APHF1608LSEEQBDZGKC TO-GRACE | Alldatasheet

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© 20 17 Kingbright. All Rights Reserved. Spec No: DSAO6897 / 1203015312 Rev No: V.3B Date: 02/14/2017 Page 1 / 4 DESCRIP TIONS z T he Hyper Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode z T he Blue source color devices are made with InGaN Light Emitting Diode z T he Green source color devices are made with InGaN on Sapphire Light Emitting Diode z Electrostatic discharge and power surge could damage the LEDs z It is recommend ed to use a wrist band or anti-electrostatic glove when handling the LEDs z All d evices, equipments and machineries must be electrically grounded

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z 1.6 x 0.8 mm SMD LED, 0.5 mm thickness z Lo w power consumption z Packa ge in 8mm tape on 7'' diameter reel, 4000 pcs / reel z Ca n produce any color in visible spectrum, including white light z Moistur e sensitivity level: 3 z Ro HS compliant APPLIC ATIONS z Backlight z Status in dicator z Hom e and smart appliances z W earable and portable devices z He althcare applications ATTE NTION Ob serve precautions for handling electrostatic discharge sensitive devices PACKAGE DI MENSIONS SELECTION GUIDE Notes: θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to CIE127-2007 standards. Part Number Emitti ng Color (Material) Lens T ype I v (mcd) @ 2mA [2] Vie wing Angle [1 Min. Ty p. 2θ1/2 APHF1608LSEE QBDZGKC ■ H yper Red (AlGaInP) 4 15 140° ■ Blue (InGaN ) 4 10 140° ■ G reen (InGaN) 20 70 140° Water Clear APHF1608LSEEQBDZGKC 1.6 x 0.8 mm Full-Color Surface Mount LED RECOMMENDED SOLDERING PATTERN (units : mm ; tolerance : ± 0.1) Notes: All dimensions are in millimeters (inches). 2. Tolerance is ±0.15(0.006") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. 香港至恩科技有限公司 www.to-grace.com 公司授权代理销售LITE-ON:光耦，贴片LED灯等 进口原装，现货供应，价格优势，技术支持 电话：0755-83464948 传真：0755-83464076 A ll data sheet.com

© 2017 Kingbright. All Rights Reserved. Spec No: DSAO6897 / 1203015312 Rev No: V.3B Date: 02/14/2017 Page 2 / 4 ABSOLUTE MAXIMUM RATINGS at TA=25°C ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C APHF1608LSEEQBDZGKC Parameter Symbol Emitting Color Value Unit Typ. Max. Wavelength at Peak Emission IF = 2mA λpeak Hyper Red Blue Green 630 460 515 - nm Dominant Wavelength IF = 2mA λdom [1] Hyper Red Blue Green 621 465 525 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 2mA Δλ Hyper Red Blue Green - nm Capacitance C Hyper Red Blue Green 100 - pF Forward Voltage IF = 2mA VF [2] Hyper Red Blue Green 1.8 2.65 2.65 2.3 3.2 3.3 V Reverse Current (VR = 5V) IR Hyper Red Blue Green uA Temperature Coefficient of λpeak IF = 2mA, -10°C ≤ T ≤ 85°C TCλpeak Hyper Red Blue Green 0.13 0.04 0.05 - nm/°C Temperature Coefficient of λdom IF = 2mA, -10°C ≤ T ≤ 85°C TCλdom Hyper Red Blue Green 0.06 0.03 0.03 - nm/°C Temperature Coefficient of VF IF = 2mA, -10°C ≤ T ≤ 85°C TCV Hyper Red Blue Green -1.9 -2.9 -2.9 - mV/°C Parameter Symbol Unit Hyper Red Blue Green Power Dissipation PD [1] 75 80 82 mW Reverse Voltage VR 5 5 5 V Junction Temperature Tj 110 110 110 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +85 °C DC Forward Current IF [1] 30 20 20 mA Peak Forward Current IFM [2] 195 100 100 mA Electrostatic Discharge Threshold (HBM) - 3000 250 450 V Thermal Resistance (Junction / Ambient) Rth JA [3] 640 610 590 °C/W Thermal Resistance (Junction / Solder point) Rth JS [3] 530 500 480 °C/W Value Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Notes: 1. The maximum ratings are valid for the case of lighting a single chip When two chips are lit at the same time, each chip should be driven at a current lower than 50% of the absolute maximum ratings When three chips are lit at the same time, each chip should be driven at a current lower than 30% of the absolute maximum ratings 2. 1/10 Duty Cycle , 0.1ms Pulse Width . 3. R th JA ,Rth JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad). 4. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. A ll data sheet.com

© 2017 Kingbright. All Rights Reserved. Spec No: DSAO6897 / 1203015312 Rev No: V.3B Date: 02/14/2017 Page 3 / 4 Ta = 25 °C Forward voltage (V) Forward current (mA) 02468 1 0 Ta = 25 °C Forward current (mA) Luminous intensity normalised at 2 mA -40 -20 0 20 40 60 80 100 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 00 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C Ta = 25 °C Forward voltage (V) Forward current (mA) 0.0 2.0 4.0 6.0 8.0 10.0 02468 1 0 Ta = 25 °C Forward current (mA) Luminous intensity normalised at 2 mA 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 00 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at Ta = 25 °C T a = 25 °C Forward voltage (V) Forward current (mA) 02468 1 0 Ta = 25 °C Forward current (mA) Luminous intensity normalised at 2 mA -40 -20 0 20 40 60 80 100 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 00 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C 20% 40% 60% 80% 100% 350 400 450 500 550 600 650 700 750 800 Hyper Red Ta = 25 °C Wavelength (nm) Relative Intensity (a. u.) Blue Green 0.5 0.50.0 -90° -75° -60° -45° -30° -15° 75° 60° 45° 30° 0° 15° 90° 1.0 1.0 R B,G Ta = 25 °C R B,G HYPER RED TECHNICAL DATA RELATIVE INTENSITY vs. WAVELENGTH SPATIAL DISTRIBUTION Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature BLUE Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature GREEN Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature APHF1608LSEEQBDZGKC A ll data sheet.com

© 2017 Kingbright. All Rights Reserved. Spec No: DSAO6897 / 1203015312 Rev No: V.3B Date: 02/14/2017 Page 4 / 4 PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference on ly. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes PACKING & LABEL SPECIFICATIONS TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS TECHNICAL DATA APHF1608LSEEQBDZGKC Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. A ll data sheet.com