APDS-9008 AVAGO | Alldatasheet
Document overview
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Technical content
Features
- Excellent responsivity - Close responsivity to the human eye
- Miniature ChipLED Leadfree surface-mount package Height – 0.55 mm Width – 1.60 mm Depth – 1.50 mm
- Low sensitivity variation across various light sources
- Operating temperature : -40°C to 85°C
- Vcc supply 1.6 to 5.5V
- Lead-free package, RoHS compliance
- Output linearity across wide illumination range
- High output saturation voltage
Applications
- Detection of ambient light to control display backlighting Mobile devices – Mobile phones, PDAs Computing devices – Notebooks, Webpads Consumer devices – TVs, Video Cameras, Digital Still Camera
- Automatic Residential and Commercial Lighting Management
- Electronic Signs and Signals
Ordering Information
Part Number Packaging Type Package Quantity APDS-9008-020 Tape and Reel 6-pins Chipled package 2500 I/O Pins Configuration Table Pin Symbol Description
1 VCC VCC
2 NC No Connect
3 NC No Connect
4 GND Ground
5 NC No Connect
6 Iout Out
VCC [1] LOADGND [4] APDS-9008 OUT [6] Typical Application Circuit Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50 °C /W Parameter Symbol Min. Max. Units Storage Temperature TS -40 85 °C Supply Voltage VCC 0 6 V Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature TA -40 85 °C Supply Voltage VCC 1.6 5.5 V CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Figure 1. Typical application circuit for APDS-9008
Electrical & Optical Specifications (Ta=25°C) Parameter Symbol Min. Typ. Max. Units Conditions Supply Current ICC 42 µA Vcc =1.8V, Lux = 100 (2) Photo Current (I) I_PH1 28 40 52 µA Vcc =1.8V, Lux = 100 (2) Photo Current (II) I_PH2 44 µA Vcc =1.8V, Lux = 100 (1) Dark Current I_DARK 300 nA Vcc =1.8V, Lux = 0 Light Current Ratio I_PH2/I_PH1 1.1 Incandescent light / Fluorescent light Rise Time Tr 5 ms Rl = 1Kohm, Lux = 100 Fall Time Tf 5 ms R1 = 1Kohm, Lux=100 Settling Time Tset 10 ms R1=2.4Kohm,Lux=100 Peak sensitivity wavelength λ 565 nm Propagation delay Td 5 ms Rl = 1Kohm, Lux = 100 Storage delay Ts 5 ms R1 = 1Kohm, Lux=100 Saturation voltage Vsat 1.5 V R1 = 100Kohm, Lux = 100, Vcc=1.8V Notes : 1. Illuminance by CIE standard light source (Incandescent lamp) 2. Fluorescence light is used as light source, however, white LED is substituted in a mass production process. Light Measurement Circuit and Waveforms Pin 2,3,5: NC Pin 1:Vcc Pin 6:Iout APDS-9008 I_pulse Td Tr Ts Tf I_pulse VoutPin 4: GND Tset Vcc Vout 90 % Vcc pulse from pulse generator Sensor output at load Tset t t
9008 Spectral response
Figure 2. Relative Spectral Response Vs Wavelength Figure 3. Average Iout Vs Lux (Vcc=1.8v, T=25°C, White LED source) Figure 4. Relative Iout Vs Temp (Vcc=1.8v, 100 Lux) Figure 5. Relative Iout Vs Vcc (T=25°C, 100 Lux) Figure 6. Relative Iout Vs Angle ( Vcc=1.8V, T=25°C) Figure 7. Relative Average Icc Vs Temp ( Vcc=1.8V, T=25°C, 100 Lux)
APDS-9008 Tape and Reel Dimension
(UNSEALED) PARTS ARE NOT RECOMMENDED TO BE USED ENVIRONMENT LESS THAN 30 °C AND LESS THAN 60%RH PACKAGE IS OPENED LESS THAN 168 HOURS PACKAGE IS OPENED LESS THAN 15 DAYS PERFORM RECOMMENDED BAKING CONDITIONS NO BAKING IS NECESSARY All APDS-9008 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Baking Conditions: Package Temperature Time In Reel 60°C 48 hours In Bulk 100°C 6 hours * Baking should only be done once. Recommended Storage Conditions: Storage Temperature 100°C to 300°C Relative Humidity below 60% RH Time from unsealing to soldering: After removal from the bag, the parts should be soldered within 168 hours if stored at the recommended storage conditions. If times longer than 168 hours are needed, the parts must be stored in a dry box.
(SECONDS) 120 150 180 200 230 255 T - TEMPERATURE (°C) R3 R4 217 MAX 260°C 60 sec to 90 sec Above 217°C HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN Recommended Reflow Profile The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow sol - der process. The temperature profile is divided into four process zones, each with different ∆T/∆time temperature change rates or duration. The ∆T/∆time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board con- nections. Process zone P1 , the PC board and component pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is lim- ited to 3°C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the sol- der. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 120 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rap - idly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maxi - mum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, put - ting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice. Process Zone Symbol ∆T Maximum ∆T/∆time or Duration Heat Up P1, R1 25°C to 150°C 3°C/s Solder Paste Dry P2, R2 150°C to 200°C 100s to 180s Solder Reflow P3, R3 P3, R4 200°C to 260°C 260°C to 200°C 3°C/s -6°C/s Cool Down P4, R5 200°C to 25°C -6°C/s Time maintained above liquidus point , 217°C > 217°C 60s to 120s Peak Temperature 260°C - Time within 5°C of actual Peak Temperature >255°C 20s to 40s Time 25°C to Peak Temperature 25°C to 260°C 8mins
Appendix A. SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil Aperture
Figure A1. Stencil and PCBA
1.1 Recommended Land Pattern
Figure A2. Recommended Land Pattern Metal Stencil For Solder Paste Printing Stencil Aperture Solder Mask Land Pattern PCBA 0.4 0.4 0.2 0.9 0.3 CL 0.45 0.4
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture open - ing for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). This is to ensure adequate printed solder paste volume and no shorting. Figure A3. Solder Stencil Aperture
1.3 Adjacent Land Keepout and Solder Mask Areas
Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. Figure A4. Adjacent Land Keepout and Solder Mask Areas 1.7 0.11 1.6 Unit: mm Aperture Opening Mounting Center Unit: mm 0.2 MIN. 2.7 2.6
Table 1. Recommended dimension for optical window to optimize the performance of APDS-9008.
1.0 Optical Window Dimensions
constraints on the dimensions and design of the window. it will not affect the angular response of the APDS-9008. sure at least a ±35° light reception cone. ternal reflection to focus the light. and an additional loss of energy in the plastic material. dow or a flat window with light pipe.
2.1 Optical Window Material
smooth, without any texture. Table 2. Recommended Plastic Materials of current-to-voltage conversion in the circuit. load resistor to reduce the ripples. Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved.