APL3511EKI-TRG

APL3510 ANPEC | Alldatasheet

Document overview

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Technical content

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw1 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. USB Power-Distribution Switches

• 70mW (MSOP-8) High Side MOSFET
• Wide Supply Voltage Range: 2.7V to 5.5V
• Current-Limit and Short-Circuit Protections
• Over-Temperature Protection
• Fault Indication Output
• Enable Input
• UL Approved-File No. E328191
• Nemko IEC 60950-1:2005(2nd Edition)+Am 1:2009 EN 60950-1:2006+A11:2009+A1:2010+A12:2011 CB_Scheme Certified, No.67404
• TUV IEC 60950-1: 2005+A1:2009 and EN 60950-1: 2006+A11:2009+A1:2010 Certified, No.44 780 11 393954
• Lead Free and Green Devices Available (RoHS Compliant) The APL3510/1 series of power switches are designed for USB applications. The 70m Ω N-channel MOSFET power switch satisfies the voltage drop requirements of USB specification. Features General Description

Applications

• Notebook and Desktop Computers
• USB Ports
• High-Side Power Protection Switchs Pin Configurations The protection features include current-limit protection, short-circuit protection, and over-temperature protection. The device limits the output current at current limit thresh- old level. When VOUT drops below VIN-1V, the devices limit the current to a lower and safe level. The over-tempera- ture protection limits the junction temperature below 140oC in case of short circuit or over load conditions. Other features include a deglitched OCB output to indi- cate the fault condition and an enable input to enable or disable the device. Simplified Application Circuit VIN 2 7 VOUT VIN 3 ENB 4

6 VOUT

5 OCB

8 VOUTGND 1

(Top View)

8 VOUT

(Top View) GND 2

5 VIN

(Top View) GND 2 (Top View) GND 2

5 VOUT

(Top View) SOT-23-5 APL3510B/D/F (Top View) GND 2

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw2 Ordering and Marking Information Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings (Note 1) Symbol Parameter Rating Unit VIN VIN Input Voltage (VIN to GND) -0.3 ~ 7 V VOUT VOUT to GND Voltage -0.3 ~ 7 V VENB, VEN EN, ENB to GND Voltage -0.3 ~ 7 V VOCB OCB to GND Voltage -0.3 ~ 7 V TJ Maximum Junction Temperature 150 oC TSTG Storage Temperature -65 ~ 150 oC TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 oC Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom- mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics Symbol Parameter Typical Value Unit θ JA Junction-to-Ambient Resistance in Free Air (Note 2) SOP-8 MSOP-8 SOT-23-5 160 160 235 oC/W Note 2 : θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air. APL3510 APL3511 Package Code K : SOP-8 X : MSOP-8 B : SOT-23-5 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Output Current/EN Function A : 2A/Active High B : 2A/Active Low C : 1A/Active High D : 1A/Active Low E : 0.3A/Active High F : 0.3A/Active Low Assembly Material G : Halogen and Lead Free Device Handling Code Temperature Range Package Code APL3510A K: APL3510A XXXXX - Date Code Assembly Material XXXXX APL3510A X: L510A XXXXX - Date CodeXXX XX Output Current/EN Function APL3510A B: L0AX X - Date Code APL3511A B: L1AX X - Date Code

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw3 Symbol Parameter Range Unit VIN VIN Input Voltage 2.7 ~ 5.5 V OUT Output Current (APL3510A/B, APL3511A/B) 0 ~2 OUT Output Current (APL3510C/D, APL3511C/D) 0 ~1 IOUT OUT Output Current (APL3510E/F) 0 ~0.3 A TA Ambient Temperature -40 ~ 85 oC TJ Junction Temperature -40 ~ 125 oC

