APM6928 ANPEC | Alldatasheet

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Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

  • 30V/4A , RDS(ON)=15mΩ (typ.) @ VGS=10V R DS(ON)=25mΩ (typ.) @ VGS=4.5V
  • •••• Super High Dense Cell Design for Extremely Low RDS(ON)
  • •••• Reliable and Rugged
  • Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems. APM6928 Handl ing Code Temp. Range Package Code Package Code O : TS S O P -8 Operation Junction Temp. Range C : -55 to 150 C Handl ing Code TR : Tape & R eel APM6928 O : APM6928 XXXXX XXXXX - Dat e Code TSSOP-8 Top View N-Channel MOSFET Symbol Parameter Rating Unit VDSS Drain-Source Voltage 30 VGSS Gate-Source Voltage ±20 V ID * Maximum Drain Current – Continuous 4 IDM Maximum Drain Current – Pulsed 20 A * Surface Mounted on FR4 Board, t ≤ 10 sec. 8D1 G1 G2

Copyright  ANPEC Electronics Corp. Rev. A.1 - Jan., 2002 www.anpec.com.tw2 APM6928 Notes a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% b : Guaranteed by design, not subject to production testing Absolute Maximum Ratings Cont. (TA = 25°C unless otherwise noted) Symbol Parameter Rating Unit PD Maximum Power Dissipation TA=25°C 1.0 W TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -55 to 150 °C RθjA Thermal Resistance – Junction to Ambient 125 °C/W APM6928Symbol Parameter Test Condition Min. Typ. Max. Unit Static BVDSS Drain-Source Breakdown Voltage VGS=0V , IDS=250µA 30 V VDS=24V , VGS=0V 1IDSS Zero Gate Voltage Drain Current VDS=24V, VGS=0V, Tj= 55°C 5 µA VGS(th) Gate Threshold Voltage VDS=VGS , IDS=250µA 13 V IGSS Gate Leakage Current VGS=±20V , VDS=0V ±100 nA VGS=10V , IDS=4A 20 30RDS(ON) a Drain-Source On-state Resistance VGS=4.5V , IDS=3.4A 35 45 mΩ VSD a Diode Forward Voltage I SD=1.25A , VGS=0V 0.73 1.2 V Dynamicb Qg Total Gate Charge 15 20 Qgs Gate-Source Charge 5.8 Qgd Gate-Drain Charge VDS=15V , IDS= 10A VGS=5V , 3.8 nC td(ON) Turn-on Delay Time 11 18 Tr Turn-on Rise Time 17 26 td(OFF) Turn-off Delay Time 37 54 Tf Turn-off Fall Time VDD=15V , IDS=2A , VGEN=10V , RG=6Ω 20 30 ns Ciss Input Capacitance 1150 Coss Output Capacitance 230 Crss Reverse Transfer Capacitance VGS=0V VDS=15V Frequency=1.0MHz 100 pF Electrical Characteristics (TA = 25°C unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.1 - Jan., 2002 www.anpec.com.tw3 APM6928 Typical Characteristics Tj-Junction Temperature (°C) 012345 Transfer Characteristics VGS-Gate-to-Source Voltage (V) IDS-Drain Current (A) TJ=125°C TJ=25°C TJ=55°C -50 -25 0 25 50 75 100 125 150 0.6 0.7 0.8 0.9 1.0 1.1 1.2 Threshold Voltage vs. Junction TemperatureVGS(th)-Variance (V) IDS=250µA 0 5 10 15 20 0.00 0.01 0.02 0.03 0.04 0.05 On-Resistance vs. Drain Current IDS-Drain Current (A) RDS(ON)-On-Resistance (Ω ) VGS=10V VGS=4.5V 02468 1 0 Output Characteristics VDS-Drain-to-Source Voltage (V) IDS-Drain Current (A) VGS=3V

Copyright  ANPEC Electronics Corp. Rev. A.1 - Jan., 2002 www.anpec.com.tw4 APM6928 Typical Characteristics 2468 1 00.00 0.02 0.04 0.06 0.08 0.10 0.12 VGS - Gate-to-Source Voltage (V) RDS(ON)-On-Resistance (Ω ) On-Resistance vs. Gate-to-Source Voltage ID=4A -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 RDS(ON)-On-Resistance (Ω ) (Normalized) On-Resistance vs. Junction Temperature TJ - Junction Temperature (°C) VGS=10V ID=4A 0 5 10 15 20 25 30 300 600 900 1200 1500 Coss VDS - Drain-to-Source Voltage (V) Capacitance Capacitance (pF) Crss Ciss 0 5 10 15 20 25 300 Gate Charge QG - Gate Charge (nC) VGS-Gate-Source Voltage (V) VDS=15V IDS=10A

Copyright  ANPEC Electronics Corp. Rev. A.1 - Jan., 2002 www.anpec.com.tw5 APM6928 Typical Characteristics Cont. 0.1 Source-Drain Diode Forward Voltage ISD-Source Current (A) VSD-Source to Drain Voltage (V) TJ=25°CTJ=150°C 0.01 0.1 1 10 Time (sec) Single Pulse Power Power (W) 1E-4 1E-3 0.01 0.1 1 10 0.01 0.1 Square Wave Pulse Duration (sec) Normalized Effective Transient Thermal Impedance 1. Duty Cycle , D=t1/t2 2. Per Unit Base=RthJA=125°C/W 3. TJM-TA=PDMZthJA 4. Surface Mounted D=0.02 D=0.05 D=0.1 D=0.2 Duty Cycle=0.5 SINGLE PULSE Normalized Transient Thermal Transient Impedence, Junction to Ambient

Copyright  ANPEC Electronics Corp. Rev. A.1 - Jan., 2002 www.anpec.com.tw6 APM6928 Packaging Information D A L e 3 e 1 E PDIP-8 pin ( Reference JEDEC Registration MS-001) Millimeters InchesDim Min. Max. Min. Max. A 5.33 0.210 A1 0.38 0.015 A2 2.92 3.68 0.115 0.145 D 9.02 10.16 0.355 0.400 e1 2.54BSC 0.100BSC e2 0.36 0.56 0.014 0.022 e3 1.14 1.78 0.045 0.070 E 7.62 BSC 0.300 BSC E1 6.10 7.11 0.240 0.280 E3 10.92 0.430 L 2.92 3.81 0.115 0.150 φ 11 5 ° 15°

Copyright  ANPEC Electronics Corp. Rev. A.1 - Jan., 2002 www.anpec.com.tw7 APM6928 Physical Specifications Reference JEDEC Standard J-STD-020A APRIL 1999 Reflow Condition (IR/Convection or VPR Reflow) Pre-heat temperature 183 C Peak temperature Time temperature Classification Reflow Profiles Convection or IR/ Convection VPR Average ramp-up rate(183°C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) 120 seconds max Temperature maintained above 183°C 60 – 150 seconds Time within 5°C of actual peak temperature 10 –20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C 215-219 °C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 10 °C /second max. Time 25°C to peak temperature 6 minutes max. Package Reflow Conditions pkg. thickness ≥≥≥≥ 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp. Rev. A.1 - Jan., 2002 www.anpec.com.tw8 APM6928 Application A B C J T1 T2 W P E F D D1 Po P1 Ao Bo Ko tTSSOP-8 ( m m ) Carrier Tape A J B C t Ao E W Po P Ko Bo D F Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability test program

Copyright  ANPEC Electronics Corp. Rev. A.1 - Jan., 2002 www.anpec.com.tw9 APM6928 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Cover Tape Dimensions Application Carrier Width Cover Tape Width Devices Per Reel TSSOP- 8 12 9.3 2500