APM2055NUC-TR

APM2055N ANPEC | Alldatasheet

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Technical content

Features

Applications

• Switching Regulators
• Switching Converters Absolute Maximum Ratings (TA = 25°C unless otherwise noted) Symbol Parameter Rating Unit VDSS Drain-Source Voltage 20 VGSS Gate-Source Voltage ±16 V ID Maximum Drain Current – Continuous 12 IDM Maximum Drain Current – Pulsed 20 A GD S 123 Top View of TO-252 SDG 12 3 Top View of SOT-223 G S D N-Channel MOSFET

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw2 Symbol Parameter Rating Unit TO-252 50 TA=25°C SOT-223 3 TO-252 10 PD Maximum Power Dissipation TA=100°C SOT-223 1.2 W TJ Maximum Junction Temperature 150 °C TSTG Storage Temperature Range -55 to 150 °C RθjA Thermal Resistance – Junction to Ambient 50 °C/W APM2055NSymbol Parameter Test Condition Min. Typ. Max. Unit Static BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250µA 20 V IDSS Zero Gate Voltage Drain Current VDS=16V, VGS=0V 1 µA VGS(th) Gate Threshold Voltage VDS=VGS, ID=250µA 0.7 0.9 1.5 V IGSS Gate Leakage Current VGS=±16V, VDS=0V ±100 nA VGS=10V, ID=12A 55 70 VGS=4.5V, ID=6A 75 90 RDS(ON) Drain-Source On-state Resistance VGS=2.5V, ID=2A 140 160 mΩ VSD Diode Forward Voltage I S=2A, VGS=0V 0.7 1.3 V Dynamic Qg Total Gate Charge 78 . 5 Qgs Gate-Source Charge 2.5 Qgd Gate-Drain Charge VDS=15V, VGS=4.5V, ID=1.5A 1.5 nC td(ON) Turn-on Delay Time 9.2 18.6 tr Turn-on Rise Time 14 27 td(OFF) Turn-off Delay Time 31 58 tf Turn-off Fall Time VDD=15V, ID=2A, VGS=10V, RG=6Ω 16 21 ns Electrical Characteristics (TA = 25°C unless otherwise noted) Absolute Maximum Ratings (Cont.) (TA = 25°C unless otherwise noted)

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw3 0 2 4 6 8 10 12 14 16 18 20 0.000 0.025 0.050 0.075 0.100 0.125 012345 -50 -25 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 Typical Characteristics VGS=3V ID-Drain Current (A) Transfer Characteristics TJ=-55°CTJ=25°C TJ=125°C VGS - Gate-to-Source Voltage (V) Threshold Voltage vs. Junction Temperature Tj - Junction Temperature (°C) VGS(th)-Threshold Voltage (V) (Normalized) IDS=250uA RDS(ON)-On-Resistance (Ω ) On-Resistance vs. Drain Current ID - Drain Current (A) VGS=10V Output Characteristics ID-Drain Current (A) VGS=2V VDS - Drain-to-Source Voltage (V) VGS=4.5V

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw4 012345678 0 5 10 15 20 100 200 300 400 500 600 -50 -25 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 012345678 0.025 0.050 0.075 0.100 0.125 0.150 0.175 0.200 Typical Characteristics (Cont.) VGS - Gate-to-Source Voltage (V) RDS(ON)-On-Resistance (Ω ) ID=5A On-Resistance vs. Gate-to-Source Voltage RDS(ON)-On-Resistance (Ω ) (Normalized) On-Resistance vs. Junction Temperature VGS=4.5V ID=5A TJ - Junction Temperature (°C) VDS - Drain-to-Source Voltage (V) Capacitance Capacitance (pF) Ciss Coss Crss Gate Charge QG - Gate Charge (nC) VGS-Gate-Source Voltage (V) VDS=15V ID=1.5A Frequency=1MHz