Electrical Characteristics

Unless otherwise specified, these specifications apply over V IN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC. APL3510/1 Symbol Parameter Test Conditions Min. Typ. Max. Unit SUPPLY CURRENT No load, VEN=0V or VENB=5V - - 1 µA VIN Supply Current No load, VEN=5V or VENB=0V - 65 100 µA Leakage Current VOUT=GND, VEN=0V or VENB=5V - - 1 µA Reverse Leakage Current VIN=GND, VOUT=5V, VEN=0V or VENB=5V - - 1 µA POWER SWITCH TA= 25 oC mΩ UNDER-VOLTAGE LOCKOUT (UVLO) VIN UVLO Threshold Voltage VIN rising, TA= -40 ~ 85 oC 1.7 - 2.65 V VIN UVLO Hysteresis - 0.2 - V CURRENT-LIMIT AND SHORT-CIRCUIT PROTECTIONS ILIM Current Limit Threshold APL3510A/B, APL3511A/B, APL3510C/D, APL3511C/D, APL3510E/F, VIN=2.7V to 5.5V, TA= -40 ~ 85 oC 0.35 - 0.7 A ISHORT Short-Circuit Output Current APL3510A/B, APL3511A/B, VIN=2.7V to 5.5V - 0.8 - A APL3510C/D, APL3511C/D, VIN=2.7V to 5.5V - 0.8 - A APL3510E/F, VIN=2.7V to 5.5V 0.35 - 0.7 A Recommended Operating Conditions (Note 3) Note 3 : Refer to the typical application circuit

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw4 Electrical Characteristics (Cont.) Unless otherwise specified, these specifications apply over V IN=5V, VEN =5V or VENB=0V and TA= -40 ~ 85 oC. Typical values are at TA=25oC. APL3510/1 Symbol Parameter Test Conditions Min. Typ. Max. Unit OCB OUTPUT PIN OCB Output Low Voltage IOCB=5mA - 0.2 0.4 V OCB Leakage Current VOCB=5V - - 1 µA tD(OCB) OCB Deglitch Time OCB assertion, TA= -40 ~ 85 oC 5 12 20 ms EN OR ENB INPUT PIN VIH Input Logic HIGH VIN=2.7V to 5V 2 - - V VIL Input Logic LOW VIN=2.7V to 5V - - 0.8 V Input Current - - 1 µA VOUT Discharge Resistance VEN=0V or VENB=5V - 150 - Ω tD(ON) Turn On Delay Time - 30 - µs tD(OFF) Turn Off Delay Time - 30 - µs tSS Soft-Start Time No load, COUT=1µF, VIN=5V - 400 - µs OVER-TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold TJ rising - 140 - °C Over-Temperature Hysteresis - 20 - °C

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw5 Typical Operating Characteristics Current Limit Threshold vs. Junction Temperature Current Limit Threshold, ILIM (A) APL3510A/B APL3510C/D Junction Temperature (oC) VIN =5V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 150 Input Voltage (V) Current Limit Threshold, ILIM (A) Current Limit Threshold vs. Input Voltage APL3510A/B APL3510C/D TA =25oC 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 Switch On Resistance vs. Input Voltage Switch On Resistance, RDS(on) (mΩ ) Input Voltage (V) SOP8 MSOP8 SOT-23-5 IOUT =1.5A, CIN =1µF/X7R, COUT =10µF/ X7R, TA=25oC 100 110 120 130 Supply Current vs. Input Voltage Input Voltage (V) Supply Current, ICC (µA) RLOAD = Open, CIN =COUT =33µF/Electrolytic, TA ℃=25 Supply Current vs. Junction Temperature Supply Current, ICC (µA) Junction Temperature (oC) VIN =5V, RLOAD = Open, CIN =COUT =33µF/Electrolytic -50 0 50 100 150 100 Switch On Resistance, RDS(on) (mΩ ) Switch On Resistance vs. Junction Temperature SOP8 MSOP8 SOT-23-5 VIN =5V, IOUT =1.5A, CIN =1µF/X7R, COUT =10µF/X7R Junction Temperature (oC) 100 120 140 160 -50 0 50 100 150

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw6 Typical Operating Characteristics (Cont.) Short-Circuit Output Current vs. Input Voltage Input Voltage (V) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Short-Circuit Output Current, ISHORT (A) VIN = 5V, TA=25oC Current-Limit Response vs. Output Peak Current Output Peak Current (A) Current-Limit Response (µs) 100 150 200 250 APL3510C/D, VIN = 5V, TA=25oC 0 2 4 6 8 10 12 100 150 200 250 300 0 2 4 6 8 10 12 Output Peak Current (A) Current-Limit Response (µs) Current-Limit Response vs. Output Peak Current APL3510A/B, VIN = 5V, TA=25oC EN Pin Threshold Voltage vs. Junction Temperature EN Pin Threshold Voltage, VEN (V) Junction Temperature (oC) EN Rising EN Falling RLOAD =50Ω , CIN = COUT =33µF/Elctrolytic -50 0 50 100 150 0.5 1.0 1.5 2.0 2.5 3.0 Turn-Off Leakage Current vs. Junction Temperature Turn-Off Leakage Current, ILEAK (µA) Junction Temperature (oC) VIN =5V, Shut-Down mode, RLOAD =0Ω , CIN = COUT =33µF/Elctrolytic 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50 0 50 100 150 EN Pin Threshold Voltage vs. Input Voltage Input Voltage (V) EN Pin Threshold Voltage, VEN (V) EN Rising EN Falling VIN =5V, RLOAD =50Ω , CIN = COUT =33µF/Elctrolytic, TA=25oC 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0.8 0.9 1.0 1.1 1.2

