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13.08.2012 APG2C1-1020 1 / 3
IR High Power single chip LED APG2C1-1020 is a GaAlAs based, high power 1020 nm single chip LED in standard emitter package for general application. Specifications
- Structure: GaAlAs
- Peak Wavelength: 1020 nm
- Optical Output Power: typ. 40 mW
- Life Time: > 10.000 hours
- Housing: standard emitter package Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Value Unit Power Dissipation, DC PD 1000 mW Forward Current, DC IF 500 mA Pulsed Current (1% duty cycle, 1kHz) IFP 1000 mA Reverse Voltage UR -5 V Operating Temperature Topr -30 … +70 °C Storage Temperature Tstg -30 … +85 °C Soldering Temperature (max. 1,5 s) Tsol 330 °C Electro-Optical Characteristics (Ta=25°C) Parameter Symbol Condition Min. Typ. Max. Unit Forward Current IF - 350 - mA Viewing Angle φ IF = 350 mA ± 75 deg. CW Output Power PO IF = 350 mA 40 mW Peak Wavelength λP IF = 350 mA 1020 nm Forward Voltage UF IF = 350 mA - 1.3 - V Half Width (FWHM) Δλ IF = 350 mA - 35 nm Wavelength measurements tolerance is +/- 2% Output power measurement tolerance is +/- 10% Voltage measurement tolerance is +/- 2% Device Materials Item Material Foundation Plastic Lens Acryl Electrodes AgCu Heat Sink AgCu
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Typical Performance Characteristics Normalized Output Power vs. Wavelength: Outline Dimensions Emitter: Radiation Pattern (lambertian lens without optics) Relative Intensity vs. Angular Displacement
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Reflow Soldering: APG2C1 LEDs have a maximum storage temperature of 85°. Therefor it is not possible to use a reflow soldering process for array assembly! Hot Bar Soldering: A Hot Bar Soldering process is recommended when soldering APG2C1 emitters. This process will only t ransfer heat to the leads and avoids overheating the emitter which will damage the device. In order to transfer sufficient heat from the hot bar to the device, following parameters must be carefully considered:
- Amount of flux
- Pressing force of solder tip
- Hot bar temperature For the standard assembly process, following parameters should be maintained:
- Hot Bar temperature: 330 °C
- Force of Hot Bar. 40 N
- Soldering time: 1.5 s It is recommended to use a copper nickel -plated hot bar mounted to standard temperatur e controlled soldering equipment. Manual Hand Soldering: For prototype build or small series production runs, it is possible to place and solder the emitters by hand. It is therefore recommended to maintain the following parameters:
- Solder Tip Temperature 330 °C
- Soldering time. < 1.5 s
- Junction temperature must be kept below 70 °C A visual inspection may be used to check the quality of the solder joint General Soldering Precautions:
- Mechanical stress, shock and vibration must be avoided during soldering
- Only use non corrosive flux.
- Do not apply current to the device until it has cooled down to room temperature after soldering.