APM3009NUC-TU

APM3009N ANPEC | Alldatasheet

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Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

• 30V/70A , RDS(ON)=7mΩ(typ.) @ VGS=10V R DS(ON)=11mΩ(typ.) @ VGS=4.5V
• •••• Super High Dense Advanced Cell Design for Extremely Low RDS(ON)
• •••• Reliable and Rugged
• •••• TO-220 , TO-252 and TO-263 Packages Symbol Parameter Rating Unit VDSS Drain-Source Voltage 30 VGSS Gate-Source Voltage ±20 V ID * Maximum Drain Current – Continuous 60 IDM Maximum Drain Current – Pulsed 110 A * Surface Mounted on FR4 Board, t ≤ 10 sec.
• Power Management in Desktop Computer or DC/DC Converters. Top View of TO-220, TO-252 and TO-263 G DS 123

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw2 Notes a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% b : Guaranteed by design, not subject to production testing APM3009NSymbol Parameter Test Condition Min. Typ. Max. Unit Static BVDSS Drain-Source Breakdown Vl t VGS=0V, IDS=250µA 30 V IDSS Zero Gate Voltage Drain Current VDS=24V , VGS=0V 1 µA VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 13 V IGSS Gate Leakage Current VGS=±20V, VDS=0V ±100 nA VGS=10V, IDS=35A 79RDS(ON) a Drain-Source On-state Resistance VGS=4.5V, IDS=20A 11 15 mΩ VSD a Diode Forward Voltage I SD=35A, VGS=0V 0.6 1.3 V Dynamicb Qg Total Gate Charge 22 28 Qgs Gate-Source Charge 12.8 Qgd Gate-Drain Charge VDS=15V, IDS=20A VGS=4.5V, nC td(ON) Turn-on Delay Time 10 15 Tr Turn-on Rise Time 71 3 td(OFF) Turn-off Delay Time 35 50 Tf Turn-off Fall Time VDD=15V, IDS=1A, VGEN=10V, RG= 0.2Ω 10 20 ns Ciss Input Capacitance 2400 Coss Output Capacitance 500 Crss Reverse Transfer Capacitance VGS=0V VDS=15V Frequency =1.0MHz 240 pF Symbol Parameter Rating Unit TO-252 50 TA=25°C TO-263 62.5 TO-252 20 PD Maximum Power Dissipation TA=100°C TO-263 25 W TJ,TSTG Maximum Operating and Storage Junction Temperature -55 to 150 °C TO-252 50RθJA Thermal Resistance – Junction to Ambient TO-263 60 °C/W TO-252 2.5RθJC Thermal Resistance – Junction to Case TO-263 2 °C/W Absolute Maximum Ratings Cont. (TA = 25°C unless otherwise noted) Electrical Characteristics (TA = 25°C unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw3 Typical Characteristics 0123456789 1 0 0 1 02 03 04 0 5 06 07 08 09 0 1 0 0 0.000 0.003 0.006 0.009 0.012 0.015 -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 Output Characteristics VDS-Drain-to-Source Voltage (V) IDS-Drain Current (A) Transfer Characteristics VGS-Gate-to-Source Voltage (V) IDS-Drain Current (A) Threshold Voltage vs. Junction Temperature Tj-Junction Temperature (°C) On-Resistance vs. Drain Current ID-Drain Current (A) RDS(ON)-On-Resistance (Ω) VGS=10V VGS=4.5V IDS=250µA VDS=10V TJ=125°C TJ=25°C TJ=-55°C VGS=4,4.5,6,8,10V VGS=2.5V VGS=3V VGS(th)-Threshold Voltage (V) (Normalized)

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw4 -50 -25 0 25 50 75 100 125 150 0 1 02 03 04 05 0 Typical Characteristics Cont. 3456789 1 0 0.000 0.005 0.010 0.015 0.020 0.025 0.030 -50 -25 0 25 50 75 100 125 150 0.6 0.8 1.0 1.2 1.4 1.6 On-Resistance vs. Gate-to-Source Voltage On-Resistaence vs. Junction Temperature RDS(ON)-On Resistance (Ω) (Normalized) RDS (ON)-On-Resistance (Ω) Gate Voltage (V) T j-Junction Temperature (°C) Gate Charge QG-Total-Gate Charge (nC) VGS-Gate-to-Source Voltage (V) IDS=35A VGS=10V IDS=35A VDS=15V IDS=20A On-Resistaence vs. Junction TemperatureRDS(ON)-On Resistance (Ω) Tj-Junction Temperature (°C) VGS=10V IDS=35A

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw5 500 1000 1500 2000 2500 3000 0.1 100 Typical Characteristics Cont. Source-Drain Diode Forward Voltage ISD-Source Current (A) VSD-Source to Drain Voltage (V) TJ=-55°C TJ=25°C TJ=125°C Time (sec) Single Pulse Power Power (W) Time (sec) Single Pulse Power Power (W) TO-252 TO-263 100 1000 3000 2000 500 0.1 1 10 30 Capacitance Characteristics VDS-Drain-to-Source Voltage (V) C-Capacitance (pF) Crss Coss Ciss Frequency=1MHz 500 1000 1500 2000 2500 3000