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw7 Typical Operating Characteristics (Cont.) UVLO Threshold Voltage vs. Junction Temperature UVLO Threshold Voltage, VUVLO (V) UVLO Rising UVLO Falling IOUT =15mA, CIN = COUT =33µF/Elctrolytic Junction Temperature (oC) 1.2 1.6 2.0 2.4 2.8 3.2 0.8 -50 0 50 100 150 Switch Off Supply Current vs. Junction Temperature Switch Off Supply Current, ICC(off)(µA) Junction Temperature (oC) VIN = 5V, RLOAD = Open, CIN = COUT =33µF/Elctrolytic 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50 0 50 100 150 OCB Deglitch Time vs. Junction Temperature OCB Deglitch Time, TD(OCB) (ms) RLOAD =1Ω , CIN = COUT =33µF/Elctrolytic Junction Temperature (oC) -50 0 50 100 150 OCB Deglitch Time vs. Input Voltage Input Voltage (V) OCB Deglitch Time, TD(OCB) (ms) RLOAD =1Ω , CIN = COUT =33µF/Elctrolytic Turn-On Rising Time, tR (µs) Turn-On Rising Time vs. Junction Temperature Junction Temperature (oC) VIN = 5V, RLOAD =30Ω , CIN = 33µF/Elctrolytic, COUT =1µF/X7R -50 0 50 100 150 100 200 600 700 300 400 500 Turn-Off Falling Time vs. Junction Temperature Turn-Off Falling Time, tF (µs) VIN = 5V, RLOAD =30Ω , CIN = 33µF/Elctrolytic, COUT =1µF/X7R Junction Temperature (oC) 100 150 200 -50 0 50 100 150

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw8 Typical Operating Characteristics (Cont.) Output Voltage, VOUT (V) Output Current (A) Output Voltage vs. Output Current APL3510C/D, VIN = 5V, TA=25oC Output Voltage vs. Output Current Output Voltage, VOUT (V) Output Current (A) APL3510A/B, VIN = 5V, TA=25oC

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw9 Operating Waveforms The test condition is VIN=5V, TA= 25oC unless otherwise specified. Turn On Response Turn Off Response UVLO at Rising UVLO at Falling VENB VOUT VENB VOUT VIN VOUT VIN VOUT CH1: VENB, 5V/Div, DC TIME: 200µs/Div VIN =5V, RLOAD =30Ω , CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH2: VOUT, 2V/Div, DC TIME: 100µs/Div VIN =5V, RLOAD =30Ω , CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH2: VOUT, 2V/Div, DC CH1: VENB, 5V/Div, DC TIME:2ms/Div VIN =5V, RLOAD =30Ω , CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VIN, 1V/Div, DC CH2: VOUT, 1V/Div, DC TIME:5ms/Div CH2: VOUT, 1V/Div, DC VIN =5V, RLOAD =30Ω , CIN =33µF/Electrolytic, COUT =1µF/Electrolytic CH1: VIN, 1V/Div, DC

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw10 Operating Waveforms (Cont.) The test condition is VIN=5V, TA= 25oC unless otherwise specified. OCB Response During Short Circuit OCB Response During Over Load OCB Response with Ramped Load Load-Transient Response VENB VOCB IOUT VBAT VCHRIN VENB VOCB IOUT VOUT IOUT CH1: VENB, 5V/Div, DC CH2: VOCB, 5V/Div, DC TIME: 5ms/Div VIN =5V, RLOAD =2Ω , CIN =COUT=33µF/ Electrolytic CH3: IOUT, 1A/Div, DC CH1: VENB, 5V/Div, DC CH2: VOCB, 5V/Div, DC TIME: 5ms/Div VIN =5V, RLOAD =0Ω , CIN =COUT=33µF/ Electrolytic CH3: IOUT, 1A/Div, DC CH1: VOUT, 5V/Div, DC CH2: VOCB, 5V/Div, DC TIME: 2ms/Div VIN =5V, CIN =COUT=33µF/Electrolytic CH3: IOUT, 1A/Div, DC VOCB VOUT IOUT CH1: VOUT, 1V/Div, DC TIME: 1ms/Div VIN =5V, RLOAD =1kΩ to 2.2Ω , CIN =COUT=33µF/ Electrolytic CH2: IOUT, 1A/Div, DC

