APDS-9005-020

APDS-9005 AVAGO | Alldatasheet

Document overview

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Technical content

Features

• Spectral responsivity close to that of human eye
• Miniature ChipLED Leadfree surface-mount package Height – 0.55 mm Width – 1.60 mm Depth – 1.50 mm
• Low sensitivity variation across various light sources
• Recommended operating temperature : -40°C to 85°C
• Vcc supply 1.8 to 5.5V
• Lead-free package, RoHS compliance
• Output linearity across wide illumination range

Applications

• Detection of ambient light to control display backlighting Mobile devices – Mobile phones, PDAs Computing devices – Notebooks, Webpads Consumer devices – TVs, Video Cameras, Digital Still Camera
• Automatic Residential and Commercial Lighting Management
• Electronic Signs and Signals

Description

The APDS-9005 is a low cost analog-output ambient light photo sensor in miniature chipLED lead-free surface mount package. It consists of a photo sensor, whose spectral response is close to the CIE standard photopic observer, as show in figure 2. The APDS-9005 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile applianc- es such as the mobile phones and PDAs that draw heavy current from display backlighting will benefit from incor- porating these photo sensor products in their designs by reducing power consumption significantly. Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS- 9005 ambient light photo sensor module. You can contact them through your local sales representatives for additional details.

Ordering Information

Part Number Packaging Type Package Quantity APDS-9005-00 Tape and Reel 6-pins Chipled package 500 Typical Application Circuit Component Recommended Application Circuit Component RLOAD k ohm Figure 1. Typical application circuit for APDS-9005 Figure 2. Relative Spectral Response Vs Wavelength

3 NC No Connect

4 Nc No Connect

5 NC No Connect

6 Iout Out

Electrical & Optical Specifications (Ta=25 °C) Parameter Symbol Min. Typ. Max. Units Conditions Photo Current (I) I_PH 8 40 5 uA Vcc =.8V, Lux = 00 () Photo Current (II) I_PH - 44 - uA Vcc =.8V, Lux = 00 () Dark Current I_DARK - 300 - nA Vcc = 3V, Lux = 0 Light Current Ratio I_PH3 / I_PH - . - - Rise Time Tr - 5 - ms Rl = Kohm, Lux = 00 Fall Time Tf - 5 - ms R = Kohm, Lux=00 Peak sensitivity wavelength l - 500 - nm Settling Time pulsed at Vcc Tset - 0 - ms Vcc pulsed = 0V to 3V; Rload = .4K ohms; Lux = 00 () Propagation delay Td - 5 - ms Rl = Kohm, Lux = 00 Storage delay Ts - 5 - ms R = Kohm, Lux=00 Saturation voltage Vsat .0 - - V R = 50Kohm, Lux = 00 Note : 1) Illuminance by incandescent lamp 2) White LED is used as light source Light Measurement Circuit and Waveforms sensor-output attains ~95% of its voltage magnitude- corresponds to the set light level Tset VCC Pulse from PG Sensor Output at Load

APDS-9005 Tape and Reel Dimension

All APDS-9005 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. Baking Conditions: If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package Temperature Time In Reel 60°C 48 hours In Bulk 00°C 4 hours Baking should only be done once. Recommended Storage Conditions: Storage Temperature 0 °C to 30 °C Relative Humidity below 60% RH Time from unsealing to soldering: After removal from the bag, the parts should be soldered within 7 days and if stored at the recommended storage conditions. If times longer than 7 days are needed, the parts must be stored in a dry box. Units in A Sealed Mositure-Proof Package Package Is Opened (Unsealed) Environment less than 30 deg C, and less than 60% RH ? Package Is Opened less than 168 hours ? Perform Recommended Baking Conditions No Baking Is Necessary No Yes No Yes

The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. Process zone P1 , the PC board and APDS-9005 pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and APDS-9005 pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200°C (392°F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255°C (491°F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 40 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The tempera- ture is then rapidly reduced to a point below the solidus temperature of the solder, usually 200°C (392°F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and APDS- 9005 pins to change dimensions evenly, putting minimal stresses on the APDS-9005. It is recommended to perform reflow soldering no more than twice. Recommended Reflow Profile 50 100 150 200 250 300 t-TIME (SECONDS) 120 150 180 200 230 255 T - TEMPERATURE (˚C) R3 R4 217 MAX 260˚C 60 sec to 90 sec Above 217˚C HEAT UP SOLDER PASTE DRY SOLDER REFLOW COOL DOWN Process Zone Symbol DT Maximum DT/Dtime or Duration Heat Up P, R 5°C to 50°C 3°C/s Solder Paste Dry P, R 50°C to 00°C 00s to 80s Solder Reflow P3, R3 00°C to 55°C 3°C/s P3, R4 55°C to 00°C -6°C/s Cool Down P4, R5 00°C to 5°C -6°C/s Time maintained above °C > °C 60s to 90s Peak Temperature 60°C Time within 5°C of actual Peak Temperature > 55°C 0s to 40s Time 5°C to Peak Temperature 5°C to 60°C 8mins

Appendix A: SMT Assembly Application Note

1.0 Solder Pad, Mask and Metal Stencil Aperture

Figure A1. Stencil and PCBA

1.1 Recommended Land Pattern

Figure A2. Recommended Land Pattern

1.2 Recommended Metal Solder Stencil Aperture

It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). This is to ensure adequate printed solder paste volume and no shorting. Figure A3. Solder Stencil Aperture

1.3 Adjacent Land Keepout and Solder Mask Areas

Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended. Figure A4 Adjacent Land Keepout and Solder Mask Areas 0.4 0.4 0.2 0.9 0.3 CL 0.45 0.4 Metal Stencil For Solder Paste PrintingStencil Aperture Solder Mask Land Pattern PCBA Mounting Center Unit: mm 0.2 MIN. 2.7 2.6 1.7 0.11 1.6 Unit: mm Aperture Opening

2.0 Optical Window Dimensions

constraints on the dimensions and design of the window. it will not affect the angular response of the APDS-9005. ensure at least a ±35° light reception cone. internal reflection to focus the light. window or a flat window with light pipe. Table 1. Recommended minimum dimension for optical window

increase the output voltage. amount of current-to-voltage conversion in the circuit. with the load resistor to reduce the ripples.

2.1 Optical Window Material

smooth, without any texture. Table 2. Recommended Plastic Materials Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.