APM4220 ANPEC | Alldatasheet

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Absolute Maximum Ratings (TA = 25°C unless otherwise noted) Symbol Parameter Rating Unit VDSS Drain-Source Voltage 25 VGSS Gate-Source Voltage ±20 V ID * Maximum Drain Current – Continuous 14 IDM Maximum Drain Current – Pulsed 60 A * Surface Mounted on FR4 Board, t ≤ 10 sec. /G20

  • 25V/14A, RDS(ON)=7.5mΩ (typ.) @ VGS=10V R DS(ON)=10mΩ (typ.) @ VGS=4.5V
  • •••• Super High Dense Cell Design for Extremely Low RDS(ON)
  • •••• Reliable and Rugged N-Channel MOSFET G S D
  • Power Management in Desktop Computer or DC/DC Converters. S S GD D D D SO − 8 Pin Description

Copyright  ANPEC Electronics Corp. Rev. A.1 - Aug., 2002 APM4220 www.anpec.com.tw2 Symbol Parameter Rating Unit TA=25°C 2.5 PD Maximum Power Dissipation TA=100°C 1.0 W TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -55 to 150 °C RθJA * Thermal Resistance – Junction to Ambient 50 °C/W /G20 APM4220 Symbol Parameter Test Condition Min. Typ. Max. Unit Static BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA/G20 25 V IDSS Zero Gate Voltage Drain Current VDS=20V , VGS=0V /G20/G20 1 µA/G20 VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA/G20 1 1.5 2 V IGSS Gate Leakage Current V GS=±20V, VDS=0V /G20/G20 ±100/G20 nA VGS=10V, IDS=14A /G20 7.5 9 RDS(ON) a Drain-Source On-state Resistance VGS=4.5V,IDS=8A /G20 10 12 mΩ VSD a Diode Forward Voltage I S=16A, VGS=0V 0.7 1.2 V Dynamicb Qg Total Gate Charge 16 20 Qgs Gate-Source Charge 6 Qgd Gate-Drain Charge VDS=15V, IDS=14A VGS=4.5V, nC td(ON) Turn-on Delay Time 10 15 Tr Turn-on Rise Time 7 13 td(OFF) Turn-off Delay Time 35 50 Tf Turn-off Fall Time VDD=15V, IDS=1A, VGEN=10V,RG=6Ω , 10 20 ns Ciss Input Capacitance 1785 Coss Output Capacitance 605 Crss Reverse Transfer Capacitance VGS=0V VDS=15V Frequency=1.0MHz 490 pF /G20 Notes a : Guaranteed by design, not subject to production testing b : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% Electrical Characteristics (TA = 25°C unless otherwise noted) Absolute Maximum Ratings (Cont.) (TA = 25°C unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.1 - Aug., 2002 APM4220 www.anpec.com.tw3 0 1 02 03 04 05 06 0 0.004 0.006 0.008 0.010 0.012 0.014 VGS=10V VGS=4.5V 012345 Tj=125 o C Tj=25 o C Tj=-55 o C 02468 1 0 VGS=2.5V VGS=2V VGS=3V -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 Typical Characteristics Output Characteristics VDS-Drain-to-Source Voltage (V) IDS-Drain Current (A) Transfer Characteristics VGS-Gate-to-Source Voltage (V) ID-Drain Current (A) Threshold Voltage vs. Junction Temperature Tj-Junction Temperature (°C) VGS(th)-Thershold Voltage (V) (Normalized) IDS=250µA On-Resistance vs. Drain Current IDS-Drain Current (A) RDS(ON)-On-Resistance (Ω )

Copyright  ANPEC Electronics Corp. Rev. A.1 - Aug., 2002 APM4220 www.anpec.com.tw4 0 8 16 24 32 VDS=10 V IDS=14A 02468 1 0 0.000 0.005 0.010 0.015 0.020 0.025 0.030 ID= 14A -50 -25 0 25 50 75 100 125 150 0.6 0.8 1.0 1.2 1.4 1.6 Typical Characteristics (Cont.) On-Resistaence vs. Junction Temperature RDS(ON)-On-Resistance (Ω ) (Normalized) Tj-Junction Temperature (°C) VGS=10V IDS=14A On-Resistance vs. Gate-to-Source Voltage RDS (ON)-On-Resistance (Ω ) VGS-Gate-to-Source Voltage (V) Gate Charge QG-Total-Gate Charge (nC) VGS-Gate-to-Source Voltage (V) Capacitance (pF) VDS-Drain-to-Source Voltage (V) Capacitance 0 5 10 15 20 25 500 1000 1500 2000 2500 3000 Frequency=1MHz Crss Coss Ciss

Copyright  ANPEC Electronics Corp. Rev. A.1 - Aug., 2002 APM4220 www.anpec.com.tw5 1E-4 1E-3 0.01 0.1 1 10 30 0.01 0.1 Duty Cycle=0. D=0.2 D=0.1 D=0.05 D=0.02 D=0.01 0.01 0.1 1 10 30 0.1 Tj=125 o C Tj=25 o C Tj=-55 o C Typical Characteristics (Cont.) ISD-Source Current (A) VSD-Source to Drain Voltage (V) Source-Drain Diode Forward Voltage Single Pulse Power Power (W) Time (sec) Normalized Transient Thermal Transient Impedence, Junction to Ambient Normalized Effective Transient Thermal Impedance Square Wave Pulse Duration (sec) 1. Duty Cycle , D=t1/t2 2. Per Unit Base=RthJA=50°C/W 3. TJM-TA=PDMZthJA 4. Surface MountedSINGLE PULSE

Copyright  ANPEC Electronics Corp. Rev. A.1 - Aug., 2002 APM4220 www.anpec.com.tw6 Millimeters InchesDim Min. Max. Min. Max. A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 D 4.80 5.00 0.189 0.197 E 3.80 4.00 0.150 0.157 H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27BSC 0.50BSC φ 18 ° 8° HE e1 e2 0.015X45 D AA1 0.004max. L SOP-8 pin ( Reference JEDEC Registration MS-012) Packaging Information

Copyright  ANPEC Electronics Corp. Rev. A.1 - Aug., 2002 APM4220 www.anpec.com.tw7 Reference JEDEC Standard J-STD-020A APRIL 1999 Reflow Condition (IR/Convection or VPR Reflow) Physical Specifications Pre-heat temperature 183 C Peak temperature Time temperature Classification Reflow Profiles Convection or IR/ Convection VPR Average ramp-up rate(183 °C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25 °C) 120 seconds max Temperature maintained above 183 °C 60 – 150 seconds Time within 5 °C of actual peak temperature 10 –20 seconds 60 seconds Peak temperature range 220 +5/-0 °C or 235 +5/-0 °C 215-219 °C or 235 +5/-0 °C Ramp-down rate 6 °C /second max. 10 °C /second max. Time 25 °C to peak temperature 6 minutes max. Package Reflow Conditions pkg. thickness ≥≥≥≥ 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp. Rev. A.1 - Aug., 2002 APM4220 www.anpec.com.tw8 Carrier Tape & Reel Dimensions Application A B C J T1 T2 W P E SOP-8 330±1 62 ± 1.5 12.75 + 0.1 5 - 0 . 1 8± 0.1 1.75 ± 0.1 Application F D D1 Po P1 Ao Bo Ko t (mm) A J B C t Ao E W Po P Ko Bo D F Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability test program

Copyright  ANPEC Electronics Corp. Rev. A.1 - Aug., 2002 APM4220 www.anpec.com.tw9 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Cover Tape Dimensions Application Carrier Width Cover Tape Width Devices Per Reel SOP- 8 12 9.3 2500