APM3005N ANPEC | Alldatasheet

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Technical content

Features

Applications

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

  • 30V / 80A , RDS(ON)= 4mΩ(typ.) @ VGS= 10V R DS(ON)= 7mΩ (typ.) @ VGS= 4.5V
  • Super High Dense Advanced Cell Design for Extremely Low RDS(ON)
  • Reliable and Rugged
  • TO-220, TO-252 and TO-263 Packages
  • Power Management in Desktop Computer or DC/DC Converters. Top View of TO-220, TO-252 and TO-263 Symbol Parameter Rating Unit VDSS Drain-Source Voltage 30 VGSS Gate-Source Voltage ±20 V ID * Maximum Drain Current – Continuous 80 IDM Maximum Drain Current – Pulsed 160 A G DS 123 G S D N-Channel MOSFET

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw2 APM3005NSymbol Parameter Test Condition Min. T yp. Max. Unit Static BVDSS Drain-Source Breakdown Voltage VGS=0V , IDS=250µA 30 V IDSS Zero Gate Voltage Drain Current VDS=24V , VGS=0V 1 µ A VGS(th) Gate Threshold Voltage VDS=VGS , IDS=250µA 11 . 52 V IGSS Gate Leakage Current VGS=±20V , VDS=0V ±100 nA VGS=10V , IDS=80A 45 . 4RDS(ON) a Drain-Source On-state Resistance VGS=4.5V , IDS=70A 78 mΩ VSD a Diode Forward Voltage I SD=30A , VGS=0V 0.85 1.3 V Dynamicb Qg Total Gate Charge 28 32 Qgs Gate-Source Charge 12.8 Qgd Gate-Drain Charge VDS=15V , IDS= 80A VGS=5V , 21.2 nC td(ON) Turn-on Delay Time 13 20 Tr Turn-on Rise Time 91 5 td(OFF) Turn-off Delay Time 43 66 Tf Turn-off Fall Time VDD=15V , IDS=1A , VGEN=10V , RG=0.2Ω 14 28 ns Ciss Input Capacitance 4700 Coss Output Capacitance 930 Crss Reverse Transfer Capacitance VGS=0V VDS=15V Frequency=1.0MHz 280 pF Symbol Parameter Rating Unit TO-252 50 TA=25°C TO-263 62.5 W TO-252 20 PD Maximum Power Dissipation TA=100°C TO-263 25 W TJ,TSTG Maximum Operating and Storage Junction Temperature -55 to 150 °C TO-252 50RθJA Thermal Resistance – Junction to Ambient TO-263 60 °C/W TO-252 2.5RθJC Thermal Resistance – Junction to Case TO-263 2 °C/W * Surface Mounted on FR4 Board, t ≤ 10 sec. Notes a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% b : Guaranteed by design, not subject to production testing Electrical Characteristics (TA = 25°C unless otherwise noted) Absolute Maximum Ratings (Cont.) (TA = 25°C unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw3 0 20 40 60 80 100 120 0.000 0.002 0.004 0.006 0.008 0.010 Typical Characteristics 012345 Output Characteristics VDS-Drain-to-Source Voltage (V) IDS-Drain Current (A) VGS=3V VGS=3.5V 0123456 100 VGS-Gate-to-Source Voltage (V) Transfer Characteristics IDS-Drain Current (A) TJ=125°C TJ=25°C TJ=-55°C On-Resistance vs. Drain Current IDS-Drain Current (A) RDS(ON)-On-Resistance (Ω ) VGS=10V VGS=4.5V -50 -25 0 25 50 75 100 125 150 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Threshold Voltage vs. Junction Temperature Tj-Junction Temperature (°C) VGS(th)-Threshold Voltage (V) (Normalized) IDS=250µA

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw4 0 1 02 03 04 05 06 07 08 09 0 -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Typical Characteristics (Cont.) Gate Charge QG-Total Gate Charge (nC) VGS-Gate-to-Source Voltage (V) VDS=15V IDS=80A 02468 1 00.000 0.005 0.010 0.015 0.020 0.025 IDS=60A VGS-Gate-to-Source Voltage (V) On-Resistance vs. Gate-to-Source VoltageRDS (ON)-On-Resistance (Ω ) Tj-Junction Temperature (°C) On-Resistaence vs. Junction TemperatureRDS(ON)-On Resistance (mΩ ) VGS=10V IDS=60A -50 -25 0 25 50 75 100 125 150 Tj-Junction Temperature (°C) On-Resistaence vs. Junction Temperature RDS(ON)-On Resistance (mΩ ) (Normalized) VGS=10V IDS=60A

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw5 500 1000 1500 2000 2500 3000 500 1000 1500 2000 2500 3000 Typical Characteristics (Cont.) 0.1 100 Source-Drain Diode Forward Voltage ISD-Source Current (A) VSD-Source-to-Drain Voltage (V) TJ=-55°C TJ=25°C TJ=125°C 0 5 10 15 20 25 30 1000 2000 3000 4000 5000 6000 7000 Capacitance Characteristics VDS-Drain-to-Source Voltage (V) C-Capacitance (pF) Crss Coss Ciss Time (sec) Single Pulse Power Power (W) TO-263 Time (sec) Single Pulse Power Power (W) TO-252 Frequency=1MHz

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw6 00.01 0.1 10.01 0.1 Typical Characteristics (Cont.) Square Wave Pulse Duration (sec) Normalized Transient Thermal Transient Impedence, Junction to Ambient D=0.1 Square Wave Pulse Duration (sec) Normalized Effective Transient Thermal Impedance Normalized Transient Thermal Transient Impedence, Junction to Ambient 1. Duty Cycle , D=t1/t2 2. Per Unit Base=RthJA=62.5°C/W 3. TJM-TA=PDMZthJA SINGLE PULSE D=0.01 D=0.02 D=0.05 D=0.1 D=0.2 Duty Cycle=0.5 TO-263 Normalized Effective Transient Thermal Impedance 1. Duty Cycle , D=t1/t2 2. Per Unit Base=RthJA=50°C/W 3. TJM-TA=PDMZthJA SINGLE PULSE D=0.01 D=0.02 D=0.05 D=0.2 Duty Cycle=0.5 TO-252

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw7

Package Information

TO-220 ( Reference JEDEC Registration TO-220) Q D R E F J1 e e1b1 A c b L Millimeters Inches Dim Min. Max. Min. Max. A 3.56 4.83 0.140 0.190 b1 1.14 1.78 0.045 0.070 b 0.51 1.14 0.020 0.045 c 0.31 1.14 0.012 0.045 D 14.23 16.51 0.560 0.650 e 2.29 2.79 0.090 0.110 e1 4.83 5.33 0.190 0.210 E 9.65 10.67 0.380 0.420 F 0.51 1.40 0.020 0.055 H1 5.84 6.86 0.230 0.270 J1 2.03 2.92 0.080 0.115 L 12.7 14.73 0.500 0.580 L1 3.65 6.35 0.143 0.250 R 3.53 4.09 0.139 0.161 Q 2.54 3.43 0.100 0.135

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw8 Package Informaion (Cont.) TO-252( Reference JEDEC Registration TO-252) Millimeters InchesDim Min. Max. Min. Max. A 2.18 2.39 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.508 0.89 0.020 0.035 b2 5.207 5.461 0.205 0.215 C 0.46 0.58 0.018 0.023 C1 0.46 0.58 0.018 0.023 D 5.334 6.22 0.210 0.245 E 6.35 6.73 0.250 0.265 e1 3.96 5.18 0.156 0.204 H 9.398 10.41 0.370 0.410 L 0.51 0.020 L1 0.64 1.02 0.025 0.040 L2 0.89 2.032 0.035 0.080 D b E A H L C A1e1

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw9 TO-263 ( Reference JEDEC Registration TO-263) Millimeters Inches Dim Min. Max. Min. Max. A 4.06 4.83 0.160 0.190 b 0.51 1.016 0.02 0.040 b2 1.14 1.651 0.045 0.065 c 0.38 TYP. 0.015 TYP . c2 1.14 1.40 0.045 0.055 D 8.64 9.65 0.340 0.380 E 9.65 10.54 0.380 0.415 L 14.60 15.88 0.575 0.625 L1 2.24 2.84 0.090 0.110 L2 1.02 2.92 0.040 0.112 L3 1.20 1.78 0.050 0.070 E D L E1 TERMINAL 4 c A R L1L4 Φ 1 DETAIL "A"ROTED Package Information (Cont.)

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw10 Reference JEDEC Standard J-STD-020A APRIL 1999 Reflow Condition (IR/Convection or VPR Reflow) Physical Specifications Pre-heat temperature 183 C Peak temperature Time temperature Convection or IR/ Convection VPR Average ramp-up rate(183 °C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25 °C) 120 seconds max. Temperature maintained above 183 °C 60 ~ 150 seconds Time within 5 °C of actual peak temperature 10 ~ 20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C 215~ 219 °C or 235 +5/-0 °C Ramp-down rate 6°C /second max. 10 °C /second max. Time 25 °C to peak temperature 6 minutes max. pkg. thickness ≥≥≥≥ 2.5mm and all bags pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm pkg. thickness < 2.5mm and pkg. volume < Convection 220 +5/-0°C Convection 235 +5/-0 °C VPR 215-219°C VPR 235 +5/-0 °C IR/Convection 220 +5/-0°C IR/Convection 235 +5/-0 °C Classification Reflow Profiles Package Reflow Conditions Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw11 Application A B C J T1 T2 W P E 330 ±3 100 ± 2 13 ± 0. 5 2 ± 0.5 16.4 + 0.3 F D D1 Po P1 Ao Bo Ko tTO-252 Application A B C J T1 T2 W P E 380±3 80 ± 2 13 ± 0. 5 2 ± 0.5 24 ± 42 ± 0.3 24 + 0.3 F D D1 Po P1 Ao Bo Ko tTO-263 ( m m ) A J B C t Ao E W Po P Ko Bo D F Carrier Tape & Reel Dimension Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability test program

Copyright  ANPEC Electronics Corp. Rev. A.3 - Jan., 2003 APM3005N www.anpec.com.tw12 Cover Tape Dimensions Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Application Carrier Width Cover Tape Width Devices Per Reel TO- 252 16 13.3 2500 TO- 263 24 21.3 1000