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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 16
Technical content
Features
/g120 Low power consumption – Internal oscillation circuit to drive LED in pulse mode – Low shut down current – External LED drive-current control /g120 Complete shutdown mode – Low shutdown current /g120 Supply voltage : 2.4 V to 3.6 V /g120 Operational in sunlight conditions up to 100klux(with HSDL-9100) /g120 Artificial light immunity /g120 Analog & Digital output available – Built in comparator for digital output – Digital output remains Low during object detected. /g120 Wide bandwidth Trans-impedance amplifier /g120 External capacitor and resistor for integration and gain controls /g120 Flexibility to enhance detection distance up to 200mm with HSDL-9100 or further with external discrete pair /g120 Small 2mm x 2mm QFN 8-pin package /g120 Design flexibility to pair with Avago Proximity Sensors or discrete pair solution /g120 Lead-free & RoHS Compliant
Applications
/g120 PDA and mobile phones /g120 Digital Camera /g120 Portable and Handheld devices /g120 Personal Computers/Notebooks /g120 Amusement/Games/Vending Machines /g120 Industrial Automation /g120 Contactless Switches /g120 Sanitary Automation
Figure 1. APDS-9702 Block Diagram
APDS-9702 pin-out and I/O Configurations Pin 1 Pin 2 Pin 3 Pin 4 Pin 8 Pin 7 Pin 6 Pin 5 PIN #1 CORNER I/O Pins Configuration Table Pin Symbol Type Description
1 SDA Digital I/O I2C Serial Data I/O terminal
2 SCL Digital I/P I2C Serial Clock Input terminal
3 DOUT Digital O/P Digital Output
An open drain output that requires a pull-up resistor of recommended value 10k /g58 DOUT = Low at last LED pulse of burst when VPFILT > VTH, DOUT remains Low during object detected. DOUT = High at last LED pulse of burst when V PFILT < VTH, DOUT remains High during object not detected. Please refer to Output Waveforms Definition.
4 GND Ground
5 PD Analog I/P Photo-Detector Input
Connect to Cathode of photo-detector (proximity sensor)
6 PFILT Analog O/P Analog Output
Connect to integration circuit (R3 & CX3)
7 LEDA Analog O/P LED Driver Output
Connect to Anode of LED (proximity sensor)
8 VCC Supply Voltage Supply
Parameter Symbol Min. Max. Units Conditions Supply Voltage V CC 0 3.6 V Ta=25°C Input Logic Voltage V I 0 3.6 V Ta=25°C Reflow Soldering Temperature 260 °C Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature T A -40 85 °C Storage Temperature T S -40 125 °C Supply Voltage V CC 2.4 3.6 V
Electrical & Optical Specifications (Ta=25°C) Parameters Symbol Minimum Typical Maximum Units Conditions Input Logic High Input Voltage V IH 0.7*VCC V Logic Low Input Voltage V IL 0.3* VCC V Logic High Input Current I IH 0.1 /g80AV I ≥ VIH Logic Low Input Current I IL 0.1 /g80AV I ≤ VIL Shutdown Current I SD 1 /g80A Vcc = 3.0 V, TRG = X, PWR = 0 Standby Current I SB 70 100 /g80A Vcc = 3.0 V, TRG = 0, PWR = 1 Output Digital Output Low Level V OL 0 0.3 V I DOUT(Low) = 2 mA, Vcc = 3.0 V Digital Output High Level V OH Vcc – 0.3 V Vcc = 3.0 V, R2 = 10k /g58 Built-in Resistor at PFILT R FILT 100k, 300k, 500k /g58 Through I2C set. Transmitter ILED Pulse Current I LED 125 235 mA Vcc = 3.0 V, R1 = 10 /g58 Number of LED Pulse 16 x (1, 2, …, 16 times) Through I2C set. LED Pulse Frequency 12.5, 25, 50, 100 kHz Through I 2C set. Pulse Duty Cycle = 50%. LED Burst Duration vs. OFF Period 1/16, 1/64, 1/128, 1/256 Through I2C set. Receiver Photodiode Input Current (PD) IPD 03 /g80A Current Gain I PFILT/IPD 20 times Vcc = 3.0 V [1] Comparator Threshold Threshold voltage V TH 0.12 0.17 0.22 0.27 0.32 0.37 0.42 0.47 0.52 0.57 0.62 0.67 0.72 0.77 0.82 0.87 V TH = 0000, TH = 0001, TH = 0010, TH = 0011, TH = 0100, TH = 0101, TH = 0110, TH = 0111, TH = 1000, TH = 1001, TH = 1010, TH = 1011, TH = 1100, TH = 1101, TH = 1110, TH = 1111 Sunlight Cancellation DC Current, PD I DC 100 /g80A Vcc = 3.0 V [1] Note: 1. Specified by design, not production tested.