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw5 1E-3 0.01 0.1 1 10 100 100 150 200 250 1E-4 1E-3 0.01 0.1 1 10 100 0.01 0.1 SINGLE PULSE D=0.01 D=0.02 D=0.05 D=0.1 D=0.2 Duty Cycle=0.5 0.1 Source-Drain Diode Forward Voltage IS-Source Current (A) TJ=150°C TJ=25°C VSD -Source-to-Drain Voltage (V) Typical Characteristics (Cont.) Power (W) Single Pulse Power Time (sec) Square Wave Pulse Duration (sec) Normalized Effective Transient Thermal Impedance Normalized Thermal Transient Impedence, Junction to Ambient 1.Duty Cycle, D=t1/t2 2.Per Unit Base=R thJA=50°C/W 3.TJM-TA=PDMZthJA

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw6

Package Information

SOT-223( Reference JEDEC Registration SOT-223) D H E K e A c L a B b Millimeters InchesDim Min. Max. Min. Max. A 1.50 1.80 0.06 0.07 A1 0.02 0.08 B 0.60 0.80 0.02 0.03 B1 2.90 3.10 0.11 0.12 c 0.28 0.32 0.01 0.01 D 6.30 6.70 0.25 0.26 E 3.30 3.70 0.13 0.15 e 2.3 BSC 0.09 BSC e1 4.6 BSC 0.18 BSC H 6.70 7.30 0.26 0.29 L 0.91 1.10 0.04 0.04 K 1.50 2.00 0.06 0.08 α 0° 10° 0° 10° β 13° 13°

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw7 Package Information (Cont.) Millimeters InchesDim Min. Max. Min. Max. A 2.18 2.39 0.086 0.094 A1 0.89 1.27 0.035 0.050 b 0.508 0.89 0.020 0.035 b2 5.207 5.461 0.205 0.215 C 0.46 0.58 0.018 0.023 C1 0.46 0.58 0.018 0.023 D 5.334 6.22 0.210 0.245 E 6.35 6.73 0.250 0.265 e1 3.96 5.18 0.156 0.204 H 9.398 10.41 0.370 0.410 L 0.51 0.020 L1 0.64 1.02 0.025 0.040 L2 0.89 2.032 0.035 0.080 TO-252( Reference JEDEC Registration TO-252) D b E A H L C A1e1

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw8 Reference JEDEC Standard J-STD-020A APRIL 1999 Reflow Condition (IR/Convection or VPR Reflow) Physical Specifications Pre-heat temperature 183 C Peak temperature Time temperature Classification Reflow Profiles Convection or IR/ Convection VPR Average ramp-up rate(183°C to Peak) 3 °C/second max. 10 °C /second max. Preheat temperature 125 ± 25°C) 120 seconds max Temperature maintained above 183°C 60 – 150 seconds Time within 5°C of actual peak temperature 10 –20 seconds 60 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C 215-219 °C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 10 °C /second max. Time 25°C to peak temperature 6 minutes max. Package Reflow Conditions pkg. thickness ≥≥≥≥ 2.5mm and all bgas pkg. thickness < 2.5mm and pkg. volume ≥≥≥≥ 350 mm³ pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 220 +5/-0 °C Convection 235 +5/-0 °C VPR 215-219 °C VPR 235 +5/-0 °C IR/Convection 220 +5/-0 °C IR/Convection 235 +5/-0 °C Terminal Material Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Lead Solderability Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw9 Carrier Tape A J B C t Ao E W Po P Ko Bo D F Test item Method Description SOLDERABILITY MIL-STD-883D-2003 245°C,5 SEC HOLT MIL-STD 883D-1005.7 1000 Hrs Bias @ 125°C PCT JESD-22-B, A102 168 Hrs, 100% RH, 121°C TST MIL-STD 883D-1011.9 -65°C ~ 150°C, 200 Cycles Reliability test program Application A B C J T1 T2 W P E 330±16 2 ±1.5 12.75± F D D1 Po P1 Ao Bo Ko tSOT-223 Application A B C J T1 T2 W P E 330 ±31 0 0 ± 21 3 ± 0. 5 2 ± 0.5 16.4 + 0.3 F D D1 Po P1 Ao Bo Ko tTO-252

Copyright  ANPEC Electronics Corp. Rev. A.1 - Feb., 2003 APM2055N www.anpec.com.tw10 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Cover Tape Dimensions Application Carrier Width Cover Tape Width Devices Per Reel SOT- 223 12 9.3 2500 TO- 252 16 13.3 2500