APDS9002

APDS-9002 AVAGO | Alldatasheet

Document overview

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Technical content

Features

• Excellent responsivity which peaks in the human luminosity curve Close responsivity to the human eye
• Miniature chipLED lead-free surface-mount package Height – 0.80 mm Width – 2.00 mm Depth – 1.25 mm
• Good output linearity across wide illumination range
• Low sensitivity variation across various light sources
• Guaranteed temperature performance -40°C to 85°C CC supply 2.4 to 5.5 V
• Lead-free package

Applications

• Detection of ambient light to control display backlighting Mobile devices – mobile phones, PDAs Computing devices – notebooks, webpads Consumer devices – TVs, video cameras, digital still cameras
• Automatic residential and commercial lighting management
• Electronic signs and signals
• Daylight and artificial light exposed devices APDS-9002 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet

Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS-9002 ambient light photo sensor module. You can contact them through your local sales representatives for additional details.

Ordering Information

Part Number Packaging Type Package Quantity APDS-9002-021 Tape and Reel 4-pins Chipled package 2500 Typical Application Circuit I/O Pins Configuration Table Pin Symbol Description

1 IOUT I OUT

2 VCC V CC

3 VCC V CC

Figure 1. Typical application circuit for APDS-9002.

Figure 2. Relative spectral response vs. wavelength. component to prevent damage and/or degradation which may be induced by ESD.

Electrical & Optical Specifications (T A = 25°C) Parameter Symbol Min. Typ. Max. Units Conditions Photo Current (I) I_ PH1 10 20 33 µAV CC = 3.0 V, Lux = 10[2] Photo Current (II) I_ PH2 136 250 410 µAV CC = 3.0 V, Lux = 100[2] Photo Current (III) I_ PH3 - 300 - µAV CC = 3.0 V, Lux = 100[1] Dark Current I_ DARK -5 0 160 nA V CC = 3.0 V, Lux = 0 Light Current Ratio I_ PH3 / I_PH2 -1 . 2 - - - Rise Time T_ RISE - 0.95 2 ms V CC = 3.0 V, Lux = 100, Rload = 1 kΩ [3] Fall Time T_ FALL -0 . 8 2 m s V CC = 3.0 V, Lux = 100, Rload = 1 kΩ [3] Notes: 1. Illuminance by CIE standard light source (incandescent lamp). 2. Fluorescent light is used as light source. White LED is substituted in mass production. 3. White LED is used as light source. Light Measurement Circuit and Waveforms RLOAD tr I_pulse I_pulse VOUT GND PIN 2: VCC APDS-9002 PIN 3: VCC PIN 4: NC PIN 1: IOUT tf 90% 10%

1.40 1.25 P4P3 2.00 0.45 0.35 R0.20 0.45 0.45 0.20 0.14 PIN 1: IOUT PIN 2: VCC PIN 3: VCC PIN 4: NC (NO CONNECT) UNITS: in mm TOLERANCE: ±0.2 mm 0.80 0.30 P.C. BOARD MOLDING BODY (LENS)

APDS-9002 Tape and Reel Dimensions PROGRESSIVE DIRECTION ORIENTATION OF UNIT IN TAPE AND REEL POCKETS IN PROGRESSIVE DIRECTION MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT SENSITIVE ADHESIVE EMPTY UNIT: mm "B" "C" 178 75 (400 mm MIN.)(40 mm MIN.) (40 mm MIN.) LEADERPARTS MOUNTEDEMPTY DETAIL A 20.2 (MIN.) 15.4 (MAX.) R1.0 DIA. 13.0 ± 0.50 2.0 ± 0.50 DETAIL A LABEL ∅ 1.56 ± 0.1 ∅ 1.00 ± 0.1 2.00 ± 0.05 1.75 ± 0.1 3.50 ± 0.058 ± 0.1 0.20 1.04 ± 0.1 4.00 ± 0.1 4.00 ± 0.1 1.96 ± 0.1 1.04 ± 0.1 C 18.4 (MAX.) B 1.25 P4P3 2.00 0.20

package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30°C, AND LESS THAN 60% RH PACKAGE IS OPENED LESS THAN 72 HOURS PERFORM RECOMMENDED BAKING CONDITIONS NO BAKING IS NECESSARY YES NO NO YES Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In Reels 60 °C 20 hours In Bulk 125 °C5 hours Baking should only be done once. Recommended Storage Conditions Storage Temperature 10 °C to 30°C Relative Humidity Below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. If times longer than three days are needed, the parts must be stored in a dry box.

Recommended Reflow Profile Process Zone Symbol DT Maximum DT/DTime Heat Up P1, R1 25 °C to 160°C4 °C/s Solder Paste Dry P2, R2 160 °C to 200°C 0.5°C/s Solder Reflow P3, R3 200 °C to 255°C (260°C at 10 seconds max.) 4 °C/s P3, R4 255 °C to 200°C- 6 °C/s Cool Down P4, R5 200 °C to 25°C- 6 °C/s The reflow profile is a straight- line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9002 castellation pins are heated to a temperature of 160°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4°C per second to allow for even heating of both the PC board and APDS-9002 castellations. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9002 castellations to change dimensions evenly, putting minimal stresses on the APDS-9002. t-TIME (SECONDS) T – TEMPERATURE – ( °C) 230 200 160 120 50 150 100 200 250 300 180 220 255 HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN R3 R4 60 sec. MAX. ABOVE 220°C MAX. 260°C

Figure 9. Stencil and PCBA.

1.1 Recommended Land Pattern

Figure 10. Solder stencil aperture.

1.3 Adjacent Land Keepout and

unit relative to the land pattern. components within this area. Figure 11. Adjacent land keepout and solder mask areas.

1.2 Recommended Metal Solder

shield pad is 0.6 mm x 0.6 mm.

Appendix B: Optical Window Design for APDS-9002

2.0 Optical Window Dimensions

To ensure that the performance of the APDS-9002 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9002. This minimum dimension that is recommended will ensure at least a ±35° light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figures 12(a) and 12(b) illustrate the two types of windows that we have recommended which could either be a flat window or a flat window with light guide. Figure 12(a). Window size determination for flat window. Figure 12(b). Window design of flat window with light guide. FLAT PHOTO LIGHT SENSOR

Figure 13. Recommended window dimensions.

2.1 Optical Window Material

recommended to be polycarbonate. and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2.

9002 is shown in Figure 15 below. Figure 15. Evaluation board layout.

For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries . Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. 5989-3051EN June 7, 2006