Figure 2. Typical Application Circuit for APDS-9702
I2C Definition APDS-9702 operates as slave device on I2C bus for clock frequency (SCL) up to 400 kHz. The basic protocol of I2C bus is described below, for more details and specifications, please refer to I2C-bus specification and user manual. SCL SDA SP START condition STOP condition START and STOP conditions SDA SCL 17 28 acknowledgement signal from slave MSB START or repeated START condition byte complete, interrupt within slave S or Sr ACK clock line held LOW while interrupts are serviced ACK
9 Sr or P1 2 3 to 8 9
P 1 2 3 to 8 9 ACK MSB MSB Data transfer on I2C bus SCL SDA S START condition ADDRESS 1-7 8 9 1-7 8 9 1-7 8 9 P STOP condition ACKDATA High byte DATA Low byte ACKACKW A complete data transfer 1 7 1 18181 1 S Slave Address Wr A Data Byte A Data Byte A P S Start Condition Wr Write”0” A Acknowledge (0 for ACK) P Stop Condition Master-to-Slave Slave-to-Master Slave Address: 1010100 (Default)
Transmit Burst Pulses Definition Operation ON/OFF condition is shown in the following table: TRG PWR Condition X 0 Shut down 0 1 Standby Mode 1 1 Active Mode, pulses sent The burst pulses at LEDA pin will be activated under 2 state conditions with 2 different start-up timing. The following diagrams explained these 2 scenarios. (a) State condition 1: From Shut down -> Standby Mode -> Active Mode: Burst pulses at LEDA pin are activated after 1.3 ms LEDA Burst Pulses >1.3 ms I2C Shutdown I2C Standby I2C Active (b) State condition 2: From Shut down -> Active Mode: Burst pulses at LEDA pin are activated after 1.3 ms LEDA Burst Pulses >1.3 ms I2C Shutdown I2C Active
Figure 4. Output Waveforms Definition
There are built-in resistors at PFILT (pin 6) to provide 4 options to set the desired resistor for integrated RC circuit. 0 1 100k ohm. R3 become optional. 1 0 300k ohm. R3 become optional. 1 1 500k ohm. R3 become optional. Figure 5. R
APDS 9702 Performance Charts RELATIVE LED CURRENT VS VCC 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 VCC (V) RELATIVE LED CURRENT RELATIVE LED CURRENT VS TEMPERATURE 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 -60 -40 -20 0 20 40 60 80 100 TEMPERATURE (°C) RELATIVE LED CURRENT RELATIVE STANDBY CURRENT VS TEMPERATURE 0.00 0.20 0.40 0.60 0.80 1.00 1.20 -60 -40 -20 0 20 40 60 80 100 RELATIVE ICC STANDBY AVERAGE PEAK LED CURRENT VS R1 100 150 200 250 300 02 468 1 0 1 2 R1 (OHMS) PEAK LED CURRENT (mA) TEMPERATURE (°C) 2.4V 2.7V 3.0V VCC 3.3V RELATIVE ICC STANDY CURRENT VS VCC 0.2 0.4 0.6 0.8 1.2 VCC (V) RELATIVE ICC STANDY CURRENT
Note: 1. All Dimensions in mm. Tolerance ±0.1mm unless specified. 2. Marking Information: The unit is marked ‘YWW LLa’ on the chip. Y = Year (Last digit of the year) WW = work week (1-54) LL = Lot number (01-99) a = Denote this is an I 2C part. 0.50 0.10
0.02 SIDE VIEW
Pin #1 ID On Top TOP VIEW 0.7 0.40 0.28 0.125 (x4) 0.25 (x8) 0.25 (x6) 1.20 0.60 0.35 45° X 12 3 4 5678 324 BOTTOM VIEW
Recommended Minimum Land pattern and Keep-out Area Keep-out Area Recommendations: Area of Solder Land pattern = 2.3mm x 2.1mm Module placement tolerance & keep out on each side with no lead = 0.55mm & keep out on each side solder lead = 0.8mm Keep-out area = 3.9mm x 3.2mm Dimension in mm. Recommended tolerances +/-0.1mm 0.1 0.5 0.32 2.2 0.22R0.175 0.25 0.25 0.5 SOLDER LAND PATTERN
APDS-9702 Tape and Reel Dimensions Tape Dimensions 4.00 ± 0.10 4.00 ± 0.10 Ø 1.00 + 0.25 1.75 ± 0.10 .10 .254 ± 0.02 5° MAX 5° MAX A. K. B. ALL DIMENSIONS IN mm. 0.75 ± 0.10 YWW LLa UNIT ORIENTATION IN POCKET
ø60.0 ± 0.5 ø56.8 ± 0.5 R75.0 R12.760° REEL MADE IN MALAYSIA SEE DETAIL A øN øA (INCLUDES FLANGE DISTORTION AT OUTER EDGE) (MEASURE AT HUB) (MEASURE AT HUB) AA B B E 1.6 11.3 1.6 1.9 FRONT VIEW SECTION: BB BACK VIEW SECTION: AA ARBOR HOLE DETAIL A SCALE 2:1 ø13.0 ± 0.5 0.2ø20.2 MIN
1.5 MIN
All Dimensions in mm. Packaging All APDS-9702 options are shipped in ESD proof packaging. This part is compliant to JEDEC MSL 1. Recommended Storage Conditions Storage Temperature The units in tape and reel are recommended to be kept in a controlled climate environment, with temp at 25 +5/-10°C and relative humidity at 55 +/-15%. Time from unsealing to soldering This part is compliant to JEDEC MSL-1 (unlimited floor life at < 30°C / 85%RH) Product SPecifications TAPE WIDTH ØA ØNW T W 2 (MAX) W3 E –0.0 +2.5 –0.5 +0.0 –2.0
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. AV02-2238EN - March 3, 2010 Recommended Reflow Profile 50 100 300 150 200 250 t-TIME (SECONDS) 120 150 180 200 230 255 T - TEMPERATURE (°C) R3 R4 217 MAX 260C 60 sec to 90 sec Above 217 C HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different /g39T//g39time tem- perature change rates or duration. The /g39T//g39time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1 , the PC board and APDS-9702 pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and APDS-9702 pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9702 pins to change dimensions evenly, putting minimal stresses on the APDS-9702. It is recommended to perform reflow soldering no more than twice.