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw6 10.01 0.1 0.01 0.1 Typical Characteristics Cont. Square Wave Pulse Duration (sec) Normalized Transient Thermal Transient Impedence, Junction to Ambient D=0.1 Square Wave Pulse Duration (sec) Normalized Effective Transient Thermal Impedance 1. Duty Cycle , D=t1/t2 2. Per Unit Base=RthJA=62.5°C/W 3. TJM-TA=PDMZthJASINGLE PULSE D=0.01 D=0.02 D=0.05 D=0.1 D=0.2 Duty Cycle=0.5 TO-263 Normalized Effective Transient Thermal Impedance 1. Duty Cycle , D=t1/t2 2. Per Unit Base=RthJA=50°C/W 3. TJM-TA=PDMZthJA SINGLE PULSE D=0.01 D=0.02 D=0.05 D=0.2 Duty Cycle=0.5 TO-252 Normalized Transient Thermal Transient Impedence, Junction to Ambient

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw7 Package Informaion TO-252( Reference JEDEC Registration TO-252) Millimeters InchesDim Min. Max. Min. Max. A 2.18 2.39 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.508 0.89 0.020 0.035 b2 5.207 5.461 0.205 0.215 C 0.46 0.58 0.018 0.023 C1 0.46 0.58 0.018 0.023 D 5.334 6.22 0.210 0.245 E 6.35 6.73 0.250 0.265 e1 3.96 5.18 0.156 0.204 H 9.398 10.41 0.370 0.410 L 0.51 0.020 L1 0.64 1.02 0.025 0.040 L2 0.89 2.032 0.035 0.080 D b E A H L C A1e1

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw8 TO-263 ( Reference JEDEC Registration TO-263) Millimeters Inches Dim Min. Max. Min. Max. A 4.06 4.83 0.160 0.190 b 0.51 1.016 0.02 0.040 b2 1.14 1.651 0.045 0.065 c 0.38 TYP. 0.015 TYP . c2 1.14 1.40 0.045 0.055 D 8.64 9.65 0.340 0.380 E 9.65 10.54 0.380 0.415 L 14.60 15.88 0.575 0.625 L1 2.24 2.84 0.090 0.110 L2 1.02 2.92 0.040 0.112 L3 1.20 1.78 0.050 0.070 E D L E1 TERMINAL 4 c A R L1L4 Φ 1 DETAIL "A"ROTED Packaging Information Cont.

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw9 Package Information Cont. TO-220 ( Reference JEDEC Registration TO-220) Q D R E F J1 e e1b1 A c b L Millimeters Inches Dim Min. Max. Min. Max. A 3.56 4.83 0.140 0.190 b1 1.14 1.78 0.045 0.070 b 0.51 1.14 0.020 0.045 c 0.31 1.14 0.012 0.045 D 14.23 16.51 0.560 0.650 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 E 9.65 10.67 0.380 0.420 F 0.51 1.40 0.020 0.055 H1 5.84 6.86 0.230 0.270 J1 2.03 2.92 0.080 0.115 L 12.7 14.73 0.500 0.580 L1 3.65 6.35 0.143 0.250 R 3.53 4.09 0.139 0.161 Q 2.54 3.43 0.100 0.135

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw10 Reference JEDEC Standard J-STD-020A APRIL 1999 Reflow Condition (IR/Convection or VPR Reflow) Physical Specifications Pre-heat temperature 183 C Peak temperature Time temperature Convection or IR/ Convection VPR Average ramp-up rate(183°C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) 120 seconds max. Temperature maintained above 183°C 60 ~ 150 seconds Time within 5°C of actual peak temperature 10 ~ 20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C 215~ 219 °C or 235 +5/-0°C Ramp-down rate 6°C /second max. 10 °C /second max. Time 25°C to peak temperature 6 minutes max. pkg. thickness ≥≥≥≥ 2.5mm and all bags pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm pkg. thickness < 2.5mm and pkg. volume < Convection220 +5/-0°C Convection 235 +5/-0°C VPR 215-219°C VPR 235 +5/-0°C IR/Convection 220 +5/-0°C IR/Convection 235 +5/-0 °C Classification Reflow Profiles Package Reflow Conditions Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw11 Application A B C J T1 T2 W P E TO-252 330±3 100 ± 2 13 ± 0. 5 2 ± 0.5 16.4 +0.3 Application F D D1 Po P1 Ao Bo Ko t Application A B C J T1 T2 W P E TO-263 380±3 80 ± 2 13 ± 0. 5 2 ± 0.5 24 ± 42 ± 0.3 24 + 0.3 Application F D D1 Po P1 Ao Bo Ko t ( m m ) A J B C t Ao E W Po P Ko Bo D F Carrier Tape & Reel Dimension Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability test program

Copyright  ANPEC Electronics Corp. Rev. A.3 - May., 2002 APM3009N www.anpec.com.tw12 Cover Tape Dimensions Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Application Carrier Width Cover Tape Width Devices Per Reel TO- 252 16 13.3 2500 TO- 263 24 21.3 1000