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Document overview

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Technical content

Features

 Spectral responsivity close to that of human eye  8-pin ODFN lead-free surface-mount package — Height – 0.34 mm — Width – 2.00 mm — Depth – 2.00 mm  Low sensitivity variation across various light sources  Recommended operating temperature: –40 °C to 85 °C  Vcc supply 1.8 to 5.5 V  Lead-free package, RoHS compliance  Output linearity across wide illumination range

Applications

 Detection of ambient light to control display backlighting — Mobile devices – Mobile phones, PDAs — Computing devices – Notebooks, Webpads — Consumer devices – TVs, Video Cameras, Digital Still Camera  Automatic Residential and Commercial Lighting Management  Electronic Signs and Signals

Ordering Information

APDS-9009 Tape and Reel 8-pin ODFN package 2500 APDS-9009 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet

  • 3 - APDS-9009 Data Sheet Electrical and Optical Specifications (Ta = 25 °C) Electrical and Optical Specifications (Ta = 25 °C) Light Measurement Circuit and Waveforms Parameter Symbol Min. Typ. Max. Units Conditions Photo Currenta a. Illuminance by incandescent lamp I_PH1 21 30 39 uA Vcc =1.8V, Lux = 100b Photo Currentb b. White LED is used as a light source I_PH2 —3 3—u A Vcc =1.8V, Lux = 100a Dark Current I _DARK — 300 — nA Vcc = 3V, Lux = 0 Light Current Ratio I _PH2 / I_PH1 —1 . 1 —— Rise Time T r — 5 — ms Rl = 1K ohm, Lux = 100 Fall Time T f — 5 — ms R1 = 1 Kohm, Lux=100 Peak sensitivity wavelength  — 500 — nm Settling Time pulsed at Vcc T set — 10 — ms Vcc pulsed = 0V to 3V; Rload = 2.4 Kohms; Lux = 100b Propagation delay T d — 5 — ms Rl = 1 Kohm, Lux = 100 Storage delay T s — 5 — ms R1 = 1 Kohm, Lux=100 Saturation voltage Vsat 1.0 — — V R1 = 150 Kohm, Lux = 100 APDS-9009 Pin 1,2,3, 4,6,7: NC Pin 8: OUT Pin 5: VCC R LOAD I_pulse VOUT I_pulse 90% 10%GND tr td tf ts sensor-output attains ~95% of its voltage magnitude- corresponds to the set light level Tset VCC Pulse from PG Sensor Output at Load
  • 4 - APDS-9009 Data Sheet Light Measurement Circuit and Waveforms Figure 3 Average Iout Vs. Lux (Vcc = 1.8V, T=25 °C, White LED Source) Figure 4 Average relative Iout Vs. Temp (Vcc = 1.8V, T=25 °C,

100 Lux)

0.00E+00 2.00E- 04 4.00E- 04 6.00E- 04 8.00E- 04 1.00E- 03 1.20E- 03 1.40E- 03 1.60E- 03 0 1000 2000 3000 4000 5000 OUTPUT CURRENT (A) LUX AVG. IOUT vs Lux (Vcc=1.8V, T=25°C, White LED source) 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -40 -20 0 20 40 60 80 100 TEMPERATURE [°C] AVG REL-IOUT vs. TEMP at 100LUX at 1.8V REL - IOUT Figure 5 Relative Output Current Vs. Temp (Vcc = 1.8V, 100 Lux) Figure 6 Relative Output Current Vs. Vcc (Ta = 25 °C, 100Lux) 0.2 0.4 0.6 0.8 1.2 1.4 1.6 1.8 -40 -20 0 20 40 60 80 100 AVG. REL-IOUT vs. TEMP at 1000LUX at 1.8V TEMPERATURE [°C] REL - IOUT 0.5 0.6 0.7 0.8 0.9 1.1 1.2 1.3 1.4 1.5 0123456 REL - IOUT VCC RELATIVE OUTPUT CURRENT vs. Vcc (25C, 100LUX) Figure 7 Relative Iout Vs. Angle (Vcc = 1.8V, Ta = 25 °C) Figure 8 Average Rise Time Vs. Load Resistance at Vcc = 1.8V 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.1 -90 -80 -70 -60 -50 -40 -30 -20 - 10 0 10 20 30 40 50 60 70 80 90 NORMALIZED RESPONSIVITY ANGULAR DISPLACEMENT (DEGREES) ANGULAR RESPONSE Half power point AVG RISE TIME Vs LOAD RESISTANCE at VCC=1.8V 000.0E+0 2.0E-3 4.0E-3 6.0E-3 8.0E-3 10.0E-3 12.0E-3 14.0E-3 16.0E-3 18.0E-3 0 2000 4000 6000 8000 10000 12000 LOAD RESISTANCE [Ohms] RISE TIME [Seconds]