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw11 Pin Description PIN NO. SOT-23-5 SOP-8/ MSOP-8 APL3510 APL3511 NAME FUNCTION 1 2 2 GND Ground. 4 5 VIN Power Supply Input. Connect this pin to external DC supply. EN (A/C/E) Enable Input. Pulling this pin to high will enable the device and pulling this pin to low will disable device. The EN pin cannot be left floating. 4 3 4 ENB (B/D/F) Enable Input. Pulling this pin to high will disable the device and pulling this pin to low will enable device. The ENB pin cannot be left floating. 5 1 3 OCB Fault Indication Pin. This pin goes low when a current limit or an over-temperature condition is detected after a 12ms deglitch time. 5 1 VOUT Output Voltage Pin. The output voltage follows the input voltage. When ENB is high or EN is low, the output voltage is discharged by an internal resistor. Block Diagram Gate Driver and Control Logic UVLO VIN VOUT Charge Pump OCBEN/ ENB OTP GND Current Limit Short-Circuit Protection

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw12 Typical Application Circuit VIN VOUT GND APL3510A/B/C/D/E/F APL3511A/B/C/D OCB EN/ENB USB Controller 5V3.3V VBUS GND USB Port 50kΩ CIN 1µF COUT 150µF CBYP 0.1µF

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw13 Function Description VIN Under-Voltage Lockout (UVLO) The APL3510/1 series of power switches have a built-in under-voltage lockout circuit to keep the output shutting off until internal circuitry is operating properly. The UVLO circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. When input voltage exceeds the UVLO threshold, the output voltage starts a soft-start to reduce the inrush current. Power Switch The power switch is an N-channel MOSFET with a low RDS(ON). The internal power MOSFET does not have the body diode. When IC is off, the MOSFET prevents a cur- rent flowing from the VOUT back to VIN and VIN to VOUT. Current-Limit Protection The APL3510/1 series of power switches provide the cur- rent-limit protection function. During current limit, the de- vices limit output current at current limit threshold. For reliable operation, the device should not be operated in current limit for extended period. Short-Circuit Protection When the output voltage drops below V IN-1V, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. The short-circuit current limit is used to reduce the power dissipation dur- ing short-circuit conditions. If the junction temperature reaches over-temperature threshold, the device will en- ter the thermal shutdown. OCB Output The APL3510/1 series of power switches provide an open-drain output to indicate that a fault has occurred. When any of current-limit or over-temperature protection occurs for a deglitch time of t D(OCB), the OCB goes low. Since the OCB pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. Enable/Disable Pull the ENB above 2V or EN below 0.8V will disable the device, and pull ENB pin below 0.8V or EN above 2V will enable the device. When the IC is disabled, the supply current is reduced to less than 1 µA. The enable input is Over-Temperature Protection When the junction temperature exceeds 140oC, the inter- nal thermal sense circuit turns off the power FET and allows the device to cool down. When the device’s junc- tion temperature cools by 20 oC, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed to protect the IC in the event of over temperature conditions. For normal operation, the junction temperature cannot exceed T J=+125oC. compatible with both TTL and CMOS logic levels. The EN/ENB pin cannot be left floating.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw14

