dense Cell Design for Extremely Low RDS(ON)
  • •••• Reliable and Rugged
  • Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems. Symbol Parameter Rating Unit VDSS Drain-Source Voltage 30 VGSS Gate-Source Voltage ±20 V ID * Maximum Drain Current – Continuous 8 IDM Maximum Drain Current – Pulsed 32 A * Surface Mounted on FR4 Board, t ≤ 10 sec. Pin Description SO-8 Top View S S GD D D D N-Channel MOSFET G S D

Copyright  ANPEC Electronics Corp. Rev. A.5 - Feb., 2003 www.anpec.com.tw2 APM9410 Notes a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% b : Guaranteed by design, not subject to production testing Electrical Characteristics (TA = 25°C unless otherwise noted) Absolute Maximum Ratings (Cont.) (TA = 25°C unless otherwise noted) APM9410Symbol Parameter Test Condition Min. Typ. Max. Unit Static BVDSS Drain-Source Breakdown Voltage VGS=0V , IDS=250µA 30 V VDS=24V , VGS=0V 1IDSS Zero Gate Voltage Drain Current VDS=24V, VGS=0V, Tj= 55°C 5 µA VGS(th) Gate Threshold Voltage VDS=VGS , IDS=250µA 11 . 52 V IGSS Gate Leakage Current VGS=±20V , VDS=0V ±100 nA VGS=10V , IDS=4A 15 20RDS(ON) a Drain-Source On-state Resistance VGS=4.5V , IDS=2A 23 32 mΩ VSD a Diode Forward Voltage I SD=2A , VGS=0V 0.7 1.3 V Dynamicb Qg Total Gate Charge 15 20 Qgs Gate-Source Charge 5.8 Qgd Gate-Drain Charge VDS=15V , IDS= 10A VGS=5V , 3.8 nC td(ON) Turn-on Delay Time 11 18 Tr Turn-on Rise Time 17 26 td(OFF) Turn-off Delay Time 37 54 Tf Turn-off Fall Time VDD=15V , IDS=2A , VGEN=10V , RG=6Ω 20 30 ns Ciss Input Capacitance 1200 Coss Output Capacitance 220 Crss Reverse Transfer Capacitance VGS=0V VDS=15V Frequency=1.0MHz 100 pF Symbol Parameter Rating Unit TA=25°C 2.5 WPD Maximum Power Dissipation TA=100°C 1.0 W TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -55 to 150 °C RθjA Thermal Resistance – Junction to Ambient 50 °C/W

Copyright  ANPEC Electronics Corp. Rev. A.5 - Feb., 2003 www.anpec.com.tw3 APM9410 0 5 10 15 20 25 30 0.000 0.005 0.010 0.015 0.020 0.025 0.030 0.035 0.040 Typical Characteristics 0 1 23 456789 1 0 Output Characteristics VDS-Drain-to-Source Voltage (V) IDS-Drain Current (A) VG=4,4.5,6,8,10V VGS=2.5V VGS=3V VGS=3.5V Transfer Characteristics VGS-Gate-to-Source Voltage (V) IDS-Drain Current (A) -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 Threshold Voltage vs. Junction Temperature Tj-Junction Temperature (°C) VGS(th)-Threshold Voltage (V) (Normalized) On-Resistance vs. Drain Current IDS-Drain Current (A) VGS=10V VGS=4.5V IDS=250µA TJ=125°C TJ=25°C TJ=-55°C RDS(on)-On-Resistance (Ω )

Copyright  ANPEC Electronics Corp. Rev. A.5 - Feb., 2003 www.anpec.com.tw4 APM9410 Typical Characteristics (Cont.) 345 6 78 9 1 0 0.000 0.005 0.010 0.015 0.020 0.025 0.030 0.035 0.040 0.045 -50 -25 0 25 50 75 100 125 150 0.6 0.8 1.0 1.2 1.4 1.6 On-Resistance vs. Gate-to-Source Voltage On-Resistaence vs. Junction Temperature RDS(on)-On-Resistance (Ω ) (Normalized) Gate Voltage (V) T j-Junction Temperature (°C) IDS=4A VGS=10V IDS=4A 100 1000 2000 500 300.1 1 10 Capacitance Characteristics VDS-Drain-to-Source Voltage (V) C-Capacitance (pF) Crss Coss Ciss Frequency=1MHz RDS(on)-On-Resistance (Ω ) 0 5 10 15 20 25 30 Gate Charge QG-Total Gate Charge (nC) VGS-Gate-to-Source Voltage (V) VDS=15V IDS=10A

Copyright  ANPEC Electronics Corp. Rev. A.5 - Feb., 2003 www.anpec.com.tw5 APM9410 Typical Characteristics (Cont.) Time (sec) Single Pulse Power Power (W) Rthjc = 2 °C/W 0.01 0.1 Square Wave Pulse Duration (sec) Normalized Effective Transient Thermal Impedance 1. Duty Cycle , D=t1/t2 2. Per Unit Base=RthJA=50°C/W 3. TJM-TA=PDMZthJA 4. Surface Mounted D=0.02 D=0.05 D=0.1 D=0.2 Duty Cycle=0.5 SINGLE PULSE 0.1 100 Source-Drain Diode Forward Voltage ISD-Source Current (A) VSD-Source to Drain Voltage TJ=-55°C TJ=25°C TJ=125°C Normalized Transient Thermal Transient Impedence, Junction to Ambient

Copyright  ANPEC Electronics Corp. Rev. A.5 - Feb., 2003 www.anpec.com.tw6 APM9410 Packaging Information Millimeters InchesDim Min. Max. Min. Max. A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC φ 18 ° 8° HE e1 e2 0.015X45 D AA1 0.004max. L SOP-8 pin ( Reference JEDEC Registration MS-012)

Copyright  ANPEC Electronics Corp. Rev. A.5 - Feb., 2003 www.anpec.com.tw7 APM9410 Reference JEDEC Standard J-STD-020A APRIL 1999 Reflow Condition (IR/Convection or VPR Reflow) Physical Specifications Pre-heat temperature 183 C Peak temperature Time temperature Classification Reflow Profiles Convection or IR/ Convection VPR Average ramp-up rate(183 °C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25 °C) 120 seconds max Temperature maintained above 183 °C 60 – 150 seconds Time within 5°C of actual peak temperature 10 –20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0 °C 215-219 °C or 235 +5/-0 °C Ramp-down rate 6 °C /second max. 10 °C /second max. Time 25°C to peak temperature 6 minutes max. Package Reflow Conditions pkg. thickness ≥≥≥≥ 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp. Rev. A.5 - Feb., 2003 www.anpec.com.tw8 APM9410 Carrier Tape & Reel Dimensions A J B C t Ao E W Po P Ko Bo D F Application A B C J T1 T2 W P E 330 ± 1 62 +1.5 12.75+ F D D1 Po P1 Ao Bo Ko tSOP- 8 Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability test program

Copyright  ANPEC Electronics Corp. Rev. A.5 - Feb., 2003 www.anpec.com.tw9 APM9410 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Cover Tape Dimensions Application Carrier Width Cover Tape Width Devices Per Reel SOP- 8 12 9.3 2500