  • 6 - APDS-9009 Data Sheet PCB Pad Layout 2±0.10 2±0.10 0.187 CL CL Active Area Center 0.34±0.10 0.31±0.10 (x8) 0.35±0.10 (x8) 0.78±0.10 (x8) 0.27±0.10 (x4) 0.53±0.10 (x6) CL CL Pin-Out 1 - NC 2 - NC 3 - NC 4 - NC 5 - VCC 6 - NC 7 - NC 8 - OUT 0.31 (×8) 0.35 (×8) 0.22 (×6) 1.20
  • 7 - APDS-9009 Data Sheet APDS-9009 Tape Dimensions APDS-9009 Tape Dimensions APDS-9009 Reel Dimensions 0.30 0.10 4 ±0.10 4 ±0.10 2 ±0.05 1.50 1.75 ±0.10 3.50 ±0.05 1 ±0.25 AA B B E 2.25 ±0.05 0.20 0.69 ±0.05 SECTION A-A SCALE 8 : 1 45 Deg MAX 2.25 ±0.05 0.20 ±0.02 SECTION B-B SCALE 8 : 1

45 Deg MAX

SCALE 16 : 1 Unit Orientation Ø178 ± 1 9 ±0.20 12 ±1 56 ± 0.20 R6.50 ±0.10 R10.50 ±0.10 1.40 2 ±0.50 DETAIL B SCALE 2 : 1 (420mm MIN) TRAILER (40mm MIN) EMPTY (620mm MIN) LEADER (PARTS MOUNTED) B

  • 8 - APDS-9009 Data Sheet Moisture Proof Packaging Moisture Proof Packaging All APDS-9009 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Baking should only be done once. Recommended Storage Conditions Time from unsealing to soldering: After removal from the bag, the parts should be soldered within 7 days and if stored at the recommended storage conditions. If times longer than 7 days are needed, the parts must be stored in a dry box. Units in A Sealed Mositure-Proof Package Package Is Opened (Unsealed) Environment less than 30 deg C, and less than 60% RH ? Package Is Opened less than 168 hours ? Perform Recommended Baking Conditions No Baking Is Necessary No Yes No Yes Package Temperature Time In Reel 60 °C 48 hours In Bulk 100 °C 4 hours Storage Temperature 10 °C to 30 °C Relative Humidity below 60% RH
  • 9 - APDS-9009 Data Sheet Recommended Reflow Profile Recommended Reflow Profile The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates or duration. The T/time rates or duration are detailed in the preceding table. The temperatures are measured at the component to printed circuit board connections. Process zone P1, the PC board and APDS-9009 pins are heated to a temperature of 150 °C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3 °C per second to allow for even heating of both the PC board and APDS-9009 pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200 °C (392 °F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255 °C (491 °F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25 °C (77 °F) should not exceed 6 °C per second maximum. This limitation is necessary to allow the PC board and APDS-9009 pins to change dimensions evenly, putting minimal stresses on the APDS-9009. It is recommended to perform reflow soldering no more than twice. Process Zone Symbol T Maximum T/time or Duration Heat Up P1, R1 25 °C to 150 °C 3 °C/s Solder Paste Dry P2, R2 150 °C to 200 °C 100 s to 180s Solder Reflow P3, R3 200 °C to 255 °C 3 °C/s P3, R4 255 °C to 200 °C –6 °C/s Cool Down P4, R5 200 °C to 25 °C –6 °C/s Time maintained above 217 °C > 217 °C 60 s to 90 s Peak Temperature 260 °C Time within 5 °C of actual Peak Temperature > 255°C 20 s to 40 s Time 25 °C to Peak Temperature 25 °C to 260 °C 8 mins 50 100 150 200 250 300 t-TIME (SECONDS) 120 150 180 200 230 255 T - TEMPERATURE (°C) R3 R4 217 MAX 260°C 60 sec to 90 sec Above 217°C HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN

For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago Technologies and the A logo are trademarks of Avago Technologies in the United States and other countries. All other brand and product names may be trademarks of their respective companies. Data subject to change. Copyright © 2014–2016 Avago Technologies. All Rights Reserved. AV02-3992EN – April 6, 2016 Appendix A: General Application Guide for APDS-9009 The APDS-9009 is a low cost analog-output ambient light photo sensor whose spectral response closely emulates the human eyes. APDS-9009 consists of a photo sensor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9009 can easily be integrated into systems that use ADC input which is available for sampling of the external source, as shown in Figure 12. The amount of converted voltage, Vout, is mainly dependent proportionally on the photo current that generated by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light or/and the load resistor will increase the output voltage. Brightness is measured as “LUX” unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for “LUX” measurement. Light sources with the same LUX level appear at the same brightness to the human eyes. Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit. Light source, e.g., fluorescent light consists of ac noise frequency of about 100Hz. A capacitor of 10 μF, which act as a low-pass filter, is recommended to add in parallel with the load resistor to reduce the ripples. Figure 12 Configuration of APDS-9009 APDS-9009 A/D micro- controller 1,2,3, 4,6,7 Vcc NC Vout R L Light C Source