Application Information

A 1µF ceramic bypass capacitor from VIN to GND, located near the APL3510, is strongly recommended to suppress the ringing during short circuit fault event. Without the bypass capacitor, the output short may cause sufficient ringing on the input (from supply lead inductance) to dam- age internal control circuitry. Output Capacitor A low-ESR 150µF aluminum electrolytic or tantalum be- tween VOUT and GND is strongly recommended to reduce the voltage droop during hot-attachment of downstream peripheral. (Per USB 2.0, output ports must have a mini- mum 120µF of low-ESR bulk capacitance per hub). Higher-value output capacitor is better when the output load is heavy. Additionally, bypassing the output with a 0.1µF ceramic capacitor improves the immunity of the de- vice to short-circuit transients. Layout Consideration The PCB layout should be carefully performed to maxi- mize thermal dissipation and to minimize voltage drop, droop and EMI. The following guidelines must be considered: 1. Please place the input capacitors near the VIN pin as close as possible. 2. Output decoupling capacitors for load must be placed near the load as close as possible for decoupling high- frequency ripples. 3. Locate APL3510 and output capacitors near the load to reduce parasitic resistance and inductance for excel- lent load transient performance. 4. The negative pins of the input and output capacitors and the GND pin must be connected to the ground plane of the load. 5. Keep VIN and VOUT traces as wide and short as possible.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw15

Package Information

D e E SEE VIEW A cb h X 45° A A1 A2 L VIEW A 0.25 SEATING PLANE GAUGE PLANE Note: 1. Follow JEDEC MS-012 AA. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. S Y M B O L MIN. MAX. 1.75 0.10 0.17 0.25 0.25 A c D E e h L MILLIMETERS b 0.31 0.51 SOP-8 0.25 0.50 0.40 1.27 MIN. MAX. INCHES 0.069 0.004 0.012 0.020 0.007 0.010 0.010 0.020 0.016 0.050 0.010 1.27 BSC 0.050 BSC A2 1.25 0.049 0° 8 ° 0° 8 ° 3.80 5.80 4.80 4.00 6.20 5.00 0.189 0.197 0.228 0.244 0.150 0.157

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw16 A VIEW A 0.25 GAUGE PLANE SEATING PLANE D e SEE VIEW A E b c SYMBOL MIN. MAX. 1.10 0.00 0.22 0.38 0.08 0.23 0.15 A b c D E e L MILLIMETERS A2 0.75 0.95

0.65 BSC

0.40 0.80

0.026 BSC

MIN. MAX. INCHES 0.043 0.000 0.030 0.037 0.009 0.015 0.003 0.009 0.016 0.031 0.006 0° 8° 0° 8° 4.70 5.10 2.90 3.10 2.90 3.10 0.114 0.122 0.185 0.201 0.114 0.122 Note: 1. Follow JEDEC MO-187 AA. 2. Dimension“D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension“E1”does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw17 MAX. 0.057 0.051 0.024 0.006 0.009 0.0200.012 L 0.30 e E D c b 0.08 0.30 0.60 0.012

0.95 BSC

1.90 BSC

0.22 0.50

0.037 BSC

0.075 BSC

0.003 MIN. MILLIMETERS SYMBOL A 0.00 0.90 SOT-23-5 MAX. 1.45 0.15 1.30 MIN. 0.000 0.035 INCHES °8°0 °8°0 b c VIEW A 0.25 GAUGE PLANE SEATING PLANE A A2A1 e D E SEE VIEW A 1.40 2.60 1.80 3.00 2.70 3.10 0.122 0.071 0.1180.102 0.055 0.106 Note : 1. Follow JEDEC TO-178 AA. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw18 Carrier Tape & Reel Dimensions A AB W F T P0OD0 B SECTION B-B SECTION A-A OD1 H A d Application A H T1 C d D W E1 F -0.00 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 SOP-8 Application A H T1 C d D W E1 F -0.00 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 MSOP-8 Application A H T1 C d D W E1 F -0.00 13.0+0.50 -0.20 P0 P1 P2 D0 D1 T A0 B0 K0 SOT-23-5 (mm)

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw19 Devices Per Unit Package Type Unit Quantity SOP-8 Tape & Reel 2500 MSOP-8 Tape & Reel 3000 SOT-23-5 Tape & Reel 3000 Taping Direction Information SOT-23-5 SOP-8 MSOP-8 USER DIRECTION OF FEED USER DIRECTION OF FEED USER DIRECTION OF FEED

Copyright  ANPEC Electronics Corp. Rev. A.7 - Mar., 2012 APL3510/1 www.anpec.com.tw20 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak package body Temperature (Tp)* See Classification Temp in table 1 See Classification Temp in table 2 Time (tP) within 5°C of the specified classification temperature (Tc) 20 seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. Time 25°C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Classification Profile

Copyright  ANPEC Electronics Corp. Table 2. Pb-free Process – Classification Temperatures (Tc) Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)