APDS-9006-020 AVAGO | Alldatasheet
Document overview
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Technical content
Features
- Excellent responsivity which peaks in the human luminosity curve, close responsivity to the human eye
- ChipLED surface-mount package – Reverse Mounting Height – 1.10mm Width – 3.20mm Depth – 1.60mm
- Good output linearity across wide illumination range
- Low sensitivity variation across various light sources
- Stable performance over temperature and voltage
- Operating temperature, -40°C to 85°C
- Vcc supply 2.4 to 5.5V
- Lead-free package
Applications
- Detection of ambient light to control display backlighting Mobile devices – Mobile phones, PDAs Computing devices – Notebooks, Webpads Consumer devices – TVs, Video Cameras, Digital Still Cameras
- Automatic Residential and Commercial Lighting Management
- Electronic Signs and Signals
Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS- 9006 ambient light photo sensor module. You can contact them through your local sales representatives for addi - tional details.
Ordering Information
Part Number Packaging Type Package Quantity APDS-9006-00 Tape and Reel 4-pins Chipled package 500 Typical Application Circuit APDS-9006 Pin 1:OUT Pin 2:VCCPin 3:VCC Pin 4:NC R LOAD Figure 1. Typical application circuit for APDS-9006 Notes : PIN 2 and PIN 3 Vcc need to be externally shorted.
3 VCC VCC
4 NC No Connect
Figure 2. Relative Spectral Response Vs. Wavelength
- Fluorescence light is used as light source, however, white LED is substituted in a mass production process
- Illuminance by CIE standard light source (Incandescent lamp
Figure 3. Average Iout Vs Lux (Vcc = 3V, T=25°C, White LED source) Figure 4. Average relative Iout Vs Temp (Vcc = 3V, T=25°C, 320 Lux)
APDS-9006 Light Measurement Circuit and Waveforms I_pulse GND VOUT 90% 10% tr tf td ts
APDS-9006 Tape and Reel Dimensions
Moisture Proof Packaging Chart All APDS-9006 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Baking conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temp. Time In Reels 60°C 48 hours In Bulk 00°C 4 hours Baking should only be done once. Recommended Storage Conditions Storage Temperature 0°C to 30°C Relative Humidity Below 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within seven days if stored at the recommended storage conditions. If times longer than seven days are needed, the parts must be stored in a dry box.
dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder con - nections. Beyond a dwell time of 40 seconds, the inter - metallic growth within the solder connections becomes excessive, resulting in the formation of weak and un - reliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS-9006 pins to change dimensions evenly, putting minimal stresses on the APDS-9006. It is recommended to perform reflow soldering no more than twice. 50 100 150 200 250 300 t-TIME (SECONDS) 120 150 180 200 230 255 T - TEMPERATURE (˚C) R3 R4 217 MAX 260C 60 sec to 90 sec Above 217 C HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN Process Zone Symbol DT Maximum DT/Dtime or Duration Heat Up P, R 5°C to 50°C 3°C/s Solder Paste Dry P, R 50°C to 00°C 00s to 80s Solder Reflow P3, R3 00°C to 55°C 3°C/s P3, R4 55°C to 00°C -6°C/s Cool Down P4, R5 00°C to 5°C -6°C/s Time maintained above °C > °C 60s to 90s Peak Temperature 60°C Time within 5°C of actual Peak Temperature > 55°C 0s to 40s Time 5°C to Peak Temperature 5°C to 60°C 8mins Recommended Reflow Profile The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime tem - perature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The tempera - tures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9006 pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and APDS-9006 pins. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The
Appendix A: SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal
Figure A1. Stencil and PCBA
1.1 Recommended Land Pattern
Figure A2. Recommended Land Pattern
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.6mm x 0.71mm. This is to ensure adequate printed solder paste volume and no shorting. Figure A3. Solder stencil aperture
1.3 Adjacent Land Keep-out and Solder Mask Areas
Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. Figure A4. Adjacent land keepout and solder mask areas. 0.71 1.89 0.71 0.60 0.50 2.00 0.60 Aperture Opening Soldering Terminal Unit: mm Tolerance: +/- 0.2 CL 0.945 1.00 Mounting Center Unit: mm 0.2 MIN. 4.31 2.7 Metal Stencil For Solder Paste PrintingStencil Aperture Solder Mask Land Pattern PCBA Aperture Opening 3.31 0.11 1.7 Unit: mm Aperture Opening
2.0 Optical Window Dimensions
constraints on the dimensions and design of the window. it will not affect the angular response of the APDS-9006. ensure at least a ±35° light reception cone. internal reflection to focus the light. window or a flat window with light pipe. Table 1. Recommended minimum dimension for optical window
2.1 Optical Window Material
smooth, without any texture. Table 2. Recommended Plastic Materials Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 00 Avago Technologies Limited. All rights reserved.