APM2301 ANPEC | Alldatasheet

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Applications

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

  • -20V/-2.8A , RDS(ON)=72mΩ (typ.) @ VGS=-10V R DS(ON)=100mΩ (typ.) @ VGS=-4.5V
  • •••• Super High Dense Cell Design for Extremely Low RDS(ON)
  • •••• Reliable and Rugged
  • Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems. APM2301 Handling Code Temp. Range Package Code Package Code A : SOT-23 Operation Junction Temp. Range C : -55 to 150 C Handling Code TR : Tape & Reel APM2301 A : M01X X - Date Code Symbol Parameter Rating Unit VDSS Drain-Source Voltage -20 VGSS Gate-Source Voltage ±16 V ID * Maximum Drain Current – Continuous -2.8 IDM Maximum Drain Current – Pulsed -10 A * Surface Mounted on FR4 Board, t ≤ 10 sec. G D S Top View of SOT-23

Copyright  ANPEC Electronics Corp. Rev. A.2 - Aug., 2002 www.anpec.com.tw2 APM2301 Notes a : Pulse test ; pulse width ≤300µs, duty cycle ≤ 2% b : Guaranteed by design, not subject to production testing Absolute Maximum Ratings Cont. (TA = 25°C unless otherwise noted) Symbol Parameter Rating Unit TA=25°C 1.25PD Maximum Power Dissipation TA=100°C 0.5 W TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -55 to 150 °C RθjA Thermal Resistance – Junction to Ambient 100 °C/W APM2301Symbol Parameter Test Condition Min. Typ. Max. Unit Static BVDSS Drain-Source Breakdown Voltage VGS=0V , IDS=-250µA 20 V IDSS Zero Gate Voltage Drain Current VDS=-16V , VGS=0V 1 µA VGS(th) Gate Threshold Voltage VDS=VGS , IDS=-250µA 0.6 1.5 V IGSS Gate Leakage Current VGS=±16V , VDS=0V ±100 nA VGS=-10V , IDS=-2.8A 72 85RDS(ON) a Drain-Source On-state Resistance VGS=-4.5V , IDS=-2.5A 98 110 mΩ VSD a Diode Forward Voltage I SD=-1.25A , VGS=0V 0.6 1.3 V Dynamicb Qg Total Gate Charge 7.6 10 Qgs Gate-Source Charge 3.2 Qgd Gate-Drain Charge VDS=-10V , IDS=-3A VGS=-4.5V nC td(ON) Turn-on Delay Time 11 22 Tr Turn-on Rise Time 32 55 td(OFF) Turn-off Delay Time 38 68 Tf Turn-off Fall Time VDD=-10V , IDS=-1A , VGEN=-4.5V , RG=6Ω RL=6Ω 32 55 ns Ciss Input Capacitance 430 Coss Output Capacitance 235 Crss Reverse Transfer Capacitance VGS=0V VDS=-15V Frequency=1.0MHz 95 pF Electrical Characteristics (TA = 25°C unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.2 - Aug., 2002 www.anpec.com.tw3 APM2301 02468 1 0 0.030 0.045 0.060 0.075 0.090 0.105 0.120 0.135 0.150 012345 -50 -25 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 Typical Characteristics -ID-Drain Current (A) Transfer Characteristics TJ=-55°C TJ=25°C TJ=125°C -VGS - Gate-to-Source Voltage (V) Threshold Voltage vs. Junction Temperature Tj - Junction Temperature (°C) -VGS(th)-Threshold Voltage (V) (Normalized) -IDS=250uA RDS(ON)-On-Resistance (Ω ) On-Resistance vs. Drain Current -VGS=4.5V -ID - Drain Current (A) -VGS=10V -VGS=2V Output Characteristics -ID-Drain Current (A) -VGS=3.5,4,4.5,5V -VGS=3V -VDS - Drain-to-Source Voltage (V) -VGS=2.5V

Copyright  ANPEC Electronics Corp. Rev. A.2 - Aug., 2002 www.anpec.com.tw4 APM2301 0369 1 2 1 5 0 5 10 15 20 125 250 375 500 625 750 - 5 0 - 2 50 2 55 07 5 1 0 0 1 2 5 1 5 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 123456789 1 0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 Typical Characteristics RDS(ON)-On-Resistance (Ω ) (Normalized) On-Resistance vs. Junction Temperature -VGS=10V -ID=2.8A TJ - Junction Temperature (°C) -VDS - Drain-to-Source Voltage (V) Capacitance Capacitance (pF) Ciss Coss Crss -VGS - Gate-to-Source Voltage (V) RDS(ON)-On-Resistance (Ω ) -ID=2.8A On-Resistance vs. Gate-to-Source Voltage Gate Charge QG - Gate Charge (nC) -VGS-Gate-Source Voltage (V) -VDS=10V -ID=3A

Copyright  ANPEC Electronics Corp. Rev. A.2 - Aug., 2002 www.anpec.com.tw5 APM2301 0.01 0.1 1 10 100 1E-4 1E-3 0.01 0.1 1 10 100 0.01 0.1 Typical Characteristics Power (W) Single Pulse Power Time (sec) Square Wave Pulse Duration (sec) Source-Drain Diode Forward Voltage -IS-Source Current (A) TJ=150°C TJ=25°C -VSD -Source-to-Drain Voltage (V) Normalized Effective Transient Thermal Impedance Normalized Thermal Transient Impedence, Junction to Ambient 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=100°C/W 3.TJM-TA=PDMZthJA Duty Cycle=0.5 D=0.2 D=0.1 D=0.05 D=0.02 SINGLE PULSED=0.01

Copyright  ANPEC Electronics Corp. Rev. A.2 - Aug., 2002 www.anpec.com.tw6 APM2301 Packaging Information D E H S e A A1 L C B Millimeters InchesDim Min. Max. Min. Max. A 1.00 1.30 0.039 0.051 A1 0.00 0.10 0.000 0.004 B 0.35 0.51 0.014 0.020 C 0.10 0.25 0.004 0.010 D 2.70 3.10 0.106 0.122 E 1.40 1.80 0.055 0.071 e 1.90 BSC 0.075 BSC H 2.40 3.00 0.094 0.118 L 0.37 0.0015 SOT-23

Copyright  ANPEC Electronics Corp. Rev. A.2 - Aug., 2002 www.anpec.com.tw7 APM2301 Physical Specifications Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) Reference JEDEC Standard J-STD-020A APRIL 1999 Classification Reflow Profiles Convection or IR/ Convection VPR Average ramp-up rate(183 °C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) 120 seconds max. Temperature maintained above 183 °C 60 ~ 150 seconds Time within 5°C of actual peak temperature 10 ~ 20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0 °C 215~ 219 °C or 235 +5/-0 °C Ramp-down rate 6 °C /second max. 10 °C /second max. Time 25°C to peak temperature 6 minutes max. Package Reflow Conditions pkg. thickness ≥≥≥≥ 2.5mm and all bags pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C Pre-heat temperature 183 C Peak temperature Time temperature

Copyright  ANPEC Electronics Corp. Rev. A.2 - Aug., 2002 www.anpec.com.tw8 APM2301 Carrier Tape & Reel Dimensions A J B C t Ao E W Po P Ko Bo D F Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability test program Application A B C J T1 T2 W P E F D D1 Po P1 Ao Bo Ko tSOT-23

Copyright  ANPEC Electronics Corp. Rev. A.2 - Aug., 2002 www.anpec.com.tw9 APM2301 Application Carrier Width Cover Tape Width Devices Per Reel SOT- 23 8 5.3 3000 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Cover Tape Dimensions